The M48Z58/Y ZEROPOWER® RAM is an 8 Kbit x 8 non-volatile static RAM that integrates
power-fail deselect circuitry and battery control logic on a single die. The monolithic chip is
available in two special packages to provide a highly integrated battery-backed memory
solution.
The M48Z58/Y is a non-volatile pin and function equivalent to any JEDEC standard 8 K x 8
SRAM. It also easily fits into many ROM, EPROM, and EEPROM sockets, providing the
non-volatility of PROMs without any requirement for special WRITE timing or limitations on
the number of WRITEs that can be performed.
The 28-pin, 600 mil DIP CAPHAT
button cell in a single package.
™
houses the M48Z58/Y silicon with a long life lithium
The 28-pin, 330 mil SOIC provides sockets with gold plated contacts at both ends for direct
connection to a separate SNAPHAT
®
housing containing the battery. The unique design
allows the SNAPHAT battery package to be mounted on top of the SOIC package after the
completion of the surface mount process. Insertion of the SNAPHAT housing after reflow
prevents potential battery damage due to the high temperatures required for device surfacemounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery packages are shipped separately in plastic anti-static tubes or in tape
& reel form.
For the 28-lead SOIC, the battery package (e.g., SNAPHAT) part number is “M4Z28BR00SH1”.
Figure 1.Logic diagram
V
CC
A0-A12
W
13
M48Z58
M48Z58Y
E
8
DQ0-DQ7
G
V
SS
Doc ID 2559 Rev 115/24
AI01176B
Page 6
DescriptionM48Z58, M48Z58Y
Table 1.Signal names
A0-A12Address inputs
DQ0-DQ7Data inputs / outputs
EChip enable input
GOutput enable input
WWRITE enable input
V
CC
V
SS
NCNot connected internally
Figure 2.DIP connections
Supply voltage
Ground
NCV
1
A12
2
A7
3
A6
4
A5
5
A4
6
A3
7
8
9
10
11
M48Z58
M48Z58Y
A2
A1
A0
DQ0
12
DQ2
13
14
SS
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CC
W
NC
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5DQ1
DQ4
DQ3V
AI01177B
Figure 3.SOIC connections
NCV
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ2
SS
6/24Doc ID 2559 Rev 11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
M48Z58Y
28
27
26
25
24
23
22
21
20
19
18
17
16
15
CC
W
NC
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5DQ1
DQ4
DQ3V
AI01178B
Page 7
M48Z58, M48Z58YDescription
Figure 4.Block diagram
A0-A12
LITHIUM
CELL
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
V
CC
POWER
V
PFD
8K x 8
SRAM ARRAY
V
SS
DQ0-DQ7
E
W
G
AI01394
Doc ID 2559 Rev 117/24
Page 8
Operating modesM48Z58, M48Z58Y
2 Operating modes
The M48Z58/Y also has its own power-fail detect circuit. The control circuitry constantly
monitors the single 5 V supply for an out of tolerance condition. When V
tolerance, the circuit write protects the SRAM, providing a high degree of data security in the
midst of unpredictable system operation brought on by low V
switchover voltage (V
), the control circuitry connects the battery which maintains data
SO
. As VCC falls below battery
CC
until valid power returns.
Table 2.Operating modes
ModeV
Deselect
WRITEV
READV
READV
DeselectV
Deselect≤ V
1. See Table 10 on page 16 for details.
SO
CC
4.75 to 5.5 V
or
4.5 to 5.5 V
to V
PFD
SO
(min)
(1)
(1)
EGWDQ0-DQ7Power
V
XXXHigh ZCMOS standby
XXXHigh ZBattery backup mode
XXHigh ZStandby
IH
XVILD
IL
V
IL
V
IL
V
IL
IH
IH
V
IH
IN
D
OUT
High ZActive
is out of
CC
Active
Active
Note:X = V
or VIL; VSO = Battery backup switchover voltage.
IH
2.1 READ mode
The M48Z58/Y is in the READ mode whenever W (WRITE enable) is high, E (chip enable) is
low. Thus, the unique address specified by the 13 address inputs defines which one of the
8,192 bytes of data is to be accessed. Valid data will be available at the data I/O pins within
address access time (t
and G
access times are also satisfied. If the E and G access times are not met, valid data
will be available after the latter of the chip enable access time (t
access time (t
The state of the eight three-state data I/O signals is controlled by E
activated before t
the address inputs are changed while E
for output data hold time (t
GLQV
) after the last address input signal is stable, providing that the E
AVQ V
) or output enable
ELQV
).
and G. If the outputs are
, the data lines will be driven to an indeterminate state until t
AVQ V
and G remain active, output data will remain valid
) but will go indeterminate until the next address access.
AXQX
AVQ V
. If
8/24Doc ID 2559 Rev 11
Page 9
M48Z58, M48Z58YOperating modes
Figure 5.READ mode AC waveforms
tAVAV
A0-A12
E
G
DQ0-DQ7
Note:WRITE enable (W
tAVQVtAXQX
tELQV
tELQX
tGLQV
tGLQX
) = High.
VAL ID
tEHQZ
tGHQZ
VAL ID
Table 3.READ mode AC characteristics
SymbolParameter
t
AVAV
t
AVQ V
t
ELQV
t
GLQV
t
ELQX
t
GLQX
t
EHQZ
t
GHQZ
t
AXQX
1. Valid for ambient operating temperature: TA = 0 to 70 °C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where noted).
2. CL = 5 pF (see Figure 9 on page 14).
READ cycle time70ns
Address valid to output valid70ns
Chip enable low to output valid70ns
Output enable low to output valid35ns
(2)
Chip enable low to output transition5ns
(2)
Output enable low to output transition5ns
(2)
Chip enable high to output Hi-Z25ns
(2)
Output enable high to output Hi-Z25ns
Address transition to output transition10ns
(1)
M48Z58/Y
MinMax
AI01385
Unit
2.2 WRITE mode
The M48Z58/Y is in the WRITE mode whenever W and E are low. The start of a WRITE is
referenced from the latter occurring falling edge of W
earlier rising edge of W
must return high for a minimum of t
to the initiation of another READ or WRITE cycle. Data-in must be valid t
end of WRITE and remain valid for t
cycles to avoid bus contention; although, if the output bus has been activated by a low on E
and G
, a low on W will disable the outputs t
or E. A WRITE is terminated by the
or E. The addresses must be held valid throughout the cycle. E or W
from chip enable or t
EHAX
afterward. G should be kept high during WRITE
WHDX
after W falls.
WLQZ
Doc ID 2559 Rev 119/24
from WRITE enable prior
WHAX
DVW H
prior to the
Page 10
Operating modesM48Z58, M48Z58Y
Figure 6.WRITE enable controlled, WRITE mode AC waveforms
tAVAV
A0-A12
tAVEL
E
tAVWL
W
tWLQZ
DQ0-DQ7
VAL ID
tAVWH
tWLWH
tWHDX
DATA INPUT
tDVWH
Figure 7.Chip enable controlled, WRITE mode AC waveforms
tAVAV
A0-A12
tAVEL
VAL ID
tAVEH
tELEH
tWHAX
tWHQX
AI01386
tEHAX
E
W
DQ0-DQ7
tAVWL
tDVEH
tEHDX
DATA INPUT
AI01387B
10/24Doc ID 2559 Rev 11
Page 11
M48Z58, M48Z58YOperating modes
Table 4.WRITE mode AC characteristics
SymbolParameter
(1)
M48Z58/Y
Unit
MinMax
t
AVAV
t
AVW L
t
AVEL
t
WLWH
t
ELEH
t
WHAX
t
EHAX
t
DVW H
t
DVE H
t
WHDX
t
EHDX
t
WLQZ
t
AVW H
t
AVEH
t
WHQX
1. Valid for ambient operating temperature: TA = 0 to 70 °C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where
noted).
2. CL = 5 pF (see Figure 9 on page 14).
goes low simultaneously with W going low, the outputs remain in the high impedance state.
3. If E
WRITE cycle time70ns
Address valid to WRITE enable low0ns
Address valid to chip enable low0ns
WRITE enable pulse width50ns
Chip enable low to chip enable high55ns
WRITE enable high to address transition0ns
Chip enable high to address transition0ns
Input valid to WRITE enable high30ns
Input valid to chip enable high30ns
WRITE enable high to input transition5ns
Chip enable high to input transition5ns
(2)(3)
WRITE enable low to output Hi-Z25ns
Address valid to WRITE enable high60ns
Address valid to chip enable high60ns
(2)(3)
WRITE enable high to output transition5ns
2.3 Data retention mode
With valid VCC applied, the M48Z58/Y operates as a conventional BYTEWIDE™ static
RAM. Should the supply voltage decay, the RAM will automatically power-fail deselect, write
protecting itself when V
become high impedance, and all inputs are treated as “Don't care.”
Note:A power failure during a WRITE cycle may corrupt data at the currently addressed location,
but does not jeopardize the rest of the RAM's content. At voltages below V
user can be assured the memory will be in a write protected state, provided the V
is not less than t
. The M48Z58/Y may respond to transient noise spikes on VCC that reach
F
into the deselect window during the time the device is sampling V
of the power supply lines is recommended.
When V
drops below VSO, the control circuit switches power to the internal battery which
CC
preserves data. The internal button cell will maintain data in the M48Z58/Y for an
accumulated period of at least 10 years when V
As system power returns and V
power supply is switched to external V
exceeds V
PFD
(max).
For more information on battery storage life refer to the application note AN1012.
falls within the V
CC
rises above VSO, the battery is disconnected, and the
CC
(max), V
PFD
is less than VSO.
CC
. Normal RAM operation can resume t
CC
(min) window. All outputs
PFD
. Therefore, decoupling
CC
(min), the
PFD
rec
fall time
CC
after VCC
Doc ID 2559 Rev 1111/24
Page 12
Operating modesM48Z58, M48Z58Y
2.4 VCC noise and negative going transients
ICC transients, including those produced by output switching, can produce voltage
fluctuations, resulting in spikes on the V
capacitors are used to store energy which stabilizes the V
bypass capacitors will be released as low going spikes are generated or energy will be
absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1 µF (see Figure 8)
is recommended in order to provide the needed filtering.
In addition to transients that are caused by normal SRAM operation, power cycling can
generate negative voltage spikes on V
one volt. These negative spikes can cause data corruption in the SRAM while in battery
backup mode. To protect from these voltage spikes, ST recommends connecting a schottky
diode from V
CC
to V
(cathode connected to VCC, anode to VSS). (Schottky diode 1N5817
SS
is recommended for through hole and MBRS120T3 is recommended for surface mount).
Figure 8.Supply voltage protection
V
CC
bus. These transients can be reduced if
CC
that drive it to values below VSS by as much as
CC
V
bus. The energy stored in the
CC
CC
0.1µFDEVICE
V
SS
AI02169
12/24Doc ID 2559 Rev 11
Page 13
M48Z58, M48Z58YMaximum ratings
3 Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 5.Absolute maximum ratings
SymbolParameterValueUnit
T
Ambient operating temperature0 to 70°C
A
SNAPHAT® top–40 to 85°C
T
STG
Storage temperature (VCC off, oscillator off)
CAPHAT® DIP–40 to 85°C
SOH28–55 to 125°C
(1)(2)
T
SLD
V
V
CC
I
O
P
1. For DIP package, soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds.
Furthermore, the devices shall not be exposed to IR reflow nor preheat cycles (as performed as part of
wave soldering). ST recommends the devices be hand-soldered or placed in sockets to avoid heat damage
to the batteries.
2. For SOH28 package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260 °C (the time above
255 °C must not exceed 30 seconds).
Lead solder temperature for 10 seconds260°C
Input or output voltages–0.3 to 7.0V
IO
Supply voltage–0.3 to 7.0V
Output current20mA
Power dissipation1W
D
Caution:Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Caution:Do NOT wave solder SOIC to avoid damaging SNAPHAT
®
sockets.
Doc ID 2559 Rev 1113/24
Page 14
DC and AC parametersM48Z58, M48Z58Y
4 DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC characteristic
tables are derived from tests performed under the measurement conditions listed in Tabl e 6 :
Operating and AC measurement conditions. Designers should check that the operating
conditions in their projects match the measurement conditions when using the quoted
parameters.
Table 6.Operating and AC measurement conditions
ParameterM48Z58M48Z58YUnit
Supply voltage (VCC)4.75 to 5.5 4.5 to 5.5V
Ambient operating temperature (T
Load capacitance (CL)100100pF
Input rise and fall times≤ 5≤ 5ns
Input pulse voltages0 to 30 to 3V
Input and output timing ref. voltages1.51.5V
Note:Output Hi-Z is defined as the point where data is no longer driven.
)0 to 700 to 70°C
A
Figure 9.AC measurement load circuit
5V
1.9kΩ
DEVICE
UNDER
TEST
1kΩ
CL includes JIG capacitance
OUT
CL = 100pF or 5pF
Table 7.Capacitance
SymbolParameter
C
C
IO
1. Effective capacitance measured with power supply at 5 V. Sampled only, not 100% tested.
2. At 25 °C, f = 1 MHz.
3. Outputs deselected.
Input capacitance-10pF
IN
(3)
Input / output capacitance-10pF
(1)(2)
MinMaxUnit
AI01030
14/24Doc ID 2559 Rev 11
Page 15
M48Z58, M48Z58YDC and AC parameters
Table 8.DC characteristics
SymbolParameterTest condition
(1)
MinMaxUnit
I
I
LO
I
CC
I
CC1
I
CC2
V
V
V
V
LI
IL
IH
OL
OH
Input leakage current0 V ≤ VIN ≤ V
(2)
Output leakage current0 V ≤ V
OUT
≤ V
CC
CC
Supply currentOutputs open50mA
Supply current (standby) TTLE = V
IH
Supply current (standby) CMOSE = VCC – 0.2 V3mA
Input low voltage–0.30.8V
Input high voltage2.2VCC + 0.3V
Output low voltageIOL = 2.1 mA0.4V
Output high voltageIOH = –1 mA2.4V
±1µA
±1µA
3mA
1. Valid for ambient operating temperature: TA = 0 to 70 °C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where noted).
2. Outputs deselected.
Figure 10. Power down/up mode AC waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
VSO
INPUTS
tPD
tF
tFB
tDR
tRB
DON'T CARE
tR
trec
RECOGNIZEDRECOGNIZED
OUTPUTS
VAL IDVAL ID
(PER CONTROL INPUT)
HIGH-Z
(PER CONTROL INPUT)
Doc ID 2559 Rev 1115/24
AI01168C
Page 16
DC and AC parametersM48Z58, M48Z58Y
Table 9.Power down/up AC characteristics
SymbolParameter
(1)
MinMaxUnit
t
PD
(2)
t
F
t
FB
t
R
t
RB
t
rec
1. Valid for ambient operating temperature: TA = 0 to 70 °C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where
noted).
2. V
PFD
until 200 µs after V
3. V
PFD
E or W at VIH before power down0µs
V
(max) to V
(3)
PFD
V
(min) to VSS VCC fall time10µs
PFD
V
(min) to V
PFD
VSS to V
V
PFD
(max) to V
(min) to VSS fall time of less than tFB may cause corruption of RAM data.
PFD
(min) V
PFD
(max) to inputs recognized40200ms
(min) fall time of less than tF may result in deselection/write protection not occurring
passes V
CC
(min) VCC fall time300µs
PFD
(max) VCC rise time10µs
PFD
rise time1µs
CC
(min).
PFD
Table 10.Power down/up trip points DC characteristics
SymbolParameter
V
V
t
DR
1. All voltages referenced to VSS.
2. Valid for ambient operating temperature: T
noted).
3. At 25 °C, VCC = 0 V.
Power-fail deselect voltage
PFD
Battery backup switchover voltage3.0V
SO
(3)
Expected data retention time10Years
(1)(2)
MinTypMaxUnit
M48Z584.54.64.75V
M48Z58Y4.24.354.5V
= 0 to 70 °C; VCC = 4.75 to 5.5 V or 4.5 to 5.5 V (except where
A
16/24Doc ID 2559 Rev 11
Page 17
M48Z58, M48Z58YPackage mechanical data
5 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
14-Sep-20012Reformatted; added temperature information (Ta b le 7 , 8, 3, 4, 9, 10)
29-May-20022.1Modify reflow time and temperature footnotes (Ta b le 5 )
16-Sep-20022.2Remove footnote from ordering information (Ta bl e 1 5 )
02-Apr-20033v2.2 template applied; test condition updated (Ta bl e 1 0)
23-Mar-20044Reformatted; updated lead-free information (Ta bl e 5 , 15)
23-Nov-20045
09-Jun-20056
14-Dec-20057Updated lead-free text (Ta b le 1 5)
06-Nov-20078
10-Mar-20099
14-Oct-201010Updated Section 3, Ta b l e 11 ; reformatted document.
07-Jun-201111
Remove references to industrial temperature grade (Ta bl e 3 , 4, 5, 6, 8,
9, 10, 15)
®
Removal of SNAPHAT
4, 5, 6, 7, 8, 10, 15)
Reformatted; added lead-free second level interconnect information to
cover page and Section 5: Package mechanical data; updated Ta bl e 5 ,
15, 16.
Updated Ta b le 5 , text in Section 5: Package mechanical data; added
Section 7: Environmental information; minor reformatting.
Updated footnote 1 of Table 5: Absolute maximum ratings; updated
Section 7: Environmental information.
, industrial temperature sales types (Ta b le 3 ,
Doc ID 2559 Rev 1123/24
Page 24
M48Z58, M48Z58Y
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