Datasheet LTC3214 Datasheet (LINEAR TECHNOLOGY)

Page 1
FEATURES
Low Noise Constant Frequency Operation*
High Efficiency: Up to 94%
Multi-Mode Operation: 1x, 1.5x or 2x Boost Modes
Automatic Mode Switching
High Output Current: Up to 500mA
Tiny Application Circuit (3mm × 3mm DFN Package, All Components <1mm High)
Automatic Soft-Start
Output Disconnect
Open, Shorted LED Protection
No Inductors
Internal 110m LED Current Sense Resistor
3mm × 3mm 10-Lead DFN Package
U
APPLICATIO S
LED Torch/Camera Light Supply for Cell Phones, PDAs and Digital Cameras
General Lighting and/or Flash/Strobe Applications
LTC3214
500mA Camera
LED Charge Pump
U
The LTC®3214 is a low noise, high current charge pump DC/DC converter capable of driving high current LEDs at up to 500mA from a 2.9V to 4.5V input. Low external parts count (two flying capacitors, one programming resistor and two bypass capacitors at V the LTC3214 ideally suited for small, battery-powered applications.
Built-in soft-start circuitry prevents excessive inrush cur­rent during start-up. High switching frequency enables the use of small external capacitors.
Output current level is programmed by an external resis­tor. LED current is regulated using an internal 110m sense resistor. Automatic mode switching optimizes effi­ciency by monitoring the voltage across the charge pump and switching modes only when dropout is detected. The part is available in a low profile 3mm x 3mm 10-lead DFN package.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. *Protected by U.S. Patents including 6411531.
and CPO) make
IN
TYPICAL APPLICATIO
2.9V TO 4.5V
2.2µF
C1
2.2µF
+C1–C2+C2–
C1
V
C
IN
IN
ENDISABLE ENABLE
I
SET
LED: AOT2015
LTC3214
0.11
R
SET
C2
2.2µF
CPO
I
LED
3214 TA01a
U
LED
I
LED
UP TO 500mA
C
CPO
4.7µF
100
100mA
90
80
70
) (%)
IN
/P
60
LED
50
40
30
EFFICIENCY (P
20
LED = AOT2015
10
= 2.9V TYP AT 100mA
V
F
0
2.9
3.1 3.5
Efficiency vs V
200mA
300mA
3.3
3.7
VIN (V)
3.9
IN
50mA
4.1
4.3
3214 TA01b
4.5
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Page 2
LTC3214
WW
W
U
ABSOLUTE AXI U RATI GS
(Note 1)
VIN to GND ............................................... –0.3V to 5.5V
CPO to GND ............................................. –0.3V to 5.5V
EN ................................................... – 0.3V to V
I
, I
CPO
(Note 2) ............................................. 600mA
ILED
CPO Short-Circuit Duration ............................ Indefinite
Storage Temperature Range ................. –65°C to 125°C
Operating Temperature Range (Note 3) .. – 40°C to 85°C
+ 0.3V
IN
UUW
PACKAGE/ORDER I FOR ATIO
TOP VIEW
+
C2
1
+
C1
2
11
3
CPO
4
I
LED
5
I
SET
10-LEAD (3mm × 3mm) PLASTIC DFN
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND
DD PACKAGE
T
= 125°C, θJA = 43°C/W
JMAX
ORDER PART NUMBER
LTC3214EDD LBVQ
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
10
C1
GND
9
C2
8
7
V
IN
6
EN
DD PART MARKING
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. V
PARAMETER CONDITIONS MIN TYP MAX UNITS
Input Power Supply
VIN Operating Voltage
I
Operating Current I
VIN
I
Shutdown Current EN = LOW 2.5 7.5 µA
VIN
LED Current
LED Current Ratio (I
I
Dropout Voltage (V
LED
Mode Switching Delay (LED Warmup Time) 2.5 ms
LED Current On Time EN to LED Current On 100 µs
Charge Pump (CPO)
Charge Pump Output Clamp Voltage 5V
1x Mode Output Impedance 0.70
1.5x Mode Output Impedance 3.2
2x Mode Output Impedance 3.5
CLK Frequency V
EN
High Level Input Voltage (VIH)
Low Level Input Voltage (VIL)
Input Current (IIH)V
Input Current (IIL)
)I
LED/ISET
) Mode Switch Threshold, I
ILED
The ● denotes the specifications which apply over the full operating
= 3.6V, CIN = C1 = C2 = 2.2µF, C
IN
= 0mA, 1x Mode 980 µA
CPO
= 0mA, 1.5x 4.8 mA
I
CPO
= 0mA, 2x Mode 6.7 mA
I
CPO
= 150mA to 500mA 2715 2950 3190 mA/mA
LED
= 200mA 40 mV
LED
= 3V
IN
= 3.6V
EN
= 4.7µF.
CPO
2.9 4.5 V
0.6 0.9 1.2 MHz
1.4 V
–1 1 µA
14.4 20 µA
0.4 V
2
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LTC3214
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at T
The ● denotes the specifications which apply over the full operating
= 25°C. V
A
= 3.6V, CIN = C1 = C2 = 2.2µF, C
IN
= 4.7µF.
CPO
PARAMETER CONDITIONS MIN TYP MAX UNITS
I
SET
V
ISET
I
ISET
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.
Note 2: Based on long-term current density limitations. Assumes an operating duty cycle of 10% under absolute maximum conditions for
I
SET
= 50µA
1.18 1.21 1.24 V
184 µA
durations less than 10 seconds. Max current for continuous operation is 300mA.
Note 3: The LTC3214E is guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C ambient operating temperature range are assured by design, characterization and correlation with statistical process controls.
UW
(T
TYPICAL PERFOR A CE CHARACTERISTICS
I
Dropout Voltage
LED
vs LED Current
0.12
0.10
0.08
600
500
400
= 25°C unless otherwise specified)
A
I
vs R
LED
SET
0.06
0.04
DROPOUT VOLTAGE (V)
0.02
0
0 100
LED CURRENT (mA)
300200 400 500
1x Mode Charge Pump Open-Loop Output Resistance vs Temperature
1.0 I
= 100mA
CPO
0.9
VIN = 2.9V
0.8
0.7
0.6
OUTPUT RESISTANCE ()
0.5
0.4
–40 –15
VIN = 3.6V
VIN = 4.5V
3510 60 85
TEMPERATURE (°C)
3216 G01
3216 G03
(mA)
300
LED
I
200
100
0
0
50 150
100
200
250
R
(k)
SET
2x Mode Charge Pump Open-Loop Output Resistance
– V
)/I
(2V
5
4
3
2
OUTPUT RESISTANCE ()
1
0
–40
IN
CPO
VIN = 3.6V
= C1 = C2 = 2.2µF
C
IN
= 4.7µF
C
CPO
–15 35
vs Temperature
CPO
10
TEMPERATURE (°C)
300
350
400
1573 G02
85
60
3216 G05
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LTC3214
UW
TYPICAL PERFOR A CE CHARACTERISTICS
(TA = 25°C unless otherwise specified)
Efficiency vs V
100
100mA
90
80
70
) (%)
IN
/P
60
LED
50
40
30
EFFICIENCY (P
20
LED = AOT2015
10
= 2.9V TYP AT 100mA
V
F
0
2.9
3.1 3.5
Input Shutdown Current vs Input Voltage
4.5
4.0
3.5
TA = 25°C
3.0
2.5
2.0
1.5
1.0
INPUT SHUTDOWN CURRENT (µA)
0.5
0
2.9 4.5
3.3
IN
200mA
300mA
50mA
3.3
3.7
VIN (V)
3.9
TA = –40°C
3.7
INPUT VOLTAGE (V)
4.3
4.1
4.5
3215 G08
TA = 85°C
4.13.1 3.5 3.9
4.3
3214 G06
I
SET/ILED
vs I
3300
3200
3100
3000
2900
CURRENT RATIO
2800
2700
0
Current Ratio
Current
LED
25°C
85°C
–40°C
I
LED
FREQUENCY (kHz)
200100 300
CURRENT (mA)
Oscillator Frequency vs Supply Voltage
910
900
890
880
870
860
850
840
830
TA = 25°C
3.1 3.5 3.9
2.9 4.5
400
3.3
500
3214 G09
TA = –40°C
TA = 85°C
3.7
SUPPLY VOLTAGE (V)
600
500
400
300
(mA)
LED
I
200
100
0
2.9 4.53.3 3.7 4.13.1 3.5 3.9 4.3
4.1
Current vs Input Voltage
I
LED
4.3
3214 G07
7.15k
11.8k
17.4k
36.6k
72.2k
VIN (V)
3214 G10
4
V
CPO
50mV/DIV
1.5x Mode CPO Output Ripple 2x Mode CPO Output Ripple
V
CPO
50mV/DIV
A/C COUPLED
IN
I
CPO
= 3.6V
= 200mA
500ns/DIVV
3214 G11
I
IN
CPO
= 3.6V
= 400mA
500ns/DIVV
3214 G12
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LTC3214
U
UU
PI FU CTIO S
C2+, C1+, C2–, C1– (Pins 1, 2, 8, 10): Charge Pump Flying Capacitor Pins. A 2.2µF X5R or X7R ceramic capacitor should be connected from C1
.
C2
+
to C1– and from C2+ to
CPO (Pin 3): Output. CPO is the output of the charge pump. This pin may be enabled or disabled using the EN input. A 4.7µF X5R or X7R ceramic capacitor is required from CPO to GND.
I
(Pin 4): Input. I
LED
LED is connected between CPO (anode) and I ode). The current into the I connected to the I
I
(Pin 5): LED Current Programming Resistor Pin. A
SET
is the LED current sense pin. The
LED
pin is set by a resistor
LED
pin and regulated internally.
SET
LED
(cath-
resistor connected between this pin and GND is used to set the LED current level.
W
BLOCK DIAGRA
EN (Pin 6): Input. The EN pin is used to enable the part and bring it into shutdown mode. An internal 250k resistor pulls this pin to GND when left floating.
(Pin 7): Power. Supply voltage for the LTC3214. V
V
IN
IN
should be bypassed with a 2.2µF to 4.7µF low impedance ceramic capacitor to GND.
GND (Pin 9): Charge Pump Ground. This pin should be connected directly to a low impedance ground plane.
Exposed Pad (Pin 11): Control Signal Ground. This pad must be soldered to a low impedance ground plane for optimum thermal and electrical performance.
2 10 1 8
OSCILLATOR
+
C1
C1
+
C2
C2
CPO
3
VOLTAGE
CLAMP
+
V
MODE
CONTROL
V
IN
7
EN
6
250k
CONTROL
LOGIC
GND
REF
CURRENT
SOURCE
CONTROL
V
IN
58
I
SET
1159
0.11
GND
I
LED
4
3214 BD
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LTC3214
OPERATIO
U
The LTC3214 uses a fractional switched capacitor charge pump to power a high current LED with a programmed regulated current. The part starts up into the 1x mode. In this mode, VIN is directly connected to CPO. This mode provides maximum efficiency and minimum noise. The LTC3214 will remain in this mode until the forward voltage (VF) approaches the maximum CPO voltage possible in this mode. When this dropout condition occurs, the LTC3214 will switch to 1.5x mode after a soft-start period. Any subsequent dropout detected will cause the part to enter 2x mode.
A two phase nonoverlapping clock activates the charge pump switches. In the 2x mode, the flying capacitors are charged on alternate clock phases from V capacitor is being charged from V on top of V
and connected to the output. Alternatively, in
IN
, the other is stacked
IN
. While one
IN
the 1.5x mode the flying capacitors are charged in series during the first clock phase, and stacked in parallel on top of VIN on the second clock phase. This sequence of charging and discharging the flying capacitors continues at a free running frequency of 900kHz (typ).
The current delivered to the LED load is controlled by the internal programmable current source. The current is programmed by a resistor connected between the I
SET
pin and GND. The resistor value needed to attain the desired current level can be determined by Equation 1.
R
= 3570/I
SET
LED
(1)
Overcurrent shutdown mode will prevent damage to the part by shutting down the high power sections of the chip. Choosing an R
value of 5k or greater will ensure that the
SET
part stays out of this mode.
Regulation is achieved by sensing the voltage at the I
LED
pin and modulating the charge pump strength based on the error signal.
In shutdown mode all circuitry is turned off and the LTC3214 draws a very low current from the VIN supply. The output is disconnected from V
and is pulled down by
IN
a resistance of approximately 43k. The LTC3214 enters shutdown mode when the EN pin is brought low.
Thermal Protection
The LTC3214 has built-in overtemperature protection. Thermal shutdown circuitry will shut down the part when the junction temperature exceeds approximately 165°C. It will re-enable the part once the junction temperature drops back to approximately 150°C. The LTC3214 will cycle in and out of thermal shutdown indefinitely without latch up or damage until the heat source is removed.
Short-Circuit Protection
When EN is brought high, the part will connect VIN and CPO through a weak pull-up. If the CPO capacitor fails to charge up to over 1V (i.e. CPO is shorted), the chip will not be enabled. Similarly, during operation if CPO is pulled down below 1V, the part will be disabled.
Soft-Start
To prevent excessive inrush current during start-up and mode switching, the LTC3214 employs built-in soft-start circuitry. Soft-start is achieved by increasing the amount of current available to the output charge storage capacitor linearly over a period of approximately 150µs.
Charge Pump Strength
When the LTC3214 operates in either the 1.5x mode or 2x mode, the charge pump can be modeled as a Thevenin equivalent circuit to determine the amount of current available from the effective input voltage and effective open-loop output resistance, R
1.5V
IN
+
OR
2V
IN
Figure 1. Charge Pump Open-Loop Thevenin-Equivalent Circuit
OL
R
OL
3214 F01
(Figure 1).
+
CPO
6
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Page 7
OPERATIO
LTC3214
U
ROL is dependent on a number of factors including the oscillator frequency, flying capacitor values and switch resistances. From Figure 1, we can see that the output current is proportional to:
15 2.– V CPO
IN
R
OL
OR
V CPO
IN
R
OL
in the 1.5x mode or 2x mode respectively.
LED Current Programming
The LTC3214 includes an accurate, programmable cur­rent source that is capable of driving LED currents up to 300mA continuously and up to 500mA for pulsed opera­tion. Pulsed operation may be achieved by toggling the EN pin. In either continuous or pulsed operation, proper board layout is required for effective heat sinking.
The current may be programmed using a single external resistor. Equation 1, used to calculate the resistor value from the desired current level is repeated below:
For applications requiring multiple current levels, several schemes may be used to change the resistance for the R
resistor. Figure 2 shows one such scheme. The
SET
circuit in Figure 2 uses the I/O output of a microcontroller to switch a second resistor (R2) in parallel or series with R1, changing the effective I
current.
SET
Mode Switching
The LTC3214 will automatically switch from 1x mode to
1.5x mode, and subsequently from 1.5x mode to 2x mode whenever the LED forward voltage approaches the maxi­mum CPO voltage for that mode. The part will wait approximately 2.5ms before switching to the next mode. This delay allows the LED to warm up and reduce its forward voltage which may remove the dropout condition. The part may be reset to 1X mode by bringing the part into shutdown by setting the EN pin low. Once the EN pin is low, it may be immediately brought high to re-enable the part.
R
SET
= 3570/I
LED
2.2µF 2.2µF
+C1–C2+C2–
C1
2.9V TO 4.5V
µP
ON/OFF
TORCH/FLASH
*I
TORCH
I
FLASH
Figure 2. Recommended Circuit for Attaining Two Current Levels (Torch and Flash Modes)
2.2µF
V
IO
V
IO
= [(1.21V/R1) – ((VIO – 1.21V)/R2)] • 2950
= [(1.21V/(R1 • R2/(R1 + R2))] • 2950
V
IN
LTC3214
EN
I
R2
SET
R1
CPO
I
LED
3214 F02
4.7µF
I
*
LED
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LTC3214
WUUU
APPLICATIO S I FOR ATIO
VIN, CPO Capacitor Selection
The value and type of capacitors used with the LTC3214 determine several important parameters such as regulator control loop stability, output ripple, charge pump strength and minimum start-up time.
To reduce noise and ripple, it is recommended that low equivalent series resistance (ESR) ceramic capacitors be used for both C
VIN
and C
. Tantalum and aluminum
CPO
capacitors are not recommended because of their high ESR.
The value of C
directly controls the amount of output
CPO
ripple for a given load current. Increasing the size of C
will reduce the output ripple at the expense of higher
CPO
start-up current. The peak-to-peak output ripple for 1.5x mode is approximately given by the expression:
V
RIPPLE(P-P)
Where f
OSC
cally 900kHz) and C
= I
OUT
/(3f
OSC
• C
CPO
)
is the LTC3214’s oscillator frequency (typi-
is the output storage capacitor.
CPO
Both the style and value of the output capacitor can significantly affect the stability of the LTC3214. As shown in the Block Diagram, the LTC3214 uses a control loop to adjust the strength of the charge pump to match the current required at the output. The error signal of this loop is stored directly on the output charge storage capacitor. The charge storage capacitor also serves as the dominant pole for the control loop. To prevent ringing or instability, it is important for the output capacitor to maintain at least 3µF of actual capacitance over all conditions.
small (~15ns), these missing “notches” will result in only a small perturbation on the input power supply line. Note that a higher ESR capacitor such as tantalum will have higher input noise due to the input current change times the ESR. Therefore, ceramic capacitors are again recom­mended for their exceptional ESR performance. Input noise can be further reduced by powering the LTC3214 through a very small series inductor as shown in Figure 3. A 10nH inductor will reject the fast current notches, thereby presenting a nearly constant current load to the input power supply. For economy, the 10nH inductor can be fabricated on the PC board with about 1cm (0.4") of PC board trace.
10nH
2.2µF0.1µF
Figure 3. 10nH Inductor Used for Input Noise Reduction (Approximately 1cm of Wire)
V
IN
GND
LTC3214
3214 F03
Flying Capacitor Selection
Warning: Polarized capacitors such as tantalum or alu­minum should never be used for the flying capacitors since their voltage can reverse upon start-up of the LTC3214. Ceramic capacitors should always be used for the flying capacitors.
Likewise, excessive ESR on the output capacitor will tend to degrade the loop stability of the LTC3214. To prevent poor load transient response and instability, the ESR of the output capacitor should be kept below 50m. Multilayer ceramic chip capacitors typically have exceptional ESR performance. MLCCs combined with a tight board layout will yield very good stability. As the value of C the amount of output ripple, the value of C amount of ripple present at the input pin (V
controls
CPO
controls the
VIN
). The input
IN
current to the LTC3214 will be relatively constant while the charge pump is on either the input charging phase or the output charging phase but will drop to zero during the clock nonoverlap times. Since the nonoverlap time is
8
The flying capacitors control the strength of the charge pump. In order to achieve the rated output current it is necessary to have at least 1.6µF of actual capacitance for each of the flying capacitors. Capacitors of different mate­rials lose their capacitance with higher temperature and voltage at different rates. For example, a ceramic capacitor made of X7R material will retain most of its capacitance from –40°C to 85°C whereas a Z5U or Y5V style capacitor will lose considerable capacitance over that range. Z5U and Y5V capacitors may also have a very poor voltage coeffi­cient causing them to lose 60% or more of their capacitance when the rated voltage is applied. Therefore, when compar­ing different capacitors, it is often more appropriate to
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Page 9
WUUU
APPLICATIO S I FOR ATIO
LTC3214
compare the amount of achievable capacitance for a given case size rather than comparing the specified capacitance value. For example, over rated voltage and temperature conditions, a 1µF, 10V, Y5V ceramic capacitor in a 0603 case may not provide any more capacitance than a 0.22µF, 10V, X7R available in the same case. The capacitor manufacturer’s data sheet should be consulted to determine what value of capacitor is needed to ensure minimum capacitances at all temperatures and voltages.
Table 1 shows a list of ceramic capacitor manufacturers and how to contact them.
Table 1. Recommended Capacitor Vendors
AVX www.avxcorp.com
Kemet www.kemet.com
Murata www.murata.com
Taiyo Yuden www.t-yuden.com
Vishay www.vishay.com
TDK www.tdk.com
Layout Considerations and Noise
Due to the high switching frequency and the transient currents produced by the LTC3214, careful board layout is necessary. A true ground plane and short connections to all capacitors will improve performance and ensure proper regulation under all conditions. An example of such a layout is shown in Figure 4.
The flying capacitor pins C1+, C2+, C1– and C2– will have very high edge rate waveforms. The large dv/dt on these
pins can couple energy capacitively to adjacent PCB runs. Magnetic fields can also be generated if the flying capaci­tors are not close to the LTC3214 (i.e., the loop area is large). To decouple capacitive energy transfer, a Faraday shield may be used. This is a grounded PCB trace between the sensitive node and the LTC3214 pins. For a high quality AC ground, it should be returned to a solid ground plane that extends all the way to the LTC3214.
The following guidelines should be followed when design­ing a PCB layout for the LTC3214.
• The Exposed Pad should be soldered to a large copper plane that is connected to a solid, low impedance ground plane using plated, through-hole vias for proper heat sinking and noise protection.
• Input and output capacitors (C
and C
IN
) must also
CPO
be placed as close to the part as possible.
• The flying capacitors must also be placed as close to the part as possible. The traces running from the pins to the capacitor pads should be as wide as possible.
•VIN, CPO and I
traces must be made as wide as
LED
possible. This is necessary to minimize inductance, as well as provide sufficient area for high current applications.
• LED pads must be large and should be connected to as much solid metal as possible to ensure proper heat sinking.
C1
C
CPO
PIN 1
RSET
Figure 4. Example Board Layout
C2
C
IN
3214 F04
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LTC3214
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APPLICATIO S I FOR ATIO
Power Efficiency
To calculate the power efficiency (η) of a white LED driver chip, the LED power should be compared to the input power. The difference between these two numbers repre­sents lost power whether it is in the charge pump or the current sources. Stated mathematically, the power effi­ciency is given by:
P
LED
η≡
P
IN
The efficiency of the LTC3214 depends upon the mode in which it is operating. Recall that the LTC3214 operates as a pass switch, connecting V detected at the I
pin. This feature provides the optimum
LED
to CPO, until dropout is
IN
efficiency available for a given input voltage and LED forward voltage. When it is operating as a switch, the efficiency is approximated by:
P
LED
η≡ =
P
IN
VI
LED LED
VIVV
IN IN
LED
IN
since the input current will be very close to the LED current.
At moderate to high output power, the quiescent current of the LTC3214 is negligible and the expression above is valid.
Once dropout is detected at the I
pin, the LTC3214
LED
enables the charge pump in 1.5x mode.
In 1.5x boost mode, the efficiency is similar to that of a linear regulator with an effective input voltage of 1.5 times the actual input voltage. This is because the input current for a 1.5x charge pump is approximately 1.5 times the load current. In an ideal 1.5x charge pump, the power efficiency would be given by:
η
IDEAL
P
LED
=
P
IN
VI
LED LED
VIVV
•. .15 15
IN LED
LED
IN
Similarly, in 2x boost mode, the efficiency is similar to that of a linear regulator with an effective input voltage of 2 times the actual input voltage. In an ideal 2x charge pump, the power efficiency would be given by:
η
IDEAL
P
LED
=
P
VI
LED LED
VIVV
IN
••22
IN LED
LED
IN
Thermal Management
For higher input voltages and maximum output current, there can be substantial power dissipation in the LTC3214. If the junction temperature increases above approximately 165°C, the thermal shutdown circuitry will automatically deactivate the output. To reduce maximum junction tem­perature, a good thermal connection to the PC board is recommended. Connecting the Exposed Pad to a ground plane and maintaining a solid ground plane under the device can reduce the thermal resistance of the package and PC board considerably.
10
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Page 11
PACKAGE DESCRIPTIO
LTC3214
U
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05 (2 SIDES)2.15 ± 0.05
PACKAGE OUTLINE
0.25 ± 0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
(2 SIDES)
3.00 ±0.10 (4 SIDES)
0.75 ±0.05
0.00 – 0.05
1.65 ± 0.10 (2 SIDES)
R = 0.115
TYP
2.38 ±0.10 (2 SIDES)
BOTTOM VIEW—EXPOSED PAD
106
15
0.50 BSC
0.38 ± 0.10
0.25 ± 0.05
(DD10) DFN 1103
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen­tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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11
Page 12
LTC3214
TYPICAL APPLICATIO
ON/OFF
U
High Power Camera Light and Flash
2.2µF 2.2µF
+C1–C2+C2–
C1
V
IN
EN
µP
2.9V TO 4.5V
2.2µF
2.8V
LTC3214
CPO
I
LED
I
LED
100mA/300mA
4.7µF
2.8V
TORCH/FLASH
41.2k 1%
I
SET
16.9k 1%
3214 TA02
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LT1618 Constant Current, 1.4MHz, 1.5A Boost Converter VIN: 1.6V to 18V, V
MS Package
LT1961 1.5A (ISW), 1.25MHz, High Efficiency Step-Up VIN: 3V to 25V, V
OUT(MAX)
DC/DC Converter MS8E Package
LTC3205 250mA, 1MHz, Multi-Display LED Controller VIN: 2.8V to 4.5V, V
DFN Package
LTC3206 400mA, 800kHz, Multi-Display LED Controller VIN: 2.8V to 4.5V, V
DFN Package
LTC3208 High Current Software Configurable Multidisplay 95% Efficiency, VIN: 2.9V to 4.5V, V
LED Controller I
< 1µA, (5mm × 5mm) QFN-32 Package
SD
LTC3215 700mA Low Noise High Current LED Charge Pump VIN: 2.9V to 4.4V, V
(3mm × 3mm) DFN Package
LTC3216 1A Low Noise High Current LED Charge Pump with VIN: 2.9V to 4.4V, V
Independent Flash/Torch Current Control (3mm × 4mm) DFN Package
LTC3440/LTC3441 600mA/1.2A I
, 2MHz/1MHz, Synchronous VIN: 2.4V to 5.5V, V
OUT
Buck-Boost DC/DC Converter MS, DFN Packages
LTC3443 600mA/1.2A I
, 600kHz, Synchronous VIN: 2.4V to 5.5V, V
OUT
Buck-Boost DC/DC Converter DFN Package
LTC3453 1MHz, 800mA Synchronous Buck-Boost VIN: 2.7V to 5.5V, V
High Power LED Driver QFN Package
LT3467/LT3467A 1.1A (ISW), 1.3/2.1MHz, High Efficiency Step-Up VIN: 2.4V to 16V, V
DC/DC Converters with Integrated Soft-Start ThinSOT Package
LT3479 3A, 42V, 3.5MHz Boost Converter VIN: 2.5V to 24V, V
DFN, TSSOP Packages
= 36V, IQ = 1.8mA, ISD < 1µA
OUT(MAX)
= 35V, IQ = 0.9mA, ISD < 6µA
= 5.5V, IQ = 50µA, ISD < 1µA
OUT(MAX)
= 5.5V, IQ = 50µA, ISD < 1µA
OUT(MAX)
= 5.5V, IQ = 300µA, ISD < 2.5µA
OUT(MAX)
= 5.5V, IQ = 300µA, ISD < 2.5µA
OUT(MAX)
= 5.25V, IQ = 25µA/50µA, ISD <1µA
OUT(MAX)
= 5.25V, IQ = 28µA, ISD <1µA
OUT(MAX)
: 2.7V to 4.5V, IQ = 2.5mA, ISD < 6µA
OUT
= 40V, IQ = 1.2mA, ISD < 1µA
OUT(MAX)
= 40V, IQ = 2µA, ISD < 1µA
OUT(MAX)
OUT(MAX)
: 5.5V, IQ = 280µA,
12
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com
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LT 0306 REV A • PRINTED IN USA
© LINEAR TECHNOLOGY CORPORATION 2005
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