Datasheet MR27T401E Datasheet (OKI)

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OKI Semiconductor

FEDR27T401E-02-01

Issue Date: Apr. 17, 2002

MR27T401E

512K–Word × 8–Bit P2ROM

FEATURES

·524,288-word × 8-bit

· 2.7 V to 3.6 V power supply

· Access time 100 ns MAX

· Operating current 25 mA MAX

· Standby current 10 µA MAX

· Input/Output TTL compatible

· Three-state output

PACKAGES

· MR27T401E-xxxMA 32-pin plastic SOP (SOP32-P-525-1.27-K)

· MR27T401E-xxxTA 32-pin plastic TSOP (TSOP I 32-P-814-0.50-1K)

P2ROM ADVANCED TECHNOLOGY

P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers c ode into the P2 ROM prior to fi nal production testing. Advancements in this technology allows production costs to be eq uivalent to M ASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following;

· Short lead time, since the P2ROM is programmed at the

final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product.

· No mask charge, since P2ROMs do not utilize a custom

mask for storing customer code, no mask charges apply.

· No additional programming charge, unlike Flash and

OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price.

· Custom Marking is available at no additional charge.

PIN CONFIGURATION (TOP VIEW)

DC

1

A16

2

A15

3

A12

4

A7

5

A6

6

A5

7

A4

8

A3

9

A2

10

A1

11

A0

12

D0

13

D1

14

D2

15

VSS

16

32SOP,

A11

1

A9

2

A8

3

A13

4

A14

5

A17

6

A18

7

Vc

8

DC

9

A16

10

A15

11

A12

12

A7

13

A6

14

A5

15

A4

16

32TSOP(Type-I)

Vcc

32

18

31

17

30

14

29

13

28

8

27

9

26

11

25

OE#

24

10

23

CE#

22

D7

21

D6

20

D5

19

D4

18

D3

17

OE#

32

10

31

CE#

30

D7

29

D6

28

D5

27

D4

26

D3

25

Vss

24

D2

23

D1

22

D0

21

0

20

1

19

2

18

3

17

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BLOCK DIAGRAM

CE# OE#

CE OE

A0 A1 A2 A3 A4 A5 A6 A7 A8

A9 A10 A11 A12 A13 A14 A15 A16 A17 A18

Row Decoder

Address Buffer

Column Decoder

Memory Cell Matrix

512K × 8-Bit

Multiplexer

Output Buffer

D0 D1 D2 D3 D4 D5 D6 D7

PIN DESCRIPTIONS

Pin name Functions

A0 to A18 Address inputs

D0 to D7 Data outputs

CE# Chip enable input OE# Output enable input

VCC Power supply voltage VSS Ground

DC Don’t Care *,

* : Logical input level is ignored . However the pin is connected to internal circuit.

MR27T401E

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MR27T401E

FUNCTION TABLE

Mode CE# OE# VCC D0 to D7 Read L L Dout Output disable L H Hi-Z Standby H *

3.0 V Hi-Z

∗: Don’t Care (H or L)

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Value Unit Operating temperature under bias Ta 0 to 70 °C Storage temperature Tstg Input voltage VI –0.5 to VCC+0.5 V Output voltage VO –0.5 to VCC+0.5 V Power supply voltage VCC Power dissipation per package PD — 1.0 W

—

relative to V

SS

–55 to 125 °C

–0.5 to 5 V

RECOMMENDED OPERATING CONDITIONS

(Ta = 0 to 70°C)

Parameter Symbol Condition Min. Typ. Max. Unit

VCC power supply voltage VCC 2.7 — 3.6 V

= 2.7 to 3.6 V

Input “H” level VIH 2.2 — VCC+0.5∗ V Input “L” level VIL

V

CC

–0.5∗∗ — 0.6 V

Voltage is relative to V

SS

.

∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.

PIN CAPACITANCE

(VCC = 3.0 V, Ta = 25°C, f = 1 MHz)

Parameter Symbol Condition Min. Typ. Max. Unit

Input C

DC C

Output C

— — 8

IN1 IN2

V

OUT

V

= 0 V

I

= 0 V — — 10

O

— — 200

pF

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MR27T401E

ELECTRICAL CHARACTERISTICS

DC Characteristics

(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)

Parameter Symbol Condition Min. Typ. Max. Unit Input leakage current ILI V Output leakage current ILO V

I

CE# = VCC — — 10 µA VCC power supply current

CCSC

(Standby)

power supply current

CC

(Read)

I

CE# = VIH — — 1 mA

CCST

tc = 100 ns — — 25 mA V

CE# = V

OE# = VIH

I

CCA1

I

CCA2

Input “H” level VIH — 2.2 — VCC+0.5∗ V Input “L” level VIL — –0.5∗∗ — 0.6 V Output “H” level VOH I Output “L” level VOL I

Voltage is relative to V

SS

.

∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns

AC Characteristics

Parameter Symbol Condition Min. Max. Unit Address cycle time tC — 100 — ns Address access time t

CE# = OE# = VIL — 100 ns

ACC

CE# access time tCE OE# = VIL — 100 ns OE# access time tOE CE #= VIL — 40 ns

t

OE# = VIL 0 35 ns

Output disable time

CHZ

t

CE# = VIL 0 30 ns

OHZ

Output hold time tOH CE #= OE# = VIL 0 — ns

Measurement conditions Input signal level------------------------------- Input timing reference level ----------------- Output load-------------------------------------- Output timing reference level----------------

Output load

Output

= 0 to VCC — — 10 µA

I

= 0 to VCC — — 10 µA

O

IL

tc = 200 ns — — 20 mA

= –1 mA 2.4 — — V

OH

= 2 mA — — 0.4 V

OL

(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)

0 V/Vcc V 1/2Vcc 50 pF 1/2Vcc

50 pF (Including scope and jig)

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TIMING CHART (READ CYCLE)

Read

A0 to A18

CE#

OE#

D0 to D7

Hi-Z

t

ACC

t

C

t

CE

t

OE

Valid Data

tOH

t

ACC

MR27T401E

tC

t

OH

t

CHZ

t

OHZ

Valid Data

Hi-Z

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PACKAGE DIMENSIONS

SOP32-P-525-1.27-K

Mirror finish

MR27T401E

(Unit: mm)

Package material Epoxy resin Lead frame material 42 alloy

5

Pin treatment Package weight (g) 1.32 TYP. Rev. No./Last Revised 5/Fev. 10, 1997

Solder plating (≥5µm)

Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s resp onsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

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TSOP(1)32-P-0814-0.50-1K

5

Mirror finish

(Unit: mm)

Package material Epoxy resin Lead frame material 42 alloy Pin treatment Package weight (g) 0.27 TYP. Rev. No./Last Revised 3/Dec. 10, 1996

Solder plating (≥5µm)

MR27T401E

Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s resp onsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

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REVISION HISTORY

Edition

Page

Current

Edition

Document

No.

FEDR27T401E-02-01 Apr. 17, 2002 – – Final edition 1

Date

Description

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NOTICE

1. The information contained herein can change without notice owing to product and/or technical improvements.

2. The outline of action and examples for application circuits described herein have been chosen as an

3. When designing your product, please use our product below the specified maximum ratings and within the

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation

5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is

6. The products listed in this document are intended for use in general electronics equipment for commercial

Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace

7. Certain products in this document may need government approval before they can be exported to particular

8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.

Before using the product, please make sure that the information being referred to is up-to-date.

explanation for the standard action an d performance of the product. When pl anning to use the pro duct, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.

specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature.

resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, expos ure to parameters beyo nd the specified maximum ratings or operation outside the specified operating range.

granted by us in connection wit h the use of the product and/or the i nformation and drawi ngs contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof.

applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or app lication where the failure of such system or application may result in the loss or damage of property, or death or injury to humans.

equipment, nuclear power control, medical equipment, and life-support systems.

countries. The purchaser assumes the responsibility of determining the leg ality of export of these products and will take appropriate and necessary steps at their own expense for these.

MR27T401E

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