INTEGRATED ULTRA LOW POWER SRAM,
POWER-FAIL CONTROL CIRCUIT and
BATTERY
UNLIMITED WRITE CYCLES
READ CYCLE TIME EQUALS WRITE CYCLE
TIME
AUTOMATIC P OWER-F AIL CHIP DES ELECT and
WRITE PROTECTION
WRITE PROTECT VOLT AGES
= Power-fail Deselect Voltage):
(V
PFD
– M48Z08: 4.50V ≤ V
– M48Z18: 4.20V ≤ V
SELF-CONTAINED BATTERY in the CAPHAT
DIP PACKAGE
PACKAGING INCLUDES a 28 LEAD SOIC
and SNAPHAT
®
TOP (to be Ordered
Separately)
SOIC PACKAGE PROVIDES DIRECT
CONNECTION for a SNAPHAT TOP which
CONTAINS the BATTERY
PIN and FUNCTION COMPATIBLE with the
DS1225 and JEDEC STANDARD 8K x 8
SRAMs
PFD
PFD
4.75V
≤
4.50V
≤
SNAPHAT (SH)
Battery
28
28
1
SOH28 (MH)
Figure 1. Logic Diagram
M48Z08
M48Z18
1
PCDIP28 (PC)
Battery CAPHAT
DESCRIPTION
The M48Z08/18 ZEROPOWER
®
RAM is an 8K x
V
CC
8 non-volatile static RAM which is pin and functional compatible with the DS1225. The monolithic
chip is available in two special packages to provide
a highly integrated battery backed-up memory so-
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indi cat ed in the operati onal
section of this specification is not implied. Exposure to the absolute maximum rating conditions for extended periods of time may
affect reliability.
2. Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to exceed 150°C for longer than 30 seconds).
CAUTION: Negat i ve undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-up mode.
CAUTION: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Table 3. Operating Modes
ModeV
Deselect
WriteV
ReadV
ReadV
DeselectV
Deselect≤ V
Note:
1. X = V
Ambient Operating Temperature–40 to 85 °C
Storage T emper ature (VCC Off)–40 to 85 °C
Lead Solder Temperature for 10 seconds260°C
Input or Output Voltages–0.3 to 7 V
Supply Voltage–0.3 to 7 V
Output Current20mA
Power Dissipation1W
(1)
CC
4.75V to 5.5V
or
4.5V to 5.5V
to V
SO
or VIL; VSO = Battery Back-up Switchover Voltage.
IH
(min)XXXHigh ZCMOS Standby
PFD
SO
EGWDQ0-DQ7Power
V
IH
IL
IL
IL
XXHigh ZStandby
XVILD
V
IL
V
IH
V
IH
V
IH
IN
D
OUT
High ZActive
XXXHigh ZBattery Back-up Mode
Active
Active
2/18
Page 3
Figure 3. Block Diagram
M48Z08, M48Z18
A0-A12
LITHIUM
CELL
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
V
CC
DESCRIPTION
(cont’d)
The M48Z08/18 is a non-volatile pin and function
equivalent to any JEDEC standard 8K x 8 SRAM.
It also easily fits into many ROM, EPROM, and
EEPROM sockets, providing the non-volatility of
PROMs without any requirement for special write
timing or limitations on the number of writes t hat
can be performed.
The 28 pin 600mil DIP CAPHAT houses the
M48Z08/18 silicon with a long life lithium button cell
in a single package.
The 28 pin 330mil SOIC provides s ockets with gold
plated contacts at both ends for direct connection
to a separate SNAPHAT housing containing the
battery. The unique design allows the SNAPHAT
battery package to be mounted on top of the SOIC
package after the completion of the surface mount
process. Insertion of the SNAPHAT housing after
reflow prevents potential battery damage due to the
high temperatures required for device surfacemounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery packages are shipped separately in plastic anti-static tubes or in Tape & Reel
form.
POWER
V
PFD
8K x 8
SRAM ARRAY
V
SS
Table 4. AC Measurement Conditions
Input Rise and Fall Times≤ 5ns
Input Pulse Voltages0 to 3V
Input and Output Timing Ref. Voltages1.5V
Note that Output Hi-Z is defined as the point where data is no
longer driven.
Figure 4. AC Testing Load Circuit
5V
1.8kΩ
DEVICE
UNDER
TEST
1kΩ
CL includes JIG capacitance
CL = 100pF or 30pF
DQ0-DQ7
E
W
G
AI01394
OUT
AI01398
3/18
Page 4
M48Z08, M48Z18
(1, 2)
T ab le 5. Capacitance
= 25 °C)
(T
A
SymbolParameterT est ConditionMinMaxUnit
C
IN
(3)
C
IO
Notes:
1. Effective capacitance measured with power supply at 5V .
2. Negative spikes of –1V allowed for up to 10ns once per cycle.
Input Leakage Current0V ≤ VIN ≤ V
Output Leakage Current0V ≤ V
Supply Current (Standby) TTLE = V
Supply Current (Standby) CMOSE = VCC – 0.2V3mA
OUT
≤ V
IH
CC
CC
Input Low Voltage–0.30.8V
Input High Voltage2.2VCC + 0.3V
Output Low VoltageIOL = 2.1mA0.4V
Output High VoltageIOH = –1mA2.4V
±1µA
±5µA
3mA
T able 7. Power Down/Up Trip Points DC Characteristics
= 0 to 70°C)
(T
A
(1)
SymbolParameterMinTypMaxUnit
V
PFD
V
PFD
V
SO
t
DR
Note:
1. All voltages referenced to V
DESCRIPTION
Power-fail Deselect Voltage (M48Z08)4.54.64.75V
Power-fail Deselect Voltage (M48Z18)4.24.34.5V
Battery Back-up Switchover Voltage3.0V
Expected Data Retention Time11YEARS
.
SS
(cont’d)
When V
is out of tolerance, the circuit write
CC
protects the SRAM, providing a high degree of data
For the 28 lead SOIC, the battery package (i.e.
SNAPHAT) part number is "M4Z28-BR00SH1".
The M48Z08/18 also has its own Power-fail Detect
circuit. The control circuitry constantly monitors the
single 5V supply for an out of tolerance condition.
4/18
security in the midst of unpredictable system op-
eration brought on by low V
. As VCC falls below
CC
approximately 3V , the control circuitry connects the
battery which maintains data until valid power re-
turns.
Page 5
M48Z08, M48Z18
T able 8. Power Down/Up Mode AC Characteristics
= 0 to 70°C)
(T
A
SymbolParameterMinMaxUnit
Notes
t
PD
(1)
t
F
t
FB
t
R
t
RB
t
REC
:1.V
2. V
(2)
V
E or W at VIH before Power Down0µs
V
(max) to V
PFD
V
(min) to VSO VCC Fall Time10µs
PFD
V
(min) to V
PFD
VSO to V
PFD
(min) VCC Fall Time300µs
PFD
(max) VCC Rise Time0µs
PFD
(min) VCC Rise Time1µs
E or W at VIH after Power Up1ms
(max) to V
PFD
passes V
CC
(min) to VSO fall time of less than tFB may cause corruption of RAM data.
PFD
(min) fall time of less than tF may result in deselection/writ e protection not occ urri ng until 200 µs after
PFD
(min).
PFD
Figure 5. Power Down/Up Mode AC Waveforms
V
CC
V
(max)
PFD
V
(min)
PFD
VSO
tF
tDR
tFB
INPUTS
OUTPUTS
Note:
Inputs may or may not be recognized at this time. Caution should be taken to keep
may perform inadvertent writ e cyc l es after V
reset is being applied to the processor, a reset condition may not occur until after the system clock is running.
VALIDVALID
(PER CONTROL INPUT)
rises above V
CC
(min) but before normal system operations begin. Even though a power on
PFD
DON'T CARE
HIGH-Z
E high as VCC rises past V
tR
NOTE
(PER CONTROL INPUT)
PFD
tRECtPDtRB
RECOGNIZEDRECOGNIZED
AI00606
(min ). Some system s
5/18
Page 6
M48Z08, M48Z18
T ab le 9. Read Mode AC Characteristics
= 0 to 70°C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)
(T
A
SymbolParameter
Notes:
t
t
AVQV
t
ELQV
t
GLQV
t
ELQX
t
GLQX
t
EHQZ
t
GHQZ
t
AXQX
AVAV
1. C
2. C
(1)
(1)
(1)
(2)
(2)
(2)
(2)
(1)
Read Cycle Time100ns
Address Valid to Output Valid100ns
Chip Enable Low to Output Valid100ns
Output Enable Low to Output Valid50ns
Chip Enable Low to Output Transition10ns
Output Enable Low to Output Transition5ns
Chip Enable High to Output Hi-Z50ns
Output Enable High to Output Hi-Z40ns
Address Transition to Output Transition5ns
= 100pF (see Figure 4).
L
= 30pF (see Figure 4).
L
Figure 6. Read Mode AC Waveforms
M48Z08 / M48Z18
-100
MinMax
Unit
Note:
Write Enable (
A0-A12
E
G
DQ0-DQ7
W) = High.
tAVAV
VALID
tAVQVtAXQX
tELQV
tELQX
tGLQX
tGLQV
tGHQZ
VALID
tEHQZ
AI01385
6/18
Page 7
M48Z08, M48Z18
T ab le 10. Write Mode AC Characteristics
= 0 to 70°C; VCC = 4.75V to 5.5V or 4.5V to 5.5V)
(T
A
SymbolParameter
Notes:
t
AVAV
t
AVWL
t
AVEL
t
WLWH
t
ELEH
t
WHAX
t
EHAX
t
DVWH
t
DVEH
t
WHDX
t
E1HDX
(1, 2)
t
WLQZ
t
AVWH
t
AVEH
(1, 2)
t
WHQX
1. C
= 30pF (see Figure 4).
L
E goes low simultaneously with W going low, the outputs remain in the high impedance state.
2. If
Write Cycle Time100ns
Address Valid to Write Enable Low0ns
Address Valid to Chip Enable Low0ns
Write Enable Pulse Width80ns
Chip Enable Low to Chip Enable High80ns
Write Enable High to Address Transition10ns
Chip Enable High to Address Transition10ns
Input Valid to Write Enable High50ns
Input Valid to Chip Enable High30ns
Write Enable High to Input Transition5ns
Chip Enable High to Input Transition5ns
Write Enable Low to Output Hi-Z50ns
Address Valid to Write Enable High80ns
Address Valid to Chip Enable High80ns
Write Enable High to Output Transition10ns
M48Z08 / M48Z18
-100
MinMax
Unit
READ MODE
The M48Z08/18 is in the Read Mode whenever
(Write Enable) is high and
E (Chip Enable) is low.
W
The device architecture allows ripple-through access of data from eight of 65,536 locations in the
static storage array. Thus, the unique address
specified by the 13 Address Inputs defines which
one of the 8,192 bytes of data is to be accessed.
Valid data will be available at the Data I/O pins
within Address Access time (t
) after the last
AVQV
address input signal is stable, providing that the
G access times are also satisfied. If the E and
and
G access times are not met, valid data will be
available after the latter of the Chip Enable Access
time (t
) or Output Enable Access time (t
ELQV
GLQV
The state of the eight three-state Data I/O signals
is controlled by
before t
AVQ V
indeterminate state until t
puts are changed while
E and G. If the outputs are activated
, the data lines will be driven to an
. If the Address In-
AVQV
E and G remain active,
output data will remain valid for Output Data Hold
time (t
) but will go indeterminate until the next
AXQX
Address Access.
WRITE MODE
The M48Z08/18 is in the Write Mode whenever
E are active. The start of a write is referenced
and
from the latter occurring falling edge of
A write is terminated by the earlier rising edge of
E
E. The addresses must be held valid throughout
or
the cycle.
of t
E or W must return high for a minimum
from Chip Enable or t
EHAX
WHAX
Enable prior to the initiation of another read or write
).
cycle. Data-in must be valid t
of write and remain valid for t
prior to the end
DVWH
WHDX
should be kept high during write cycles to avoid bus
contention; although, if the output bus has been
activated by a low on
disable the outputs t
E and G, a low on W will
after W falls.
WLQZ
W
W or E.
W
from Write
afterward. G
7/18
Page 8
M48Z08, M48Z18
Figure 7. Write Enable Controlled, Write AC Waveforms
tAVAV
A0-A12
tAVEL
E
tAVWL
W
tWLQZ
DQ0-DQ7
VALID
tAVWH
tWLWH
Figure 8. Chip Enable Controlled, Write AC Waveforms
tDVWH
tWHAX
tWHQX
tWHDX
DATA INPUT
AI01386
8/18
A0-A12
E
W
DQ0-DQ7
tAVEL
tAVWL
tAVAV
VALID
tAVEH
tELEH
tDVEH
tEHAX
tEHDX
DATA INPUT
AI01387B
Page 9
M48Z08, M48Z18
DA TA RETE NT ION MODE
With valid V
applied, the M48Z08/18 operates as
CC
a conventional BYTEWIDE static RAM. Should
the supply voltage decay, the RAM will automatically power-fail deselect, write protecting itself
when V
falls within the V
CC
(max), V
PFD
PFD
(min)
window. All outputs become high im pedanc e, and
all inputs are treated as "don’t care."
Note:
A power failure during a write cycle may
corrupt data at the c urrently addressed location,
but does not jeopardize the rest of the RAM’s
content. At voltages below V
(min), the user can
PFD
be assured the memory will be in a write protected
state, provided the V
fall time is not less than tF.
CC
The M48Z08/18 may respond to transient noise
spikes on V
during the time the device is s ampling V
that reach into the deselect window
CC
. There-
CC
fore, decoupling of the power supply lines is recommended.
When V
drops below VSO, the control circuit
CC
switches power to the internal batter y which preserves data and powers the clock. The internal
button cell will maintain data in the M48Z08/18 for
an accumulated period of at least 11 years when
is less than VSO. As system power r eturns and
V
CC
rises above VSO, the battery is disconnected,
V
CC
and the power supply is switched to external V
Write protection continues until V
(min) plus t
rises past V
(min). E should be kept high as V
REC
(min) to prevent inadvertent write
PFD
reaches V
CC
CC
PFD
CC
cycles prior to system stabilization. Normal RAM
operation can resume t
(max).
V
PFD
after VCC exceeds
REC
For more information on Battery Storage Life refer
to the Application Note AN 1012.
SYSTEM BATTERY LIFE
The useful life of the bat tery in the M48Z08/18 is
expected to ultimately come to an end for one of
two reasons: either because it has been discharged while providing current to the RAM in the
battery back-up mode, or because the effects of
aging render the cell useless before it can actually
be completely discharged. The two effects are
virtually unrelated, allowing discharge or Capacity
Consumption, and the effects of aging or Storage
Life, to be treated as two independent but simultaneous mechanisms. The earlier occurring failure
mechanism defines the battery system life of the
M48Z08/18.
.
Figure 9. Predicted Battery Storage Life versus Temperature
50
40
30
20
10
8
6
YEARS
5
4
3
2
1
2030405060708090
TEMPERATURE (Degrees Celsius)
AI01399
t50% (AVERAGE)
t1%
9/18
Page 10
M48Z08, M48Z18
Cell Storage Life
Storage life is primarily a function of temperature.
Figure 9 illustrates the approximate stor age life of
the M48Z08/18 battery over temperature. The results in Figure 9 are derived from temperature
accelerated life test studies performed at SGSTHOMSON. For the purpose of the testing, a cell
failure is defined as the inability of a cell stabilized
at 25°C to produce a 2.4V closed circuit voltage
across a 250 kΩ load resistor. The two lines, t
and t
, represent different failure rate dis tribu-
50%
1%
tions for the cell’s storage life. At 70°C, for example,
line indicates that an M48Z08/18 has a 1%
the t
1%
chance of having a battery failure 28 years into its
life while the t
of failure at the 50 year mark. The t
shows the part has a 50% chance
50%
line repre-
1%
sents the practical onset of wear out and can be
considered the worst case Storage Life for the cell.
The t
can be considered the normal or average
50%
life.
Calculating Storage Life
The following formula can be used to predict storage life:
or 154 years.
As can been seen from these calculations and the
results, the expected lifetime of the M48Z08/18
should exceed most system requirements.
Estimated System Life
Since either storage life or capacity consumption
can end the battery’s life, the system life is marked
by which ever occurs first.
Reference for System Life
Each M48Z08/18 is marked with a nine digit manufacturing date code in the form of H99XXYYZZ. For
example, H995B9431 is:
H = fabricated in Carrollton, TX
9 = assembled in Muar, Malaysia,
9 = tested in Muar, Malaysia,
5B = lot designator,
9431 = assembled in the year 1994, work week 31.
POWER SUPPLY DECOUPLING and UNDERSHOOT PROTECTION
transients, including those produced by output
I
CC
switching, can produce voltage fluctuations, resulting in spikes on the V
bus. These transients can
CC
be reduced if capacitors are used to store energy,
which stabilizes the V
bus. The energy stored in
CC
the bypass capacitors will be released as low going
spikes are generated or energy will be absorbed
when overshoots occur. A ceramic bypass capacitor value of 0.1µF (as shown in Figure 10) is
recommended in order to provide the needed filtering.
In addition to transients that are caused by normal
SRAM operation, power cycling can generate
negative voltage spikes on V
values below V
by as much as one Volt. These
SS
that drive it to
CC
negative spikes can cause data corruption in t he
SRAM while in battery backup mode. To protect
from these voltage spikes, it is recommeded to
connect a schottky diode from V
connected to V
, anode to VSS). Schottky diode
CC
to VSS (cathode
CC
1N5817 is recommended for through hole and
MBRS120T3 is recommended for surface mount.
Figure 10. Supply Voltage Protection
V
CC
V
CC
0.1µFDEVICE
V
SS
AI02169
10/18
Page 11
ORDERING INFORMATION SCHEME
Example: M48Z18 -100 MH 1 TR
M48Z08, M48Z18
Supply Voltage and Write
Protect Voltage
(1)
08
VCC = 4.75V to 5.5V
V
= 4.5V to 4.75V
PFD
18 V
Notes:
Caution:
= 4.5V to 5.5V
CC
V
= 4.2V to 4.5V
PFD
1. The M48Z08 part is offered with the PCDIP28 (i.e. CAPHAT) package only.
2. The SOIC package (SOH28) requires the battery package (SNAPHAT) which is ordered separately under the part number
"M4Z28-BR00SH1" in plasti c tube or "M4Z28 -BR 00SH 1T R" in Tape & Reel form.
3. Delivery may include either the 2-pin version of the SOIC/SNAPHAT or the 4-pin version of the SOIC/SNAPHAT. Both are
functionally equivalent (see package drawing section for details).
4. Temperature range available for M48Z18 product only.
Do not place the SNAPHAT battery package "M4Z28-BR00SH1" in conductive foam since this will drain the lithium button-cel l
battery.
Speed
-100 100ns
Package
PC PCDIP28
(2,3)
MH
SOH28
Temp. Range
1 0 to 70 °C
(4)
6
–40 to 85 °C
Shipping Method
for SOIC
blank Tubes
TR Tape &Reel
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device,
please contact the STMicroelectronics Sales Office nearest to you.
Information furnished is believ ed to be accurate and reliable. How ever, STMicroelectronics ass umes no responsib ility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and repl aces all information previous ly supplied. STMicroelect ronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelect roni cs