Datasheet MF699ST Datasheet (MITEL)

24

Applications

• Ethernet 10 or 100Mbps

• Token Ring

• Fibre Channel 266Mbps

• FDDI

• ATM-SDH/SONET 155Mbps

• Intra-Office Telecom

• WDM Applications

Features

• Full Duplex Communication

Over One Fiber

• Dual Wavelengths

820/1300nm

• Very Small Size

• Very Low Internal Crosstalk

• Packaged in Industry-

Standard ST® Receptacle

• Designed for 62.5/125µm

Fiber

Description

Used in combination with the
MF799, the MF699 Duplex
Device is designed for WDM

(Wavelength Division Multiplex),
Datacom, Video Links, or Intra­Office Telecom Applications. It
emits optical power at 1320nm
and detects incoming optical
power at 820nm, allowing full
Duplex Communication over
one single fiber.

The MF699 uses dichroic
(wavelength-selective)
beamsplitters for maximum
power budget and minimum
crosstalk. Minimum internal
crosstalk is achieved with
wavelength-selective detectors.
The long wavelength path meets
requirements for FDDI (ANSI
X3T9.5) and ATM 155Mbps.

The MF699 is designed for
multi-mode fiber and optimized
for 62.5/125µm fiber.

MF699 ST

ST Assembly

DICHROIC

BEAMSPLITTER

LED

1320nm

PIN

1320nm

LED

820nm

PIN

820nm

FIBER

MF799

MF699

BOTTOM VIEW

BOTTOM VIEW

BOTTOM VIEW

ANODEANODE

CATHODE

ANODE

CASE

CATHODE

BOTTOM VIEW

ANODE

CASE

CATHODE

Ordering Information

PART # RECEPTACLE

MF699 ST

-40°C to +85°C

13330.11 1997-04-01

MF699 Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device

MF699 Functional Diagram

25

LED Optical & Electrical Characteristics (Case Temperature -25 to +70˚C)

Units

dBm

ns

MHz

nm
nm

V
µA
pF

Test Conditions

I

Peak

=60mA (Note 1, 2)
IF=60mA (Note 2, 3)
IF=60mA (Note 2)
IF=60mA (Note 3)
IF=60mA (Note 3)
IF=60mA
VR=1V
VR=0V, f=1MHz

Max.

1.65
100

Min.

-20.5

Typ.

2.5

125

1320

135

1.3

200

Symbol

P

fiber

trt

f

f

c

λ

p

∆λ

V

F

I

R

C

Parameter

Fiber-Coupled-Power (Fig 1)
Rise & Fall Time

(10-90% no bias)

Bandwidth (3dBel)
Peak Wavelength
Spectral Width (FWHM)
Forward Voltage (Fig 3)
Reverse Current
Capacitance

Note 1: Average power at 10MHz/50% duty cycle. Measured at the exit of 100m of fiber.
Note 2: 62.5/125µm graded index fiber (NA=0.275). Note 3: Meets the FDDI ANSI X3T9.5 specification.

Absolute Maximum Ratings*

Units

°C
°C

mW

mA
mA

V
V

°C

Max.

+85
+85
160

80

130

0.5
20

260

Min.

-40

-40

Symbol

T

stg

T

op

P

tot

I

F

I

FRM

V

RL

V

RP

T

sld

Parameter

Storage Temperature
Operating Temperature (Fig 2)
LED Power Dissipation (Fig 2)
LED Continuous Forward Current (f≤10kHz)
LED Peak Forward Current (duty cycle ≤50%, f≥1MHz)
LED Reverse Voltage
PIN Reverse Voltage
Soldering Temperature (Note 1)

*Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Note 1: 2mm from the case for 10s.

PIN Optical & Electrical Characteristics (Case Temperature -25 to +70˚C)

Units

A/W

MHz

pF
nA

nA

Test Conditions

VR=5V λ=820nm
(Note 1)
VR=5V RL=50Ω
(Note 1)
VR=5V f=1MHz
T

Case

=25˚C

T

Case

=70˚C

VR=5V I

LED

=0mA

VR=5V I

LED

=60mA

(Note 2)

Max.

3

50

Min.

0.25

500

Typ.

1

3

Symbol

R

f

c

C
I

d

I

Cr

Parameter

Responsivity (Fig 4)

Bandwidth

Capacitance (Fig 5)
Dark Current

Crosstalk Current

Note 1: 62.5/125µm graded index fiber (NA=0.275). Note 2: Internal crosstalk with ceramic ferrule inserted but no power from the fiber. Total Current = Dark
Current + Crosstalk Current.

LED Thermal Characteristics

Units

˚C/W
˚C/W
%/˚C

nm/˚C

Max.

200
300

Min. Typ.

-0.75

0.45

Symbol

R

thjc

R

thjb

dP/dT

j

dλ/dT

j

Parameter

Thermal Resistance - Infinite Heat Sink
Thermal Resistance - On PC Board
Temperature Coefficient - Optical Power
Temperature Coefficient - Wavelength

PIN Thermal Characteristics

Units

%/˚C
%/˚C

Max.Min. Typ.

5

-0.75

Symbol

dId/dT

j

dICr/dT

j

Parameter

Temperature Coefficient - Dark Current
Temperature Coefficient - Crosstalk Current

Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device MF699

26

Figure 1

Figure 5

Figure 2

Figure 4

Figure 3

Figure 2

Figure 1

0

20

40

60

80

100

%

0

40 80

120

160

200

mA

FORWARD CURRENT

50% DUTY CYCLE

DC

HEAT SINKED

mW

300

200

100

0

0 50 100

150 °C

ON PC BOARD

OPERATING TEMPERATURE

MAX. ELECTRICAL POWER DISSIPATION

INFINITE
HEAT SINK

FORWARD VOLTAGE

FORWARD CURRENT

mA

200

100

0

0

1 2

3

V

RELATIVE FIBER-COUPLED POWER

0

2.0

pF

0

5

10

V

REVERSE VOLTAGE

CAPACITANCE

1.0

600

700

1000 nm

0

100

50

RELATIVE RESPONSIVITY

WAVELENGTH

%

800

900

600

700

1000 nm

0

100

50

WAVELENGTH

%

800

900

RELATIVE RESPONSIVITY

MF699 Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device

27

MF699 Mechanical Data

Packaging Hardware

MARKING/ SLOT SIDE

12.7

2.5

5.4

LED

PIN DIODE

21

max. 1

1.44. 1 r0.3

7.89 66 0.03

0.006

FIBER

END

MATING FERRULE

(not included)

Ø2.5

+0

-0.004

Ø2.502
+0.01
0

3.9

6.8

min. 12

9.6

2-56 UNC - 2B

3/8" - 32 UNEF

20.1

9.5

9.53

12.70

1.65

0.46

10.41

14.27

HEX-NUT

WASHER

3/8 - 32 UNEF
2B THREAD

Note: The LED chip is isolated from the case. All dimensions in mm.

Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device MF699

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