The LPC662 CMOS Dual operational amplifier is ideal for
operation from a single supply. It features a wide range of
operating voltage from +5V to +15V, rail-to-rail output swing
in addition to an input common-mode range that includes
ground. Performance limitations that have plagued CMOS
amplifiers in the past are not a problem with this design.
Input V
(into 100 kΩ and5kΩ) are all equal to or better than widely
accepted bipolar equivalents, while the power supply
requirement is typically less than 0.5 mW.
This chip is built with National’s advanced Double-Poly
Silicon-Gate CMOS process.
See the LPC660 datasheet for a Quad CMOS operational
amplifier and LPC661 for a single CMOS operational
amplifier with these same features.
, drift, and broadband noise as well as voltage gain
OS
Applications
n High-impedance buffer
n Precision current-to-voltage converter
n Long-term integrator
n High-impedance preamplifier
n Active filter
n Sample-and-Hold circuit
n Peak detector
Features
n Rail-to-rail output swing
n Micropower operation (
n Specified for 100 kΩ and5kΩloads
n High voltage gain120 dB
n Low input offset voltage3 mV
n Low offset voltage drift1.3 µV/˚C
n Ultra low input bias current2 fA
n Input common-mode includes GND
n Operating range from +5V to +15V
n Low distortion0.01% at 1 kHz
n Slew rate0.11 V/µs
n Full military temperature range available
(C = 100 pF, R = 1.5 kΩ)1000V
Power Dissipation(Note 2)
Current at Input Pin
Current at Output Pin
±
Supply Voltage
(Note 11)
(Note 1)
±
5mA
±
18 mA
Current at Power Supply Pin35 mA
+
Voltage at Input/Output Pin(V
) + 0.3V, (V−) −0.3V
Operating Ratings (Note 3)
Temperature Range
LPC662AMJ/883−55˚C ≤ T
LPC662AM−55˚C ≤ T
LPC662AI−40˚C ≤ T
LPC662I−40˚C ≤ T
Supply Range4.75V to 15.5V
Power Dissipation(Note 9)
Thermal Resistance (θ
) (Note 10)
JA
8-Pin Ceramic DIP100˚C/W
8-Pin Molded DIP101˚C/W
8-Pin SO165˚C/W
8-Pin Side Brazed Ceramic DIP100˚C/W
≤ +125˚C
J
≤ +125˚C
J
≤ +85˚C
J
≤ +85˚C
J
DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ= 25˚C. Boldface limits apply at the temperature extremes. V+= 5V, V
= 0V, VCM= 1.5V, VO= 2.5V and R
Input Offset Voltage1.3µV/˚C
Average Drift
Input Bias Current0.00220pA
Input Offset Current0.00120pA
Input Resistance
Common Mode0V ≤ V
Rejection RatioV
+
= 15V686861min
Positive Power Supply5V ≤ V
Rejection RatioV
O
Negative Power Supply0V ≤ V
Rejection Ratio828373min
Input Common-ModeV
+
= 5V and 15V−0.4−0.1−0.1−0.1V
Voltage RangeFor CMRR ≥ 50 dB000max
Large SignalR
= 100 kΩ (Note 5)1000400400300V/mV
L
Voltage GainSourcing250300200min
Sinking50018018090V/mV
R
=5kΩ(Note 5)1000200200100V/mV
L
Sourcing15016080min
Sinking25010010050V/mV
>
1M unless otherwise specified.
L
LPC662AMLPC662AILPC662I
Limit(Note 4)(Note 4)
(Notes 4, 8)
3.53.36.3max
10044max
10022max
>
1Tera Ω
≤ 12.0V83707063dB
CM
+
≤ 15V83707063dB
= 2.5V686861min
−
≤ −10V94848474dB
+
V
− 1.9V+− 2.3V+− 2.3V+− 2.3V
+
V
− 2.6V+− 2.5V+− 2.5min
7012070min
356040min
−
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Page 3
DC Electrical Characteristics (Continued)
Unless otherwise specified, all limits guaranteed for TJ= 25˚C. Boldface limits apply at the temperature extremes. V+= 5V, V
= 0V, VCM= 1.5V, VO= 2.5V and R
Gain-Bandwidth Product0.35MHz
Phase Margin50Deg
Gain Margin17dB
Amp-to-Amp Isolation(Note 7)130dB
Input Referred Voltage NoiseF = 1 kHz42
Input Referred Current NoiseF = 1 kHz0.0002
Total Harmonic DistortionF = 1 kHz, AV= −10, V+= 15V0.01%
R
Note 1: Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature and/or multiple Op Amp shorts
can result in exceeding the maximum allowed junction temperature of 150˚C. Output currents in excess of
Note 2: The maximum power dissipation is a function of T
−TA)/θJA.
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 4: Limits are guaranteed by testing or correlation.
Note 5: V
Note 6: V
Note 7: Input referred. V
Note 8: A military RETS electrical test specification is available on request. At the time of printing, the LPC662AMJ/883 RETS specification complied fully with the
boldface limits in this column. The LPC662AMJ/883 may also be procured to a Standard Military Drawing specification.
Note 9: For operating at elevated temperatures the device must be derated based on the thermal resistance θ
Note 10: All numbers apply for packages soldered directly into a PC board.
Note 11: Do not connect output to V
+
= 15V, VCM= 7.5V and RLconnected to 7.5V. For Sourcing tests, 7.5V ≤ VO≤ 11.5V. For Sinking tests, 2.5V ≤ VO≤ 7.5V.
+
= 15V. Connected as Voltage Follower with 10V step input. Number specified is the slower of the positive and negative slew rates.
+
= 15V and RL= 100 kΩ connected to V+/2. Each amp excited in turn with 1 kHz to produce VO=13VPP.
+
when V+is greater than 13V or reliability may be adversely affected.
>
1M unless otherwise specified.
L
= 100 kΩ,VO=8V
L
J(max)
LPC662AMLPC662AI LPC662I
Limit(Note 4)(Note 4)
(Notes 4, 8)
0.040.050.03min
PP
±
30 mA over long term may adversely affect reliability.
, θJA, and TA. The maximum allowable power dissipation of any ambient temperature is PD=(T
Note: Avoid resistive loads of less than 500Ω, as they may cause
instability.
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DS010548-5
Page 9
Application Hints
AMPLIFIER TOPOLOGY
The topology chosen for the LPC662 is unconventional
(compared to general-purpose op amps) in that the
traditional unity-gain buffer output stage is not used; instead,
the output is taken directly from the output of the integrator,
to allow rail-to-rail output swing. Since the buffer traditionally
delivers the power to the load, while maintaining high op
amp gain and stability, and must withstand shorts to either
rail, these tasks now fall to the integrator.
As a result of these demands, the integrator is a compound
affair with an embedded gain stage that is doubly fed forward
(via C
driver. In addition, the output portion of the integrator is a
push-pull configuration for delivering heavy loads. While
sinking current the whole amplifier path consists of three
gain stages with one stage fed forward, whereas while
sourcing the path contains four gain stages with two fed
forward.
and Cff) by a dedicated unity-gain compensation
f
tolerated without oscillation. Note that in all cases, the output
will ring heavily when the load capacitance is near the
threshold for oscillation.
Capacitive load driving capability is enhanced by using a
pull up resistor to V
+
Figure 3
. Typically a pull up resistor
conducting 50 µA or more will significantly improve
capacitive load responses. The value of the pull up resistor
must be determined based on the current sinking capability
of the amplifier with respect to the desired output swing.
Open loop gain of the amplifier can also be affected by the
pull up resistor (see Electrical Characteristics).
The large signal voltage gain while sourcing is comparable
to traditional bipolar op amps for load resistance of at least
5kΩ. The gain while sinking is higher than most CMOS op
amps, due to the additional gain stage; however, when
driving load resistance of 5 kΩ or less, the gain will be
reduced as indicated in the Electrical Characteristics. The op
amp can drive load resistance as low as 500Ω without
instability.
COMPENSATING INPUT CAPACITANCE
Refer to the LMC660 or LMC662 datasheets to determine
whether or not a feedback capacitor will be necessary for
compensation and what the value of that capacitor would be.
CAPACITIVE LOAD TOLERANCE
Like many other op amps, the LPC662 may oscillate when
its applied load appears capacitive. The threshold of
oscillation varies both with load and circuit gain. The
configuration most sensitive to oscillation is a unity-gain
follower. See the Typical Performance Characteristics.
The load capacitance interacts with the op amp’s output
resistance to create an additional pole. If this pole frequency
is sufficiently low, it will degrade the op amp’s phase margin
so that the amplifier is no longer stable at low gains. The
addition of a small resistor (50Ω to 100Ω) in series with the
op amp’s output, and a capacitor (5 pF to 10 pF) from
inverting input to output pins, returns the phase margin to a
safe value without interfering with lower-frequency circuit
operation. Thus, larger values of capacitance can be
DS010548-26
FIGURE 3. Compensating for Large
Capacitive Loads with A Pull Up Resistor
PRINTED-CIRCUIT-BOARD LAYOUT
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with less than 1000 pA of leakage current requires special
layout of the PC board. When one wishes to take advantage
of the ultra-low bias current of the LPC662, typically less
than 0.04 pA, it is essential to have an excellent layout.
Fortunately, the techniques for obtaining low leakages are
quite simple. First, the user must not ignore the surface
leakage of the PC board, even though it may sometimes
appear acceptably low, because under conditions of high
humidity or dust or contamination, the surface leakage will
be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LPC662’s inputs and the
terminals of capacitors, diodes, conductors, resistors, relay
terminals, etc. connected to the op-amp’s inputs. See
4
. To have a significant effect, guard rings should be placed
Figure
on both the top and bottom of the PC board. This PC foil
must then be connected to a voltage which is at the same
voltage as the amplifier inputs, since no leakage current can
flow between two points at the same potential. For example,
a PC board trace-to-pad resistance of 10
12
ohms, which is
normally considered a very large resistance, could leak 5 pA
if the trace were a 5V bus adjacent to the pad of an input.
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Page 10
Application Hints (Continued)
This would cause a 100 times degradation from the
LPC662
LPC662’s actual performance. However, if a guard ring is
held within 5 mV of the inputs, then even a resistance of
11
10
ohms would cause only 0.05 pA of leakage current, or
perhaps a minor (2:1) degradation of the amplifier’s
performance. See
Figure 5a,Figure 5b,Figure 5c
for typical
connections ofguard ringsfor standardop-amp
configurations. If both inputs are active and at high
impedance, the guard can be tied to ground and still provide
some protection; see
Figure 5d
.
DS010548-19
FIGURE 4. Example of Guard Ring in P.C. Board Layout, using the LPC660
(c) Follower
DS010548-20
(a) Inverting Amplifier
DS010548-21
(b) Non-Inverting Amplifier
DS010548-22
FIGURE 5. Guard Ring Connections
The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
www.national.com10
DS010548-23
(d) Howland Current Pump
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
Page 11
Application Hints (Continued)
board at all, but bend it up in the air and use only air as an
insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board
construction, but the advantages are sometimes well worth
the effort of using point-to-point up-in-the-air wiring.
See
Figure 6
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board.)
BIAS CURRENT TESTING
The test method of
bias current with reasonable accuracy. To understand its
operation, first close switch S2 momentarily. When S2 is
opened, then
.
FIGURE 6. Air Wiring
Figure 7
DS010548-24
is appropriate for bench-testing
DS010548-25
FIGURE 7. Simple Input Bias Current Test Circuit
A suitable capacitor for C2 would be a 5 pF or 10 pF silver
mica, NPO ceramic, or air-dielectric. When determining the
magnitude of I
−
, the leakage of the capacitor and socket
must be taken into account. Switch S2 should be left shorted
most of the time, or else the dielectric absorption of the
capacitor C2 could cause errors.
Similarly, if S1 is shorted momentarily (while leaving S2
shorted)
LPC662
Typical Single-Supply Applications (V
Photodiode Current-to-Voltage Converter
DS010548-17
Note: A 5V bias on the photodiode can cut its capacitance by a factor of 2
or 3, leading to improved response and lower noise. However, this bias on
the photodiode will cause photodiode leakage (also known as its dark
current).
where Cxis the stray capacitance at the + input.
+
= 5.0 VDC)
Micropower Current Source
DS010548-18
Note: (Upper limit of output range dictated by input common-mode range;
lower limit dictated by minimum current requirement of LM385.)
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Page 12
Typical Single-Supply Applications (V
LPC662
Low-Leakage Sample-and-Hold
+
= 5.0 VDC) (Continued)
Instrumentation Amplifier
DS010548-8
DS010548-9
For good CMRR over temperature, low drift resistors should be used. Matching of R3 to R6 and R4 to R7 affects CMRR. Gain may be adjusted through R2.
CMRR may be adjusted through R7.
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Page 13
Typical Single-Supply Applications (V
+
= 5.0 VDC) (Continued)
Sine-Wave Oscillator
Oscillator frequency is determined by R1, R2, C1, and C2:
f
= 1/2πRC
OSC
where R = R1 = R2 and C = C1 = C2.
This circuit, as shown, oscillates at 2.0 kHz with a peak-to-peak output swing of 4.5V
LPC662
DS010548-10
1 Hz Square-Wave Oscillator
Power Amplifier
DS010548-12
DS010548-11
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Page 14
Typical Single-Supply Applications (V
LPC662
10 Hz Bandpass Filter
DS010548-13
fO=10Hz
Q = 2.1
Gain = −8.8
+
= 5.0 VDC) (Continued)
10 Hz High-Pass Filter (2 dB Dip)
fc=10Hz
d = 0.895
Gain = 1
DS010548-14
1 Hz Low-Pass Filter
(Maximally Flat, Dual Supply Only)
DS010548-15
High Gain Amplifier with Offset Voltage Reduction
DS010548-16
Gain = −46.8
Output offset voltage reduced to the level of the input offset voltage of the
8-Pin Small Outline Molded Package (M)
Order Number LPC662AIM or LPC662IM
NS Package Number M08A
8-Pin Molded Dual-In-Line Package (N)
Order Number LPC662AIN or LPC662IN
NS Package Number N08E
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Page 18
Notes
LPC662 Low Power CMOS Dual Operational Amplifier
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Asia Pacific Customer
Response Group
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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