The M41T56 is a low-power, serial real-time clock (RTC) with 56 bytes of NVRAM. A built-in
32,768 Hz oscillator (external crystal controlled) and the first 8 bytes of the RAM are used
for the clock/calendar function and are configured in binary coded decimal (BCD) format.
Addresses and data are transferred serially via a two-line, bidirectional bus. The built-in
address register is incremented automatically after each WRITE or READ data byte.
The M41T56 clock has a built-in power sense circuit which detects power failures and
automatically switches to the battery supply during power failures. The energy needed to
sustain the RAM and clock operations can be supplied from a small lithium coin cell.
Typical data retention time is in excess of 10 years with a 50 mAh, 3 V lithium cell. The
M41T56 is supplied in an 8-lead plastic SOIC package.
Figure 1.Logic diagram
OSCI
SCL
V
CC
M41T56
V
SS
V
BAT
OSCO
SDA
FT/OUT
AI02304B
Doc ID 6104 Rev 95/27
Page 6
DescriptionM41T56
Table 1.Signal names
OSCIOscillator input
OCSOOscillator output
FT/OUTFrequency test / output driver (open drain)
SDASerial data address input / output
SCLSerial clock
V
BAT
V
CC
V
SS
Battery supply voltage
Supply voltage
Ground
Figure 2.8-pin SOIC connections
M41T56
OSCIV
V
BAT
SS
Figure 3.M41T56 block diagram
OSCI
OSCO
FT/OUT
V
CC
V
SS
V
BAT
SCL
SDA
OSCILLATOR
32.768 kHz
VOLTAGE
SENSE
and
SWITCH
CIRCUITRY
SERIAL
BUS
INTERFACE
1
2
3
4
8
7
6
5
DIVIDER
CONTROL
LOGIC
ADDRESS
REGISTER
CC
FT/OUTOSCO
SCL
SDAV
1 Hz
AI02306B
SECONDS
MINUTES
CENTURY/HOURS
DAY
DATE
MONTH
YEAR
CONTROL
RAM
(56 x 8)
6/27Doc ID 6104 Rev 9
AI02566
Page 7
M41T56Operation
2 Operation
The M41T56 clock operates as a slave device on the serial bus. Access is obtained by
implementing a start condition followed by the correct slave address (D0h). The 64 bytes
contained in the device can then be accessed sequentially in the following order:
1.Seconds register
2. Minutes register
3. Century/hours register
4. Day register
5. Date register
6. Month register
7. Years register
8. Control register
9. RAM
The clock continually monitors V
V
, the device terminates an access in progress and resets the device address counter.
PFD
for an out of tolerance condition. Should VCC fall below
CC
Inputs to the device will not be recognized at this time to prevent erroneous data from being
written to the device from an out of tolerance system. When V
automatically switches over to the battery and powers down into an ultra low current mode
of operation to conserve battery life. Upon power-up, the device switches from battery to
V
CC
at V
and recognizes inputs when VCC goes above V
BAT
2.1 2-wire bus characteristics
This bus is intended for communication between different ICs. It consists of two lines: one
bidirectional for data signals (SDA) and one for clock signals (SCL). Both the SDA and the
SCL lines must be connected to a positive supply voltage via a pull-up resistor.
The following protocol has been defined:
●Data transfer may be initiated only when the bus is not busy.
●During data transfer, the data line must remain stable whenever the clock line is high.
●Changes in the data line while the clock line is high will be interpreted as control
signals.
Accordingly, the following bus conditions have been defined:
2.1.1 Bus not busy
falls below V
CC
volts.
PFD
, the device
BAT
Both data and clock lines remain high.
2.1.2 Start data transfer
A change in the state of the data line, from high to low, while the clock is high, defines the
START condition.
Doc ID 6104 Rev 97/27
Page 8
OperationM41T56
2.1.3 Stop data transfer
A change in the state of the data line, from low to high, while the clock is high, defines the
STOP condition.
2.1.4 Data valid
The state of the data line represents valid data when after a start condition, the data line is
stable for the duration of the high period of the clock signal. The data on the line may be
changed during the low period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a start condition and terminated with a stop condition.
The number of data bytes transferred between the start and stop conditions is not limited.
The information is transmitted byte-wide and each receiver acknowledges with a ninth bit.
By definition, a device that gives out a message is called “transmitter,” the receiving device
that gets the message is called “receiver.” The device that controls the message is called
“master.” The devices that are controlled by the master are called “slaves.”
2.1.5 Acknowledge
Each byte of eight bits is followed by one acknowledge bit. This acknowledge bit is a low
level put on the bus by the receiver, whereas the master generates an extra acknowledge
related clock pulse.
A slave receiver which is addressed is obliged to generate an acknowledge after the
reception of each byte. Also, a master receiver must generate an acknowledge after the
reception of each byte that has been clocked out of the slave transmitter.
The device that acknowledges has to pull down the SDA line during the acknowledge clock
pulse in such a way that the SDA line is a stable low during the high period of the
acknowledge related clock pulse. Of course, setup and hold times must be taken into
account. A master receiver must signal an end-of-data to the slave transmitter by not
generating an acknowledge on the last byte that has been clocked out of the slave. In this
case, the transmitter must leave the data line high to enable the master to generate the
STOP condition.
Figure 4.Serial bus data transfer sequence
DATA LINE
STABLE
DATA VALID
CLOCK
DATA
START
CONDITION
CHANGE OF
DATA ALLOWED
STOP
CONDITION
8/27Doc ID 6104 Rev 9
AI00587
Page 9
M41T56Operation
Figure 5.Acknowledge sequence
CLOCK PULSE FOR
ACKNOWLEDGEMENT
SCLK FROM
MASTER
START
1289
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
MSBLSB
Figure 6.Bus timing requirements sequence
SDA
tHD:STAtBUF
tR
SCL
SP
tHIGH
tLOW
tF
tHD:DAT
tSU:DAT
SR
AI00601
tHD:STA
tSU:STOtSU:STA
P
AI00589
Doc ID 6104 Rev 99/27
Page 10
OperationM41T56
Table 2.AC characteristics
SymbolParameter
(1)
MinMaxUnit
f
SCL
t
LOW
t
HIGH
t
R
t
F
t
HD:STA
t
SU:STA
t
SU:DAT
t
HD:DAT
t
SU:STO
t
BUF
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
2. Transmitter must internally provide a hold time to bridge the undefined region (300 ns max.) of the falling
edge of SCL.
SCL clock frequency0100kHz
Clock low period4.7µs
Clock high period4µs
SDA and SCL rise time1µs
SDA and SCL fall time300ns
START condition hold time
(after this period the first clock pulse is generated)
START condition setup time
(only relevant for a repeated start condition)
Data setup time250ns
(2)
Data hold time0µs
STOP condition setup time4.7µs
Time the bus must be free before a new
transmission can start
2.2 Read mode
4µs
4.7µs
4.7µs
In this mode, the master reads the M41T56 slave after setting the slave address (see
Figure 7 on page 11 and Figure 8 on page 11). Following the WRITE mode control bit
(R/W
= 0) and the acknowledge bit, the word address An is written to the on-chip address
pointer. Next the START condition and slave address are repeated, followed by the READ
mode control bit (R/W
= 1). At this point, the master transmitter becomes the master
receiver. The data byte which was addressed will be transmitted and the master receiver will
send an acknowledge bit to the slave transmitter. The address pointer is only incremented
on reception of an acknowledge bit. The M41T56 slave transmitter will now place the data
byte at address A
byte and the address pointer is incremented to A
+ 1 on the bus. The master receiver reads and acknowledges the new
n
+ 2. This cycle of reading consecutive
n
addresses will continue until the master receiver sends a STOP condition to the slave
transmitter.
An alternate READ mode may also be implemented, whereby the master reads the M41T56
slave without first writing to the (volatile) address pointer. The first address that is read is the
last one stored in the pointer, see Figure 9 on page 11.
10/27Doc ID 6104 Rev 9
Page 11
M41T56Operation
Figure 7.Slave address location
R/W
STA RTA
Figure 8.Read mode sequence
BUS ACTIVITY:
MASTER
SDA LINE
BUS ACTIVITY:
START
S
SLAVE
ADDRESS
R/W
ADDRESS (n)
ACK
DATA n+X
WORD
SLAVE ADDRESS
MSB
0100 011
START
S
ACK
ADDRESS
STOP
P
SLAVE
LSB
R/W
DATA nDATA n+1
ACK
AI00602
ACK
ACK
NO ACK
Figure 9.Alternative read mode sequence
BUS ACTIVITY:
MASTER
BUS ACTIVITY:
START
S
SLAVE
ADDRESS
R/W
DATA nDATA n+1DATA n+X
ACK
Doc ID 6104 Rev 911/27
AI00899
STOP
PSDA LINE
ACK
ACK
ACK
NO ACK
AI00895
Page 12
OperationM41T56
2.3 Write mode
In this mode the master transmitter transmits to the M41T56 slave receiver. Bus protocol is
shown in Figure 10 on page 12. Following the START condition and slave address, a logic '0'
(R/W
= 0) is placed on the bus and indicates to the addressed device that word address An
will follow and is to be written to the on-chip address pointer. The data word to be written to
the memory is strobed in next and the internal address pointer is incremented to the next
memory location within the RAM on the reception of an acknowledge clock. The M41T56
slave receiver will send an acknowledge clock to the master transmitter after it has received
the slave address and again after it has received the word address and each data byte (see
Figure 7 on page 11).
2.4 Data retention mode
With valid VCC applied, the M41T56 can be accessed as described above with READ or
WRITE cycles. Should the supply voltage decay, the M41T56 will automatically deselect,
write protecting itself when V
accomplished by internally inhibiting access to the clock registers and SRAM. When V
falls below the battery backup switchover voltage (V
V
pin to the battery and the clock registers and SRAM are maintained from the attached
CC
battery supply.
falls between V
CC
(max) and V
PFD
), power input is switched from the
SO
(min). This is
PFD
CC
All outputs become high impedance. On power up, when V
write protection continues for t
REC
.
returns to a nominal value,
CC
For a further more detailed review of battery lifetime calculations, please see application
note AN1012.
Figure 10. Write mode sequence
BUS ACTIVITY:
MASTER
BUS ACTIVITY:
START
S
SLAVE
ADDRESS
R/W
WORD
ADDRESS (n)
ACK
DATA nDATA n+1DATA n+X
ACK
ACK
ACK
PSDA LINE
ACK
AI00591
STOP
12/27Doc ID 6104 Rev 9
Page 13
M41T56Clock operation
3 Clock operation
The eight byte clock register (see Ta bl e 3 ) is used to both set the clock and to read the date
and time from the clock, in a binary coded decimal format. Seconds, minutes, and hours are
contained within the first three registers. Bits D6 and D7 of clock register 2 (hours register)
contain the century enable bit (CEB) and the century bit (CB). Setting CEB to a '1' will cause
CB to toggle, either from '0' to '1' or from '1' to '0' at the turn of the century (depending upon
its initial state). If CEB is set to a '0,' CB will not toggle. Bits D0 through D2 of register 3
contain the day (day of week). Registers 4, 5, and 6 contain the date (day of month), month,
and years. The final register is the control register (this is described in the clock calibration
section). Bit D7 of register 0 contains the stop bit (ST). Setting this bit to a '1' will cause the
oscillator to stop.
If the device is expected to spend a significant amount of time on the shelf, the oscillator
may be stopped to reduce current drain. When reset to a '0' the oscillator restarts within one
second.
The seven clock registers may be read one byte at a time, or in a sequential block. The
control register (address location 7) may be accessed independently. Provision has been
made to assure that a clock update does not occur while any of the seven clock addresses
are being read. If a clock address is being read, an update of the clock registers will be
delayed by 250 ms to allow the READ to be completed before the update occurs. This will
prevent a transition of data during the READ.
Note:This 250 ms delay affects only the clock register update and does not alter the actual clock
time.
Table 3.Register map
Address
D7D6D5D4D3D2D1D0
0ST10 SecondsSecondsSeconds00-59
1X10 MinutesMinutesMinutes00-59
2CEB
3XXXXX DayDay01-07
4XX10 dateDateDate01-31
5XXX10 M.MonthMonth01-12
610 yearsYearsYear00-99
7OUTFTSCalibrationControl
1. Keys:
S = Sign bit
FT = Frequency test bit
ST = Stop bit
OUT = Output level
X = Don't care
CEB = Century enable bit
CB = Century bit
2. When CEB is set to '1,' CB toggles from '0' to '1' or from '1' to '0' every 100 years (dependent upon the
initial value set). When CEB is set to '0,' CB does not toggle.
(2)
(1)
Data
CB10 hoursHoursCentury/hours 0-1/00-23
Function/range
BCD format
Doc ID 6104 Rev 913/27
Page 14
Clock operationM41T56
3.1 Clock calibration
The M41T56 is driven by a quartz-controlled oscillator with a nominal frequency of
32,768 Hz. The devices are tested not to exceed 35 ppm (parts per million) oscillator
frequency error at 25 °C, which equates to about ±1.53 minutes per month. With the
calibration bits properly set, the accuracy of each M41T56 improves to better than ±2 ppm
at 25 °C.
The oscillation rate of any crystal changes with temperature (see Figure 11 on page 15).
Most clock chips compensate for crystal frequency and temperature shift error with
cumbersome “trim” capacitors. The M41T56 design, however, employs periodic counter
correction. The calibration circuit adds or subtracts counts from the oscillator divider circuit
at the divide by 256 stage, as shown in Figure 11 on page 15. The number of times pulses
are blanked (subtracted, negative calibration) or split (added, positive calibration) depends
upon the value loaded into the five-bit calibration byte found in the control register. Adding
counts speeds the clock up, subtracting counts slows the clock down.
The calibration byte occupies the five lower order bits (D4-D0) in the control register (addr
7). This byte can be set to represent any value between 0 and 31 in binary form. Bit D5 is
the sign bit; '1' indicates positive calibration, '0' indicates negative calibration. Calibration
occurs within a 64 minute cycle. The first 62 minutes in the cycle may, once per minute, have
one second either shortened by 128 or lengthened by 256 oscillator cycles. If a binary '1' is
loaded into the register, only the first 2 minutes in the 64 minutes cycle will be modified; if a
binary 6 is loaded, the first 12 will be affected, and so on.
Therefore, each calibration step has the effect of adding 512 or subtracting 256 oscillator
cycles for every 125,829,120 actual oscillator cycles, that is +4.068 or –2.034 ppm of
adjustment per calibration step in the calibration register. Assuming that the oscillator is in
fact running at exactly 32,768Hz, each of the 31 increments in the calibration byte would
represent +10.7 or –5.35 seconds per month which corresponds to a total range of +5.5 or –
2.75 minutes per month.
Two methods are available for ascertaining how much calibration a given M41T56 may
require. The first involves simply setting the clock, letting it run for a month and comparing it
to a known accurate reference (like WWV broadcasts). While that may seem crude, it allows
the designer to give the end user the ability to calibrate his clock as his environment may
require, even after the final product is packaged in a non-user serviceable enclosure. All the
designer has to do is provide a simple utility that accessed the calibration byte.
The second approach is better suited to a manufacturing environment, and involves the use
of some test equipment. When the frequency test (FT) bit, the seventh-most significant bit in
the control register, is set to a '1,' and the oscillator is running at 32,768 Hz, the FT/OUT pin
of the device will toggle at 512 Hz. Any deviation from 512 Hz indicates the degree and
direction of oscillator frequency shift at the test temperature.
For example, a reading of 512.01024 Hz would indicate a +20 ppm oscillator frequency
error, requiring a –10(XX001010) to be loaded into the calibration byte for correction.
Note:Setting or changing the calibration byte does not affect the frequency test output frequency.
14/27Doc ID 6104 Rev 9
Page 15
M41T56Clock operation
Figure 11. Crystal accuracy across temperature
Frequency (ppm)
20
0
–20
–40
–60
–80
–100
–120
–140
–160
ΔF
= K x (T –T
F
K = –0.036 ppm/°C2 ± 0.006 ppm/°C
TO = 25°C ± 5°C
0 10203040506070
Temperature °C
2
)
O
2
80–10–20–30–40
AI00999b
Figure 12. Clock calibration
NORMAL
POSITIVE
CALIBRATION
NEGATIVE
CALIBRATION
3.2 Output driver pin
When the FT bit is not set, the FT/OUT pin becomes an output driver that reflects the
contents of D7 of the control register. In other words, when D6 of location 7 is a '0' and D7 of
location 7 is a '0' and then the FT/OUT pin will be driven low.
Note:The FT/OUT pin is open drain which requires an external pull-up resistor.
3.3 Initial power-on defaults
AI00594B
Upon initial application of power to the device, the FT bit will be set to a '0' and the OUT bit
will be set to a '1.' All other register bits will initially power-on in a random state.
Doc ID 6104 Rev 915/27
Page 16
Maximum ratingsM41T56
4 Maximum ratings
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 4.Absolute maximum ratings
SymbolParameterValueUnit
T
A
T
STG
T
SLD
V
IO
V
CC
I
O
P
D
1. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260 °C. The time above
255 °C must not exceed 30 seconds.
Ambient operating temperature–40 to 85°C
Storage temperature (VCC off, oscillator off)–55 to 125°C
(1)
Lead solder temperature for 10 seconds260°C
Input or output voltages–0.3 to 7V
Supply voltage–0.3 to 7V
Output current20mA
Power dissipation0.25W
Caution:Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
16/27Doc ID 6104 Rev 9
Page 17
M41T56DC and AC parameters
5 DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC characteristics
tables are derived from tests performed under the measurement conditions listed in Ta bl e 5 :
Operating and AC measurement conditions. Designers should check that the operating
conditions in their projects match the measurement conditions when using the quoted
parameters.
Table 5.Operating and AC measurement conditions
ParameterValueUnit
(1)
Supply voltage (V
Ambient operating temperature (T
Load capacitance (C
)4.5 to 5.5V
CC
)–40 to 85°C
A
)100pF
L
Input rise and fall times≤ 5ns
Input pulse voltages0 to 3V
Input and output timing ref. voltages1.5V
1. Output Hi-Z is defined as the point where data is no longer driven.
Figure 13. AC measurement I/O waveform
0.8V
CC
0.2V
CC
Table 6.Capacitance
SymbolParameter
C
IN
C
OUT
t
LP
1. Effective capacitance measured with power supply at 5V; sampled, not 100% tested.
2. At 25 °C, f = 1 MHz.
3. Outputs deselected.
Input capacitance (SCL)7pF
(3)
Output capacitance (SDA, FT/OUT)10pF
Low-pass filter input time constant (SDA and SCL)0.251µs
(1)(2)
0.7V
CC
0.3V
CC
MinMaxUnit
AI02568
Doc ID 6104 Rev 917/27
Page 18
DC and AC parametersM41T56
Table 7.DC characteristics
≤ V
BAT
(1)
CC
CC
= 3 V
MinTypMaxUnit
±1µA
±1µA
450550nA
MinTypMaxUnit
SymbolParameterTest condition
I
Input leakage current0V ≤ VIN ≤ V
LI
Output leakage current0V ≤ V
I
LO
I
I
V
V
BAT
I
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
2. STMicroelectronics recommends the RAYOVAC BR1225 or BR1632 (or equivalent) as the battery supply.
Table 8.Crystal electrical characteristics
SymbolParameter
Supply current Switch frequency = 100 kHz300µA
CC1
Supply current (standby)SCL, SDA = VCC – 0.3 V100µA
CC2
Input low voltage–0.31.5V
V
IL
Input high voltage3VCC + 0.8V
V
IH
Output low voltageIOL = 5mA, VCC = 4.5 V0.4V
OL
(2)
Battery supply voltage2.533.5V
T
Battery supply current
BAT
A
oscillator ON, V
(1)(2)
OUT
= 25 °C, VCC = 0 V,
f
R
C
1. These values are externally supplied for the SO8 package. STMicroelectronics recommends the KDS DT-
38: 1TA/1TC252E127, Tuning Fork Type (thru-hole) or the DMX-26S: 1TJS125FH2A212, (SMD) quartz
crystal for industrial temperature operations. For contact information on this crystal type, seeSection 8:
References on page 25.
2. Load capacitors are integrated within the M41T56. Circuit board layout considerations for the 32.768 kHz
crystal of minimum trace lengths and isolation from RF generating signals should be taken into account.
Resonant frequency32.768kHz
O
Series resistance60kΩ
S
Load capacitance12.5pF
L
Figure 14. Power down/up mode AC waveforms
V
CC
V
PFD
VSO
SDA
SCL
I
BAT
t
PD
t
FB
DATA RETENTION TIME
t
RB
t
REC
AI00595
18/27Doc ID 6104 Rev 9
Page 19
M41T56DC and AC parameters
Table 9.Power down/up mode AC characteristics
SymbolParameter
(1)
MinMaxUnit
t
PD
t
FB
t
RB
t
REC
1. Valid for ambient operating temperature: TA = –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
Table 10.Power down/up trip points DC characteristics
SymbolParameter
V
PFD
V
1. All voltages referenced to VSS.
2. Valid for ambient operating temperature: T
SCL and SDA at VIH before power-down0ns
V
(min) to VSS VCC fall time300µs
PFD
VSS to V
(min) VCC rise time100µs
PFD
SCL and SDA at VIH after power-up10µs
(1)(2)
Power-fail deselect voltage1.2 V
Battery back-up switchover voltageV
SO
= –40 to 85 °C; VCC = 4.5 to 5.5 V (except where noted).
A
MinTypMaxUnit
BAT
1.25 V
BAT
BAT
1.285 V
BAT
V
V
Doc ID 6104 Rev 919/27
Page 20
Package mechanical dataM41T56
6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
20/27Doc ID 6104 Rev 9
Page 21
M41T56Package mechanical data
Figure 15. SO8 – 8-pin plastic small package outline
h x 45˚
A2
b
e
D
8
1
1. Drawing is not to scale.
Table 11.SO8 – 8-pin plastic small outline, package mechanical data
E1
A
ccc
E
A1
L
L1
c
0.25 mm
GAUGE PLANE
k
SO-A
millimetresinches
Symbol
TypMinMaxTypMinMax
A1.750.069
A10.100.250.0040.010
A21.250.049
b0.280.480.0110.019
c0.170.230.0070.009
ccc0.100.004
D4.904.805.000.1930.1890.197
E6.005.806.200.2360.2280.244
E13.903.804.000.1540.1500.157
e1.27– –0.050– –
h0.250.500.0100.020
k0°8°0°8°
L0.401.270.0160.050
L11.040.041
1. Drawing is not to scale.
Doc ID 6104 Rev 921/27
Page 22
Package mechanical dataM41T56
Figure 16. Carrier tape for SO8 package (150-mil body width)
P
D
T
A
TOP COVER
TAPE
K
0
0
CENTER LINES
OF CAVITY
P
2
B
0
0
P
1
E
F
W
USER DIRECTION OF FEED
Table 12.Carrier tape dimensions for SO8 package (150-mil body width)
PackageWDEP
1.50
+0.10/
–0.00
1.75
±0.10
4.00
±0.10
SO8
12.00
±0.30
P
0
2.00
±0.10
FA0B
2
5.50
±0.05
6.50
±0.10
0
5.30
±0.10
K
0
2.20
±0.10
P
1
8.00
±0.10
AM03073v1
TUnit
0.30
±0.05
mm 2500
Bulk
Qty
22/27Doc ID 6104 Rev 9
Page 23
M41T56Package mechanical data
Figure 17. Reel schematic
T
40mm min.
Access hole
At slot location
B
D
C
A
Tape slot
Full ra dius
In core for
Tape s tart
2.5mm min.width
N
G measured
At hub
AM04928v1
Table 13.Reel dimensions for 12 mm carrier tape - SO8 package (150-mil body width)
A
(max)
330 mm
(13-inch)
B
(min)
1.5 mm
C
13 mm
± 0.2 mm
D
(min)
N
(min)
20.2 mm60 mm
G
12.4 mm
+ 2/–0 mm
T
(max)
18.4 mm
Note:The dimensions given in Tab le 13 incorporate tolerances that cover all variations on critical
parameters.
Doc ID 6104 Rev 923/27
Page 24
Part numberingM41T56
7 Part numbering
Table 14.Ordering information scheme
Example:M41T56M6E
Device type
M41T
Supply voltage and write protect voltage
56 = V
Package
M = SO8
Temperature range
= 4.5 to 5.5 V
CC
6 = –40 °C to 85 °C
Shipping method
E = Lead-free package (ECOPACK
®
), tubes
(1)
F = Lead-free package (ECOPACK®), tape & reel
1. Not recommended for new design. Contact local ST sales office for availability.
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M41T56References
8 References
●The crystal component supplier KDS as cited in Table 8: Crystal electrical
characteristics on page 18 can be contacted at http://www.kds.info/index_en.htm
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Revision historyM41T56
9 Revision history
Table 15.Document revision history
DateRevisionChanges
Mar-19991.0First issue
23-Dec-19991.1SOH28 package added
21-Mar-20001.2Series resistance max value changed (Ta b le 8 )
30-Nov-20001.3Added PSDIP8 package
25-Jan-20011.4Corrected graphic, measurements of PSDIP8 (Figure 18, Table 14)
16-Feb-20012.0Reformatted, table added (Tab l e 1 6).
06-Apr-20012.1
Add temp./voltage information to characteristics (Ta bl e 7 , Ta b l e 2 ); correct series
resistance (Ta bl e 8 )
17-Jul-20012.2Basic formatting changes
02-Aug-20022.3
Modify reflow time and temperature footnote (Ta bl e 4 ); modify crystal electrical
characteristics table footnotes (Tab l e 8 ); removed PSDIP8 package
07-Nov-20022.4Correct figure name (Features on page 1)
15-Jun-20043.0
Reformatted; add lead-free information; update characteristics (Figure 11; Ta bl e 4 ,
Ta bl e 1 4 )
Changed document to new template; amalgamated diagrams in Features on page 1;
11-Sep-20064
amended footnotes in Table 3: Register map; updated Package mechanical data in
Section 6: Package mechanical data; small text changes for entire document, removed
lead packages from Ta bl e 1 4 , ECOPACK compliant
09-Oct-20065
10-Apr-20076
Updated package mechanical data in Figure 15: SO8 – 8-pin plastic small package
outline.
Updated package information references that only SO8 available (cover page, Section 1,
Section 4, Ta b le 4 , Ta bl e 8 , and Ta bl e 1 4 ).
Added lead-free second level interconnect information to cover page and Section 6:
06-Nov-20077
Package mechanical data; updated Ta bl e 4 , footnote 1 in Ta bl e 8 ; addition of Section 8:
References.
13-Dec-20078Updated cover page and Section 8: References.
Updated footnote 1 of Table 4: Absolute maximum ratings; updated ECOPACK
06-Dec-20119
Section 6: Package mechanical data; added footnote 1 to Table 14: Ordering information
scheme; added Figure 16, 17, Ta b le 1 2 , 13; updated title; minor textual updates.
®
text in
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M41T56
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