Datasheet ML64P168-xxxGP, ML64P168-NGA, ML64P168-NGP, ML64P168-xxxGA Datasheet (OKI)

Page 1

FEDL64P168-01

This version: Sep. 27,1999

Semiconductor

Previous version: Jun.

22,1999

ML64P168

4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver

GENERAL DESCRIPTION

The ML64P168 is a one-time-programmable ROM-version product, which has one-time PROM (OTP) as internal program memory. On the other hand, the ML64168 is a mask ROM-version product, which has mask ROM as internal program memory. Unlike the mask ROM-version product (ML64168), the ML64P168 cannot be supplied in the form of a chip. The ML64P168 has two operation modes, microcontroller operation mode and PROM mode. The microcontroller operation mode is used to operate the ML64P168 like a ML64168 and the PROM mode is used to program or read the PROM.

The ML64P168 is a low power 4-bit microcontroller incorporating the Oki’s original CPU core nX4/30. The ML64P168 provides a minimum instruction execution time of 4.3µs (@700kHz). The ML64P168 contains 8160-byte program memory, 512-nibble data memory, three 4-bit input-output ports, 4-bit input port, 4-bit output port, 2-channel RC oscillation type A/D converter, LCD driver for up to 120 segments, and buzzer output port.

APPLICATION

The ML64P168 is best suited for low power, high precision thermometers and hygrometers.

FEATURES

∙ Processing speed

Minimum instruction execution time : 4.3 µs @700 kHz

91.6 µs @32.768 kHz

∙ Clock generation circuit

Low-speed clock : 32.768 kHz crystal oscillator High-speed clock : 700 kHz RC oscillator ( with an external resistor ) CPU clock is selectable as Low-speed clock / High-speed clock by software.

∙ Operating voltage : 1.5 V spec. / 3.0 V spec. ( selectable by mask option )

1.45 to 1.70 V (1.5V spec.)

2.7 to 3.5 V (3.0V spec.)

∙ Operating temperature : 0 to +65°C

The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date.

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FEDL64P168-01

Semiconductor

∙ Memory space

Internal program memory : 8160 bytes Internal data memory : 512 nibbles

∙ RC oscillation type A/D converter : 2 channels

Time division 2-channel method Counter A : 1 / ( 10 Counter B : 1 / 2

4

× 8 ) × 1

14

× 1

∙ I/O port

Input-output port : 3 ports× 4 bits Input port : 1 port× 4 bits Output port : 1 port× 4 bits

( 8 out of the 34 LCD driver outputs can be used as

output-only ports by mask option. )

∙ LCD driver : 34 outputs

(1) At 1/4 duty and 1/3 bias : 120 segments (max.) (2) At 1/3 duty and 1/3 bias : 93 segments (max.) (3) At 1/2 duty and 1/2 bias : 64 segments (max.) Voltage Regulator for LCD Driver (selectable by mask option)

The LCD panel display is stable regardless of temporary supply voltage drop, because the voltage generated by the voltage regulator for LCD driver is supplied to the bias voltage generator as a reference voltage.

LCD Operating Voltage

When the voltage regulator for LCD driver is used

: 3.6 V ( Duty cycle = 1/4 or 1/3 ) : 2.4 V ( Duty cycle = 1/2 )

When the voltage regulator for LCD driver is not used

: 4.5 V ( Duty cycle = 1/4 or 1/3 ) : 3.0 V ( Duty cycle = 1/2 )

∙ Buzzer driver : 1 output ( 4 output modes selectable ) ∙ Serial port : Synchronous 8-bit transfer

Selectable as external clock / internal clock

Selectable as MSB first / LSB first

∙ Capture circuit : 2 channels ( 32Hz, 64Hz, 128Hz, 256Hz ) ∙ Battery check circuit : 1 ( incorporated into the input-only port ) ∙ Watchdog timer ∙ Interrupt

External interrupt : 2 sources Internal interrupt : 8 sources

∙ Package:

80-pin plastic QFP ( QFP80-P-1420-0.80-BK )

Product name : ML64P168 - xxxGP ( written PROM )

ML64P168 - NGP ( blanked PROM ) 80-pin plastic QFP ( QFP80-P-1414-0.65-K )

Product name : ML64P168 - xxxGA ( written PROM )

ML64P168 - NGA ( blanked PROM )

xxx indicates a code number.

ML64P168

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FEDL64P168-01

Semiconductor

PROGRAM DEVELOPMENT ENVIRONMENT

∙ Structured Assembler : SASM64K ∙ In Circuit Emulator : EASE64168 ∙ Debugger : DT64K

ML64P168

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FEDL64P168-01

Semiconductor

BLOCK DIAGRAM

BSR

MIEF

HALT

TIMING

CONTROLLER

C

B A

SP

CPU CORE: nX-4/30

DATA BUS ( 8 )

TR0

ALU

DATA BUS ( 8 )

TR1TR2

PCH

PCM PCL

X YH L

IR

DECORDER

IR

ROMR

ML64P168

V

PP

PROM

8160

Bytes

OSC1 OSC2

XT XT

RST

TST1

TST2

2CLK

RSTC

TST

INT

TBC

BC

RAM

512

Nibbles

5

INT

SIOP

ADDRESS BUS

BIAS

V V V

C1

DD1

DD2

DD3

C2

BD

BD

LCD

L0 L1

to

L33

IN0

CS0 RS0

CRT0

RT0

IN1 CS1 RS1

RT1

INT

INT

CAPR

INTC

WDT

ADC

INT

INT

V

DDI

P2 P3 P4

V

DDI

P2.0 P2.1

to

P4.3

P1.0

P1

P1.1 P1.2

P1.3

V

DDI

P0.0

P0

P0.1 P0.2

P0.3

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FEDL64P168-01

Semiconductor

PIN CONFIGURATION (TOP VIEW)

L0

L1

L2

L3

L4

L5

L6

L7

L8

L9

L10

L11

L12

L13

L14

L15

L16

P2.0

P2.1

P2.2

P2.3

P3.0

P3.1

P3.2

P0.3

80

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

P0.2

79

P0.1

78

P0.0

77

P1.3

76

P1.2

75

P1.1

74

P1.0

73

TST2

72

TST1

71

RESET

XT

70

69

XT

68

DD

V

67

OSC1

OSC2

66

65

64

63

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

ML64P168

L33 / P6.3

L32 / P6.2

L31 / P6.1

L30 / P6.0

L29 / P5.3

L28 / P5.2

L27 / P5.1

L26 / P5.0

L25

L24

L23

L22

L21

L20

L19

L18

L17

C2

C1

DD3

V

DD2

V

DDI

V

DD1

V

RT1

25

P3.3

26

P4.0

27

28

29

30

31

32

33

34

PPVSS

BD

P4.1

P4.2

P4.3

V

RT0

CRT0

( GP : QFP80-P-1420-0.80-BK )

80-Pin Plastic QFP

35

RS0

36

CS0

37

IN0

38

IN1

39

CS1

40

RS1

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Semiconductor

PIN CONFIGURATION (TOP VIEW) ( continued )

L1

L0

L2

L3

L4

L5

L6

L7

L8

L9

L10

L11

L12

L13

L14

L15

L16

P2.0

P2.1

P2.2

P2.3

P3.0

10

11

12

13

14

15

16

17

18

19

20

P0.3

80

79

78

1

2

3

4

5

6

7

8

9

P0.2

77

P0.1

76

P0.0

75

P1.3

74

P1.2

73

P1.1

72

P1.0

71

TST2

70

TST1

69

RESET

XT

68

67

XT

66

DD

V

65

OSC1

64

OSC2

63

L33 / P6.3

L32 / P6.2

62

61

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

ML64P168

L31 / P6.1

L30 / P6.0

L29 / P5.3

L28 / P5.2

L27 / P5.1

L26 / P5.0

L25

L24

L23

L22

L21

L20

L19

L18

L17

C2

C1

V

DD3

V

DD2

V

DDI

21

P3.1

22

P3.2

23

P3.3

24

P4.0

25

26

27

28

29

30

31

32

PPVSS

BD

P4.1

P4.2

P4.3

V

RT0

CRT0

( GA : QFP80-P-1414-0.65-K )

80-Pin Plastic QFP

33

RS0

34

CS0

35

IN0

36

IN1

37

CS1

38

RS1

39

RT1

40

DD1

V

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FEDL64P168-01

Semiconductor

ML64P168

PIN DESCRIPTIONS

The basic functions of each pin of the ML64P168 is described in Table 1. A symbol with a slash ( / ) denotes a pin that has a secondary function. Refer to Table 2 for secondary functions. For Type, “ - ” denotes a power supply pin, “ I ” an input pin, “O” an output pin, and “I/O” an inputoutput pin.

Table 1 Pin Descriptions ( Basic Functions )

Function Symbol

SS

V

DD

V

DD1

V

DD2

V

Power

Supply

DD3

V

DDI

V

Pin No.

GP GA

Type Description

32 30 - 0V power supply

67 65 - Positive power supply

42 40 -

44 42 -

45 43 -

Bias output for driving LCD (+1.5 V, +1.2 V* )

Bias output for driving LCD (+3.0 V, +2.4 V* )

Bias output for driving LCD (+4.5 V, +3.6 V* )

43 41 - Positive power supply for I/O port interface

PP

V

C1 46 44 -

C2 47 45 -

XT

XT 68 66 O

31 29 - Power supply (+12.5 V) for PROM writing

Pins for connecting a capacitor for generating LCD driving bias

69 67 I

Low-speed clock oscillation input and output pins. Connect to a crystal ( 32.768 kHz ).

Oscillation

Test

OSC1 66 64 I

OSC2 65 63 O

TST1

TST2

71 69 I

72 70 I

High-speed clock oscillation input and output pins. Connect to an external resistor for oscillation ( R

Input pins for testing. A pull-up resistor is internally connected to these pins.

System reset input pin.

Reset

RESET

70 68 I

Setting this pin to ″ L ″ level puts this device into a reset state. Then, setting this pin to ″ H ″ level starts executing an instruction from address 0000H.

*When the voltage regulator for LCD driver is used.

OS

).

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FEDL64P168-01

Semiconductor

Table 1 Pin Descriptions ( Basic Functions ) ( continued )

Function Symbol

P0.0/

INT1/

CAPIN0

P0.1/

INT1/

CAPIN1

P0.2/

INT1

P0.3/

INT1/

CMP

P1.0 73 71

P1.1 74 72

P1.2 75 73

Pin No.

GP GA

77 75

78 76

79 77

80 78

Type Description

4-bit input port ( Port 0 ) Selectable as pull-up resistor input, pull-down resistor input, or high impedance input by the port 01 control register ( P01CON ).

I

4-bit output port ( Port 1 ) Selectable as NMOS open drain output or CMOS output by

O

the port 01 control register ( P01CON ). P1.0 is a high current drive output port.

ML64P168

Ports

P1.3 76 74

P2.0/

INT0

P2.1/

INT0

P2.2/

INT0

P2.3/

INT0

P3.0/

INT0

P3.1/

INT0

P3.2/

INT0

18 16

19 17

20 18

21 19

22 20

23 21

24 22

P3.3/

INT0/

25 23

SIN

P4.0/

INT0/

26 24

SOUT

P4.1/

INT0/

27 25

SPR

P4.2/

INT0/

28 26

SCLK

P4.3/

INT0/

29 27

MON

I/O

I/O

I/O

4-bit input-output port ( Port 2 ) Fllowing can be specified for each bit by the port 2 control registers 0 to 3 ( P20CON to P23CON ). (1) input or output (2) pull-up/pull-down resistor input or high impedance input (3) NMOS open drain output or CMOS output

4-bit input-output port ( Port 3 ) Following can be specified for each bit by the port 3 control registers 0 to 3 ( P30CON to P33CON ). (1) input or output (2) pull-up/pull-down resistor input or high impedance input (3) NMOS open drain output or CMOS output

4-bit input-output port ( Port 4 ) Following can be specified for each bit by the port 4 control registers 0 to 3 ( P40CON to P43CON ). (1) input or output (2) pull-up/pull-down resistor input or high impedance input (3) NMOS open drain output or CMOS output

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FEDL64P168-01

Semiconductor

Table 1 Pin Descriptions ( Basic Functions ) ( continued )

Function Symbol

Buzzer BD 30 28 O Output pin for the buzzer driver.

RT03331O

CRT0 34 32 O

RS0 35 33 O

CS0 36 34 O

A/D

Converter

IN0 37 35 I

RT14139O

RS1 40 38 O

CS1 39 37 O

IN1 38 36 I

Pin No.

GP GA

Type Description

Resistance temperature sensor connection pin ( for channel 0 ) Resistance/capacitance temperature sensor connection pin ( for channel 0 ) Reference resistor connection pin ( for channel 0 ) Reference capacitor connection pin ( for channel 0 ) Input pin for RC oscillator circuit ( for channel 0 ) Resistance temperature sensor connection pin ( for channel 1 ) Reference resistor connection pin ( for channel 1 ) Reference capacitor connection pin ( for channel 1 ) Input pin for RC oscillator circuit ( for channel 1 )

ML64P168

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FEDL64P168-01

Semiconductor

Table 1 Pin Descriptions ( Basic Functions ) ( continued )

Function Symbol

L0 1 79 O

L1 2 80 O

L2 3 1 O

L3 4 2 O

L4 5 3 O

L5 6 4 O

L6 7 5 O

L7 8 6 O

L8 9 7 O

L9 10 8 O

L10 11 9 O

Pin No.

GP GA

ML64P168

Type Description

LCD segment and common signals output pins.

LCD

Driver

L11 12 10 O

L12 13 11 O

L13 14 12 O

L14 15 13 O

L15 16 14 O

L16 17 15 O

L17 48 46 O

L18 49 47 O

L19 50 48 O

L20 51 49 O

L21 52 50 O

L22 53 51 O

L23 54 52 O

L24 55 53 O

L25 56 54 O

L26 / P5.0 57 55 O

L27 / P5.1 58 56 O

L28 / P5.2 59 57 O

LCD segment and common signals output pins. These pins can be configured to be output ports by a mask option.

L29 / P5.3 60 58 O

L30 / P6.0 61 59 O

L31 / P6.1 62 60 O

L32 / P6.2 63 61 O

L33 / P6.3 64 62 O

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Semiconductor

Function Symbol

P2.0/

INT0

P2.1/

INT0

P2.2/

INT0

P2.3/

INT0

P3.0/

INT0

P3.1/

INT0

P3.2/

INT0

P3.3/

External

Interrupt

INT0

P4.0/

INT0

P4.1/

INT0

P4.2/

INT0

P4.3/

INT0

P0.0/

INT1

P0.1/

INT1

P0.2/

INT1

P0.3/

INT1

P0.0/

Capture

trigger

CAPIN0

P0.1/

CAPIN1

P3.3/

SIN

P4.0/

Serial

port

SOUT

P4.1/

SPR

P4.2/

SCLK

Table 2 Pin Descriptions ( Secondary Functions )

Pin No.

GP GA

18 16

19 17

20 18

21 19

22 20

23 21

24 22

25 23

26 24

27 25

28 26

29 27

77 75

78 76

79 77

80 78

77 75

78 76

25 23 I

26 24 O

27 25 O

28 26 I/O

Type Description

Secondary functions of P2.0 to P2.3, P3.0 to P3.3, and P4.0 to P4.3: Level-triggered external 0 interrupt input pins. The change of input signal level causes an interrupt to occur.

I

I

I

Secondary functions of P0.0 to P0.3: Level-triggered external 1 interrupt input pins. The change of input signal level causes an interrupt to occur.

I

Secondary functions of P0.0: This pin is assigned the capture circuit trigger input pin of CAPR0 function .

I

Secondary functions of P0.1: This pin is assigned the capture circuit trigger input pin of CAPR1 function . Secondary functions of P3.3: This pin is assigned the data input of a serial port. Secondary functions of P4.0: This pin is assigned the data output of a serial port. Secondary functions of P4.1: This pin is assigned the ready output of a serial port. Secondary functions of P4.2: This pin is assigned the clock input-output of a serial port.

ML64P168

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Semiconductor

Table 2 Pin Descriptions ( Secondary Functions ) ( continued )

Function Symbol

RC

Oscillation

Monitor

Battery

Check

P4.3/

MON

P0.3/

CMP

Pin No.

GP GA

Type Description

29 27 O

80 78 I

ML64P168

Secondary functions of P4.3: This pin is a monitor output of the RC oscillation clock for an A/D converter and a 700kHz RC oscillation clock for a system clock. Secondary functions of P0.3: This pin is an analog comparator input pin for battery check circuit.

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FEDL64P168-01

Semiconductor

MEMORY MAPS

Program Memory ( PROM )

1FFFH

1FE0H

003EH

Interrupt area

0020H

Test program area

8160 bytes

ML64P168

32 bytes

Contents of interrupt area

003BH Watchdog interrupt

0038H External 0 interrupt

0035H Serial port interrupt

0032H External 1 interrupt

002FH A/D converter interrupt

002CH 256Hz interrupt

0029H 32Hz interrupt

0026H 16Hz interrupt

0023H 1Hz interrupt

0020H 0.1Hz interrupt

CZP area

0010H

0000H

Start address

8 bits

Program Memory Map

Address 0000H is the instruction execution start address by the system reset. The CZP area from address 0010H to address 001FH is the start address for the CZP subroutine of 1byte call instruction. The start address of interrupt subroutine is assigned to the interrupt address from address 0020H to 003DH. The user area has 8160 bytes of address 0000H to 1FDFH. No program can be stored in the test program area.

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Semiconductor

ML64P168

Data Memory

The data memory area consists of 8 banks and each bank has 256 nibbles ( 256 × 4 bits ). The data RAM is assigned to BANK 6, BANK 7 and peripheral ports are assigned to BANK 0.

7FFH

780H

700H

6FFH

600H

BANK7

Data RAM area

( 256 nibbles )

512 nibbles

BANK6

Data RAM area

( 256 nibbles )

Data / Stack area ( 128 nibbles )

Contents of 000H to 07FH

07FH

Inaccessible area

SFR area

100H

0FFH

080H

07FH

000H

Unused area

BANK0

000H

4 bits

Data Memory Map

Half the BANK 7 of Data RAM area ( 128 nibbles ) is shared by the stack area. The stack is a memory starting from address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call Instruction and 8 nibbles are used by an interrupt. The addresses 080H to 0FFH of BANK 0 are not assigned as the data memory, so access to these addresses has no effect. Moreover, it is impossible to access BANK 1 to BANK 5.

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ABSOLUTE MAXIMUM RATINGS ( 1.5

Parameter Symbol Condition Rating Unit

Power supply voltage 1 V

Power supply voltage 2 V

Power supply voltage 3 V

Power supply voltage 4 V

Power supply voltage 5 V

Input voltage 1 V

Input voltage 2 V

Output voltage 1 V

Output voltage 2 V

Output voltage 3 V

Output voltage 4 V

Output voltage 5 V

Power Dissipation PD

Storage temperature T

DD1

DD2

DD3

DDI

DD

IN1

IN2

OUT1

OUT2

OUT3

OUT4

OUT5

STG

VDD input, Ta = 25°C

DDI

V

DD1

V

DD2

V

DD3

V

VDD output, Ta = 25°C

DDI

V

QFP80-P-1420-0.80-BK

QFP80-P-1414-0.65-K

V Spec. )

(VSS = 0V)

Ta = 25°C -0.3 to + 2.0 V

Ta = 25°C -0.3 to + 4.0 V

Ta = 25°C

Ta = 25°C

Ta = 25°C

-0.3 to + 5.5 V

-0.3 to + 5.5 V

-0.3 to + 2.0 V

-0.3 to VDD+ 0.3 V

input, Ta = 25°C

output, Ta = 25°C

output, Ta = 25°C

output, Ta = 25°C

-0.3 to V

-0.3 to V

-0.3 to V

-0.3 to V

DDI

+ 0.3 V

DD1

+ 0.3 V

DD2

+ 0.3 V

DD3

+ 0.3 V

-0.3 to VDD+ 0.3 V

output, Ta = 25°C

Ta = 0 to + 65°C

Ta = 0 to + 65°C

-0.3 to VDD+ 0.3 V

381 mW

334 mW

- -55 to + 150

ML64P168

°

C

RECOMMENDED OPERATING CONDITIONS ( 1.5V Spec. )

Parameter Symbol Condition Rating Unit

VDD,V

DDI

V

R

XT

op

OS

DD1

-0 to + 65

- 1.45 to 1.70 V

- 2.70 to 5.25 V

- 60 to 200

- 30 to 35 kHz

Operating Temperature* T

Operating Voltage*

External 700kHz RC Oscillator Resistance*

Crystal oscillation frequency* f

* : At Non-regulated LCD driver.

In case of select a voltage regulated LCD driver, see P.37/51.

(VSS = 0V)

°

C

Ω

k

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Semiconductor

ELECTRICAL CHARACTERISTICS ( 1.5

DC Characteristics ( 1.5 V Spec. )

(VSS=0V, V

Parameter Symbol Condition Min. Typ. Max. Unit

DD2

V

Vo l t a ge * V

DD3

V

Vo l t a ge * V

Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 700kHz RC Oscillator Capacitance

700kHz RC Oscillation Frequency

POR Generation Vo l t a g e POR Non-generation Vo l t a g e Battery Check Reference Voltage VRB Temperature Va r ia t i o n

V

V

T

C

V

V

∆

DD2

DD3

STA

HOLD

STOP

C

GEX

C

OS

C

OSC

f

POR1

POR2

RB

V

V

Ca, Cb, C12=0.1µF

Ca, Cb, C12=0.1µF

Oscillation start time: within 5 seconds

G

When external CG used 10 - 30 pF

D

External resistor ROS=160k VDD = 1.45 to 1.70V When VDD is between

POR1

V

and 1.5V No POR when VDD is between V

Ta = 25°C

RB

DD1=VDD

-

-

-

-101520pF

- 8 12 16 pF

POR2

and 1.5V

-

V Spec. )

=1.5V, V

+100%

-50%

+100%

-50%

Ω

ML64P168

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified )

Measuring

Circuit

2.8 3.0 3.2 V

4.3 4.5 4.7 V

1.47 - - V

1.40 - - V

0.1 - 1000 ms

10 15 20 pF

80 280 350 kHz

0-0.4V

1.4 - 1.5 V

0.50 0.60 0.70 V

--2-

mV/°C

1

2

Notes: 1.”POR” denotes Power On Reset.

STOP

2.”T

” indicates that if the crystal oscillator stops over the value of T

* : At Non-regulated LCD driver.

In case of select a voltage regulated LCD driver, see P.37/51.

STOP

, the system reset occurs.

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FEDL64P168-01

Semiconductor

DC Characteristics ( 1.5V Spec. ) ( Continued )

SCK

=300kHz,

DD1=VDD

=1.5V, V

(VSS=0V, V

Parameter Symbol Condition Min. Typ.

Supply current 1* I

Supply current 2* I

Supply current 3 I

Supply current 4 I

Supply current 5 I

Supply current 6 I

DD1

DD2

DD3

DD4

DD5

DD6

CPU in halt state (700kHz RC oscillation stop) CPU in operating state (700kHz RC oscillation stop) CPU in operating state (700kHz RC oscillation in operation) Serial transfer, f CPU in operating state (700kHz RC oscillation stop) CPU in halt state (700kHz RC oscillation stop) RC oscillation for A/D converter is in operating state Battery check circuit in operating state, CPU in operating state (700kHz RC oscillation stop)

RT0=10k

T0

=2k

R

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified )

Ω

Ω

Max

.

-25

-1530

- 200 300

- 60 100

- 150 230

- 600 900

- 25 125

ML64P168

Unit

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

Measur-

ing

Circuit

1

* : At Non-regulated LCD driver.

In case of select a voltage regulated LCD driver, see P.37/51.

17/51

Page 18

FEDL64P168-01

Semiconductor

DC Characteristics (1.5 V Spec. ) ( Continued )

(VSS=0V, V

DD1=VDD

=1.5V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Output current 1 ( P1.0 )

Output current 2 ( P1.1 to P1.3 )

OH1

I

OL1

I

OH1S

I

OL1S

I

OH2

I

OL2

I

OH1

V

= V

OL1

V

= 0.5V 2 5 20

DDI

V

= 5.0V, V

DDI

V

= 5.0V, V

OH2

V

= V

OL2

V

= 0.5V 0.7 2.0 6.0

( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 )

Output current 3 ( BD )

Output current 4

OH2S

I

OL2S

I

OH3

I

OL3

I

OH4

I

DDI

V

= 5.0V, V

DDI

V

= 5.0V, V

OH3

V

= VDD - 0.7V -1.8 -0.6 -0.1

OL3

V

= 0.7V 0.2 2 4

OH4

V

= VDD - 0.1V -1.1 -0.6 -0.2

( RT0, RT1, RS0, RS1, CRT0, CS0, CS1 )

Output current 5 ( When the pins

I

I

I

OL4

OH5

OL5

OL4

V

= 0.1V 0.3 0.6 1.1

OH5

V

= V

OL5

V

= 0.5V 0.15 1.0 4

L26 to L33 are configured as output ports )

Output current 6 ( OSC2 )

OH5S

I

OL5S

I

OH6

I

OL6

I

OH7

I

DDI

V

= 5V, V

DDI

V

= 5V, V

OH6

V

= V

OL6

V

= 0.5V 0.15 0.7 2.1

OH7

V

= V

DD2

=3.0V, V

DDI

- 0.5V -6.0 -1.7 -0.7

OH1S

OL1S

DDI

- 0.5V -6.0 -2.0 -0.7

OH2S

OL2S

DDI

- 0.5V -1.5 -0.8 -0.15

OH5S

= V

OL5S

= 0.5V 0.2 3.0 5.0

DD

- 0.5V -2.1 -0.7 -0.15

DD3

- 0.2V (V

= V

DD3

=4.5V, V

DDI

- 0.5V -9 -3.0 -1

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified )

= 0.5V 4 8 25

DDI

= V

- 0.5V -9 -3 -1

= 0.5V 1 3 9

DDI

- 0.5V -2.0 -1.5 -0.2

DD3

level) - - -4

ML64P168

Measuring

Circuit

mA 2

Output current 7 ( L0 to L33 )

Output Leakage Current ( P1.0 to P1.3 ) ( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 ) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1 )

OMH7

I

OMH7S

I

OML7

I

OML7S

I

OL7

I

OOH

I

OOL

I

OMH7

V

OMH7S

V

OML7

V

OML7S

V

OL7

V

VOH = V

VOL = V

= V

= V

= V

= V

DD2

+ 0.2V (V

DD2

- 0.2V (V

DD1

+ 0.2V (V

DD1

- 0.2V (V

DD2

level) 4 - -

DD2

level) - - -4

DD1

level) 4 - -

DD1

level) - - -4

= VSS + 0.2V (VSS level) 4 - -

DD

SS

--0.3

-0.3 - -

µ

A

-

18/51

Page 19

FEDL64P168-01

Semiconductor

DC Characteristics (1.5 V Spec. ) ( Continued )

( VSS=0V, V

DD1=VDD

=1.5V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Input Current 1 ( P0.0 to P0.3 )

I

I

IH1S

I

IH1

IL1

IH1

V

= V

IL1

V

= VSS ( when pulled up ) -300 -90 -30

IH1

V

= V

( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 )

Input Current 2 ( IN0, IN1 )

Input Current 3 ( OSC1 )

Input Current 4

RESET, TST1,

(

TST2

)

Input Voltage 1 ( P0.0 to P0.3 )

IL1S

I

IH1Z

I

IL1Z

I

I

IH2Z

I

IL2Z

I

I

IH3Z

I

IL3Z

I

I

I

V

V

IH2

IL3

IH4

IL4

IH1

IL1

L1

VI

= VSS, V

IH1

V

= V

IL1

V

= VSS (in a high impedance ) -1 - 0

IH2

V

= VDD ( when pulled down ) 2 8 60

IH2

V

= VDD ( in a high impedance ) 0 - 1

IL2

V

= VSS ( in a high impedance ) -1 - 0

IL3

V

= VSS ( when pulled up ) -60 -18 -5

IH3

V

= VDD ( in a high impedance ) 0 - 1

IL3

V

= VSS ( in a high impedance ) -1 - 0

IH

V

= V

IL4

V

= V

( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 )

Input Voltage 2 ( IN0, IN1, OSC1 )

Input Voltage 3

RESET, TST1,

(

TST2

)

V

V

V

V

V

V

IH1S

IL1S

IH2

IL2

IH3

IL3

DDI

V

= 5.0V 4 - 5

DDI

V

= 5.0V 0 - 1

DD2

=3.0V, V

DDI

( when pulled down ) 30 90 300

DDI

= 5V ( when pulled down ) 80 250 800

DDI

= 5V ( when pulled up ) -800 -250 -80

DDI

( in a high impedance ) 0 - 1

DD

SS

DD3

=4.5V, V

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified )

0-1

-1.0 -0.3 -0.05 mA

- 1.2 - 1.5

-0-0.3

- 1.2 - 1.5

-0-0.3

- 1.2 - 1.5

-0-0.3

ML64P168

Measuring

Circuit

µ

A

V4

3

19/51

Page 20

FEDL64P168-01

Semiconductor

DC Characteristics (1.5 V Spec. ) ( Continued )

(VSS=0V, V

DD1=VDD

=1.5V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Hysteresis Width

∆

T1

V

( P0.0 to P0.3 ) ( P2.0 to P2.3 )

DDI

V

( P3.0 to P3.3 )

∆

T1S

V

= 5.0V 0.25 1.0 1.5

( P4.0 to P4.3 ) Hysteresis Width

RESET, TST1,

(

TST2

)

∆

T2

V

Input Pin Capacitance ( P0.0 to P0.3 ) ( P2.0 to P2.3 )

IN

C

( P3.0 to P3.3 ) ( P4.0 to P4.3 )

DD2

=3.0V, V

DD3

=4.5V, V

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified )

- 0.05 0.1 0.3

- 0.05 0.1 0.3

---5pF1

ML64P168

Measuring

Circuit

V4

20/51

Page 21

FEDL64P168-01

Semiconductor

Measuring circuit 1

OSC1

OS

R

OSC2

V

ML64P168

T0

R

S0

C

I0

R

IN0CS0RT0

XT

XT

32.768kHz Crystal

C1

12

C

C2

V

V

DDI

A,CB,CC,C12

C

OS

R

T0

R

S0

C

I0

R

0.1µF

:

160k

:

10kΩ/2k

:

820pF

:

10k

:

Ω

Ω

Ω

V

A

DD

DD1

V

A

C

V

DD2

V

B

C

V

DD3

V

C

C

SS

Measuring circuit 2

IH

V

*1

IL

V

INPUT

SS

V

V

DD1

V

DD2

V

DD3

V

DD

V

*2

OUTPUT

A

DDI

21/51

Page 22

FEDL64P168-01

Semiconductor

Measuring circuit 3

*3

A

INPUT

SS

V

V

DD1

V

DD2

V

DD3

V

DD

V

ML64P168

OUTPUT

DDI

Measuring circuit 4

IH

V

*3

IL

V

Waveform

OUTPUT

Monitoring

INPUT

V

V

DD1

SS

V

DD2

V

DD3

V

DD

V

DDI

*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.

22/51

Page 23

FEDL64P168-01

Semiconductor

A/D Converter Characteristics (1.5 V Spec. )

( VSS=0V, V

Parameter Symbol Condition Min. Typ. Max. Unit

DD1=VDD

=1.5V, V

RS0,

S1

R

Resistor for Oscillation

Input Current Limiting Resistor

Oscillation Frequency

RS•RT Oscillation Frequency Ratio (*)

T0

R

T0-1

R

T1

R

I0

R

I1

R

OSC1

f

OSC2

f

OSC3

f

Kf1

Kf2

Kf3

, ,

CS0, CT0, CS1 ≥ 740pF

,

,

Resistor for oscillation =2 k

Resistor for oscillation =10 k

Resistor for oscillation =200 k

T0-1

RT0, R

RT0, R

T0

R

, R

T0-1

T0-1

, RT1 = 2 k

, RT1 = 10 k

, RT1 = 200 k

-110-

Ω

Ω

Ω

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified

2- -

Ω

Ω

Ω

165 221 256 kHz

41.8 52.2 60.6 kHz

2.55 3.04 3.53 kHz

3.89 4.18 4.35 -

0.990 1.000 1.010

0.0561 0.0584 0.0637

ML64P168

Measur-

Circuit

Ω

k

Ω

k

-

-

)

ing

5

* Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a

reference resistor in the same condition.

f

Kfx=

(RT0 - CS0 Oscillation) f

OSCX

f

(RS0 - CS0 Oscillation) , f

OSCX

(X = 1, 2, 3)

(RT0-1 - CS0 Oscillation) f

OSCX

(RS0 - CS0 Oscillation) , f

OSCX

(RT1 - CS1 Oscillation)

OSCX

(RS1 - CS1 Oscillation)

OSCX

23/51

Page 24

FEDL64P168-01

Semiconductor

Measuring circuit 5

(CROSC1)

T1

R

RT1 RS1 CS1 IN1

RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3

Oscillation Mode Designation

SS

V

S1CS1

R

ML64P168

(CROSC0)

I1

R

I0

R

IN0 CS0 RS0

D.U.T

S0RS0

C

T0

C

T0-1

R

T0

R

RT0CRT0

P4.3

R RS0,RS1=10k

DD

V

V

RI0,RI1=10k

DDI

CS0,CT0,CS1=820pF

Frequency Measurement

OSCX

(f

T0,RT0-1,RT1

)

=2kΩ/10kΩ/200k

Ω

Ω

Ω

24/51

Page 25

FEDL64P168-01

Semiconductor

AC Characteristics (1.5 V Spec. ) ( Serial Interface )

( VSS=0v, VDD=1.5V , V

Parameter Symbol Condition Min. Typ. Max. Unit

SCLK Input Fall Time t

SCLK Input Rise Time t

SCLK Input “L” Level Pulse Width t

SCLK Input “H” Level Pulse Width t

SCLK Input Cycle Time t

SCLK Output Cycle Time t

SCLK Output Cycle Time t

SOUT Output Delay Time t

SIN Input Setup Time t

SIN Input Hold Time t

f

r

CWL

CWH

CYC

CYC1(O)

CYC2(O)

DDR

DS

DH

CPU is operating at

32.768kHz

CPU is operating at 700kHz - 1.43 -

ML64P168

DDI

=2.7V, Ta=0 to +65°C unless otherwise specified

)

- - 15 50 ns

- - 15 50 ns

-0.8--

-0.8--

-2.0--

- 30.5 -

---0.4

-0.5--

-0.8--

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

Synchronous communication timing

( “H” level = 4.0V, “L” level = 1.0V )

t

SCLK

(P4.2)

DDR

t

SOUT

(P4.0)

DS

t

SIN

(P3.3)

CYC

5V

t

r

CWH

t

DDR

t

t

f

CWL

t

5V

DH

t

DS

t

5V

25/51

Page 26

FEDL64P168-01

Semiconductor

ABSOLUTE MAXIMUM RATINGS (3.0

Parameter Symbol Condition Rating Unit

Power supply voltage 1 V

Power supply voltage 2 V

Power supply voltage 3 V

Power supply voltage 4 V

Power supply voltage 5 V

Input voltage 1 V

Input voltage 2 V

Output voltage 1 V

Output voltage 2 V

Output voltage 3 V

Output voltage 4 V

Output voltage 5 V

Power Dissipation PD

Storage temperature T

DD1

DD2

DD3

DDI

DD

IN1

IN2

OUT1

OUT2

OUT3

OUT4

OUT5

STG

VDD input, Ta = 25°C

V

DD1

V

DD2

V

DD3

V

VDD output, Ta = 25°C

DDI

V

QFP80-P-1420-0.80-BK

QFP80-P-1414-0.65-K

V Spec. )

Ta = 25°C -0.3 to + 2.0 V

Ta = 25°C -0.3 to + 4.0 V

Ta = 25°C

Ta = 25°C

Ta = 25°C

-0.3 to + 5.5 V

-0.3 to + 5.5 V

-0.3 to + 4.0 V

-0.3 to VDD + 0.3 V

DDI

input, Ta = 25°C

output, Ta = 25°C

output, Ta = 25°C

output, Ta = 25°C

-0.3 to V

-0.3 to V

-0.3 to V

-0.3 to VDD+ 0.3 V

DDI

+ 0.3 V

DD2

+ 0.3 V

DD3

+ 0.3 V

-0.3 to VDD+ 0.3 V

output, Ta = 25°C

Ta = 0 to + 65°C

Ta = 0 to + 65°C

-0.3 to VDD+ 0.3 V

381 mW

334 mW

- -55 to + 150

ML64P168

SS

(V

= 0V)

°

C

RECOMMENDED OPERATING CONDITIONS ( 3.0V Spec. )

Parameter Symbol Condition Rating Unit

Operating Temperature*1 T

Operating Voltage*1

External 700kHz RC oscillator Resistance*1

Crystal oscillation frequency*1 f

*1: At Non-regulated LCD driver.

In case of select a voltage regulated LCD driver, see P.37/51.

op

DD

V

DDI

V

OS

R

XT

-0 to + 65

- 2.7 to 3.5 V

-V

- 60 to 200

- 30 to 66 kHz

(VSS = 0V)

DD

to 5.25 V

°

C

Ω

k

26/51

Page 27

FEDL64P168-01

Semiconductor

ELECTRICAL CHARACTERISTICS ( 3.0V Spec. )

DC Characteristics ( 3.0V Spec. )

(VSS=0V, V

Parameter Symbol Condition Min. Typ. Max. Unit

DD1

V

Vo l t a ge * V

DD3

V

Vo l t a ge * V

Crystal Oscillation Start Voltage Crystal Oscillation Hold Voltage Crystal Oscillation Stop Detection Time Internal Crystal Oscillator Capacitance External Crystal Oscillator Capacitance Internal Crystal Oscillator Capacitance Internal 700kHz RC Oscillator Capacitance

700kHz RC Oscillation Frequency

POR Generation Vo l t a g e POR Non-generation Vo l t a g e Battery Check Reference Voltage VRB Temperature Va r ia t i o n

V

V

T

C

V

V

∆

DD1

DD3

STA

HOLD

STOP

G

C

GEX

D

C

OS

C

OSC

f

POR1

POR2

RB

V

V

Ca, Cb, C12=0.1µF

Ca, Cb, C12=0.1µF

Oscillation start time: within 5 seconds

When external CG used 10 - 30 pF

External resistor ROS=60k VDD = 2.7 to 3.5V When VDD is between

POR1

V

and 3.0V No POR when VDD is between V

POR2

Ta = 25°C

RB

DD2=VDDI=VDD

+100%

-50%

+100%

-50%

-

-

-

-101520pF

- 8 12 16 pF

Ω

and 3.0V

ML64P168

=3.0V, Ta=0 to +65°C unless otherwise specified )

Measuring

Circuit

1.3 1.5 1.7 V

4.3 4.5 4.7 V

2.7 - - V

2.7 - - V

0.1 - 1000 ms

10 15 20 pF

600 700 1000 kHz

0-0.7V

2.7 - 3 V

0.50 0.60 0.70 V

--2-

mV/°C

1

2

Notes: 1.”POR” denotes Power On Reset.

STOP

2.”T

” indicates that if the crystal oscillator stops over the value of T

*: At Non-regulated LCD driver.

In case of select a voltage regulated LCD driver, see P.37/51.

STOP

, the system reset occurs.

27/51

Page 28

FEDL64P168-01

Semiconductor

DC Characteristics ( 3.0V Spec. ) ( Continued )

(VSS=0V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Supply current 1* I

Supply current 2* I

Supply current 3 I

Supply current 4 I

Supply current 5 I

Supply current 6 I

DD1

DD2

DD3

DD4

DD5

DD6

CPU in halt state (700kHz RC oscillation stop) CPU in operating state (700kHz RC oscillation stop) CPU in operating state (700kHz RC oscillation in operation) Serial transfer, f CPU in operating state (700kHz RC oscillation stop) CPU in halt state (700kHz RC oscillation stop) RC oscillation for A/D converter is in operating state Battery check circuit in operating state, CPU in operating state (700kHz RC oscillation stop)

SCK

=300kHz,

DD2=VDDI=VDD

RT0=10k

R

Ω

Ω

T0

=2k

=3.0V, Ta=0 to +65°C unless otherwise specified )

-712

-3550

- 800 1400

-4070

- 300 450

- 1200 1800

- 55 150

ML64P168

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

µ

A

Measuring

Circuit

1

*: At Non-regulated LCD driver.

In case of select a voltage regulated LCD driver, see P.37/51.

28/51

Page 29

FEDL64P168-01

Semiconductor

DC Characteristics (3.0 V Spec. ) ( Continued )

( VSS=0V, V

DD1

=1.5V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Output current 1 ( P1.0 )

Output current 2 ( P1.1 to P1.3 )

OH1

I

OL1

I

OH1S

I

OL1S

I

OH2

I

OL2

I

OH1

V

= V

OL1

V

= 0.5V 2 5 20

DDI

V

= 5.0V, V

DDI

V

= 5.0V, V

OH2

V

= V

OL2

V

= 0.5V 0.7 2.0 6.0

( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 )

Output current 3 ( BD )

Output current 4

OH2S

I

OL2S

I

OH3

I

OL3

I

OH4

I

DDI

V

= 5.0V, V

DDI

V

= 5.0V, V

OH3

V

= VDD - 0.7V -6.0 -2.0 -0.7

OL3

V

= 0.7V 0.7 6.0 10.0

OH4

V

= VDD - 0.1V -2.5 -0.8 -0.3

( RT0, RT1, RS0, RS1, CRT0, CS0, CS1 )

Output current 5 ( When the pins

I

I

I

OL4

OH5

OL5

OL4

V

= 0.1V 0.7 1.3 2.5

OH5

V

= V

OL5

V

= 0.5V 0.15 2.0 4.0

L26 to L33 are configured as output ports )

OH5S

I

OL5S

I

V

V

DDI

DDI

= 5V, V

= 5V, V

DD2=VDDI=VDD

DDI

- 0.5V -6.0 -1.7 -0.7

OH1S

= V

OL1S

= 0.5V 4 8 25

DDI

- 0.5V -6.0 -2.0 -0.7

OH2S

= V

OL2S

= 0.5V 1 3 9

DDI

- 0.5V -1.5 -0.8 -0.15

OH5S

= V

OL5S

= 0.5V 0.2 3.0 5.0

=3.0V, V

DDI

- 0.5V -9 -3 -1

DDI

- 0.5V -9 -3 -1

DDI

- 0.5V -2.0 -1.5 -0.2

DD3

=4.5V, Ta=0 to +65°C unless otherwise specified )

ML64P168

Measuring

Circuit

mA 2

Output current 6 ( OSC2 )

Output current 7 ( L0 to L33 )

Output Leakage Current ( P1.0 to P1.3 ) ( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 ) (RT0, RT1, RS0, RS1, CRT0, CS0, CS1 )

OH6

I

OL6

I

OH7

I

OMH7

I

OMH7S

I

OML7

I

OML7S

I

OL7

I

OOH

I

OOL

I

OH6

V

V

V

V

V

V

V

V

VOH = V

VOL = V

DD

= V

- 0.5V -4.0 -0.8 -0.3

OL6

= 0.5V 0.7 3.0 6.0

OH7

OMH7

OMH7S

OML7

OML7S

OL7

= V

= V

= V

= V

= V

DD3

- 0.2V (V

DD2

+ 0.2V (V

DD2

- 0.2V (V

DD1

+ 0.2V (V

DD1

- 0.2V (V

DD3

level) - - -4

DD2

level) 4 - -

DD2

level) - - -4

DD1

level) 4 - -

DD1

level) - - -4

= VSS + 0.2V (VSS level) 4 - -

DD

SS

--0.3

-0.3 - -

µ

A

-

29/51

Page 30

FEDL64P168-01

Semiconductor

DC Characteristics (3.0 V Spec. ) ( Continued )

(VSS=0V, V

DD1

=1.5V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Input Current 1 ( P0.0 to P0.3 )

I

I

IH1S

I

IH1

IL1

IH1

V

= V

IL1

V

= VSS ( when pulled up ) -300 -90 -30

IH1

V

= V

( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 )

Input Current 2 ( IN0, IN1 )

Input Current 3 ( OSC1 )

Input Current 4

RESET, TST1,

(

TST2

)

Input Voltage 1 ( P0.0 to P0.3 )

IL1S

I

IH1Z

I

IL1Z

I

I

IH2Z

I

IL2Z

I

I

IH3Z

I

IL3Z

I

I

I

V

V

IH2

IL3

IH4

IL4

IH1

IL1

IL1

V

= VSS, VDD = 5V ( when pulled up ) -800 -250 -80

IH1

V

= V

IL1

V

= VSS (in a high impedance ) -1 - 0

IH2

V

= V

IH2

V

= VDD ( in a high impedance ) 0 - 1

IL2

V

= VSS ( in a high impedance ) -1 - 0

IL3

V

= VSS ( when pulled up ) -300 -110 -10

IH3

V

= VDD ( in a high impedance ) 0 - 1

IL3

V

= VSS ( in a high impedance ) -1 - 0

IH4

V

= V

IL4

V

= V

( P2.0 to P2.3 ) ( P3.0 to P3.3 ) ( P4.0 to P4.3 )

Input Voltage 2 ( IN0, IN1, OSC1 )

Input Voltage 3

RESET, TST1,

(

TST2

)

V

V

V

V

V

V

IH1S

IL1S

IH2

IL2

IH3

IL3

DDI

V

= 5.0V 4 - 5

DDI

V

= 5.0V 0 - 1

DD2=VDDI=VDD

DDI

( when pulled down ) 30 90 300

DDI

= 5V ( when pulled down ) 80 250 800

DDI

( in a high impedance ) 0 - 1

DD

when pulled down )

(

DD

SS

=3.0V, V

DD3

=4.5V, Ta=0 to +65°C unless otherwise specified )

30 90 300

0-1

-3.00 -1.50 -0.75 mA

- 2.4 - 3.0

-0-0.6

- 2.4 - 3.0

-0-0.6

- 2.4 - 3.0

-0-0.6

ML64P168

Measuring

Circuit

µ

A

V4

3

30/51

Page 31

FEDL64P168-01

Semiconductor

DC Characteristics (3.0 V Spec. ) ( Continued )

(VSS=0V, V

DD1

=1.5V, V

Parameter Symbol Condition Min. Typ. Max. Unit

Hysteresis Width

∆

T1

V

( P0.0 to P0.3 ) ( P2.0 to P2.3 )

DDI

V

( P3.0 to P3.3 )

∆

T1S

V

=5.0V 0.25 1.00 1.50

( P4.0 to P4.3 ) Hysteresis Width

RESET, TST1,

(

TST2

)

∆

T2

V

Input Pin Capacitance ( P0.0 to P0.3 ) ( P2.0 to P2.3 )

IN

C

( P3.0 to P3.3 ) ( P4.0 to P4.3 )

DD2=VDDI=VDD

=3.0V, V

DD3

=4.5V, Ta=0 to +65°C unless otherwise specified)

- 0.2 0.5 1.0

- 0.2 0.5 1.0

---5pF1

ML64P168

Measuring

Circuit

V4

31/51

Page 32

FEDL64P168-01

Semiconductor

Measuring circuit 1

OSC1

OS

R

OSC2

V

ML64P168

T0

R

S0

C

I0

R

IN0CS0RT0

XT

XT

32.768kHz Crystal

C1

12

C

C2

SS

V

A

DD

DD1

V

A

C

V

DD2

V

B

C

V

DD3

V

C

C

V

V

DDI

A,CB,CC,C12

C

OS

R

T0

R

S0

C

I0

R

0.1µF

:

60k

:

10kΩ/2k

:

820pF

:

10k

:

Ω

Ω

Ω

Measuring circuit 2

IH

V

*1

IL

V

INPUT

SS

V

V

DD1

V

DD2

V

DD3

V

DD

V

*2

OUTPUT

A

DDI

32/51

Page 33

FEDL64P168-01

Semiconductor

Measuring circuit 3

*3

A

INPUT

SS

V

V

DD1

V

DD2

V

DD3

V

DD

V

ML64P168

OUTPUT

DDI

Measuring circuit 4

IH

V

*3

IL

V

Waveform

OUTPUT

Monitoring

INPUT

V

V

DD1

SS

V

DD2

V

DD3

V

DD

V

DDI

*1 Input logic circuit to determine the specified measuring conditions. *2 Measured at the specified output pins. *3 Measured at the specified input pins.

33/51

Page 34

FEDL64P168-01

Semiconductor

A/D Converter Characteristics (3.0 V Spec. )

Ω

Ω

DDI=VDD

Ω

Ω

Ω

=3.0V, Ta=0 to +65°C unless otherwise specified

1--

200 239 277 kHz

46.5 55.4 64.3 kHz

2.79 3.32 3.85 kHz

4.272 4.380 4.490 -

0.990 1.000 1.010

0.0573 0.0616 0.0659

( VSS=0V, V

Parameter Symbol Condition Min. Typ. Max. Unit

RS0,

S1

R

Resistor for Oscillation

Input Current Limiting Resistor

Oscillation Frequency

RS•RT Oscillation Frequency Ratio(*)

T0

R

T0-1

R

T1

R RI0,

I1

R

OSC1

f

OSC2

f

OSC3

f

Kf1

Kf2

Kf3

,

,

CS0, CT0, CS1 ≥ 740pF

,

Resistor for oscillation =2 k

Resistor for oscillation =10 k

Resistor for oscillation =200 k

T0-1

RT0, R

RT0, R

T0

R

, R

T0-1

T0-1

, RT1 = 2 k

, RT1 = 10 k

, RT1 = 200 k

-110-

Ω

ML64P168

Measur-

Ω

k

Ω

k

-

-

)

ing

Circuit

5

* Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency by a

reference resistor in the same condition.

f

Kfx=

(RT0 - CS0 Oscillation) f

OSCx

(RS0 - CS0 Oscillation) , f

f

OSCx

(x=1, 2, 3)

(RT0-1 - CS0 Oscillation) f

OSCx

(RS0 - CS0 Oscillation) , f

OSCx

(RT1 - CS1 Oscillation)

OSCx

(RS1 - CS1 Oscillation)

OSCx

34/51

Page 35

FEDL64P168-01

Semiconductor

Measuring circuit 5

(CROSC1)

T1

R

RT1 RS1 CS1 IN1

RESET TST1 TST2 P0.0 P0.1 P0.2 P0.3

Oscillation Mode Designation

SS

V

S1CS1

R

ML64P168

(CROSC0)

I1

R

I0

R

IN0 CS0 RS0

D.U.T

S0RS0

C

T0

C

T0-1

R

T0

R

RT0CRT0

P4.3

R RS0,RS1=10k

DD

V

V

RI0,RI1=10k

DDI

CS0,CT0,CS1=820pF

Frequency Measurement

OSCX

(f

T0,RT0-1,RT1

)

=2kΩ/10kΩ/200k

Ω

Ω

Ω

35/51

Page 36

FEDL64P168-01

Semiconductor

AC Characteristics ( 3.0V Spec. ) ( Serial Interface )

f

r

CWL

CWH

CYC

DDR

DS

DH

DD2=VDD

=3.0V, V

CPU is operating at

32.768kHz CPU is operating at 700kHz - 1.43 -

( VSS=0V, V

Parameter Symbol Condition Min. Typ. Max. Unit

SCLK Input Fall Time t SCLK Input Rise Time t

SCLK Input “L” Level Pulse Width t

SCLK Input “H” Level Pulse Width t SCLK Input Cycle Time t

SCLK Output Cycle Time t

SCLK Output Cycle Time t

CYC1(O)

CYC2(O)

SOUT Output Delay Time t SIN Input Setup Time t SIN Input Hold Time t

Synchronous communication timing

( “H” level = 4.0V, “L” level = 1.0V )

CYC

t

SCLK

(P4.2)

ML64P168

DDI

=5.0V , Ta=0 to +65°C unless otherwise specified

)

- - 15 50 ns

- - 15 50 ns

-0.8--

-0.8--

-2.0--

- 30.5 -

---0.4

-0.5--

-0.8--

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

µ

s

5V

SOUT

(P4.0)

SIN

(P3.3)

DDR

t

t

r

CWH

t

DDR

t

t

f

CWL

t

5V

DS

t

DH

t

DS

t

5V

36/51

Page 37

FEDL64P168-01

Semiconductor

RECOMMENDED OPERATING CONDITIONS

( When Voltage Regulator for LCD Driver Used )

Parameter Symbol Condition Rating Unit

Operating Temperature T

Operating Voltage V

Crystal oscillation frequency f

op

DD

XT

ELECTRICAL CHARACTERISTICS

( When Voltage Regulator for LCD Driver Used )

DC Characteristics

ML64P168

(VSS = 0V)

-0 to + 65

°

C

- 2.7 to 3.5 V

- 30 to 66 kHz

(VSS=0V, VDD=3.0V, Ta=0 to +65°C unless otherwise specified )

Parameter Symbol Condition Min. Typ. Max. Unit

DD1

V

Vo l t a ge

DD2

V

Vo l t a ge V

DD3

V

Vo l t a ge V

V

∆

V

DD2

DD3

VDD=2.7 to 3.5, Ta=25

---4-

DD1

VDD=2.7 to 3.5

VDD=2.7 to 3.5

°

C

1.00 1.2 1.4 V

Typ. - 0.1

Typ. - 0.2

V

2

×

V

3

×

DD1

DD1

Typ. + 0.1

Typ. + 0.2

mV/°C

V

DD1

VDD=1.5V , CPU in halt state - 2 5

Supply Current 1 I

DD1

VDD=3.0V, CPU in halt state - 7 12

µ

A

Supply Current 2 I

DD2

VDD=1.5V, CPU in operating state - 15 30

VDD=3.0V, CPU in operating state - 35 50

Notes: The other electrical characteristics are the same as those for the 1.5V and 3.0V specifications.

Measur-

ing

Circuit

1

37/51

Page 38

FEDL64P168-01

Semiconductor

Power Supply Circuit

ML64P168

ML64P168 1.5V Version

ML64P168

ML64P168

V

DDI

V

DD

C1

C2

V

DD3

C

C

V

DD2

C

B

V

DD1

V

SS

V

DDI

V

DD

C1

C2

V

DD3

C

C

V

DD2

C

B

V

DD1

C

A

V

SS

C

S

C

12

C

S

C

12

C

1.5V

C

1.5V

I

2.7 to 5V

I

2.7 to 5V

ML64P168 1.5V Version (The LCD bias is regulated.)

V

DDI

V

DD

ML64P168

C1

C2

V

DD3

C

C

V

DD2

V

DD1

C

A

V

SS

C

S

C

12

C

I

3.0V

ML64P168 3.0V Version

V

DDI

V

DD

ML64P168

C1

C2

V

DD3

C

C

V

DD2

C

B

V

DD1

C

A

V

SS

C

S

C

12

C

3.0V

I

ML64P168 3.0V Version (The LCD bias is regulated.)

Note:CA,CB,CC,CS,CI,C12:0.1µF

+100%

-50%

38/51

Page 39

FEDL64P168-01

Semiconductor

PROM MODE

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

PROM power supply voltage V

Program voltage V

PROM input voltage V

PROM output voltage V

Storage temperature T

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Rating Unit

Operating Temperature T

VCC power supply voltage V

CC

PP

O

STG

VCC=VDD, Ta=25°C

Ta = 25°C -0.3 to + 14.0 V

I

VCC system input, Ta=25°C

VCC system output, Ta=25°C

- -55 to + 150

op

CC

VCC=VDD=V

ML64P168

(VSS = 0V)

-0.3 to + 6.7 V

-0.3 to VCC + 0.3 V

-0.3 to VCC + 0.3 V

°

C

(VSS = 0V)

-0 to + 65

DDI

4.75 to 5.25 V

°

C

VPP power supply voltage V

V

Input voltage

PP

In write 12.0 to 13.0 V

In read 4.75 to 5.25 V

IH

IL

V

VCC=VDD=V

DDI

4 to V

CC

V

-0 to 1V

39/51

Page 40

FEDL64P168-01

Semiconductor ML64P168

READ OPERATION ( PROM MODE )

DC Characteristics

Parameter Symbol Condition Min. Typ. Max. Unit

=V

=V

DD

IH

DD

IL

DD

DD

CC

- 0.5V

VCC power supply current

(standby)

VCC power supply current

(operation)

Input voltage

Output voltage

I

I

V

V

CC1

CC2

OH

I

OL

I

VCC = V

CE

VCC = V

CE

IH

VCC = V

IL

VCC = V VOH = V

VOL = 0.5V 0.2 0.7 2.0 mA

(VDD=VPP=5.0V±5%, Ta=25 ±5°C unless otherwise specified )

--35mA

- - 100 mA

4-V

-0-1

CC

V

V

-2.0 -0.7 -0.2 mA

AC Characteristics

(VCC =5.0V±5%, VPP=VCC, Ta=0 to 65°C unless otherwise specified

Parameter Symbol Condition Min. Typ. Max. Unit

Address access time t

access time

CE

access time

OE

Output disable time t

ACC

CE

t

OE

t

DF

OE=CE

=V

OE

=V

CE

=V

CE

=V

IL

IL

IL

IL

Measurement conditions: Input pulse level 0.45 to 4.55V

Input rise / fall time 5ns Timing judgement level Input 0.8V, 2V / Output 0.8V , 2V

Timing chart

Address Input

CE

)

- - 120 ns

- - 120 ns

- - 50 ns

0 - 40 ns

OE

Data output

tACC

tCE

tOE

tDF

40/51

Page 41

FEDL64P168-01

Semiconductor ML64P168

WRITE OPERATION ( PROM MODE )

DC Characteristics

( VSS=0V, VDD=5.0V ± 5%, VPP=12.5V ± 5V, Ta=25 ± 5°C unless otherwise specified )

Parameter Symbol Condition Min. Typ. Max. Unit

VPP power supply current I

VCC power supply current I

PP

CC

IL

=V

CE

VCC = V

DD

--50mA

- - 100 mA

IH

Input voltage

V

V

I

Output voltage

I

VCC = V

IL

VCC = V

OH

VOH = V

OL

VOL = 0.5V 0.2 0.7 2.0 mA

AC Characteristics

( VSS=0V, VDD=5.0V ± 5%, VPP=12.5 ± 5V, Ta=25 ± 5°C unless otherwise specified

Parameter Symbol Condition Min. Typ. Max. Unit

Address set-up time t

set-up time

OE

Data set-up time t Address hold time t Data hold time t

output floating delay time

OE

VPP power supply set-up time t

Initial program pulse width t

Additional program pulse width t

output effective delay time

OE

AS

OES

t

DS

AH

DH

DEP

t

VS

PW

OPW

OE

t

DD

DD

CC

- 0.5V

4-V

-0-1

-2.0 -0.7 -0.2 mA

CC

V

V

)

-2--

-2--

-2--

-0--

-2--

- 0 - 130 ns

-2--

VDD=V

6V ± 0.25V

V

6V ± 0.25V

DDI

DD1=VDD2

0.95 1.0 1.05 ms

2.85 - 78.75 ms

- - - 150 ns

µs µs µs µs µs

µs

Measurement conditions: Input pulse level 0.45 to 4.55V

Input rise / fall time Less than 20ns Timing judgement level Input 0.8V, 2V / Output 0.8V , 2V

41/51

Page 42

FEDL64P168-01

Semiconductor ML64P168

Program timing chart

Address Input

AS

t

Data Input/Output Data Input

DS

t

PP

V

VS

t

CE

PW

t

OPW

t

OE

DH

t

Address N

OES

t

Data Output

OE

t

AH

t

DEP

t

42/51

Page 43

FEDL64P168-01

Semiconductor ML64P168

FUNCTIONAL DESCRIPTION

CPU Peripheral Function

∙ A/D converter ( ADC )

The ML64P168 has a built-in two-channel RC oscillation A/D converter. The A/D converter is composed of a two-cannel oscillation circuit, Counter A ( CNTA0-4, a 4.8-digit decade counter ), Counter B ( CNTB0-3, a 14-bit binary counter ), and A/D Converter Control Registers 0 and 1 ( ADCON0, ADCON1 ). By counting oscillation frequencies that vary depending on a resistor or capacitor connected to the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to corresponding digital values. By using a thermistor or humidity sensor as a resistance, a thermometer or a hygrometer can be constructed. By applying a separate sensor to each cannel of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at two places.

∙ Serial port ( SIOP )

The ML64P168 has an 8-bit synchronous serial port. Receive/transmit operation of the serial port is performed simultaneously and the serial transfer clock can select either internal or external mode. Direction of transfer data can be big endian or little endian. Each pin of the serial port is assigned as secondary functions of P3.3 and P4.0 to P4.2. Setting each bit of SIN,SOUT, SPR and SCLK of P33CON and P40CON to P42CON to “1” makes each pin valid.

∙ LCD driver ( LCD )

The ML64P168 has a built-in LCD driver for 34 outputs. The LCD driver consists of 31× 4-bit display registers ( DSPR0-30 ), the Display Control Register ( DSPCON ), a 34-output LCD driver circuit, and a bias generation circuit ( BIAS ). The bias generation circuit for LCD driver ( BIAS ) generates bias voltages for the LCD driver by rising or dropping the power supply voltage by externally installing capacitors. Alternatively, it generates bias voltages by rising the constant voltage ( V

DD1

= 1.2V ) generated by the voltage regulator for LCD driver. Which way is to be used is specified by mask option. There are three types of driving methods: 1/4duty, 1/3duty and 1/2duty. Software selects the duty mode. A mask option can select either a common driver or a segment driver for each LCD driver pin. A mask option can also specify assignment of each bit of the display register to each segment. All the display registers must be selected by a mask option. L26 to L33 of the LCD driver can be configured to be output ports by a mask option. The relationship between the duty, the bias method, and the maximum segment number follows:

1/4duty, 1/3 bias method ----------- 120 segments 1/3duty, 1/3 bias method ----------- 93 segments 1/2duty, 1/2 bias method ----------- 64 segments

∙ Buzzer driver ( BD )

The ML64P168 has a built-in buzzer driver with 15 buzzer output frequencies and 4 buzzer output modes. Each buzzer output is selected by the Buzzer Control Register ( BDCON ) and the Buzzer Frequency Control Register ( BFCON ).

43/51

Page 44

FEDL64P168-01

Semiconductor ML64P168

∙ Capture circuit ( CAPR )

The ML64P168 captures 32Hz to 256Hz output of the time base counter at the falling of Port 0.0 or Port 0.1 ( P0.0 or P0.1 ) to “L” level when the pull-up resistor input is chosen, or at the rising to “H” level when the pull-down resistor input is chosen. The capture circuit is composed of the Capture Control Register ( CAPCON ) and the Capture Registers ( CAPR0, CAPR1 ) that fetch output from the time base counter.

∙ Watchdog timer ( WDT )

The ML64P168 has a built-in watchdog timer to detect CPU malfunction. The watchdog timer is composed of a 6-bit watchdog timer counter ( WDTC ) to count a 16Hz output and a watchdog timer control register ( WDTCON ) to reset WDTC.

∙ Clock generation circuit ( 2CLK )

The clock generation circuit ( 2CLK ) in the ML64P168 contains a 32.768kHz crystal oscillation circuit, a 700kHz RC oscillation circuit, and a clock control port. This circuit generates the system clock ( CLK ) and the time base clock ( 32.768kHz ). The system clock drives the CPU while the time base clock drives the time base counter and the buzzer driver. Via the contents of the Frequency Control Register ( FCON ), the system clock can be switched between 32.768kHz ( the output of the crystal oscillation circuit ) and 700kHz ( the output of the RC oscillation circuit ).

Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of an

external resistor ( R

OS

), operating power supply voltage ( VDD ), and ambient temperatures

(Ta).

∙ Time base counter ( TBC )

The ML64P168 has a built-in time base counter ( TBC ) that generates clocks to be supplied to internal peripheral circuit. The time base counter is composed of 15 binary counters, and a 1/10 frequency dividing circuit. The count clock of the time base is driven by the oscillation clock ( 32.768kHz ) of the crystal oscillation circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit, the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture circuit.

∙ I/O port

Input-output ports ( P2, P3, P4 ) : 3 ports× 4bits

Pull-up ( pull-down ) resistor input or high-impedance input, CMOS output or NMOS open drain output: these can be specified for each bit; external 0 interrupt

Input port ( P0 ) : 1 port× 4bits

Pull-up ( pull-down ) resistor input or high-impedance input; external 1 interrupt

Output port ( P1 ) : 1 port× 4bits

CMOS output or NMOS open drain output

44/51

Page 45

FEDL64P168-01

Semiconductor ML64P168

∙ Interrupt ( INTC )

The ML64P168 has 10 interrupt sources ( 10 vector address ), of which two are external interrupts from ports and eight are internal interrupts. Of the ten interrupt sources, only the watchdog timer interrupt cannot be disabled ( non-maskable interrupt ). The other nine interrupts are controlled by the master interrupt enable flag ( MI ) and the interrupt enable registers ( IE0, IE1, and IE2 ). When an interrupt condition is met, the CPU branches to a vector address corresponding to the interrupt source.

∙ Battery check circuit ( BC )

The battery check circuit ( BC ) detects the level of the supply voltage by comparing the voltage generated by an external supply-voltage dividing resistor ( R

rb

( V

).

BLD

) with the internal reference voltage

45/51

Page 46

FEDL64P168-01

Semiconductor ML64P168

APPLICATION CIRCUITS (1.5

V Spec. )

I

C

S

C

DD

DDI

C2

V

V

12

C

C1

5V

1.5V

C

C

DD3VDD2

V

of crystal oscillator : External

GEX

- 5V Interface

- Temperature measurement by two

thermistors

- Battery check circuit is used.

- C

B

C

SS

PP

DD1

V

V

V

TST2

TST1

IN0

RI0CS0RS0RT0RI1CS1RS1RT1

CS0

RS0

CRT0

RT0

LCD

L33 L0

OS

R

OSC2

OSC1XTXT

32.768 kHz

CS1

RS1

RT1

ML 64P168-xxxGA/GP

ML 64P168-xxx

(1.5V Spec.)

P4.3 P4.2 P4.1 P4.0

P3.3 P3.1

RESET

P1.0

P1.1

P1.2

P1.3

P0.0

P0.1

P0.2

GEX

C

IN1

BD

P0.3

Switch matrix ( 4 x 4 )

BLD

R

Buzzer

1.5V Spec. Application Circuit ( Voltage Regulator for LCD Driver not Used )

46/51

Page 47

FEDL64P168-01

Semiconductor ML64P168

APPLICATION CIRCUITS (1.5

V Spec. ) ( continued )

5V

I

DDI

V

C

1.5V

S

C

C

B

A

C

C

C

12

C

DD

C2

C1

DD3VDD2

V

DD1

V

V

SS

PP

V

V

- 5V Interface

TST2

of crystal oscillator : External

GEX

- Temperature measurement by two

thermistors

- Battery check circuit is used.

- C

TST1

IN0

RI0CS0RS0RT0RI1CS1RS1RT1

CS0

RS0

CRT0

RT0

LCD

L33 L0

OS

R

OSC2

OSC1XTXT

32.768 kHz

(1.5V Spec.)

ML 64P168-xxxGA/GP

RESET

P1.0

P1.1

P1.2

P1.3

P0.0

P0.1

GEX

C

IN1

CS1

RS1

RT1

BD

P4.3 P4.2 P4.1 P4.0

P3.3 P3.1

P0.2

P0.3

Switch matrix ( 4 x 4 )

BLD

R

Buzzer

1.5V Spec. Application Circuit ( Voltage Regulator for LCD Driver Used )

47/51

Page 48

FEDL64P168-01

Semiconductor ML64P168

APPLICATION CIRCUITS (3.0

DD

DDI

V

V

LCD

L33 L0

V Spec. )

5V

I

C

3V

S

C

C

A

C

C

12

C

C2

C1

DD3VDD2

V

DD1

V

SS

V

(3.0V Spec.)

ML 64P168-xxxGA/GP

of crystal oscillator : External

GEX

- 5V Interface

- Temperature measurement by two

thermistors

- Battery check circuit is used.

- C

PP

V

TST2

TST1

IN0

CS0

RS0

CRT0

RT0

IN1

CS1

RS1

RT1

BD

P4.3 P4.2 P4.1 P4.0

P3.3 P3.1

RI0CS0RS0RT0RI1CS1RS1RT1

BLD

R

Buzzer

) system )

DDI

To the serial communication interface

( 5V ( V

SIN

SPR

OSC monitor

SCLK

SOUT

OSC2

OS

R

OSC1XTXT

RESET

P1.0

P1.1

P1.2

P1.3

P0.0

P0.1

P0.2

P0.3

32.768 kHz

GEX

C

Switch matrix ( 4 x 4 )

3.0V Spec. Application Circuit ( Voltage Regulator for LCD Driver not Used )

48/51

Page 49

FEDL64P168-01

Semiconductor ML64P168

APPLICATION CIRCUITS (3.0

DD

DDI

V

V

LCD

L33 L0

V Spec. ) ( continued )

5V

I

C2

C

3V

S

C

B

C

A

C

C

C

12

C

C1

DD3VDD2

DD1

V

V

SS

PP

V

V

- 5V Interface

- Temperature measurement by two

TST2

TST1

(3.0V Spec.)

ML 64P168-xxxGA/GP

of crystal oscillator : External

GEX

thermistors

- Battery check circuit is used.

- C

IN0

RI0CS0RS0RT0RI1CS1RS1RT1

CS0

RS0

CRT0

RT0

IN1

CS1

RS1

RT1

BD

P4.3 P4.2 P4.1 P4.0

P3.3 P3.1

BLD

R

Buzzer

) system )

DDI

To the serial communication interface

( 5V ( V

SIN

SPR

OSC monitor

SCLK

SOUT

OSC2

OS

R

OSC1XTXT

RESET

P1.0

P1.1

P1.2

P1.3

P0.0

P0.1

P0.2

P0.3

32.768 kHz

GEX

C

Switch matrix ( 4 x 4 )

3.0V Spec. Application Circuit ( Voltage Regulator for LCD Driver Used )

49/51

Page 50

FEDL64P168-01

Semiconductor ML64P168

PACKAGE DIMENSIONS

ML64P168-

XXXGP

25.0±0.2

20.0±0.2

0.17±0.05

41

24

0.32

+0.08

-0.07

40

25

1.0TYP.

0.16 M

2.1±0.2

2.5MAX.

0.05~0.35

0.12

2.5TYP.

0.25

SEATING PLANE

0~10°

1.3TYP.

1.38±0.15

19.0±0.2

INDEX MARK

65

14.0±0.2

80

0.8TYP.

64

1

0.8

Figure C-1 80-Pin QFP:GP Package Dimension Diagram

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

50/51

Page 51

FEDL64P168-01

Semiconductor ML64P168

PACKAGE DIMENSIONS

ML64P168-

XXXGA

14.0±0.1

16.8±0.2

INDEX MARK

0.83TYP.

60

61

80

1

0.65

0.32

41

+0.08

-0.07

20

40

21

0.17±0.05

0.83TYP.

0.13 M

2.1±0.2

2.4MAX.

0~0.25

0.10

1.4±0.2

0.25

SEATING PLANE

0~10°

0.6TYP.

0.67±0.15

Figure C-2 80-Pin QFP:GA Package Dimension Diagram

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

51/51

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