Datasheet MOD621X Datasheet (Lattice Semiconductor)

SiBEAM Snap™

OEM Module Installation Guide for MOD6212/13

Module Installation Guide

USB3.0/2.0

I2C Tunnel

System

Host

MOD6212

USB3.0/2.0

I/O RST

USB devices

I2C peripherals

System controller

3.3V 3.3V

MOD6213

I2C D ebug

I/O RST

I2C D ebug

I2C Tunnel

Introduction

The Lattice Semiconductor MOD6212/13 Wireless module provides a data interface compatible with USB device, which allows reception/transmission of various data rate from/to any USB compliant device. OEM can develop a system equipped with this module to wirelessly connect their high data sources to the target device. The MOD6212/13 modules fit into a variety of industrial designs. No software needs to initialize and to control the module to achieve the wired connectivity offered. The MOD6212/13 module is a completely self-contained autonomous wireless sub-system that connects to a system board that provides the wired connectivity from a single port to a full featured multiport, multi-standard system. The advantage of this design is that the complexity of the wireless system, radio performance, regulatory requirements, and compliance to standards are all eliminated. This system interface carries data, power, and control signals. The module is pre-certified and is fully tested for fast time-to-market.

MOD6212/13 Diagram

Figure 1. MOD6212/13 Transceiver Module Wireless connector principle

MOD6212/13 transceiver Features

• USB 3.0 and 2.0 connections: SS, HS, FS, LS.

• Up to 6Gbps full duplex data-rate

• I

• Fully automatic device detection and connection

• Close proximity operation

• Single chip IC, direct connector replacement

• Integrated antenna

• No software driver required

2

C tunneling for remote I2C connections

Module Installation Guide

MOD6212/13 Transceiver Module Dimensions

Figure 2. MOD6212/13 Transceiver Module Dimension (in mm)

Module Installation Guide

O.D.

Master; SB6211/SB6213 Connect to Slave

4

SDA

Digital

In/Out O.D.

I2C

I2C Data, Tunneling port. SB6210/SB6212 Connect to Master; SB6211/SB6213 Connect to Slave

required for normal operation.

O.D.

required for normal operation.

the GPO pin on the opposite side of an active wireless link.

12

VBUS_SENSE

Digital

Input

USB

USB VBUS status input , 3V3

14

GND

Power

Ground

16

SSRX-

Analog

Input

USB

USB Super speed Neg Input

18

SSRX+

Analog

Input

USB

USB Super speed Pos Input

27

LEDO

Digital

Output

Config

LED output

29

GPO/INT

Digital

Output

GPIO

General purpose output. When a wireless link is active, the

of the wireless link. Also used as I2C tunnel interupt

MOD6212/13 Transceiver Module Pinout

Table 1. Signal pinout

Pin Name Type Dir Group Description

1 3V3 Power Input Power 3.3V +/-5% power supply

2 SCL Digital

3 3V3 Power Input Power 3.3V +/-5% power supply

5 3V3 Power Input Power 3.3V +/-5% power supply

6 SCL_DBG I2C Bi-Dir USB

7 GND Power Power Ground

8 SDA_DBG I2C

9 GND Power Power Ground

10 GPI Digital Input GPIO

In/Out

I2C

Debug

I2C Clock, Tunneling port. SB6210/SB6212 Connect to

I2C Data, Debug port. Connection to debug controller not

General purpose input. Status of this input is reflected on

11 WAKE_UP Digital Input Control

13 ATB_N Analog Output Debug Differential analog test bus - negative terminal

15 ATB_P Analog Output Debug Differential analog test bus - positive terminal

17 RST Digital Input Config Reset Input, active HIGH

19 ID_IN Digital Input USB USB ID Input

20 GND Power Power Ground

21 ID_VAL Digital Input USB USB ID Valid Input

22 SSTX+ Analog Output USB USB Super speed Pos Output

23 ID_OUT Digital Output USB USB ID Output

24 SSTX- Analog Output USB USB Super speed Neg Output

25 VBUS_EN Digital Output USB USB VBUS status output, 3V3

26 GND Power Power Ground

28 D+ Analog Bi-Dir USB USB High Speed/Full Speed/Low Speed Pos I/O

Force the link to W0 State. This is useful to bypass USB states, when I2C tunnel or GPI signal needs to be used, while the link is in low power states. Active High. Optional.

status of this output reflects the GPI pin on the opposite side

30 D- Analog Bi-Dir USB USB High Speed/Full Speed/Low Speed Neg I/O

Module Installation Guide

MOD6212/13 Transceiver Module Connector

The module is designed to be connected to the system board through a single board to board connector:

On the module side:

The connector type is DF40 from Hirose

Part number: DF40C-30DP-0.4V (51)

Description: Dual row Board to Board Receptacle (Plug), 0.4 pitch, 50 pins

A=7.52mm, B=5.6mm, C =1.5mm

Figure 3. Module side connector.

Module Installation Guide

Pair Configuration

Transceiver Personality

Application Example

0 1 1 1 Z 0 DS

US 1 0

Sport Camera/ Storage

MOD6212/13 Transceiver Module Functional description

USB 3.0 Interface

The MOD6212/13 Transceiver Module interfaces directly with a USB 3.0 port without requiring any additional control or interface logic. “ID_IN” and “ID_VAL” strapping pins on the Transceiver Module are used along with wireless communication to establish the USB port personality as either upstream facing or downstream facing. The ID_OUT signal from each transceiver to the attached USB port indicates upstream or downstream facing transceiver operation.

Table 2. Transceiver Personality Based on Pair Configuration

MOD6212 MOD6213 MOD6212 MOD6213 MOD6212 MOD6213

ID_IN ID_VAL ID_IN ID_VAL ID_OUT ID_OUT Facing Facing

1 1 0 1 0 Z US DS 0 1 2 in 1 Laptop

X 0 1 1 Z 0 DS US 1 0 Mobile Phone (as Device)

X 0 0 1 0 Z US DS 0 1 Mobile Phone (as Host)

MOD6212 MOD6213

VBUS_En VBUS_En

The “VBUS” supply from the upstream USB port is used as a VBUS_SENSE input to the transceiver. Note that a resistor divider or equivalent circuit should be used to reduce the +5V VBUS voltage level to a +3.3V voltage level that is compatible with the VBUS_SENSE input. The VBUS status is sent to the downstream facing transceiver, where the “VBUS_EN” signal is used to control the local VBUS status at the downstream USB connection.

When MOD6212 based Module transceiver is located in close proximity to another MOD6213 based Module transceiver, the two transceivers automatically establish a wireless connection, enabling high speed communication with the devices on the other side of the link. Establishing a wireless link is analogous to plugging in a USB cable. Once “connected”, this link will act and behave just like a wired USB 3.0 interface. The “ID_OUT” signal emulates the proper grounding of the ID pin that would be seen when attaching a USB 3.0 cable between devices. The “VBUS_EN” signal can be used to either drive a VBUS logic input, or an external FET transistor to actually switch the VBUS power to the downstream facing USB interface.

I2C Tunneling

I2C tunneling is a key feature of the MOD6212/13 Transceiver Module. It simply allows an I2C master on the MOD6212 to communicate with I2C devices connected to the MOD6213.

Module Installation Guide

I2C Master

SK6210/12-MOD SK6211/13-MOD I2C Slave(s)

SDA

SCL

SDA

SCL

I2C Slave(s)

SDA

SCL

SDA

SCL

SDA

Figure 5. MOD6212/13 Transceiver Module I2C tunnel principle

GPI, GPO, and LEDO

The MOD6212/13 Transceiver Module contains a general purpose input (GPI) and a general purpose output (GPO) as well as a dedicated led output (LEDO) pin. At system level those can be routed to a Host MCU or directly to LED devices.

The LEDO indicates the state of the wireless link. A persistent low (off state) indicates that the module transceiver is powered down or being held in reset. A periodic high (blink) indicates that the device is scanning for a connection. A high (on state) indicates that RF link is established.

Without a link present, GPO will be low (off state). When a link is established, and the transfer is in the Full speed mode (W0 state), the GPO will reflect the state of the GPI pin on the opposite side of the link. If the GPI pin on the opposite side of the link keeps high, the GPO output can be used to indicate a high speed data transfer. If the device goes into a “Detached State”, (link established but no data being transferred) the GPO signal will periodically go high (blink).

Each GPI pin can be used to control the state of the GPO pin on the opposite side of the link, but only when the link is in a Full Speed mode (W0 state).

GPI on MOD6212 to GPO on MOD6213 can also be used as interrupt function along with the WAKE_UP pin to wake up the wireless link and I2C host for service. Asserting WAKE_UP will force the wireless link to W0 state or stop the link from entering low power modes (W2, W3, IDLE). This combination of WAKE_UP pin and GPO/INT works together with the I2C Tunnel function to prevent the need for polling on the I2C tunnel from the master side.

Module Installation Guide

I2C Ma ster MOD62 12

MOD62 13

I2C S la ve(s)

SDA

SCL

SDA

SCL

SDA

SCL

SDA

SCL

INT

GPO

INT

GPI

WA KE _UP

Figure 6. MOD6212/13 Transceiver Module interrupt based I2C tunnel

Reset

The MOD6212/13 Transceiver module has an RST input pin that keeps the device in standby. The reset circuit is designed such that if an RST signal is not available. The part will generate an internal RST signal as the device is powered on.

No device driver needed

MOD6212/13 Transceiver module is software free product. Module does not need to install and to initialize the device driver to control the module to achieve the wired connectivity offered. As soon as the MOD6212/13 module detects each other through proximity detection and establishes the RF link within second, user could start the USB data transfer now.

Module Installation Guide

Modular approval for Lattice MOD6212/13 transmitter

MOD6212/MOD6213 radio is a low power 60GHz full duplex radio operating under §15.255 that provides very short range (<15mm) contactless bidirectional USB data transfer between two hosts. Spatial separation between receive and transmit antennas is used to allow simultaneous operation of two radio links on the same frequency to provide bidirectional data transfer.

Lattice is a module supplier and does not manufacture host systems.

Modular transmitter should meet all the applicable requirements.

1. The final host system shall be subject to unwanted radiated emission testing up to 40GHz with transmitter active and a test report shall be provided to the grantee. The grantee shall review that report and acknowledge to the host manufacturer that it demonstrates compliance.

2. Host manufacturer module placement shall comply with the following requirements:

a) The shielded side of the module shall face inwards to the host;

b) The open side of the module shall be immediately adjacent to the enclosure with no intermediate conducting material;

c) The spacing between unshielded side of module and enclosure shall be 3mm or less and must be free of any conducting material within a defined exclusion region (Figure 7).

d) The enclosure shall be constructed from non-conducting material adjacent to that exclusion region.

Module Installation Guide

A

Module PCB

Host enclosure (insulating)

Dimension A <= 3mm

26mm

10mm

Region with no metal permitted

Inward facing shielded side

MFC-VFBGA package

FRONT ELEVATION

PLAN ELEVATION

2.5mm

A

5mm

outward facing open side

2.5mm

direction of radiation

Figure 7: Module placement restrictions

Module Installation Guide

4mm

15mm

4mm

15mm

FCC ID: UK2-MOD621X

IC : 6705A-MOD621X

204-630017

Made In China

Sib eam Snap Technolog y Tra nsceiver module:MOD6213

FCC ID: UK2-MOD621X

IC : 6705A-MOD621X

204-630016

Made In China

R

Sib eam Snap Technolog y Tra nsceiver module:MOD6212

Lattice S emiconduc tor Co rp.

9.8 mm

FCC ID: UK2-MOD621X

IC : 6705A-MOD621X

Made In China

R

Sib eam Snap Technolog y Tra nsceiver module:MOD6213

204-630016

26 mm

5.0 mm

Lattice S emiconduc tor Co rp.

Proposed label

Proposed Module Location

Module Installation Guide

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

● Reorient or relocate the receiving antenna.

● Increase the separation between the equipment and receiver.

● Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

● Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

IMPORTANT NOTE: FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance

20cm between the radiator & your body.

IMPORTANT NOTE:

Module Installation Guide

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessar y when multi pl e mod ul es ar e used.

USERS MANUAL OF THE END PRODUCT:

In the user’s manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guideli n es for an uncontrolled environment can be satisfied.

The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment.

If the labelling area is small than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the user’s manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the following "Contains FCC ID: UK2-MOD621X.

If the labelling area is larger than the palm of the hand, then the following FCC part

15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

This Module may not be integrated into host devices that are addressed for operation inside airplanes/satellites.

Module Installation Guide

Brand

Model Name

Antenna Type

Gain (dBi)

Sibeam

SB6212

Chip

0

Sibeam

SB6213

Chip

2

Industry Canada Interference Statement

This device complies with Industry Canada License-exempt RSS standard(s). Opération is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne

doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage

radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

This radio transmitter (MOD6212/MOD6213) has been approved by Industry Canada to operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (MOD6212/MOD6213) a été approuvé par Industrie Canada pour

fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal

d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

List of antenna for each module :

IMPORTANT NOTE: IC Radiation Exposure Statement:

This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20cm

between the radiator & your body.

Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20

cm de distance entre la source de rayonnement et votre corps.

Module Installation Guide

IMPORTANT NOTE:

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to the product into which this certified RF module is integrated. Additional testing and certification may be necessar y when multi pl e mod ul es ar e used.

Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment.

USERS MANUAL OF THE END PRODUCT:

In the user’s manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the IC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied.

The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

LABEL OF THE END PRODUCT:

The final end product must be labeled in a visible area with the follow i ng "Contains IC: 6705A-MOD621X". The Host Model Number (HMN) must be indicated at any location

on the exterior of the end product or product packaging or product literature which shall be available with the end product or online.

Datasheet MOD621X Datasheet (Lattice Semiconductor)

Specifications and Main Features

Frequently Asked Questions

User Manual

Introduction

MOD6212/13 Diagram

MOD6212/13 transceiver Features

MOD6212/13 Transceiver Module Dimensions

MOD6212/13 Transceiver Module Pinout

MOD6212/13 Transceiver Module Connector

MOD6212/13 Transceiver Module Functional description

USB 3.0 Interface

I2C Tunneling

GPI, GPO, and LEDO

Reset

No device driver needed

Modular approval for Lattice MOD6212/13 transmitter