The ML6554 switching regulator is designed to convert
voltage supplies ranging from 2.3V to 4V into a desired
output voltage or termination voltage for various
applications. The ML6554 can be implemented to
produce regulated output voltages in two different modes.
In the default mode, when the V
ML6554 output voltage is 50% of the voltage applied to
V
. The ML6554 can also be used to produce various
CCQ
user-defined voltages by forcing a voltage on the VREF
pin. In this case, the output voltage follows the input
VREFIN voltage. The switching regulator is capable of
sourcing or sinking up to 3A of current while regulating an
output VTT voltage to within 3% or less.
The ML6554, used in conjunction with series termination
resistors, provides an excellent voltage source for active
termination schemes of high speed transmission lines as
those seen in high speed memory buses and distributed
backplane designs. The voltage output of the regulator
can be used as a termination voltage for other bus
interface standards such as SSTL, CMOS, Rambus™,
GTL+, VME, LV-CMOS, LV-TTL, and PECL.
pin is open, the
REF
IN
FEATURES
■ Power SOP package
■ Can source and sink up to 3A, no heat sink required
■ Integrated Power MOSFETs
■ Generates termination voltages for SSTL-2 SDRAM,
SGRAM, or equivalent memories
■ Generates termination voltages for active termination
schemes for GTL+, Rambus, VME, LV-TTL, PECL and
other high speed logic
■ V
■ Separate voltages for V
■ Buffered V
■ V
■ Minimum external components
■ Shutdown for standby or suspend mode operation
input available for external voltage divider
REF
and PV
output
REF
of ±3% or less at 3A
OUT
CCQ
DD
BLOCK DIAGRAM
15
V
CCQ
+
–
10
11
13
200kΩ
VREF
200kΩ
AGND
IN
■ Thermal Shutdown » 130ºC
GND
9
SRQ
12
V
DD
Q
SHDN
2
458
PV
P
GND1
DD1
7
PV
DD2
V
L1
(V
)
OUT
3
6
V
L2
(V
)
OUT
P
GND2
AV
REF
14
CC
BUFFER
+
–
VREF
OUT
OSCILLATOR/
GENERATOR
ERROR AMP
RAMP
16
V
V
FB
1
V
DD
–
+
RAMP
COMPARATOR
D
1
Page 2
ML6554
PIN CONFIGURATION
PIN DESCRIPTION
ML6554
16-Pin PSOP (U16)
PV
P
GND1
P
GND2
PV
D
GND
V
DD
DD1
V
V
DD2
L1
L2
1
2
3
4
5
6
7
8
TOP VIEW
AV
16
15
14
13
12
11
10
9
CC
V
CCQ
VREF
AGND
SHDN
VREF
V
FB
V
DD
OUT
IN
PINNAMEFUNCTION
1V
2PV
DD
DD1
Digital supply voltage
Voltage supply for internal po wer
transistors
3V
4P
5P
6V
7PV
L1
GND1
GND2
L2
DD2
Output voltage/ inductor connection
Ground for output power transistors
Ground for output power transistors
Output voltage/inductor connection
Voltage supply for internal po wer
transistors
8D
GND
Digital ground
PINNAMEFUNCTION
9V
10V
DD
FB
Digital supply voltage
Input for external compensation
feedback
11VREF
IN
Input for external reference voltage
12SHDNShutdown active low. CMOS input
level
13AGNDGround for internal reference voltage
divider
14VREF
15V
CCQ
OUT
Reference voltage output
Voltage reference for internal voltage
divider
16AV
CC
Analog voltage supply
2
NOVEMBER, 1999
Page 3
ABSOLUTE MAXIMUM RATINGS
ML6554
Absolute maximum ratings are those values beyond which
the device could be permanently damaged. Absolute
maximum ratings are stress ratings only and functional
Lead Temperature (Soldering, 10 sec) ..............................
Junction T emperature.......................................................
Storage Temperature Range .............................................
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, PVDD = 3.3V±10%, TA = Operating Temperature Range (Note 1)
SYMBOLPARAMETERCONDITIONSMINTYPMAXUNITS
SWITCHING REGULATOR
V
VREF
Z
Output Voltage, SSTL_2I
TT
(See Figure 1)V
Internal Resistor DividerI
OUT
V
IN
Reference Pin Input ImpedanceNote 2V
REF
= 0,V
OUT
= openV
REF
Note 2V
I
= ±3A,V
OUT
V
= openV
REF
Note 2V
= 0V
OUT
Note 2V
= 2.3V1.121.151.18V
CCQ
= 2.5V1.221.251.28V
CCQ
= 2.7V1.321.351.38V
CCQ
= 2.3V1.091.151.21V
CCQ
= 2.5V1.191.251.31V
CCQ
= 2.7V1.281.351.42V
CCQ
= 2.3V1.1391.151.162V
CCQ
= 2.5V1.2381.251.263V
CCQ
V
= 2.7V1.3371.351.364V
CCQ
= 0100kW
CCQ
Switching Frequency650kHz
DV
OFFSET
Offset Voltage V
TT
– VREF
OUT
V
= 2.5V No LoadV
CCA
SUPPLY
I
Quiescent CurrentI
Q
= 0, no loadI
OUT
BUFFER
I
REF
Note 1: Limits are guaranteed by 100% testing, sampling, or correlation with worst-case test conditions.
Note 2: AV
Note 3: Infinite heat sink
Output Load Current3mA
, PVDD = 3.3V ±10%
CC
NOVEMBER, 1999
= 2.5–12.512.5mV
CCQ
VCCQ
I
AVCC
I
DVCC
10µA
500µA
7mA
3
Page 4
ML6554
FUNCTIONAL DESCRIPTION
This switching regulator is capable of sinking and sourcing
3A of current without an external heatsink. The ML6554
uses a power surface mount package (PSOP) that includes
an integrated heat slug. The heat can be piped through the
bottom of the device and onto the PCB (Figure 2).
The ML6554 integrates two power MOSFETs that can be
used to source and sink 3A of current while maintaining a
tight voltage regulation. Using the external feedback, the
output can be regulated well within 3% or less,
depending on the external components chosen. Separate
voltage supply inputs have been added to accommodate
applications with various power supplies for the databus
and power buses.
OUTPUTS
, V
The output voltage pins (V
L1
are tied to the databus,
L2)
address, or clock lines via an external inductor. See the
Applications section for recommendations. Output
voltage is determined by the V
or VREFIN inputs.
CCQ
INPUTS
The input voltage pins (V
output voltages (VL1 or V
the VREF
the V
pin is floating, the output voltage is 50% of
IN
CCQ
input. V
can be the reference voltage for the
CCQ
or VREFIN) determine the
CCQ
. In the default mode, where
L2)
databus.
Output voltage can also be selected by forcing a voltage
at the VREF
the voltage at the VREF
pin. In this case, the output voltage follows
IN
input. Simple voltage dividers
IN
can be used this case to produce a wide variety of output
voltages between 2.3V to 4V.
VREF INPUT AND OUTPUT
The VREF
outputs (Inputs section, above). The VREF
input can be used to force a voltage at the
IN
OUT
pin is an
output pin that is driven by a small output buffer to
provide the V
signal to other devices in the system.
REF
The output buffer is capable of driving several output
loads. The output buffer can handle 3mA.
OTHER SUPPLY VOLTAGES
Several inputs are provide for the supply voltages: PV
PV
, AVCC, and VDD.
DD2
The PV
DD1
and PV
and provide the power supply to
DD2
DD1
the power MOSFETs. VDD provides the voltage supply to
the digital sections, while AV
supplies the voltage for
CC
the analog sections. Again, see the Applications section
for recommendations.
FEEDBACK INPUT
The VFB pin is an input that can be used for closed loop
compensation. This input is derived from the voltage
output. See application section for recommendation.
,
TPI
V
TT
TO SDRAMS
C1
820µF
F2V
OS-CON
L1 3.3µH
C2
0.1µF
R1 100Ω
C3 0.1µF
C4 0.1µF
R2 100Ω
1
V
DD
2
PV
3
V
L1
4
P
GND1
5
P
GND2
6
V
L2
7
PV
8
D
GND
R4 100kΩ
R5 1kΩ
Figure 1.
C9 0.1µF
U1
ML6554
DD1
DD2
C7 1nF
VREF
AV
V
CCQ
OUT
AGND
SHDN
VREF
V
V
CC
DD
220µF
2.5V TO 4V
220µF
GNDGND
C8 0.1µF
R3
100kΩ
16
15
14
13
12
11
IN
10
FB
9
V
CCQ
VREF
SHDN
VREF
OUT
IN
4
NOVEMBER, 1999
Page 5
APPLICATIONS
ML6554
USING THE ML6554 FOR SSTL BUS TERMINATION
The circuit schematic in Figure 1 shows a recommended
approach for an constructing a bus terminating solution for
an SSTL-2 bus. This circuit can be used in PC memory and
Graphics memory applications as shown in Figures 3 and
4. Note that the ML6554 can provide the voltage
reference (V
the layout as shown in Figures 5, 6, and 7, and measuring
the VTT performance using the test setup as described in
Figure 8, the ML6554 delivered a VTT ± 20mV for 1A to
3A loads (see Figure 9). Table 1 provides a recommended
parts list. For more recent Applications Notes or
Evaluation Boards contact Micro Linear.
POWER HANDLING CAPABILITY OF THE PSOP PACKAGE
Using the board layout shown in Figures 5,6, and 7;
soldering the ML6554 to the board at zero LFPM the
temperature around the package measured 55ºC for 3A
loads. Note that a 1ounce copper plane was used in the
board construction.
) and terminating voltages (VTT). Using
REF
Airflow is not likely to be needed in the operation of this
device (assuming a board layout similar to that described
above). T he power handling performance of the PSOP
package is shown by a study of the package manufacturer
for various airflow vs. qJA conditions in Figure 10.
BUS TERMINATION SOLUTIONS FOR OTHER BUSES
Table 2 provides a summary of various bus termination
V
& V
REF
those applications.
requirements. The ML6554 can be used for
TT
Figure 2. Cutaway view of PSOP Package
NOVEMBER, 1999
HEAT SLUG
5
Page 6
ML6554
168/184/208-PIN DIMM CONNECTORS
AND SDRAM/SGRAM MODULES
TERMINATION
RESISTORS
PC CHIP SET
NORTHBRIDGE
DATA LINE, CLOCK LINES,
ADDRESS LINES, CONTROL LINES
TERMINATION
RESISTORS
VREF
Figure 3. Complete Termination Solution PC Main Memory (PC Motherboard)
Table 1. Recommend Parts List for SSTL-2 Termination Circuit
10
NOVEMBER, 1999
Page 11
ML6554
(ºC/W)
JA
θ
60
40
20
0
0.21.01.41.80.6
0.0
0.41.21.62.00.8
POWER (W)
NATURAL CONVECTION ΘJA TEST RESULTS
1.27mm PITCH PowerSOP™ 2
SLUG SOLDERED
Figure 10. Graphical Results Summary – 1S2P Test Board
16Ld PSOP2
2.3x3.1mm PAD
1.9mm DIE
60
40
(ºC/W)
JA
Θ
20
16Ld PSOP2
2.3x3.1mm PAD
0
0200300500
AIR VELOCITY (LFPM)
FORCED CONVECTION ΘJA TEST RESULTS
1.27mm PITCH PowerSOP™ 2
1.9mm DIE @ 0.8 WATTS
SLUG SOLDERED
400100
DRAWING NUMBERENG-CB-1007 REV A
Applicable Jedec SpecJC 51-X (Note 1)
(Sroposed Spec)
Substrate MaterialFR-4
Dimensions (LxW) (Overall)114.3 x 76.2mm
Dimensions (LxW) (Metallization)55 x 65mm
Dimensions (LxW) (Inner Planes) 73 x 73mm
Thickness1.6 mm
Pitch1.27mm
Stackup (# Signal Layers, # Cu Planes)1S2P
Cu Trace Coverage (Signal Layer)12%
Cu Coverage (Internal Layer)100%
T r ace W idth (Spec/Measured)235.5±25.5/288µm
Trace Cu Thickness (Spec/Measured)70±14/67µm
Inner Cu Thickness (Spec/Measured)35±3.5/31µm
Build #C1797
Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages".
Figure 11. Test Board Layout for QJA vs. Airflow
NOVEMBER, 1999
11
Page 12
ML6554
BUSDESCRIPTIONDRIVINGVDDQVTTVREFMICROINDUSTRY
METHODLINEARSYSTEM
SOUTIONSCOMPONENTS
GTL+GunningOpen Drain5v or 3.3V 1.5V±10%1.0V±2%ML6554CU;300 to 500MHz
Tr ansceiverNote 10Note12Note 11Mode: V
REF
Bus PlusInput = 1.5V,PC Chipsets;
VCC = 5VGTLP 16xxx
SSTL_2Series StubSymmetric2.5V±10% 0.5x(V
)2.5VML6554CUSSTL SDRAM;
DDQ
TerminatedDrive, Series±3%or ML6553CS;Hitachi,
Logic for 2VResistanceMode: V
REF
Input = FloatingNEC, Micro,
or Forced,Mitsubishi
VCC = 3.3V
RAMBUSRAMBUSOpen DrainNone2.5V2.0VML6553CS;nDRAM,
SignalingSpecifiedMode: V
REF
LogicInput = Open,Intel, Toshiba
V
= V
CC
DDQ
L V-TTLLow VoltageSymmetric3.3±10%V
TTL Logic orDriveMode: V
/23.3VML6553CS;Processors o r
DDQ
REF
PECL orInput = Open,LV-TTL
3.3V VMEVCC = VDDQSDRAM,
Processor;
Buffers;
Fairchild,
Texas Instr.
Fujitsu,
RAMBUS,
backplanes;
EDO RAM
12
Table 2. Termination Solutions Summary By Buss Type
Products described herein may be covered by one or more of the following U.S. patents: 4,897,611; 4,964,026; 5,027,116;
5,281,862; 5,283,483; 5,418,502; 5,508,570; 5,510,727; 5,523,940; 5,546,017; 5,559,470; 5,565,761; 5,592,128; 5,594,376;
5,652,479; 5,661,427; 5,663,874; 5,672,959; 5,689,167; 5,714,897; 5,717,798; 5,742,151; 5,747,977; 5,754,012; 5,757,174;
5,767,653; 5,777,514; 5,793,168; 5,798,635; 5,804,950; 5,808,455; 5,811,999; 5,818,207; 5,818,669; 5,825,165; 5,825,223;
5,838,723; 5.844,378; 5,844,941. Japan: 2,598,946; 2,619,299; 2,704,176; 2,821,714. Other patents are pending.
Micro Linear makes no representations or warranties with respect to the accuracy, utility, or completeness of the contents
of this publication and reserves the right to make changes to specifications and product descriptions at any time without
notice. No license, express or implied, by estoppel or otherwise, to any patents or other intellectual property rights is granted
by this document. The circuits contained in this document are offered as possible applications only. Particular uses or
applications may invalidate some of the specifications and/or product descriptions contained herein. The customer is urged
to perform its own engineering review before deciding on a particular application. Micro Linear assumes no liability
whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Micro Linear products including
liability or warranties relating to merchantability, fitness for a particular purpose, or infringement of any intellectual property
right. Micro Linear products are not designed for use in medical, life saving, or life sustaining applications.
DS6554-01
NOVEMBER, 1999
13
Page 14
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