The MIC5236 is a low quiescent current, µCap low-dropout
regulator. With a maximum operating input voltage of 30V
and a quiescent current of 20µA, it is ideal for supplying keepalive power in systems with high-voltage batteries.
Capable of 150mA output, the MIC5236 has a dropout
voltage of only 300mV. It can also survive an input transient
of –20V to +60V.
As a µCap LDO, the MIC5236 is stable with either a ceramic
or a tantalum output capacitor. It only requires a 1.0µF output
capacitor for stability.
The MIC5236 includes a logic compatible enable input and an
undervoltage error flag indicator. Other features of the
MIC5236 include thermal shutdown, current-limit, overvoltage shutdown, load-dump protection, reverse leakage protections, and reverse battery protection.
Available in the thermally enhanced SOP-8 and MSOP-8, the
MIC5236 comes in fixed 2.5V, 3.0V, 3.3V, 5.0V, and adjustable voltages. For other output voltages, contact Micrel.
Features
• Ultra-low quiescent current (IQ = 20µA @IO = 100µA)
• Wide input range: 2.3V to 30V
• Low dropout:
230mV @50mA;
300mV @150mA
• Fixed 2.5V, 3.0V, 3.3V, 5.0V, and Adjustable outputs
• ±1.0% initial output accuracy
• Stable with ceramic or tantalum output capacitor
• Load dump protection: –20V to +60V input transient
survivability
• Logic compatible enable input
• Low output flag indicator
• Overcurrent protection
• Thermal shutdown
• Reverse-leakage protection
• Reverse-battery protection
• High-power SOP-8 and MSOP-8
Applications
• Keep-alive supply in notebook and
portable personal computers
• Logic supply from high-voltage batteries
• Automotive electronics
• Battery-powered systems
Typical Application
V
30V
IN
MIC5236
IN
EN
GND
OUT
ERR
Regulator with Low IO and Low I
November 20001MIC5236
Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • http://www.micrel.com
V
5V
IN
V
OUT
3.0V/100µA
I
= 20µA
GND
Q
MIC5236
IN
EN
OUT
ADJ
GND
Regulator with Adjustable Output
Regulator with Error Output
V
OUT
3.0V/150mA
Page 2
MIC5236Micrel
Ordering Information
Part Number *VoltageJunction Temp. RangePackage
MIC5236-5.0BM5.0V–40°C to +125°C8-lead SOIC
MIC5236-5.0BMM5.0V–40°C to +125°C8-lead MSOP
MIC5236-3.3BM3.3V–40°C to +125°C8-lead SOIC
MIC5236-3.3BMM3.3V–40°C to +125°C8-lead MSOP
MIC5236-3.0BM3.0V–40°C to +125°C8-lead SOIC
MIC5236-3.0BMM3.0V–40°C to +125°C8-lead MSOP
MIC5236-2.5BM2.5V–40°C to +125°C8-lead SOIC
MIC5236-2.5BMM2.5V–40°C to +125°C8-lead MSOP
MIC5236BMADJ–40°C to +125°C8-lead SOIC
MIC5236BMMADJ–40°C to +125°C8-lead MSOP
*Conta5ct factory regarding availablity for voltages not listed
Pin Configuration
ERR
IN
OUT
EN
1
2
3
4
8-Pin SOIC (M)
8-Pin MSOP (MM)
8 GND
GND
7
GND
6
GND
5
ADJ
IN
OUT
EN
1
2
3
4
8-Pin SOIC (M)
8-Pin MSOP (MM)
Pin Description
Pin NumberPin NumberPin NamePin Function
1/ERRError (Output): Open-collector output is active low when the output is out of
regulation due to insufficient input voltage or excessive load. An external
pull-up resistor is required.
1ADJAdjustable Feedback Input. Connect to voltage divider network.
22INPower supply input.
33OUTRegulated Output
44ENEnable (Input): Logic low = shutdown; logic high = enabled.
5–85–8GNDGround: Pins 5, 6, 7, and 8 are internally connected in common via the
leadframe.
8 GND
GND
7
GND
6
GND
5
MIC52362November 2000
Page 3
MIC5236Micrel
Absolute Maximum Ratings (Note 1)
Supply Voltage (V
Power Dissipation (P
Junction Temperature (T
Storage Temperature (TS) ....................... –65°C to +150°C
Lead Temperature (soldering, 5 sec.) ....................... 260°C
), Note 3 ........................ –20V to +60V
IN
), Note 4 ............... Internally Limited
D
) ......................................+150°C
J
Operating Ratings (Note 2)
Supply Voltage (V
Junction Temperature (T
Package Thermal Resistance
Note 1. Exceeding the absolute maximum rating may damage the device.
Note 2. The device is not guaranteed to function outside its operating rating.
Note 3: The absolute maximum positive supply voltage (60V) must be of limited duration (≤100ms) and duty cycle (≤1%). The maximum continuous
Note 4: The maximum allowable power dissipation of any T
Note 5. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.
Note 6: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.
Note 7: Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle. Changes in output voltage due to heating
Note 8: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1.0V
(ambient temperature) is P
allowable power dissipation will result in excessive die termperature, and the regulator will go into thermal shutdown. The θ
MIC5236-x.xBM (all versions) is 63°C/W, and the MIC5236-x.xBMM (all versions) is 80°C/W, mounted on a PC board (see “Thermal Characteristics” for further details).
effects are covered by the specification for thermal regulation.
differential.
A
D(max)
= (T
– TA) ÷θJA. Exceeding the maximum
J(max)
5.0µA
of the
JA
MIC52364November 2000
Page 5
MIC5236Micrel
1.0
1.5
2.0
2.5
3.0
3.5
1.52.02.53.03.54.0
OUTPUT VOLTAGE (V)
SUPPLY VOLTAGE (V)
0
5
10
15
20
25
0100 200 300 400 500
GROUND PIN CURRENT (µA)
OUTPUT CURRENT (µA)
)
g
0
0.02
0.04
0.06
0.08
0.10
-40 -20 0 20 40 60 80 100 120
GROUND CURRENT (mA)
TEMPERATURE (°C)
2.985
2.990
2.995
3.000
3.005
3.010
3.015
-40 -20 0 20 40 60 80 100 120
VOLTAGE OUTPUT (V)
TEMPERATURE (°C)
Typical Characteristics
Dropout Voltage
vs. Output Current
400
300
200
100
V
= 98% of Nominal V
OUT
DROPOUT VOLTAGE (mV)
MIC5236-3.0
0
04080120 160 200
OUTPUT CURRENT (mA)
Ground Current
vs. Output Current
4
MIC5236-3.0
3
= 4V
2
1
GROUND PIN CURRENT (mA)
0
0 20 40 60 80 100120 140160
V
IN
OUTPUT CURRENT (mA)
Dropout Characteristics
600
500
400
300
200
100
DROPOUT VOLTAGE (mV)
OUT
I
= 10mA
LOAD
I
= 50mA
LOAD
I
MIC5236-3.0
LOAD
I
LOAD
= 100mA
= 150mA
Ground Pin Current
vs. Output Current
VIN = 4V
VIN = 10V
= 10V
V
IN
MIC5236-3.0
GROUND CURRENT (mA)
Dropout Voltage
vs. Temperature
I
= 150mA
LOAD
MIC5236-3.0
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Ground Current
vs. Supply Voltage
5
MIC5236-3.0
4
3
V
= 3V
OUT
2
1
0
012345678
SUPPLY VOLTAGE (V)
I
LOAD
I
LOAD
= 150mA
= 100µA
100
90
80
70
60
50
40
30
20
10
GROUND PIN CURRENT (µA)
November 20005MIC5236
GROUND CURRENT (mA)
Ground Current
vs. Supply Volta
0
012345678
SUPPLY VOLTAGE (V
e
MIC5236-3.0
I
= 10mA
LOAD
1mA
100µA
10µA
Ground Current
vs. Temperature
4
3
2
1
MIC5236-3.0
0
-40 -20 0 20 40 60 80 100 120
V
= 4V
IN
I
= 150mA
LOAD
TEMPERATURE (°C)
Ground Current
vs. Temperature
MIC5236-3.0
Output Voltage
vs. Temperature
MIC5236-3.0
V
IN
I
LOAD
VIN = 4V
I
LOAD
= 4V
= 10mA
= 150mA
Ground Current
1.2
1.0
0.8
0.6
0.4
0.2
GROUND CURRENT (mA)
vs. Temperature
= 4V
V
IN
I
= 75mA
LOAD
MIC5236-3.0
0
-40 -20 0 20 40 60 80 100120
TEMPERATURE (°C)
Short Circuit Current
285
280
275
270
265
260
255
SHORT CIRCUIT CURRENT (mA)
vs. Temperature
V
= 0V
OUT
MIC5236-3.0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Page 6
MIC5236Micrel
3.018
Line Regulation
3.016
MIC5236-3.0
3.014
3.012
3.010
3.008
3.006
VOLTAGE OUTPUT (V)
3.004
3.002
05 10 15 20 25 30 35
INPUT VOLTAGE (V)
120
MIC5236-3.0
100
VEN = 5V
80
R
= 30Ω
L
60
40
20
INPUT CURRENT (mA)
0
-30-20-10010
INPUT VOLTAGE (V)
I
LOAD
Input Current
= 10mA
Overvoltage Threshold
vs. Temperature
41
MIC5236-3.0
40
39
38
37
INPUT VOLTAGE (V)
36
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Dropout Induced
3.0
2.5
2.0
1.5
1.0
0.5
OUTPUT-LOW VOLTAGE (V)
0
00.51.01.52.0
Error Flag
MIC5236-3.0
VIN = 2.7V
V
=2.62V
OUT
No Load
SINK CURRENT (mA)
Current Limit
vs. Output Voltage
3.5
3.0
2.5
2.0
1.5
1.0
OUTPUT VOLTAGE (V)
0.5
MIC5236-3.0
0
0100200300400
CURRENT LIMIT (mA)
Current Limit Induced
1.25
1.00
0.75
0.50
0.25
OUTPUT-LOW VOLTAGE (V)
0
00.5 1.0 1.5 2.0 2.5 3.0
Error Flag
VIN = 6V
V
= 2.03V
OUT
R
= 6Ω
L
SINK CURRENT (mA)
MIC5236-3.0
Reverse Current
60
50
40
30
20
10
REVERSE CURRENT (µA)
0
(Open Input)
Note 10
-40°C
+25°C
+85°C
05101520
EXTERNAL VOLTAGE (V)
Note 10Note 11
MIC5236
IN
EN
GND
OUT
Reverse
Current
Reverse Current
(Grounded Input)
70
60
Note 11
50
40
30
20
10
REVERSE CURRENT (µA)
0
05101520
EXTERNAL VOLTAGE (V)
MIC5236
IN
EN
GND
+25°C
OUT
-40°C
Reverse
Current
+85°C
MIC52366November 2000
Page 7
MIC5236Micrel
Functional Characteristics
V
V
OUT
EN
Enable
Transient Response
(2V/div.)
(5V/div.)
TIME (250µs/div.)
VIN = 5V
= 10mA
I
L
V
I
OUT
(100mV/div.)
OUT
(100mA/div.)
Load
Transient Response
TIME (250µs/div.)
VIN = 4V
= 3V
V
OUT
= 15µF
C
OUT
ESR = 200mΩ
November 20007MIC5236
Page 8
MIC5236Micrel
Functional Diagram
IN
EN
1.23V
MIC5236-x.x
OUT
R
FB1
Error
Amplifier
R
FB2
R
FB3
ERR
V
REF
Error
Comparator
GND
MIC52368November 2000
Page 9
MIC5236Micrel
Application Information
The MIC5236 provides all of the advantages of the MIC2950:
wide input voltage range, load dump (positive transients up to
60V), and reversed-battery protection, with the added advantages of reduced quiescent current and smaller package.
Additionally, when disabled, quiescent current is reduced to
0.1µA.
Enable
A low on the enable pin disables the part, forcing the quiescent current to less than 0.1µA. Thermal shutdown and the
error flag are not functional while the device is disabled. The
maximum enable bias current is 2µA for a 2.0V input. An open
collector pull-up resistor tied to the input voltage should be set
low enough to maintain 2V on the enable input. Figure 1
shows an open collector output driving the enable pin through
a 200k pull-up resistor tied to the input voltage.
In order to avoid output oscillations, slow transitions from low
to high should be avoided.
SHUTDOWN
ENABLE
V
5V
200k
IN
200k
MIC5236
IN
EN
GND
OUT
ERR
V
ERR
V
OUT
C
OUT
Error Detection Comparator Output
The ERR pin is an open collector output which goes low when
the output voltage drops 5% below it’s internally programmed
level. It senses conditions such as excessive load (current
limit), low input voltage, and over temperature conditions.
Once the part is disabled via the enable input, the error flag
output is not valid. Overvoltage conditions are not reflected in
the error flag output. The error flag output is also not valid for
input voltages less than 1.3V.
The error output has a low voltage of 400mV at a current of
200µA. In order to minimize the drain on the source used for
the pull-up, a value of 200k to 1MΩ is suggested for the error
flag pull-up. This will guarantee a maximum low voltage of
0.4V for a 30V pull-up potential. An unused error flag can be
left unconnected.
Error
4.75V
0V
VALID ERROR
NOT
VALID
NOT
VALID
Output
Voltage
Output
1.3V
5V
0V
Input
Voltage
Figure 3. Error Output Timing
Figure 1. Remote Enable
Input Capacitor
An input capacitor may be required when the device is not
near the source power supply or when supplied by a battery.
Small, surface mount, ceramic capacitors can be used for
bypassing. Larger values may be required if the source
supply has high ripple.
Output Capacitor
The MIC5236 has been designed to minimize the effect of the
output capacitor ESR on the closed loop stability. As a result,
ceramic or film capacitors can be used at the output. Figure 2
displays a range of ESR values for a 10µF capacitor. Virtually
any 10µF capacitor with an ESR less than 3.4Ω is sufficient
for stability over the entire input voltage range. Stability can
also be maintained throughout the specified load and line
conditions with 1µF film or ceramic capacitors.
5
4
3
2
1
OUTPUT CAPACITOR ESR (Ω)
0
5 1015202530
Stable Region
TJ = 25°C
V
= 10µF
OUT
INPUT VOLTAGE (V)
Figure 2. Output Capacitor ESR
Reverse Current Protection
The MIC5236 is designed to limit the reverse current flow
from output to input in the event that the MIC5236 output has
been tied to the output of another power supply. See the
graphs detailing the reverse current flow with the input
grounded and open.
Thermal Shutdown
The MIC5236 has integrated thermal protection. This feature
is only for protection purposes. The device should never be
intentionally operated near this temperature as this may have
detrimental effects on the life of the device. The thermal
shutdown may become inactive while the enable input is
transitioning a high to a low. When disabling the device via the
enable pin, transition from a high to low quickly. This will
insure that the output remains disabled in the event of a
thermal shutdown.
Current Limit
Figure 4 displays a method for reducing the steady state
short circuit current. The duration that the supply delivers
current is set by the time required for the error flag output to
discharge the 4.7µF capacitor tied to the enable pin. The off
time is set by the 200K resistor as it recharges the 4.7µF
capacitor, enabling the regulator. This circuit reduces the
short circuit current from 280mA to 15mA while allowing for
regulator restart once the short is removed.
November 20009MIC5236
Page 10
MIC5236Micrel
a
1N4148
SHUTDOWN
ENABLE
200k
4.7µF
MIC5236
IN
EN
GND
OUT
ERR
V
IN
5V
200k
V
ERR
V
OUT
C
OUT
Figure 4. Remote Enable with Short-Circuit
Current Foldback
Thermal Characteristics
The MIC5236 is a high input voltage device, intended to
provide 150mA of continuous output current in two very small
profile packages. The power SOP-8 and power MSOP-8
allow the device to dissipate about 50% more power than
their standard equivalents.
Power SOP-8 Thermal Characteristics
One of the secrets of the MIC5236’s performance is its power
SO-8 package featuring half the thermal resistance of a
standard SO-8 package. Lower thermal resistance means
more output current or higher input voltage for a given
package size.
Lower thermal resistance is achieved by joining the four
ground leads with the die attach paddle to create a singlepiece electrical and thermal conductor. This concept has
been used by MOSFET manufacturers for years, proving
very reliable and cost effective for the user.
Thermal resistance consists of two main elements, θ
JC
(junction-to-case thermal resistance) and θCA (case-to-ambient thermal resistance). See Figure 5. θJC is the resistance
from the die to the leads of the package. θCA is the resistance
from the leads to the ambient air and it includes θCS (case-tosink thermal resistance) and θSA (sink-to-ambient thermal
resistance).
SOP-8
θ
JA
θ
θ
JC
CA
printed circuit board
AMBIENT
ground plane
heat sink are
Figure 5. Thermal Resistance
Using the power SOP-8 reduces the θJC dramatically and
allows the user to reduce θCA. The total thermal resistance,
θJA (junction-to-ambient thermal resistance) is the limiting
factor in calculating the maximum power dissipation capability of the device. Typically, the power SOP-8 has a θJC of
20°C/W, this is significantly lower than the standard SOP-8
which is typically 75°C/W. θCA is reduced because pins 5
through 8 can now be soldered directly to a ground plane
which significantly reduces the case-to-sink thermal resistance and sink to ambient thermal resistance.
Low-dropout linear regulators from Micrel are rated to a
maximum junction temperature of 125°C. It is important not
to exceed this maximum junction temperature during operation of the device. To prevent this maximum junction temperature from being exceeded, the appropriate ground plane heat
sink must be used.
900
800
)
2
700
600
500
400
300
200
COPPER AREA (mm
100
0
0 0.25 0.50 0.75 1.00 1.25 1.50
40°C
50°C
55°C
65°C
75°C
85°C
POWER DISSIPATION (W)
100°C
Figure 6. Copper Area vs. Power-SOP
Power Dissipation (∆TJA)
Figure 6 shows copper area versus power dissipation with
each trace corresponding to a different temperature rise
above ambient.
From these curves, the minimum area of copper necessary
for the part to operate safely can be determined. The maximum allowable temperature rise must be calculated to determine operation along which curve.
∆T = T
T
J(max)
T
A(max)
– T
J(max)
A(max)
= 125°C
= maximum ambient operating temperature
For example, the maximum ambient temperature is 50°C, the
∆T is determined as follows:
∆T = 125°C – 50°C
∆T = 75°C
Using Figure 6, the minimum amount of required copper can
be determined based on the required power dissipation.
Power dissipation in a linear regulator is calculated as follows:
PD = (VIN – V
OUT
) I
OUT
+ VIN· I
GND
If we use a 3V output device and a 28V input at moderate
output current of 25mA, then our power dissipation is as
follows:
From Figure 6, the minimum amount of copper required to
operate this application at a ∆T of 75°C is 25mm2.
Quick Method
Determine the power dissipation requirements for the design
along with the maximum ambient temperature at which the
device will be operated. Refer to Figure 7, which shows safe
operating curves for three different ambient temperatures:
25°C, 50°C and 85°C. From these curves, the minimum
MIC523610November 2000
Page 11
MIC5236Micrel
amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is as above,
632mW, the curve in Figure 7 shows that the required area of
copper is 25mm2.
The θJA of this package is ideally 63°C/W, but it will vary
depending upon the availability of copper ground plane to
which it is attached.
900
TJ = 125°C
800
)
2
700
600
500
400
300
200
COPPER AREA (mm
100
0
85°C50°C 25°C
0 0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 7. Copper Area vs. Power-SOP
Power Dissipation (TA)
900
800
)
2
700
600
500
400
300
200
COPPER AREA (mm
100
0
40°C
50°C
55°C
65°C
75°C
100°C
85°C
0 0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 8. Copper Area vs. Power-MSOP
Power Dissipation (∆TJA)
The same method of determining the heat sink area used for
the power-SOP-8 can be applied directly to the powerMSOP-8. The same two curves showing power dissipation
versus copper area are reproduced for the power-MSOP-8
and they can be applied identically, see Figures 8 and 9.
900
TJ = 125°C
800
)
2
700
600
500
400
300
200
COPPER AREA (mm
100
85°C50°C 25°C
0
0 0.25 0.50 0.75 1.00 1.25 1.50
POWER DISSIPATION (W)
Figure 9. Copper Area vs. Power-MSOP
Power Dissipation (TA)
Power MSOP-8 Thermal Characteristics
The power-MSOP-8 package follows the same idea as the
power-SO-8 package, using four ground leads with the die
attach paddle to create a single-piece electrical and thermal
conductor, reducing thermal resistance and increasing power
dissipation capability.
Quick Method
Determine the power dissipation requirements for the design
along with the maximum ambient temperature at which the
device will be operated. Refer to Figure 9, which shows safe
operating curves for three different ambient temperatures,
25°C, 50°C, and 85°C. From these curves, the minimum
amount of copper can be determined by knowing the maximum power dissipation required. If the maximum ambient
temperature is 50°C, and the power dissipation is 639mW,
the curve in Figure 9 shows that the required area of copper
is 110mm2,when using the power MSOP-8.
November 200011MIC5236
Page 12
MIC5236Micrel
Package Information
0.026 (0.65)
MAX)
PIN 1
0.157 (3.99)
0.150 (3.81)
0.064 (1.63)
0.045 (1.14)
0.122 (3.10)
0.112 (2.84)
0.036 (0.90)
0.032 (0.81)
0.050 (1.27)
TYP
0.197 (5.0)
0.189 (4.8)
0.020 (0.51)
0.013 (0.33)
0.0098 (0.249)
0.0040 (0.102)
SEATING
PLANE
8-Lead SOIC (M)
0.199 (5.05)
0.187 (4.74)
0.120 (3.05)
0.116 (2.95)
0.043 (1.09)
0.038 (0.97)
DIMENSIONS:
INCHES (MM)
0°–8°
0.012 (0.30) R
45°
0.050 (1.27)
0.016 (0.40)
0.244 (6.20)
0.228 (5.79)
DIMENSIONS:
INCH (MM)
0.010 (0.25)
0.007 (0.18)
0.007 (0.18)
0.005 (0.13)
0.012 (0.03)
0.0256 (0.65) TYP
0.008 (0.20)
0.004 (0.10)
5° MAX
0° MIN
0.012 (0.03) R
0.039 (0.99)
0.035 (0.89)
0.021 (0.53)
8-Lead MSOP (MM)
MICREL INC.1849 FORTUNE DRIVESAN JOSE, CA 95131USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel Inc.