This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 300 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Steady State Power Rating of 300 mW
• Small Body Outline Dimensions:
0.067” x 0.049” (1.7 mm x 1.25 mm)
• Low Body Height: 0.035” (0.9 mm)
• Package Weight: 4.507 mg/Unit
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These are Pb−Free Devices*
Mechanical Characteristics:
Void-free, Transfer-Molded Plastic
CASE:
FINISH: All External Surfaces are Corrosion Resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)
POLARITY: Cathode Indicated by Polarity Band
FLAMMABILITY RATING: UL 94 V−0
MOUNTING POSITION: Any
MAXIMUM RATINGS
RatingSymbolMaxUnit
Total Device Dissipation FR−4 Board,
(Note 1) @ T
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature RangeTJ, T
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
= 25°C
A
P
D
R
q
JA
stg
300
2.4
416°C/W
−65 to +150°C
mW
mW/°C
2
.
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SOD−323
CASE 477
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
M
xx G
G
xx = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
DevicePackageShipping†
MM3ZxxxT1GSOD−323
(Pb−Free)
SZMM3ZxxxT1GSOD−323
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD801 1/D.
3,000 /
Tape & Reel
3,000 /
Tape & Reel
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 o
this data sheet.
2. Zener voltage is measured with a pulse test current I
at an ambient temperature of 25°C.
Z
C
= 0
R
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2
Page 3
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
Z
, DYNAMIC IMPEDANCE ( )
2
C, CAPACITANCE (pF)
0
TYPICAL CHARACTERISTICS
1000
Ω
100
10
ZT
1.0
V
Z
TJ = 25°C
= 0.1 I
I
Z(AC)
f = 1 kHz
IZ = 1 mA
103.0
, NOMINAL ZENER VOLTAGE
Z(DC)
5 mA
Figure 1. Effect of Zener Voltage on Zener Impedance
1000
TA = 25°C
100
10
1.0
V
0 V BIAS1 V BIAS
BIAS AT
50% OF V
104.0
, NOMINAL ZENER VOLTAGE (V)
Z
NOM
Z
Figure 3. Typical Capacitance
80
70
1000
100
10
, FORWARD CURRENT (mA)
F
I
1.0
1000
100
10
1.0
0.1
0.01
0.001
, LEAKAGE CURRENT ( A)μ
R
I
0.0001
0.00001
150°C
75°C 25°C0°C
VF, FORWARD VOLTAGE (V)
Figure 2. Typical Forward Voltage
VZ, NOMINAL ZENER VOLTAGE (V)
Figure 4. Typical Leakage Current
+150°C
+25°C
−55°C
1.
1.11.00.90.80.70.60.50.4
7
6050403020100
100
10
1.0
0.1
, ZENER CURRENT (mA)
Z
I
0.01
TA = 25°C
108.06.04.02.00
, ZENER VOLTAGE (V)
V
Z
Figure 5. Zener Voltage versus Zener Current
(V
Up to 12 V)
Z
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12
100
10
1
0.1
, ZENER CURRENT (mA)
Z
I
0.01
1030507090
VZ, ZENER VOLTAGE (V)
Figure 6. Zener Voltage versus Zener Current
(12 V to 75 V)
3
TA = 25°C
Page 4
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
TYPICAL CHARACTERISTICS
100
80
60
40
POWER DISSIPATION (%)
20
0
250
5075100125150
TEMPERATURE (°C)
Figure 7. Steady State Power Derating
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4
Page 5
C
P
al
NOTE 3
MM3ZxxxT1G Series, SZMM3ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE H
H
E
D
1
L
NOTE 5
E
2b
A3
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
MILLIMETERS
DIM MIN NOM MAX
A0.80 0.90 1.00
A1 0.000.05 0.10
A30.15 REF
b0.25 0.320.4
C 0.089 0.12 0.177
D1.60 1.70 1.80
E1.15 1.25 1.35
0.08
L
H
2.30 2.502.70
E
STYLE 1:
PIN 1. CATHODE
2. ANODE
INCHES
MIN NOM MAX
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
ǒ
inches
mm
Ǔ
UBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
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Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
Sales Representative
MM3Z2V4T1/D
5
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