High voltage NPN Power transistor for standard definition CRT
display
Features
■ State-of-the-art technology:
– Diffused collector “enhanced generation”
■ Stable performance versus operating
temperature variation
■ Low base drive requirement
■ Tight h
■ Fully insulated power package UL compliant
■ Integrated free wheeling diode
range at operating collector current
FE
Applications
■ Horizontal deflection output for TV
Description
The MD1803DFP is manufactured using diffused
collector in planar technology adopting new and
enhanced high voltage structure. The new MD
product series show improved silicon efficiency
bringing updated performance to the horizontal
deflection stage.
3
2
1
TO-220FP
Figure 1.Internal schematic diagram
RBE=60Ω typ.
Table 1.Device summary
Order codeMarkingPackagePacking
MD1803DFPMD1803DFPTO-220FPTube
May 2008Rev 11/10
www.st.com
10
Page 2
Electrical ratingsMD1803DFP
1 Electrical ratings
Table 2.Absolute maximum rating
SymbolParameterValueUnit
V
V
V
I
P
V
T
Collector-emitter voltage (VBE = 0) 1500V
CES
Collector-emitter voltage (IB = 0) 700V
CEO
Emitter-base voltage (IC = 0) 10V
EBO
I
Collector current10A
C
Collector peak current (tP < 5ms)15A
CM
Base current5A
I
B
Total dissipation at Tc = 25°C40W
TOT
Insulation withstand voltage (rms) from all three leads to
Figure 4.Output characteristicsFigure 5.Reverse biased SOA
4/10
Page 5
MD1803DFPElectrical characteristics
Figure 6.DC current gainFigure 7.DC current gain
Figure 8.Collector-emitter saturation voltage Figure 9.Base-emitter saturation voltage
Figure 10. Power lossesFigure 11. Inductive load switching time
5/10
Page 6
Test circuitMD1803DFP
3 Test circuit
Figure 12. Power losses and inductive load switching test circuit
Figure 13. Reverse biased safe operating area test circuit
6/10
Page 7
MD1803DFPPackage mechanical data
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
7/10
Page 8
Package mechanical dataMD1803DFP
TO-220FP mechanical data
Dim.
A4.404.600.1730.181
B2.52.70.0980.106
D2.52.750.0980.108
E0.450.700.0170.027
F0.751.000.0300.039
F11.151.500.0450.067
F21.151.500.0450.067
G4.955.200.1950.204
G12.402.700.0940.106
H1010.400.3930.409
L2160.630
L328.630.61.1261.204
L49.8010.600.3850.417
L52.93.60.1140.141
L615.9016.400.6260.645
L799.300.3540.366
Dia33.20.1180.126
Min.TypMax.Min.Typ.Max.
mm.inch
E
A
D
B
L6
Dia
H
8/10
L2
L7
L3
L5
F1
F2
F
G1
G
123
L4
7012510-I
Page 9
MD1803DFPRevision history
5 Revision history
Table 5.Document revision history
DateRevisionChanges
27-May-20081First release
9/10
Page 10
MD1803DFP
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