LED Torch/Camera Light Supply for Cell Phones,
PDAs and Digital Cameras
■
General Lighting and/or Flash/Strobe Applications
LTC3214
500mA Camera
LED Charge Pump
U
DESCRIPTIO
The LTC®3214 is a low noise, high current charge pump
DC/DC converter capable of driving high current LEDs at
up to 500mA from a 2.9V to 4.5V input. Low external
parts count (two flying capacitors, one programming
resistor and two bypass capacitors at V
the LTC3214 ideally suited for small, battery-powered
applications.
Built-in soft-start circuitry prevents excessive inrush current during start-up. High switching frequency enables the
use of small external capacitors.
Output current level is programmed by an external resistor. LED current is regulated using an internal 110mΩ
sense resistor. Automatic mode switching optimizes efficiency by monitoring the voltage across the charge pump
and switching modes only when dropout is detected. The
part is available in a low profile 3mm x 3mm 10-lead DFN
package.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
*Protected by U.S. Patents including 6411531.
and CPO) make
IN
TYPICAL APPLICATIO
2.9V TO 4.5V
2.2µF
C1
2.2µF
+C1–C2+C2–
C1
V
C
IN
IN
ENDISABLE ENABLE
I
SET
LED: AOT2015
LTC3214
0.11Ω
R
SET
C2
2.2µF
CPO
I
LED
3214 TA01a
U
LED
I
LED
UP TO 500mA
C
CPO
4.7µF
100
100mA
90
80
70
) (%)
IN
/P
60
LED
50
40
30
EFFICIENCY (P
20
LED = AOT2015
10
= 2.9V TYP AT 100mA
V
F
0
2.9
3.13.5
Efficiency vs V
200mA
300mA
3.3
3.7
VIN (V)
3.9
IN
50mA
4.1
4.3
3214 TA01b
4.5
3214fa
1
Page 2
LTC3214
WW
W
U
ABSOLUTE AXIU RATIGS
(Note 1)
VIN to GND ............................................... –0.3V to 5.5V
CPO to GND ............................................. –0.3V to 5.5V
EN ................................................... – 0.3V to V
Storage Temperature Range ................. –65°C to 125°C
Operating Temperature Range (Note 3) .. – 40°C to 85°C
+ 0.3V
IN
UUW
PACKAGE/ORDER IFORATIO
TOP VIEW
+
C2
1
+
C1
2
11
3
CPO
4
I
LED
5
I
SET
10-LEAD (3mm × 3mm) PLASTIC DFN
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB GND
DD PACKAGE
T
= 125°C, θJA = 43°C/W
JMAX
ORDER PART NUMBER
LTC3214EDDLBVQ
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
–
10
C1
GND
9
–
C2
8
7
V
IN
6
EN
DD PART MARKING
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at TA = 25°C. V
PARAMETERCONDITIONSMINTYPMAXUNITS
Input Power Supply
VIN Operating Voltage
I
Operating CurrentI
VIN
I
Shutdown CurrentEN = LOW2.57.5µA
VIN
LED Current
LED Current Ratio (I
I
Dropout Voltage (V
LED
Mode Switching Delay (LED Warmup Time)2.5ms
LED Current On TimeEN to LED Current On100µs
Charge Pump (CPO)
Charge Pump Output Clamp Voltage5V
1x Mode Output Impedance0.70Ω
1.5x Mode Output Impedance3.2Ω
2x Mode Output Impedance3.5Ω
CLK FrequencyV
EN
High Level Input Voltage (VIH)
Low Level Input Voltage (VIL)
Input Current (IIH)V
Input Current (IIL)
)I
LED/ISET
)Mode Switch Threshold, I
ILED
The ● denotes the specifications which apply over the full operating
= 3.6V, CIN = C1 = C2 = 2.2µF, C
IN
= 0mA, 1x Mode980µA
CPO
= 0mA, 1.5x4.8mA
I
CPO
= 0mA, 2x Mode6.7mA
I
CPO
= 150mA to 500mA271529503190mA/mA
LED
= 200mA40mV
LED
= 3V
IN
= 3.6V
EN
= 4.7µF.
CPO
●
2.94.5V
●
0.60.91.2MHz
●
1.4V
●
●
●
–11µA
14.420µA
0.4V
2
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Page 3
LTC3214
ELECTRICAL CHARACTERISTICS
temperature range, otherwise specifications are at T
The ● denotes the specifications which apply over the full operating
= 25°C. V
A
= 3.6V, CIN = C1 = C2 = 2.2µF, C
IN
= 4.7µF.
CPO
PARAMETERCONDITIONSMINTYPMAXUNITS
I
SET
V
ISET
I
ISET
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Based on long-term current density limitations. Assumes an
operating duty cycle of ≤ 10% under absolute maximum conditions for
I
SET
= 50µA
●
1.181.211.24V
●
184µA
durations less than 10 seconds. Max current for continuous operation is
300mA.
Note 3: The LTC3214E is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the –40°C to 85°C ambient
operating temperature range are assured by design, characterization and
correlation with statistical process controls.
UW
(T
TYPICAL PERFOR A CE CHARACTERISTICS
I
Dropout Voltage
LED
vs LED Current
0.12
0.10
0.08
600
500
400
= 25°C unless otherwise specified)
A
I
vs R
LED
SET
0.06
0.04
DROPOUT VOLTAGE (V)
0.02
0
0100
LED CURRENT (mA)
300200400500
1x Mode Charge Pump Open-Loop
Output Resistance vs Temperature
C2+, C1+, C2–, C1– (Pins 1, 2, 8, 10): Charge Pump Flying
Capacitor Pins. A 2.2µF X5R or X7R ceramic capacitor
should be connected from C1
–
.
C2
+
to C1– and from C2+ to
CPO (Pin 3): Output. CPO is the output of the charge
pump. This pin may be enabled or disabled using the EN
input. A 4.7µF X5R or X7R ceramic capacitor is required
from CPO to GND.
I
(Pin 4): Input. I
LED
LED is connected between CPO (anode) and I
ode). The current into the I
connected to the I
I
(Pin 5): LED Current Programming Resistor Pin. A
SET
is the LED current sense pin. The
LED
pin is set by a resistor
LED
pin and regulated internally.
SET
LED
(cath-
resistor connected between this pin and GND is used to set
the LED current level.
W
BLOCK DIAGRA
EN (Pin 6): Input. The EN pin is used to enable the part and
bring it into shutdown mode. An internal 250kΩ resistor
pulls this pin to GND when left floating.
(Pin 7): Power. Supply voltage for the LTC3214. V
V
IN
IN
should be bypassed with a 2.2µF to 4.7µF low impedance
ceramic capacitor to GND.
GND (Pin 9): Charge Pump Ground. This pin should be
connected directly to a low impedance ground plane.
Exposed Pad (Pin 11): Control Signal Ground. This pad
must be soldered to a low impedance ground plane for
optimum thermal and electrical performance.
21018
OSCILLATOR
+
C1
–
C1
+
C2
–
C2
CPO
3
–
VOLTAGE
CLAMP
+
V
MODE
CONTROL
V
IN
7
EN
6
250k
CONTROL
LOGIC
GND
REF
CURRENT
SOURCE
CONTROL
V
IN
58Ω
I
SET
1159
0.11Ω
GND
I
LED
4
3214 BD
3214fa
5
Page 6
LTC3214
OPERATIO
U
The LTC3214 uses a fractional switched capacitor charge
pump to power a high current LED with a programmed
regulated current. The part starts up into the 1x mode. In
this mode, VIN is directly connected to CPO. This mode
provides maximum efficiency and minimum noise. The
LTC3214 will remain in this mode until the forward voltage
(VF) approaches the maximum CPO voltage possible in
this mode. When this dropout condition occurs, the
LTC3214 will switch to 1.5x mode after a soft-start period.
Any subsequent dropout detected will cause the part to
enter 2x mode.
A two phase nonoverlapping clock activates the charge
pump switches. In the 2x mode, the flying capacitors are
charged on alternate clock phases from V
capacitor is being charged from V
on top of V
and connected to the output. Alternatively, in
IN
, the other is stacked
IN
. While one
IN
the 1.5x mode the flying capacitors are charged in series
during the first clock phase, and stacked in parallel on top
of VIN on the second clock phase. This sequence of
charging and discharging the flying capacitors continues
at a free running frequency of 900kHz (typ).
The current delivered to the LED load is controlled by the
internal programmable current source. The current is
programmed by a resistor connected between the I
SET
pin
and GND. The resistor value needed to attain the desired
current level can be determined by Equation 1.
R
= 3570/I
SET
LED
(1)
Overcurrent shutdown mode will prevent damage to the
part by shutting down the high power sections of the chip.
Choosing an R
value of 5k or greater will ensure that the
SET
part stays out of this mode.
Regulation is achieved by sensing the voltage at the I
LED
pin and modulating the charge pump strength based on
the error signal.
In shutdown mode all circuitry is turned off and the
LTC3214 draws a very low current from the VIN supply.
The output is disconnected from V
and is pulled down by
IN
a resistance of approximately 43kΩ. The LTC3214 enters
shutdown mode when the EN pin is brought low.
Thermal Protection
The LTC3214 has built-in overtemperature protection.
Thermal shutdown circuitry will shut down the part when
the junction temperature exceeds approximately 165°C. It
will re-enable the part once the junction temperature drops
back to approximately 150°C. The LTC3214 will cycle in
and out of thermal shutdown indefinitely without latch up
or damage until the heat source is removed.
Short-Circuit Protection
When EN is brought high, the part will connect VIN and
CPO through a weak pull-up. If the CPO capacitor fails to
charge up to over 1V (i.e. CPO is shorted), the chip will not
be enabled. Similarly, during operation if CPO is pulled
down below 1V, the part will be disabled.
Soft-Start
To prevent excessive inrush current during start-up and
mode switching, the LTC3214 employs built-in soft-start
circuitry. Soft-start is achieved by increasing the amount
of current available to the output charge storage capacitor
linearly over a period of approximately 150µs.
Charge Pump Strength
When the LTC3214 operates in either the 1.5x mode or 2x
mode, the charge pump can be modeled as a Thevenin
equivalent circuit to determine the amount of current
available from the effective input voltage and effective
open-loop output resistance, R
ROL is dependent on a number of factors including the
oscillator frequency, flying capacitor values and switch
resistances. From Figure 1, we can see that the output
current is proportional to:
152.––VCPO
IN
R
OL
OR
VCPO
IN
R
OL
in the 1.5x mode or 2x mode respectively.
LED Current Programming
The LTC3214 includes an accurate, programmable current source that is capable of driving LED currents up to
300mA continuously and up to 500mA for pulsed operation. Pulsed operation may be achieved by toggling the EN
pin. In either continuous or pulsed operation, proper
board layout is required for effective heat sinking.
The current may be programmed using a single external
resistor. Equation 1, used to calculate the resistor value
from the desired current level is repeated below:
For applications requiring multiple current levels, several
schemes may be used to change the resistance for the
R
resistor. Figure 2 shows one such scheme. The
SET
circuit in Figure 2 uses the I/O output of a microcontroller
to switch a second resistor (R2) in parallel or series with
R1, changing the effective I
current.
SET
Mode Switching
The LTC3214 will automatically switch from 1x mode to
1.5x mode, and subsequently from 1.5x mode to 2x mode
whenever the LED forward voltage approaches the maximum CPO voltage for that mode. The part will wait
approximately 2.5ms before switching to the next mode.
This delay allows the LED to warm up and reduce its
forward voltage which may remove the dropout condition.
The part may be reset to 1X mode by bringing the part into
shutdown by setting the EN pin low. Once the EN pin is
low, it may be immediately brought high to re-enable the
part.
R
SET
= 3570/I
LED
2.2µF2.2µF
+C1–C2+C2–
C1
2.9V TO 4.5V
µP
ON/OFF
TORCH/FLASH
*I
TORCH
I
FLASH
Figure 2. Recommended Circuit for Attaining Two Current Levels (Torch and Flash Modes)
2.2µF
V
IO
V
IO
= [(1.21V/R1) – ((VIO – 1.21V)/R2)] • 2950
= [(1.21V/(R1 • R2/(R1 + R2))] • 2950
V
IN
LTC3214
EN
I
R2
SET
R1
CPO
I
LED
3214 F02
4.7µF
I
*
LED
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7
Page 8
LTC3214
WUUU
APPLICATIO S I FOR ATIO
VIN, CPO Capacitor Selection
The value and type of capacitors used with the LTC3214
determine several important parameters such as regulator
control loop stability, output ripple, charge pump strength
and minimum start-up time.
To reduce noise and ripple, it is recommended that low
equivalent series resistance (ESR) ceramic capacitors be
used for both C
VIN
and C
. Tantalum and aluminum
CPO
capacitors are not recommended because of their high ESR.
The value of C
directly controls the amount of output
CPO
ripple for a given load current. Increasing the size of
C
will reduce the output ripple at the expense of higher
CPO
start-up current. The peak-to-peak output ripple for 1.5x
mode is approximately given by the expression:
V
RIPPLE(P-P)
Where f
OSC
cally 900kHz) and C
= I
OUT
/(3f
OSC
• C
CPO
)
is the LTC3214’s oscillator frequency (typi-
is the output storage capacitor.
CPO
Both the style and value of the output capacitor can
significantly affect the stability of the LTC3214. As shown
in the Block Diagram, the LTC3214 uses a control loop to
adjust the strength of the charge pump to match the
current required at the output. The error signal of this loop
is stored directly on the output charge storage capacitor.
The charge storage capacitor also serves as the dominant
pole for the control loop. To prevent ringing or instability,
it is important for the output capacitor to maintain at least
3µF of actual capacitance over all conditions.
small (~15ns), these missing “notches” will result in only
a small perturbation on the input power supply line. Note
that a higher ESR capacitor such as tantalum will have
higher input noise due to the input current change times
the ESR. Therefore, ceramic capacitors are again recommended for their exceptional ESR performance. Input
noise can be further reduced by powering the LTC3214
through a very small series inductor as shown in Figure 3.
A 10nH inductor will reject the fast current notches,
thereby presenting a nearly constant current load to the
input power supply. For economy, the 10nH inductor can
be fabricated on the PC board with about 1cm (0.4") of PC
board trace.
10nH
2.2µF0.1µF
Figure 3. 10nH Inductor Used for Input Noise Reduction
(Approximately 1cm of Wire)
V
IN
GND
LTC3214
3214 F03
Flying Capacitor Selection
Warning: Polarized capacitors such as tantalum or aluminum should never be used for the flying capacitors
since their voltage can reverse upon start-up of the
LTC3214. Ceramic capacitors should always be used for
the flying capacitors.
Likewise, excessive ESR on the output capacitor will tend
to degrade the loop stability of the LTC3214. To prevent
poor load transient response and instability, the ESR of the
output capacitor should be kept below 50mΩ. Multilayer
ceramic chip capacitors typically have exceptional ESR
performance. MLCCs combined with a tight board layout
will yield very good stability. As the value of C
the amount of output ripple, the value of C
amount of ripple present at the input pin (V
controls
CPO
controls the
VIN
). The input
IN
current to the LTC3214 will be relatively constant while the
charge pump is on either the input charging phase or the
output charging phase but will drop to zero during the
clock nonoverlap times. Since the nonoverlap time is
8
The flying capacitors control the strength of the charge
pump. In order to achieve the rated output current it is
necessary to have at least 1.6µF of actual capacitance for
each of the flying capacitors. Capacitors of different materials lose their capacitance with higher temperature and
voltage at different rates. For example, a ceramic capacitor
made of X7R material will retain most of its capacitance from
–40°C to 85°C whereas a Z5U or Y5V style capacitor
will lose considerable capacitance over that range. Z5U and
Y5V capacitors may also have a very poor voltage coefficient causing them to lose 60% or more of their capacitance
when the rated voltage is applied. Therefore, when comparing different capacitors, it is often more appropriate to
3214fa
Page 9
WUUU
APPLICATIO S I FOR ATIO
LTC3214
compare the amount of achievable capacitance for a given
case size rather than comparing the specified capacitance
value. For example, over rated voltage and temperature
conditions, a 1µF, 10V, Y5V ceramic capacitor in a 0603 case
may not provide any more capacitance than a 0.22µF, 10V,
X7R available in the same case. The capacitor
manufacturer’s data sheet should be consulted to determine
what value of capacitor is needed to ensure minimum
capacitances at all temperatures and voltages.
Table 1 shows a list of ceramic capacitor manufacturers
and how to contact them.
Table 1. Recommended Capacitor Vendors
AVXwww.avxcorp.com
Kemetwww.kemet.com
Muratawww.murata.com
Taiyo Yudenwww.t-yuden.com
Vishaywww.vishay.com
TDKwww.tdk.com
Layout Considerations and Noise
Due to the high switching frequency and the transient
currents produced by the LTC3214, careful board layout is
necessary. A true ground plane and short connections to
all capacitors will improve performance and ensure proper
regulation under all conditions. An example of such a
layout is shown in Figure 4.
The flying capacitor pins C1+, C2+, C1– and C2– will have
very high edge rate waveforms. The large dv/dt on these
pins can couple energy capacitively to adjacent PCB runs.
Magnetic fields can also be generated if the flying capacitors are not close to the LTC3214 (i.e., the loop area is
large). To decouple capacitive energy transfer, a Faraday
shield may be used. This is a grounded PCB trace between
the sensitive node and the LTC3214 pins. For a high quality
AC ground, it should be returned to a solid ground plane
that extends all the way to the LTC3214.
The following guidelines should be followed when designing a PCB layout for the LTC3214.
• The Exposed Pad should be soldered to a large copper
plane that is connected to a solid, low impedance
ground plane using plated, through-hole vias for proper
heat sinking and noise protection.
• Input and output capacitors (C
and C
IN
) must also
CPO
be placed as close to the part as possible.
• The flying capacitors must also be placed as close to the
part as possible. The traces running from the pins to the
capacitor pads should be as wide as possible.
•VIN, CPO and I
traces must be made as wide as
LED
possible. This is necessary to minimize inductance,
as well as provide sufficient area for high current
applications.
• LED pads must be large and should be connected to as
much solid metal as possible to ensure proper heat
sinking.
C1
C
CPO
PIN 1
RSET
Figure 4. Example Board Layout
C2
C
IN
3214 F04
3214fa
9
Page 10
LTC3214
WUUU
APPLICATIO S I FOR ATIO
Power Efficiency
To calculate the power efficiency (η) of a white LED driver
chip, the LED power should be compared to the input
power. The difference between these two numbers represents lost power whether it is in the charge pump or the
current sources. Stated mathematically, the power efficiency is given by:
P
LED
η≡
P
IN
The efficiency of the LTC3214 depends upon the mode in
which it is operating. Recall that the LTC3214 operates as
a pass switch, connecting V
detected at the I
pin. This feature provides the optimum
LED
to CPO, until dropout is
IN
efficiency available for a given input voltage and LED
forward voltage. When it is operating as a switch, the
efficiency is approximated by:
P
LED
η≡=≈
P
IN
•
VI
LEDLED
•
VIVV
ININ
LED
IN
since the input current will be very close to the LED
current.
At moderate to high output power, the quiescent current
of the LTC3214 is negligible and the expression above is
valid.
Once dropout is detected at the I
pin, the LTC3214
LED
enables the charge pump in 1.5x mode.
In 1.5x boost mode, the efficiency is similar to that of a
linear regulator with an effective input voltage of 1.5 times
the actual input voltage. This is because the input current
for a 1.5x charge pump is approximately 1.5 times the load
current. In an ideal 1.5x charge pump, the power efficiency
would be given by:
η
IDEAL
P
LED
≡=≈
P
IN
VI
•
LEDLED
VIVV
•..1515
INLED
LED
IN
Similarly, in 2x boost mode, the efficiency is similar to that
of a linear regulator with an effective input voltage of 2
times the actual input voltage. In an ideal 2x charge pump,
the power efficiency would be given by:
η
IDEAL
P
LED
≡=≈
P
VI
LEDLED
VIVV
IN
••22
INLED
•
LED
IN
Thermal Management
For higher input voltages and maximum output current,
there can be substantial power dissipation in the LTC3214.
If the junction temperature increases above approximately
165°C, the thermal shutdown circuitry will automatically
deactivate the output. To reduce maximum junction temperature, a good thermal connection to the PC board is
recommended. Connecting the Exposed Pad to a ground
plane and maintaining a solid ground plane under the
device can reduce the thermal resistance of the package
and PC board considerably.
10
3214fa
Page 11
PACKAGE DESCRIPTIO
LTC3214
U
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05
(2 SIDES)2.15 ± 0.05
PACKAGE
OUTLINE
0.25 ± 0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.50
BSC
(2 SIDES)
3.00 ±0.10
(4 SIDES)
0.75 ±0.05
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
106
15
0.50 BSC
0.38 ± 0.10
0.25 ± 0.05
(DD10) DFN 1103
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3214fa
11
Page 12
LTC3214
TYPICAL APPLICATIO
ON/OFF
U
High Power Camera Light and Flash
2.2µF2.2µF
+C1–C2+C2–
C1
V
IN
EN
µP
2.9V TO 4.5V
2.2µF
2.8V
LTC3214
CPO
I
LED
I
LED
100mA/300mA
4.7µF
2.8V
TORCH/FLASH
41.2k
1%
I
SET
16.9k
1%
3214 TA02
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High Power LED DriverQFN Package
LT3467/LT3467A1.1A (ISW), 1.3/2.1MHz, High Efficiency Step-UpVIN: 2.4V to 16V, V
DC/DC Converters with Integrated Soft-StartThinSOT Package
LT34793A, 42V, 3.5MHz Boost ConverterVIN: 2.5V to 24V, V