Low phase noise oscillators up to 16 GHz
VCO’s, DRO’s and YIG oscillators
Point-to-point radios
Satellite communications
Fiber optics, OC-192 and OC-768
Local Multipoint Distribution Systems, LMDS
Features
Low 1/f noise: -142 dBc/Hz at 100 Hz offset
Phase noise: -167 dBc/Hz at 100 kHz offset
Output power up to +13 dBm
Operation down to 1 volt, 2 mA
Gold bump pads for wire bond or flip chip (for
direct die attachment)
Ordering Information
Type Package Remark
LPT16ED Bare Die Shipped in
Waffle Pack
Functional Block Diagram
Product Description
The LPT16ED is a silicon germanium low phase
noise, high frequency NPN transistor for oscillator
applications up to 16GHz.
The transistor exhibits low 1/f noise and provides
+13 dBm typical output power at V
equal to 20 mA. It is easily operated from a single
supply voltage with appropriate external passive
components.
The silicon germanium technology used in this device
provides outstanding high-frequency performance
combined with high thermal conductivity and superior
reliability under harsh operating and storage
conditions.
A complete mechanical description of the transistor is
available under SiGe Semiconductor Document
07MS001.
of 3V and IC
CE
C
B
E
38-DST-01 Rev 2.3 Sept 5/02 1 of 5
Page 2
LPT16ED
30 GHz SiGe Bipolar Transistor
Final
Absolute Maximum Ratings
Operation in excess of any one of Absolute Maximum Ratings may result in permanent damage. This is a high
performance RF device with ESD rating < 2keV. Handling and assembly of this device should be done at ESD
protected workstations.
Symbol Parameter Min. Max. Unit
V
Collector to Base Voltage +13.0 V
CBO
V
Collector to Emitter Voltage +4.0 V
CEO
V
Emitter to Base Voltage +1.5 V
EBO
IC Collector Current 80 mA
IB Base Current 2.0 mA
PT Total Power Dissipation 250 mW
Tj Junction Temperature +150
T
Storage Temperature -65 +150
STG
DC Electrical Characteristics
Conditions: T
Symbol Parameter Condition Min. Typ. Max. Unit
VBE Base-emitter voltage IC = 1µA 670 687 700 mV
BV
CEO
BV
CES
BV
EBO
BV
CBO
VA Early voltage IC = 10mA, VCE = 3V 100 200 300 V
I
CBO
I
EBO
hFE DC current gain VCE = 2V, IC = 20mA 50 60 150
= unless otherwise specified 25°C
A
Collector-emitter
breakdown voltage
Collector-emitter
breakdown voltage
Emitter-base breakdown
voltage
Collector-base
breakdown voltage
Collector-base cutoff
current
Emitter-base cutoff
current
Open base 4.0 4.5 5.0 V
Base-emitter shorted via
100kΩ
= 100µA, open
I
E
collector
14 15.0 16 V
2.0 2.3 2.6 V
Open emitter 14 15.0 16 V
VCB = 5V and IE = 0 100 pA
= 1.5V and IC = 0 5 10 15 µA
V
EB
°C
°C
38-DST-01 Rev 2.3 Sept 5/02 2 of 5
Page 3
LPT16ED
30 GHz SiGe Bipolar Transistor
AC Electrical Characteristics
Symbol Parameter Note Min. Typ. Max. Unit
Final
VCE = 1.5V, IC = 10mA,
f = 16GHz
V
= 3.0V, IC = 20mA,
CE
f = 16GHz
VCE = 1.5V, IC = 10mA,
f = 16GHz
V
= 3.0V, IC = 20mA,
CE
f = 16GHz
IS21I2
MAG/
MSG
Insertion Power Gain
= ZL = 50Ω)
(Z
S
Maximum Available
Gain or Maximum Stable
Gain
Typical Performance Characteristics
Please refer to application note (Document 07AN001).
Typical Measurements @
10 GHz, I
Residual
Phase
Noise
(dBc/Hz)
=5mA, VCE=1V
C
0.7 1.0 1.3 dB
2.3 2.6 2.9 dB
3.3 3.6 4.2 dB
4.9 5.2 5.6 dB
Frequency (Hz)
Typical Applications Information
Series or parallel feedback oscillators at 5-16 GHz. (Please refer to application note, Document 07AN001).
38-DST-01 Rev 2.3 Sept 5/02 3 of 5
Page 4
Die and Pad Description
LPT16ED
30 GHz SiGe Bipolar Transistor
Final
Collector
X length
Emitter2
Y length
Base Emitter1
Dimensions are relative to the 0,0 cut die corner.
Feature Specification Comments
0,0
Die edge
Die thickness 10 mil +/- 1mil
X length 15.3 mil +/- 1mil
Y length 14.5 mil +/- 1mil
Pad diameter 2.9 mil +/- 0.1mil Pads are circular.
Pad pitch 6 mil +/- 0.1mil Pad center to pad centre
Pad/bump height 1 mil +/- 0.05mil
Pad/bump co-planarity 0.2 mil
Pad Center Position (X mil, Y mil) +/- 0.7mil relative to the 0,0 cut die corner
Collector 5, 11
Emitter1 5, 5
Base 11, 5
Emitter 2 11, 11
Please refer to Document 01-MS-001 for SiGe’s die inspection criteria.
For S-parameter data, please refer to SiGe Document 07SP001.
Product Preview
The datasheet contains information from the product concept specification. SiGe Semiconductor Inc. reserves the right to change
information at any time without notification.
Preliminary Information
The datasheet contains information from the design target specification. SiGe Semiconductor Inc. reserves the right to change
information at any time without notification.
Final
The datasheet contains information from the final product specification. SiGe Semiconductor Inc. reserves the right to change
information at any time without notification. Production testing may not include testing of all parameters.
Information furnished is believed to be accurate and reliable and is provided on an “as is” basis. SiGe Semiconductor Inc. assumes
no responsibility or liability for the direct or indirect consequences of use of such information nor for any infringement of patents or
other rights of third parties, which may result from its use. No license or indemnity is granted by implication or otherwise under any
patent or other intellectual property rights of SiGe Semiconductor Inc. or third parties. Specifications mentioned in this publication
are subject to change without notice. This publication supersedes and replaces all information previously supplied. SiGe
Semiconductor Inc. products are NOT authorized for use in implantation or life support applications or systems without express
written approval from SiGe Semiconductor Inc.
RangerCharger
Copyright 2002 SiGe Semiconductor
All Rights Reserved
TM
, StreamChargerTM, PointChargerTM, and LightChargerTM are trademarks owned by SiGe Semiconductor Inc.
38-DST-01 Rev 2.3 Sept 5/02 5 of 5
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