Datasheet ML6554CU Datasheet (Micro Linear Corporation)

Page 1
November 1999
FEATURING
POWER SOP
High-Performance
Thermal Dissipation Package
PRELIMINARY
ML6554
3A Bus Termination Regulator
GENERAL DESCRIPTION
The ML6554 switching regulator is designed to convert voltage supplies ranging from 2.3V to 4V into a desired output voltage or termination voltage for various applications. The ML6554 can be implemented to produce regulated output voltages in two different modes. In the default mode, when the V ML6554 output voltage is 50% of the voltage applied to V
. The ML6554 can also be used to produce various
CCQ
user-defined voltages by forcing a voltage on the VREF pin. In this case, the output voltage follows the input VREFIN voltage. The switching regulator is capable of sourcing or sinking up to 3A of current while regulating an output VTT voltage to within 3% or less.
The ML6554, used in conjunction with series termination resistors, provides an excellent voltage source for active termination schemes of high speed transmission lines as those seen in high speed memory buses and distributed backplane designs. The voltage output of the regulator can be used as a termination voltage for other bus interface standards such as SSTL, CMOS, Rambus™, GTL+, VME, LV-CMOS, LV-TTL, and PECL.
pin is open, the
REF
IN
FEATURES
Power SOP package
Can source and sink up to 3A, no heat sink required
Integrated Power MOSFETs
Generates termination voltages for SSTL-2 SDRAM,
SGRAM, or equivalent memories
Generates termination voltages for active termination
schemes for GTL+, Rambus, VME, LV-TTL, PECL and other high speed logic
V
Separate voltages for V
Buffered V
V
Minimum external components
Shutdown for standby or suspend mode operation
input available for external voltage divider
REF
and PV
output
REF
of ±3% or less at 3A
OUT
CCQ
DD
BLOCK DIAGRAM
15
V
CCQ
+ –
10
11
13
200k
VREF
200k
AGND
IN
Thermal Shutdown » 130ºC
GND
9
SRQ
12
V
DD
Q
SHDN
2
4 58
PV
P
GND1
DD1
7
PV
DD2
V
L1
(V
)
OUT
3
6
V
L2
(V
)
OUT
P
GND2
AV
REF
14
CC
BUFFER
+ –
VREF
OUT
OSCILLATOR/
GENERATOR
ERROR AMP
RAMP
16
V
V
FB
1
V
DD
– +
RAMP COMPARATOR
D
1
Page 2
ML6554
PIN CONFIGURATION
PIN DESCRIPTION
ML6554
16-Pin PSOP (U16)
PV
P
GND1
P
GND2
PV
D
GND
V
DD
DD1
V
V
DD2
L1
L2
1
2
3
4
5
6
7
8
TOP VIEW
AV
16
15
14
13
12
11
10
9
CC
V
CCQ
VREF
AGND
SHDN
VREF
V
FB
V
DD
OUT
IN
PIN NAME FUNCTION
1V 2PV
DD
DD1
Digital supply voltage Voltage supply for internal po wer
transistors 3V 4P
5P
6V 7PV
L1
GND1
GND2
L2
DD2
Output voltage/ inductor connection
Ground for output power transistors
Ground for output power transistors
Output voltage/inductor connection
Voltage supply for internal po wer
transistors 8D
GND
Digital ground
PIN NAME FUNCTION
9V
10 V
DD
FB
Digital supply voltage Input for external compensation
feedback
11 VREF
IN
Input for external reference voltage
12 SHDN Shutdown active low. CMOS input
level
13 AGND Ground for internal reference voltage
divider 14 VREF 15 V
CCQ
OUT
Reference voltage output
Voltage reference for internal voltage
divider 16 AV
CC
Analog voltage supply
2
NOVEMBER, 1999
Page 3
ABSOLUTE MAXIMUM RATINGS
ML6554
Absolute maximum ratings are those values beyond which the device could be permanently damaged. Absolute maximum ratings are stress ratings only and functional
Lead Temperature (Soldering, 10 sec) ..............................
Thermal Resistance (qJC)(Note 3) ........................... 2°C/W
Output Current, Source or Sink.................................3.0A
device operation is not implied.
OPERATING CONDITIONS
Temperature Range ....................................... 0°C to 70°C
PVDD Operating Range................................ 2.0V to 4.0V
+ 0.3V
IN
5.0V
PV
..........................................................................................
DD
Voltage on Any Other Pin ......GND – 0.3V to V
Average Switch Current (I
)..................................3.0A
AVG
Junction T emperature.......................................................
Storage Temperature Range .............................................
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, PVDD = 3.3V±10%, TA = Operating Temperature Range (Note 1)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
SWITCHING REGULATOR
V
VREF
Z
Output Voltage, SSTL_2 I
TT
(See Figure 1) V
Internal Resistor Divider I
OUT
V
IN
Reference Pin Input Impedance Note 2 V
REF
= 0, V
OUT
= open V
REF
Note 2 V I
= ±3A, V
OUT
V
= open V
REF
Note 2 V
= 0 V
OUT
Note 2 V
= 2.3V 1.12 1.15 1.18 V
CCQ
= 2.5V 1.22 1.25 1.28 V
CCQ
= 2.7V 1.32 1.35 1.38 V
CCQ
= 2.3V 1.09 1.15 1.21 V
CCQ
= 2.5V 1.19 1.25 1.31 V
CCQ
= 2.7V 1.28 1.35 1.42 V
CCQ
= 2.3V 1.139 1.15 1.162 V
CCQ
= 2.5V 1.238 1.25 1.263 V
CCQ
V
= 2.7V 1.337 1.35 1.364 V
CCQ
= 0 100 kW
CCQ
Switching Frequency 650 kHz
DV
OFFSET
Offset Voltage V
TT
– VREF
OUT
V
= 2.5V No Load V
CCA
SUPPLY
I
Quiescent Current I
Q
= 0, no load I
OUT
BUFFER
I
REF
Note 1: Limits are guaranteed by 100% testing, sampling, or correlation with worst-case test conditions. Note 2: AV Note 3: Infinite heat sink
Output Load Current 3 mA
, PVDD = 3.3V ±10%
CC
NOVEMBER, 1999
= 2.5 –12.5 12.5 mV
CCQ
VCCQ
I
AVCC
I
DVCC
10 µA
500 µA
7mA
3
Page 4
ML6554
FUNCTIONAL DESCRIPTION
This switching regulator is capable of sinking and sourcing 3A of current without an external heatsink. The ML6554 uses a power surface mount package (PSOP) that includes an integrated heat slug. The heat can be piped through the bottom of the device and onto the PCB (Figure 2).
The ML6554 integrates two power MOSFETs that can be used to source and sink 3A of current while maintaining a tight voltage regulation. Using the external feedback, the output can be regulated well within 3% or less, depending on the external components chosen. Separate voltage supply inputs have been added to accommodate applications with various power supplies for the databus and power buses.
OUTPUTS
, V
The output voltage pins (V
L1
are tied to the databus,
L2)
address, or clock lines via an external inductor. See the Applications section for recommendations. Output voltage is determined by the V
or VREFIN inputs.
CCQ
INPUTS
The input voltage pins (V output voltages (VL1 or V the VREF the V
pin is floating, the output voltage is 50% of
IN
CCQ
input. V
can be the reference voltage for the
CCQ
or VREFIN) determine the
CCQ
. In the default mode, where
L2)
databus.
Output voltage can also be selected by forcing a voltage at the VREF the voltage at the VREF
pin. In this case, the output voltage follows
IN
input. Simple voltage dividers
IN
can be used this case to produce a wide variety of output voltages between 2.3V to 4V.
VREF INPUT AND OUTPUT
The VREF outputs (Inputs section, above). The VREF
input can be used to force a voltage at the
IN
OUT
pin is an output pin that is driven by a small output buffer to provide the V
signal to other devices in the system.
REF
The output buffer is capable of driving several output loads. The output buffer can handle 3mA.
OTHER SUPPLY VOLTAGES
Several inputs are provide for the supply voltages: PV PV
, AVCC, and VDD.
DD2
The PV
DD1
and PV
and provide the power supply to
DD2
DD1
the power MOSFETs. VDD provides the voltage supply to the digital sections, while AV
supplies the voltage for
CC
the analog sections. Again, see the Applications section for recommendations.
FEEDBACK INPUT
The VFB pin is an input that can be used for closed loop compensation. This input is derived from the voltage output. See application section for recommendation.
,
TPI
V
TT
TO SDRAMS
C1 820µF F2V OS-CON
L1 3.3µH
C2
0.1µF
R1 100
C3 0.1µF
C4 0.1µF
R2 100
1
V
DD
2
PV
3
V
L1
4
P
GND1
5
P
GND2
6
V
L2
7
PV
8
D
GND
R4 100k
R5 1k
Figure 1.
C9 0.1µF
U1
ML6554
DD1
DD2
C7 1nF
VREF
AV
V
CCQ
OUT
AGND
SHDN
VREF
V
V
CC
DD
220µF
2.5V TO 4V
220µF
GNDGND
C8 0.1µF
R3
100k
16
15
14
13
12
11
IN
10
FB
9
V
CCQ
VREF
SHDN
VREF
OUT
IN
4
NOVEMBER, 1999
Page 5
APPLICATIONS
ML6554
USING THE ML6554 FOR SSTL BUS TERMINATION
The circuit schematic in Figure 1 shows a recommended approach for an constructing a bus terminating solution for an SSTL-2 bus. This circuit can be used in PC memory and Graphics memory applications as shown in Figures 3 and
4. Note that the ML6554 can provide the voltage reference (V the layout as shown in Figures 5, 6, and 7, and measuring the VTT performance using the test setup as described in Figure 8, the ML6554 delivered a VTT ± 20mV for 1A to 3A loads (see Figure 9). Table 1 provides a recommended parts list. For more recent Applications Notes or Evaluation Boards contact Micro Linear.
POWER HANDLING CAPABILITY OF THE PSOP PACKAGE
Using the board layout shown in Figures 5,6, and 7; soldering the ML6554 to the board at zero LFPM the temperature around the package measured 55ºC for 3A loads. Note that a 1ounce copper plane was used in the board construction.
) and terminating voltages (VTT). Using
REF
Airflow is not likely to be needed in the operation of this device (assuming a board layout similar to that described above). T he power handling performance of the PSOP package is shown by a study of the package manufacturer for various airflow vs. qJA conditions in Figure 10.
BUS TERMINATION SOLUTIONS FOR OTHER BUSES
Table 2 provides a summary of various bus termination V
& V
REF
those applications.
requirements. The ML6554 can be used for
TT
Figure 2. Cutaway view of PSOP Package
NOVEMBER, 1999
HEAT SLUG
5
Page 6
ML6554
168/184/208-PIN DIMM CONNECTORS
AND SDRAM/SGRAM MODULES
TERMINATION
RESISTORS
PC CHIP SET
NORTHBRIDGE
DATA LINE, CLOCK LINES,
ADDRESS LINES, CONTROL LINES
TERMINATION
RESISTORS
VREF
Figure 3. Complete Termination Solution PC Main Memory (PC Motherboard)
VTT
ML6554
6
NOVEMBER, 1999
Page 7
ML6554
3D
GRAPHIC CHIP
DATA LINE, CLOCK LINES,
ADDRESS LINES, CONTROL LINES
TERMINATION
RESISTORS
VOLTAGE
REGULATOR
5V OR 3.3V
2.5V
SO DIMM
AND MODULES
TERMINATION
RESISTORS
SGRAM
VREF
ML6554
VTT
AGP/PCI BUS
Figure 4. Complete Termination Solution Graphics Memory Bus – AGP Graphics Cards
NOVEMBER, 1999
7
Page 8
ML6554
Figure 5. Top Silk
Figure 6. Top Layer Figure 7. Bottom Layer
8
NOVEMBER, 1999
Page 9
3.3V POWER SUPPLY
ML6554
VA
V
CCQ
SUPPLY
VA
ACTIVE CLAMP
V
CCQ
Figure 8. Test Circuit Setup
V
DD
ML6554
EVAL
GND
V
TT
CURRENT SOURCE/SINK
POWER SUPPLY
I
TT
VTT VARIANCE WITH VDD@ITT (V
1.29
1.28
(V)
TT
V
1.27
1.26
2.0 2.5 3.0 4.03.5
TESTED WITH EVAL PCB
VDD (V)
Figure 9. VTT Performance for SSTL-2 Bus
CCQ
2.5V)
I
TT
3A SINKING
2A SINKING
1A SINKING
0A SINKING
3A SOURCING
2A SOURCING
1A SOURCING
NOVEMBER, 1999
9
Page 10
ML6554
ITEM QTY DESCRIPTION MANUFACTURER / PART NUMBER DESIGNATOR
RESISTORS
1 2 100W1210 SMD P anasonic/ERJ-8ENF1000V R1, R2 211kW 1210 SMD P anasonic/ERJ-8ENF1001V R5 3 2 100kW1210 SMD P anasonic/ERJ-8ENF1003V R3, R4
CAPACITORS
4 3 0.1µF 1210 Film SMD Panasonic/ECV3VB1E104K C2, C8, C9
Panasonic/ECU-V1H104KBW 5 1 820µF 2V Solid Elect. SMD Sanyo/ 2SV820M Os Con C1 6 2 330µF Tant 6.3V 100mW AVX/ TPSE337M006R0100 C5, C6 7 1 1nF 1210 Film SMD Panasonic/ECU-V1H102KBM C7 8 2 0.1µF 0805 Film Panasonic/ECJ-2VF1C104Z C3, C4
ICS
9 1 ML6554 Bus Terminator ML6554CU U1
Power SOP Package
MAGNETICS
1 0 1 3.3µH 5A inductor SMD Coilcraft/D03316P-332HC L1
Pulse Eng./ P0751.332T
Gowanda/SMP3316-331M
XFMRS inc./XF0046-S4
OTHER
11 1 Scope probe socket Tektronics/131-4353-00 TP1 1 2 1 12 Pin breakaway strip Sullins/PTC36SAAN (36 PINS) I/O, standoffs
VENDOR LIST
1. AVX (207) 282-5111
2. Sanyo (619) 661-6835
3. Tektronix (408) 496-0800
4. Coilcraft (847) 639-6400
5. Pulse (800) 797-8573
6. Gowanda (716) 532-2234
7. Xfmrs Inc. (317) 834-1066
8. Panasonic (714) 373-7366
9. Digikey (800) 344-4539
Table 1. Recommend Parts List for SSTL-2 Termination Circuit
10
NOVEMBER, 1999
Page 11
ML6554
(ºC/W)
JA
θ
60
40
20
0
0.2 1.0 1.4 1.80.6
0.0
0.4 1.2 1.6 2.00.8
POWER (W)
NATURAL CONVECTION ΘJA TEST RESULTS
1.27mm PITCH PowerSOP 2 SLUG SOLDERED
Figure 10. Graphical Results Summary – 1S2P Test Board
16Ld PSOP2
2.3x3.1mm PAD
1.9mm DIE
60
40
(ºC/W)
JA
Θ
20
16Ld PSOP2
2.3x3.1mm PAD
0
0 200 300 500
AIR VELOCITY (LFPM)
FORCED CONVECTION ΘJA TEST RESULTS
1.27mm PITCH PowerSOP 2
1.9mm DIE @ 0.8 WATTS
SLUG SOLDERED
400100
DRAWING NUMBER ENG-CB-1007 REV A
Applicable Jedec Spec JC 51-X (Note 1)
(Sroposed Spec)
Substrate Material FR-4 Dimensions (LxW) (Overall) 114.3 x 76.2mm Dimensions (LxW) (Metallization) 55 x 65mm Dimensions (LxW) (Inner Planes) 73 x 73mm Thickness 1.6 mm Pitch 1.27mm Stackup (# Signal Layers, # Cu Planes) 1S2P Cu Trace Coverage (Signal Layer) 12% Cu Coverage (Internal Layer) 100% T r ace W idth (Spec/Measured) 235.5±25.5/288µm Trace Cu Thickness (Spec/Measured) 70±14/67µm Inner Cu Thickness (Spec/Measured) 35±3.5/31µm Build # C1797
Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages".
Figure 11. Test Board Layout for QJA vs. Airflow
NOVEMBER, 1999
11
Page 12
ML6554
BUS DESCRIPTION DRIVING VDDQ VTT VREF MICRO INDUSTRY
METHOD LINEAR SYSTEM
SOUTIONS COMPONENTS
GTL+ Gunning Open Drain 5v or 3.3V 1.5V±10% 1.0V±2% ML6554CU; 300 to 500MHz
Tr ansceiver Note 10 Note12 Note 11 Mode: V
REF
Bus Plus Input = 1.5V, PC Chipsets;
VCC = 5V GTLP 16xxx
SSTL_2 Series Stub Symmetric 2.5V±10% 0.5x(V
) 2.5V ML6554CU SSTL SDRAM;
DDQ
Terminated Drive, Series ±3% or ML6553CS; Hitachi, Logic for 2V Resistance Mode: V
REF
Input = Floating NEC, Micro, or Forced, Mitsubishi VCC = 3.3V
RAMBUS RAMBUS Open Drain None 2.5V 2.0V ML6553CS; nDRAM,
Signaling Specified Mode: V
REF
Logic Input = Open, Intel, Toshiba
V
= V
CC
DDQ
L V-TTL Low Voltage Symmetric 3.3±10% V
TTL Logic or Drive Mode: V
/2 3.3V ML6553CS; Processors o r
DDQ
REF
PECL or Input = Open, LV-TTL
3.3V VME VCC = VDDQ SDRAM,
Processor;
Buffers; Fairchild, Texas Instr.
Fujitsu,
RAMBUS,
backplanes;
EDO RAM
12
Table 2. Termination Solutions Summary By Buss Type
NOVEMBER, 1999
Page 13
PHYSICAL DIMENSIONS inches (millimeters)
Package: U16
16-Pin PSOP
0.386 - 0.393
PIN 1 ID
9.80 - 9.98
HEAT SLUG
0.150 - 0.157
3.81 - 3.99
16
ML6554
HEAT SLUG
DIMENSIONS:
0.079 × 0.279 (2.01 × 7.09)
0.230 - 0.244 (5.84 - 6.20)
0.017 - 0.027
0.43 - 0.69 (4 PLACES)
0.055 - 0.061 (1.40 - 1.55)
1
0.014 - 0.019 (0.35 - 0.49)
ORDERING INFORMATION
PART NUMBER TEMPERATURE RANGE PACKAGE
ML6554CU 0°C to 70°C 16-Pin PSOP (U16)
0.050 BSC (1.27 BSC)
0.061 - 0.068 (1.55 - 1.73)
SEATING PLANE
Micro Linear Corporation
2092 Concourse Drive
San Jose, CA 95131 T el: (408) 433-5200
Fax: (408) 432-0295
www .microlinear.com
0.00 - 0.004
(0.127 - 0.25)
0º - 8º
0.016 - 0.035 (0.41 - 0.89)
0.0075 - 0.0098 (0.19 - 0.25)
© Micro Linear 1999. is a registered trademark of Micro Linear Corporation. All other trademarks are the property of their respective owners.
Products described herein may be covered by one or more of the following U.S. patents: 4,897,611; 4,964,026; 5,027,116; 5,281,862; 5,283,483; 5,418,502; 5,508,570; 5,510,727; 5,523,940; 5,546,017; 5,559,470; 5,565,761; 5,592,128; 5,594,376; 5,652,479; 5,661,427; 5,663,874; 5,672,959; 5,689,167; 5,714,897; 5,717,798; 5,742,151; 5,747,977; 5,754,012; 5,757,174; 5,767,653; 5,777,514; 5,793,168; 5,798,635; 5,804,950; 5,808,455; 5,811,999; 5,818,207; 5,818,669; 5,825,165; 5,825,223; 5,838,723; 5.844,378; 5,844,941. Japan: 2,598,946; 2,619,299; 2,704,176; 2,821,714. Other patents are pending.
Micro Linear makes no representations or warranties with respect to the accuracy, utility, or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, express or implied, by estoppel or otherwise, to any patents or other intellectual property rights is granted by this document. The circuits contained in this document are offered as possible applications only. Particular uses or applications may invalidate some of the specifications and/or product descriptions contained herein. The customer is urged to perform its own engineering review before deciding on a particular application. Micro Linear assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Micro Linear products including liability or warranties relating to merchantability, fitness for a particular purpose, or infringement of any intellectual property right. Micro Linear products are not designed for use in medical, life saving, or life sustaining applications.
DS6554-01
NOVEMBER, 1999
13
Page 14
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