Datasheet MN13822, MN13812, MN1382, MN1381, MN1380 Datasheet (Panasonic)

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Microcomputer Peripheral LSIs
3
21
23 MN1380 - R
1381 23R
12
3
MN1380 Series
CMOS LSIs for Voltage Detection
Overview
The MN1380 series are elements that monitor the power supply voltage supplied to microcomputers and other LSI systems and issue reset signals for initializing the system after the power is first applied or for preventing runaway operation when the supply voltage fluctuates.
There is a choice of three output types: CMOS output, N-channel open drain output, and inverted CMOS out­put. There are also three package types: M, TO-92, and a mini type for surface mounting.
Choose the ideal element for your application from the series' wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts), output types, and package types.
Features
Three-pin element requiring no adjustment Wide selection of detection ranks (17 ranks between
2.0 and 4.9 volts) Highly precise detection voltage Detection voltage with hysteresis characteristic
VD = 50 mV for ranks C to K VD = 100 mV for ranks L to U
Low current consumption: IDD = 1µA (typ.) for V
= 5 V
Low fluctuation in detection voltage with tempera-
ture (typ. 1 mV/˚C)
Wide selection of output types: CMOS output, N-
channel open drain output, and inverted CMOS output
Wide selection of package types: M, TO-92, and a
mini type for surface mounting.
DD
Applications
Battery checkers Power outage detectors Level discriminators Memory backup systems Microcomputer reset circuits Reset circuits for other electronic circuits
Pin Assignment
TO-92 type package
Mini type package
M type package
2
LCR
1
3
1=OUT 2=V
DD
3=V
SS
1
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MN1380 Series Microcomputer Peripheral LSIs
MN1380 Series Naming Conventions
The MN1380 series offers a wide selection of detection ranks, output types, package types, and packaging. All combinations use the following naming conventions. When ordering, be sure to give the correct part number using these naming conventions.
MN13801–R (TA)
Winding direction for tape packaging
(TA) ...... Tape packaging for TO-92 type package
(TX)...... Embossed tape packing for mini type package
(TW)..... Embossed tape packing for mini type package
For further details, see the package specifications.
Detection voltage rank (C to U)
Output type: Blank ········ CMOS output 1················ N-channel open drain output 2 ················ inverted CMOS output
(Example)
MN13821–R (TW)
Minimum Packaging Unit
Package: 0 ················ M type package 1 ················ TO-92 type package 2 ················ Mini type package
Matsushita Electronics Corporation MN1380 series of voltage detection CMOS
LSIs with low current consumptions
Embossed tape packaging
R rank (detection voltage of 4.0 to 4.3 V)
N-channel open drain output
Mini type package
MN1380 series of voltage detection CMOS LSIs with low current consumption
Bulk (M and TO-92 types) ·············· 1,000
Magazine (Mini type) ······················ 50
Taping (Mini and TO-92 types)·······3,000
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Microcomputer Peripheral LSIs MN1380 Series
Series Lineup
Output
CMOS output MN1380 MN1381 MN1382 N-channel open drain output MN13801 MN13811 MN13821 Inverted CMOS output MN13802 MN13812 MN13822
Detection Ranks (on Voltage)
Rank
Detection Voltage for Drop in Power Supply Voltage (VDL)
C 2.0 2.2 D 2.1 2.3 E 2.2 2.4 F 2.3 2.5 G 2.4 2.6 H 2.5 2.7
J 2.6 2.9 K 2.8 3.1 L 3.0 3.3
M 3.2 3.5
N 3.4 3.7 P 3.6 3.9 Q 3.8 4.1 V 100 300 mV R 4.0 4.3 S 4.2 4.5 T 4.4 4.7 U 4.6 4.9
Package
min max min max
M type Package TO-92 type Package Mini type Package
Unit
Detection Voltage Hysteresis Width (VD)
V 50 300 mV
V 50 300 mV
Unit
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MN1380 Series Microcomputer Peripheral LSIs
Block Diagram
2
V
DD
Voltage Reference 1
+
Comparator
Level Converter
* Output Circuit
1
OUT
1
+
Voltage Reference 2
Note *1: Circuits vary slightly depending on the output type (CMOS output, N-channel open drain output, or inverted CMOS
output)
Comparator
3
V
SS
Pin Descriptions
Pin No. Symbol Function Description
1 OUT Reset signal output pin 2VDDPower supply pin 3VSSGround pin
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Microcomputer Peripheral LSIs MN1380 Series
Absolute Maximum Ratings V
=0V, Ta=25˚C
SS
Parameter Symbol Rating Unit
Power supply voltage V Output voltage V
DD
O
7.0 V
– 0.3 to V
+0.3 V
DD
Operating ambient temperature Ta –20 to +70 ˚C Storage temperature T
Recommended Operating Conditions
stg
VSS=0V, Ta=25˚C
–55 to +125 ˚C
Parameter Symbol Conditions min typ max Unit
Power supply
voltage
V
See Figures 1 and 4. 1.5 6.0 V
DD
Electrical Characteristics
1) DC Characteristics V
Parameter Symbol Conditions min typ max Unit
Power supply current I
Detection voltage for drop in power supply voltage Detection voltage hysteresis
*2
width "H" level output voltage V
"L" level output voltage V
=0V, Ta=–20˚C to +70˚C
SS
VDD = 5 V
DD
Load resistance = 10 kW
V
*2
DL
VD
OH
Ta=25˚C See Figures 1 and 4.
CMOS output IOH=– 40µA 0.8V Inverted VDD=1.8V CMOS output IOH=– 0.5mA –1.5
N-channel open V
OL
drain output I
Inverted VDD=6.0V V CMOS output IOH=0.3mA
*1
15µA
=1.8V V
DD
=0.7mA
OL
*
*
0.8
2
2
DD
SS
SS
V V
*
*
0.4
0.6
2
2
DD DD
V
mV
V
V
Notes *1: This includes the output pin's leakage current. *2: For particulars, see the detection voltage rank table.
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MN1380 Series Microcomputer Peripheral LSIs
Electrical Characteristics (continued)
2) AC Characteristics V
=0V, Ta=25˚C
SS
Parameter Symbol Conditions
Reset release time t
Reset time t
OH
OL
MN1380 MN13801 MN13802
Allowable Value (typ)
MN1381 MN13811 MN13812
Rank MN1382 MN13821 MN13822
C D E 3.0 2.5 230.0 F G
See H
Figures J 3.0 3.0 100.0 µs
2 and 3. K
L
M
N P Q 2.0 4.0 30.0 R S T C D E 250.0 160.0 3.0 F G
See H
Figures J 115.0 100.0 3.0 µs
2 and 3. K
L
M
N P Q 15.0 35.0 3.0 R S T
Unit
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Microcomputer Peripheral LSIs MN1380 Series
Description of Operation
V
DD
V
DH
V
DL
1.5V
0V
t
CMOS output, N-channel
V
OUT
0V
V
OUT
0V
open drain output
Inverted CMOS output Figure
MN1380/1381/1382 MN13801/13811/13821
t
OH
t
OL
MN13802/13812/13822
t
OL
t
OH
t
t
OH
OL
t
t
OH
OL
t
t
Figure 1. Description of Operation
Notes 1: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range. 2: VDL: Detection voltage for drop in power supply voltage
VDH: Detection voltage for rise in power supply voltage t
: Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that the
OL
output pin (OUT) goes to "L" level.
t
: Time lag between the time that the power supply voltage reaches the detection voltage (VDL or VDH) and the time that
OH
the output pin (OUT) goes to "H" level.
3: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and V
pins.
DD
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MN1380 Series Microcomputer Peripheral LSIs
Description for Measuring the Output Characteristics
V
DD
6.0V
1.6V
0V
6.0V
1.5V
1.0V
0V
6.0V
1.6V
1.5V
1.0V
0V
CMOS output, N-channel open drain output
MN1380/1381/1382 MN13801/13811/13821
t
OH
Inverted CMOS output
t
OH
MN13802/13812/13822
t
t
OL
t
t
OH
t
Figure 2. Description chart of Measuring the Output Characteristics
100k
V
DD
MN1380 Series
Switch: Connect when measuring N-channel open drain output (MN13801/MN13811/MN13821)
100pF
V
OUT
Figure 3. Circuit for Measuring the Output Characteristics
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Microcomputer Peripheral LSIs MN1380 Series
Description for Measuring the I/O Characteristics
V
OUT
CMOS output, N-channel open drain output
MN1380/1381/1382 MN13801/13811/13821
VD
Operation indeterminate
0
0 1.5V V
V
V
OUT
V
DL
DH
Inverted CMOS output
DD
MN13802/13812/13822
VD
Operation
0
indeterminate
0 1.5V V
V
V
DL
DH
DD
Figure 4. Description chart for Measuring the I/O Characteristics
Notes
: Output cannot be specified for power supply voltages under 1.5 V because operation is not guaranteed for that range.
1
: VDL: Detection voltage for drop in power supply voltage
2
VDH: Detection voltage for rise in power supply voltage
: These characteristics for the N-channel open drain output are when a load resistor is connected between the OUT and V
3
DD
pins.
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MN1380 Series Microcomputer Peripheral LSIs
Application Circuit Example
Connect resistors, capacitors, and the like only to the output pin on the MN1380 series element. Note that connect-
ing them to the Power source pins changes V
, VDL, and ∆VD.
DH
Sample Circuit 1
V
DD
OUT
MN1380 Series
C
Select the values of R and C to match the application.
V
MN1380 Series
Sample Circuit 2
DD
R
OUT
C
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Microcomputer Peripheral LSIs MN1380 Series
Package Dimensions (Unit:mm)
M type package
6.9±0.2
1.5
1.5
2.5±0.2
1.0
0.7R
12
0.85 0.55±0.10
2.5±0.5 2.5±0.5
3
0.4
1.0
4.5±0.24.1±0.2
0.45±0.10
1.25
2.5
1.25 1.25
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MN1380 Series Microcomputer Peripheral LSIs
Package Dimensions (continued)(Unit:mm)
TO-92 type package
5.0±0.2 4.0±0.2
5.1±0.213.5±0.5
0.45
+0.2
-
0.1
2.54
12
2.3±0.2
3
12
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Microcomputer Peripheral LSIs MN1380 Series
Package Dimensions (continued)(Unit:mm)
Mini type package
+0.20
-
0.05
2.9
+0.10
-
0.05
0.4
2
0.05
0.3
+0.25
-
+0.2
-
1.50.65±0.15
2.8
13
0.950.95
1.9±0.2
0.05
0.1
+0.10
-
+0.2
-
0.8
1.1
0.16
0.3
0.4±0.2 0.1
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MN1380 Series Microcomputer Peripheral LSIs
Reference Characteristics
The following characteristics curves represent results from a specific sample therefore they do not guarantee the
characteristics for the final product.
1.4
1.2
1.0
0.8
(µA)
DD
I
0.6
0.4
0.2
0
0 1.0 2.0
3.0 4.0 VDD(V)
Figure 5.a. IDD vs. VDD Characteristic (Rank Q)
2.0
5.0
6.0
7.0
V
SS
OUT
V
DD
A
V
Figure 5.b. Measurement Circuit
14
1.5
(µA)
DD
I
1.0
0.5 –40
–20 0
Ambient temperature, Ta (˚C)
20
40 60 80
Figure 6.a. IDD Temperature Characteristic (Rank Q)
V
SS
OUT
V
DD
A
5V
Figure 6.b. Measurement Circuit
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Microcomputer Peripheral LSIs MN1380 Series
Reference Characteristics (continued)
4.8
4.6
4.4
4.2
4.0
(V)
DH
,V
3.8
DL
V
3.6
3.4
–40 –20 0
20 40 60 80
Temperature Ta(˚C)
V
DH
V
DL
V
SS
OUT
V
DD
V
V
Figure 7.a. VDL/VDH Temperature Characteristic (Rank Q) Figure 7.b. Measurement Circuit
0.3
0.25
0.2
0.15
VD(V)
0.1
0.05
0 –40 –20 0 20 40 60 80
Ambient temperature, Ta (˚C)
Figure 8.a. VD Temperature Characteristic (Rank Q)
V
SS
OUT
V
DD
V
V
Figure 8.b. Measurement Circuit
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MN1380 Series Microcomputer Peripheral LSIs
Reference Characteristics (continued)
3
–30˚C Room temperature 80˚C
V
2
SS
OUT
V
DD
(mA)
OL
I
1
0
0
0.5
1.0 1.5 2.0 VOL(V)
2.5
3.0
1.8V
Figure 9.a. IOL vs. VOL Characteristic Figure 9.b. Measurement Circuit
20
–30˚C
Room temperature
15
10
(mA)
|
OH
| I
5
80˚C
V
SS
V
DD
5V
A
V
OUT
A
V
16
0
01
2
3
V
(V)
OL
4
5
Figure 10.a. IOH vs. VOH Characteristic Figure 10.b. Measurement Circuit
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Microcomputer Peripheral LSIs MN1380 Series
Reference Characteristics (continued)
2.5
2.0
1.5
(mA)
OL
I
1.0
0.5
V
SS
V
DD
1.8V
OUT
A
V
0
–40
–20
020
Ambient temperature, Ta (˚C)
40 60 80
Figure 11.a. IOL vs. Temperature Characteristic Figure 11.b. Measurement Circuit
7.0
| (mA)
OH
| I
6.5
6.0
5.5
5.0
4.5 –40
020
–20
Ambient temperature, Ta (˚C)
40 60 80
V
SS
V
DD
5V
OUT
A
V
Figure 12.a. IOH vs. Temperature Characteristic
Figure 12.b. Measurement Circuit
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MN1380 Series Microcomputer Peripheral LSIs
TO-92 Type Package Taping-Specifications (MN1381/MN13811/MN13812)
0
h
1
P
1
A
P
1
A
h
2
T
H
0
H
1
H l1
d
Drawing direction
F1F
P
2
0
Figure 13. TO-92 Type Package Taping-Dimensions (Ammunition pack)
TO-92 Type Package Taping Dimensions (Ammunition pack)
Name Symbol Length (mm)
Product height* A 5.3 max
Product width* A1 5.2 max
Product thickness* T 4.2 max
Lead width* d 0.45
+0.15 – 0.1
Taped lead length l1 2.0 max
Product pitch P 12.7±1.0
Feed hole pitch P0 12.7±0.3
Feed hole position P1 6.35±0.5
Lead spacing F1, F2 2.5
Product deflection angle ∆h1, ∆h2 2.0 max
Tape width W 18.0
+0.5 – 0.2
+1.0 – 0.5
2
W
0
W
2
t
1
t
W
øD
0
Name Symbol Length (mm)
Adhesive tape width W0 6.0±0.5
Feed hole position W1 9.0±0.5
Adhesive tape position W2 0.5 max
Distance to top of product H 25.0 max
Distance to
bottom of product
H0 19.0±0.5
Lead clinch height H1 16.0±0.5
Feed hole diameter D0 4.0±0.2
Tape thickness t1 0.7±0.2
Total tape thickness t2 1.5 max
Note*1: For further details, see the specifications issued separately.
18
WHD
330 250 41
Unit: mm
Figure 14. Box Dimensions for TO-92 Type Packages with Ammunition pack
Leave the space for at least three elements
H
25 elements (example)
E
B
W
D
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Microcomputer Peripheral LSIs MN1380 Series
Embossed Taping Specifications for Mini Type Package (MN1382/MN13821/MN13822)
There is a choice of two orientations, TW and TX, for the product relative to the tape.
TW
(Marking surface on top)
Figure 15. TW Orientation
1.75±0.1
8.0±0.3
3.5±0.05
A
ø1.5
4.0±0.1
+0.1
-0
Tape feed hole
Drawing direction
TX
(Marking surface on top)
Tape feed hole
Drawing direction
Figure 16. TX Orientation
Unit: mm
4.0±0.1
t+0.3±0.1
1.75±0.1
B
3.2±0.1
Product orientation A is labeled TW; orientation B, TX.
3.3±0.1
Figure 17. Embossed Taping Dimensions for Mini Type Package
ø21±0.8
2±0.5
10±1.5
ø13±0.5
2±0.5
Figure 18. Embossed Taping Reel Dimensions for Mini Type Package
ø80±1.0
ø178±2.0
Unit: mm
3,000 packages per reel
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MN1380 Series Microcomputer Peripheral LSIs
Reliability Testing Results for MN1380 Series
(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)
Test Subjects Test Conditions Results
Operating lifetime test VDD=5.5V, Ta=125˚C, t=1000hrs 0/15 High-temperature storage test Ta=150˚C, t=1000hrs 0/15 Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15 High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15 high-humidity storage test High-temperature, VDD=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15 high-humidity bias test Thermal shock test Ta=150˚C and –65˚C. 0/15
Five minutes at each temperature for ten cycles
Temperature cycle test Ta=150˚C and –65˚C. 0/15
Thirty minutes at each temperature for ten cycles Pressure cooker test Tw o a tmospheres for 50 hours at ambient tempera ture (Ta) of 121˚C 0/15 Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15 Solder heat resistance test Ambient temperature (Ta) of 270˚C for ten seconds 0/15
(2) Mini type package (MN1382/MN13821/MN13822)
Test Subjects Test Conditions Results
Operating lifetime test VDD=5.5V, Ta=125˚C, t=1000hrs 0/15 High-temperature storage test Ta=150˚C, t=1000hrs 0/15 Low-temperature storage test Ta=–65˚C, t=1000hrs 0/15 High-temperature, Ta=85˚C, RH=85%, t=1000hrs 0/15 high-humidity storage test High-temperature, V high-humidity bias test Thermal shock test Ta=150˚C and –65˚C. 0/15
Temperature cycle test Ta=150˚C and –65˚C. 0/15
Pressure cooker test *
1 Soldering test Ambient temperature (Ta) of 230˚C for five seconds 0/15 Solder heat resistance test *
1
=5.5V, Ta=85˚C, RH=85%, t=1000hrs 0/15
DD
Five minutes at each temperature for ten cycles
Thirty minutes at each temperature for ten cycles
Tw o a tmospheres for 24 hours at ambient tempera ture (Ta) of 121˚C 0/15
Ambient temperature (Ta) of 260˚C for five seconds 0/15
Note*1: Note that the testing conditions for the mini package differ from those for the other two packages.
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