Datasheet MR27T1602F Datasheet (OKI)

OKI Semiconductor

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FEDR27T1602F-02-02

Issue Date: Mar. 12, 2002

MR27T1602F

1M–Word × 16–Bit or 2M–Word × 8–Bit P2ROM

FEATURES

· 1,048,576-word × 16-bit/2,097,152-word × 8-bit electrically
switchable configuration

· 2.7 V to 3.6 V power supply

· Access time 90 ns MAX

· Operating current 30 mA MAX

· Standby current 10 µA MAX

· Input/Output TTL compatible

· Three-state output

PACKAGES

· MR27T1602F-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)

· MR27T1602F-xxxTP
44-pin plastic TSOP (TSOP(2)44-P-400-0.80-K)

· MR27T1602F-xxxTN
48-pin plastic TSOP (TSOP(1)48-P-1220-0.50-K)

P2ROM ADVANCED TECHNOLOGY

P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers c ode into the P2 ROM prior to fi nal
production testing. Advancements in this technology allows
production costs to be eq uivalent to M ASKROM and has many
advantages and added benefits over the other non-volatile
technologies, which include the following;

· Short lead time, since the P2ROM is programmed at the

final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
products are maintained to provide an aggressive lead-time
and minimizes liability as a custom product.

· No mask charge, since P2ROMs do not utilize a custom

mask for storing customer code, no mask charges apply.

· No additional programming charge, unlike Flash and

OTP that require additional programming and handling
costs, the P2ROM already has the code loaded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.

· Custom Marking is available at no additional charge.

· Pin Compatible with Mask ROM and some FLASH

products.

PIN CONFIGURATION (TOP VIEW)

1

NC

2

A18

3

A17

4

A7

5

A6

6

A5

7

A4

8

A3

9

A2

10

A1

11

A0

12

CE#

13

V

SS

14

OE#

15

D0

16

D8

17

D1

18

D9

19

D2

20

D10

21

D3

22

D11

44SOP,

44TSOP(Type-II)

1

A15

2

A14

3

A13

4

A12

5

A11

6

A10

7

A9

8

A8

9

A19

10

NC

11

NC

12

NC

13

NC

14

NC

15

NC

16

A18

17

A17

18

A7

19

A6

20

A5

21

A4

22

A3

23

A2

24

A1

48TSOP(Type-I)

44

NC

43

19

42

8

41

9

40

10

39

11

38

12

37

13

36

14

35

15

34

16

33

BYTE#

32

VSS

31

D15/A–1

30

D7

29

D14

28

D6

27

D13

26

D5

25

D12

24

D4

23

VCC

16

48

BYTE#

47

VSS

46

D15/A–1

45

D7

44

D14

43

D6

42

D13

41

D5

40

D12

39

D4

38

VCC

37

D11

36

D3

35

D10

34

D2

33

D9

32

D1

31

D8

30

D0

29

OE#

28

VSS

27

CE#

26

0

25

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OKI Semiconductor

BLOCK DIAGRAM

A0
A1
A2
A3
A4
A5
A6
A7
A8

A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19

PIN DESCRIPTIONS

Pin name Functions
D15 / A–1 Data output / Address input
A0 to A19 Address inputs
D0 to D14 Data outputs

CE# Chip enable input
OE# Output enable input

BYTE# Word / Byte select input

VCC Power supply voltage
VSS Ground

NC No connect

A–1

CE# BYTE# OE#

CE OE

Row Decoder

Address Buffer

Column Decoder

FEDR27T1602F-02-02

MR27T1602F/P2ROM

× 8/× 16 Switch

Memory Cell Matrix

1M × 16-Bit or 2M × 8-Bit

Multiplexer

Output Buffer

D0 D2 D4 D6 D8 D10 D12 D14

D1 D3 D5 D7 D9 D11 D13 D15

In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.

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FEDR27T1602F-02-02

OKI Semiconductor

MR27T1602F/P2ROM

FUNCTION TABLE

Mode CE# OE# BYTE# VCC D0 to D7 D8 to D14 D15/A–1
Read (16-Bit) L L H D
Read (8-Bit) L L L D

Output disable L H

Standby H ∗

H

L

H

L

3.0 V

Hi–Z L/H

OUT

OUT

Hi–Z

Hi–Z

∗

∗

∗: Don’t Care (H or L)

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Value Unit
Operating temperature under bias Ta 0 to 70 °C
Storage temperature Tstg
Input voltage VI –0.5 to VCC+0.5 V
Output voltage VO –0.5 to VCC+0.5 V
Power supply voltage VCC
Power dissipation per package PD — 1.0 W

—

relative to V

SS

–55 to 125 °C

–0.5 to 5 V

RECOMMENDED OPERATING CONDITIONS

(Ta = 0 to 70°C)

Parameter Symbol Condition Min. Typ. Max. Unit

VCC power supply voltage VCC 2.7 — 3.6 V

= 2.7 to 3.6 V

Input “H” level VIH 2.2 — VCC+0.5∗ V
Input “L” level VIL

V

CC

–0.5∗∗ — 0.6 V

Voltage is relative to V

SS

.

∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.

PIN CAPACITANCE

(VCC = 3.0 V, Ta = 25°C, f = 1 MHz)

Parameter Symbol Condition Min. Typ. Max. Unit

Input C

BYTE# C

Output C

— — 8

IN1
IN2

V

OUT

= 0 V

V

I

= 0 V — — 10

O

— — 120

pF

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FEDR27T1602F-02-02

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MR27T1602F/P2ROM

ELECTRICAL CHARACTERISTICS

DC Characteristics

(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)

Parameter Symbol Condition Min. Typ. Max. Unit
Input leakage current ILI V
Output leakage current ILO V

I

CE# = VCC — — 10 µA VCC power supply current

CCSC

(Standby)

power supply current

CC

(Read)

I

CE# = VIH — — 1 mΑ

CCST

tc = 100 ns — — 30 mA V

CE# = V
OE# = V

I

CCA1

I

CCA2

Input “H” level VIH — 2.2 — VCC+0.5∗ V
Input “L” level VIL — –0.5∗∗ — 0.6 V
Output “H” level VOH I
Output “L” level VOL I

Voltage is relative to V

SS

.

∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.

AC Characteristics

Parameter Symbol Condition Min. Max. Unit
Address cycle time tC — 90 — ns
Address access time t

CE# = OE# = V

ACC

CE# access time tCE OE# = VIL — 90 ns
OE# access time tOE CE #= VIL — 30 ns

t

OE# = VIL 0 30 ns

Output disable time

CHZ

t

CE# = VIL 0 25 ns

OHZ

Output hold time tOH CE #= OE# = V

Measurement conditions
Input signal level-------------------------------­ Input timing reference level -----------------­ Output load--------------------------------------­ Output timing reference level----------------

Output load

Output

= 0 to VCC — — 10 µA

I

= 0 to VCC — — 10 µA

O

IL
IH tc = 200 ns — — 16 mA

= –1 mA 2.4 — — V

OH

= 2 mA — — 0.4 V

OL

(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)

IL

IL

— 90 ns

0 — ns

0 V / 3 V
1/2 Vcc
50 pF
1/2 Vcc

50 pF
(Including scope and jig)

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OKI Semiconductor

TIMING CHART (READ CYCLE)

16-Bit Read Mode (BYTE# = VIH)

t

A0 to A19

t

CE

CE#

t

OE

OE#

t

ACC

D0 to D15

8-Bit Read Mode (BYTE# = VIL)

Hi-Z

t

A-1 to A19

C

C

CE#

t

CE

t

OE

OE#

D0 to D7

Hi-Z

t

ACC

Valid Data

Valid Data

tOH

tOH

t

ACC

t

ACC

FEDR27T1602F-02-02

MR27T1602F/P2ROM

tC

tOH

t

CHZ

t

OHZ

Valid Data

Hi-Z

tC

t

OH

t

CHZ

t

OHZ

Valid Data

Hi-Z

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OKI Semiconductor

PACKAGE DIMENSIONS

SOP44-P-600-1.27-K

Mirror finish

FEDR27T1602F-02-02

MR27T1602F/P2ROM

(Unit: mm)

Package material Epoxy resin
Lead frame material 42 alloy

5

Pin treatment
Package weight (g) 2.10 TYP.
Rev. No./Last Revised 4/Dec. 5, 1996

Solder plating (≥5µm)

Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s resp onsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).

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OKI Semiconductor

TSOP(2)44-P-400-0.80-K

FEDR27T1602F-02-02

MR27T1602F/P2ROM

(Unit: mm)

Mirror finish

Package material Epoxy resin
Lead frame material 42 alloy

5

Pin treatment
Package weight (g) 0.54 TYP.
Rev. No./Last Revised 3/Dec. 10, 1996

Solder plating (≥5µm)

Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s resp onsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).

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OKI Semiconductor

TSOP(1)48-P-1220-0.50-1K

Mirror finish

FEDR27T1602F-02-02

MR27T1602F/P2ROM

(Unit: mm)

Package material Epoxy resin
Lead frame material 42 alloy

5

Pin treatment
Package weight (g) 0.55 TYP.
Rev. No./Last Revised 1/Dec. 2, 1999

Solder plating (≥5µm)

Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s resp onsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).

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OKI Semiconductor

REVISION HISTORY

Document

No.

Date

Previous

Edition

Page

Current

Edition

FEDR27T1602F-02-02

MR27T1602F/P2ROM

Description

FEDR27T1602F-02-01

Jun. 200

1

FEDR27T1602F-02-02 Mar. 12, 2002

– – Final edition 1

Changed tC, t

, tCE to 90ns

ACC

Changed tOE to 30ns

5 4

Changed I

CCSC

to 10uA

Changed IOH, the condition of VOH, to
–1 mA

Changed I

, the condition of VOL, to

OL

2 mA

1-4, 7 1-3 Changed the form

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FEDR27T1602F-02-02

OKI Semiconductor

MR27T1602F/P2ROM

NOTICE

1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action an d performance of the product. When pl anning to use the pro duct, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusua l or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, expos ure to parameters beyo nd the specified
maximum ratings or operation outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection wit h the use of the product and/or the i nformation and drawi ngs contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.

6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or app lication where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.

Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace

equipment, nuclear power control, medical equipment, and life-support systems.

7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the leg ality of export of these products
and will take appropriate and necessary steps at their own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.

Copyright 2002 Oki Electric Industry Co., Ltd.

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