Datasheet LM3940WG3.3-QML Datasheet (NSC)

Page 1
LM3940 1A Low Dropout Regulator for 5V to 3.3V Conversion
General Description
The LM3940 is a 1A low dropout regulator designed to pro­vide 3.3V from a 5V supply.
The LM3940 is ideally suited for systems which contain both 5V and 3.3V logic, with prime power provided from a 5V bus.
Because the LM3940 is a true low dropout regulator, it can hold its 3.3V output in regulation with input voltages as low as 4.5V.
The T0-220 package of the LM3940 means that in most ap­plications the full 1A of load current can be delivered without using an additional heatsink.
The surface mount TO-263 package uses minimum board space, and gives excellent power dissipation capability when soldered to a copper plane on the PC board.
Features
n Output voltage specified over temperature n Excellent load regulation n Guaranteed 1A output current n Requires only one external component n Built-in protection against excess temperature n Short circuit protected
Applications
n Laptop/Desktop Computers n Logic Systems
Typical Application
DS012080-1
*
Required if regulator is located more than 1" from the power supply filter capacitor or if battery power is used.
**
See Application Hints.
May 1999
LM3940 1A Low Dropout Regulator for 5V to 3.3V Conversion
© 1999 National Semiconductor Corporation DS012080 www.national.com
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Connection Diagram/Ordering Information
DS012080-2
3-Lead TO-220 Package
(Front View)
Order Part Number LM3940IT-3.3
NSC Drawing Number TO3B
DS012080-3
3-Lead TO-263 Package
(Front View)
Order Part Number LM3940IS-3.3
NSC Drawing Number TS3B
DS012080-10
3-Lead SOT-223
(Front View)
Order Part Number LM3940IMP-3.3
Package Marked L52B
NSC Drawing Number MA04A
DS012080-27
16-Lead Ceramic Dual-in-Line Package
(Top View)
Order Part Number LM3940J-3.3-QML
5962-9688401QEA
NSC Drawing Number J16A
DS012080-28
16-Lead Ceramic Surface-Mount Package
(Top View)
Order Part Number LM3940WG-3.3-QML
5962-9688401QXA
NSC Drawing Number WG16A
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Page 3
Absolute Maximum Ratings (Note 1)
Storage Temperature Range −65˚C to +150˚C
Operating Junction Temperature Range −40˚C to +125˚C Lead Temperature (Soldering, 5 seconds) 260˚C Power Dissipation (Note 2) Internally Limited Input Supply Voltage 7.5V ESD Rating (Note 3) 2 kV
Electrical Characteristics
Limits in standard typeface are for T
J
=
25˚C, and limits in boldface type apply over the full operating temperature range. Un-
less otherwise specified: V
IN
=
5V, I
L
=
1A, C
OUT
=
33 µF.
Symbol Parameter Conditions Typical LM3940 (Note 4) Units
min max
V
O
Output Voltage 5 mA IL≤ 1A 3.3 3.20 3.40 V
3.13 3.47
Line Regulation I
L
=
5mA
20
40 mV
4.5V V
O
5.5V
Load Regulation 50 mA IL≤ 1A
35
50
80
Z
O
Output Impedance IL(DC)=100 mA
I
L
(AC)=20 mA (rms) 35 m
f=120 Hz
I
Q
Quiescent Current 4.5V VIN≤ 5.5V 10 15 mA
I
L
=
5mA 20
V
IN
=
5V 110 200
I
L
=
1A 250
e
n
Output Noise Voltage BW=10 Hz–100 kHz 150 µV (rms)
I
L
=
5mA
V
O−VIN
Dropout Voltage I
L
=
1A 0.5 0.8 V
(Note 5) 1.0
I
L
=
100 mA 110 150 mV
200
I
L
(SC) Short Circuit Current R
L
=
0 1.7 1.2 A
Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the de­vice outside of its rated operating conditions.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, T
J
, the junction-to-ambient thermal resistance, θ
J−A
, and the
ambient temperature,T
A
. Exceeding themaximumallowablepower dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
The value of θ
J−A
(for devices in still air with no heatsink) is 60˚C/W for the TO-220 package, 80˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package.
The effective value of θ
J−A
can be reduced by using a heatsink (see Application Hints for specific information on heatsinking).
Note 3: ESD rating is based on the human body model: 100 pF discharged through 1.5 k. Note 4: All limits guaranteed for T
J
=
25˚C are 100%tested and are used to calculate Outgoing Quality Levels. All limits at temperature extremes are guaranteed
via correlation using standard Statistical Quality Control (SQC) methods. Note 5: Dropout voltage is defined as the input-output differential voltage where the regulator output drops to a value that is 100 mV below the value that is measured
at V
IN
=
5V.
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Page 4
Typical Performance Characteristics
Dropout Voltage
DS012080-13
Dropout Voltage vs Temperature
DS012080-14
Output Voltage vs Temperature
DS012080-15
Quiescent Current vs Temperature
DS012080-16
Quiescent Current vs V
IN
DS012080-17
Quiescent Current vs Load
DS012080-18
Line Transient Response
DS012080-19
Load Transient Response
DS012080-20
Ripple Rejection
DS012080-21
Low Voltage Behavior
DS012080-22
Output Impedance
DS012080-23
Peak Output Current
DS012080-24
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Page 5
Application Hints
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stabil­ity, and must meet the required conditions for both ESR (Equivalent Series Resistance) and minimum amount of ca­pacitance.
MINIMUM CAPACITANCE: The minimum output capacitance required to maintain stabil-
ESR LIMITS: The ESR of the output capacitor will cause loop instability if
it is too high or too low.The acceptable range of ESR plotted versus load current is shown in the graph below.
It is essen­tial that the output capacitor meet these requirements, or oscillations can result.
It is important to note that for most capacitors, ESR is speci­fied only at room temperature. However, the designer must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the design.
For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25˚C to
−40˚C. This type of capacitor is not well-suited for low tem­perature operation.
Solid tantalum capacitors have a more stable ESR over tem­perature, but are more expensive than aluminum electrolyt­ics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid Tantalum, with the total capacitance split about 75/25%with the Aluminum being the larger value.
If two capacitors are paralleled, the effective ESR is the par­allel of the two individual values. The “flatter” ESR of the Tan­talum will keep the effective ESR from rising as quickly at low temperatures.
HEATSINKING
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. Under all possible operating conditions, the junc­tion temperature must be within the range specified under Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated by the regulator, P
D
, must be calculated.
The figure below shows the voltages and currents which are present in the circuit, as well as the formula for calculating the power dissipated in the regulator:
R
(max). This is calcu-
lated by using the formula: T
R
(max)=TJ(max) − TA(max)
Where: T
J
(max) is the maximum allowable junction tem-
perature, which is 125˚C for commercial grade parts.
T
A
(max) is the maximum ambient temperature
which will be encountered in the applica­tion.
Using the calculated values for T
R
(max) and PD, the maxi­mum allowable value for the junction-to-ambient thermal re­sistance, θ
(J−A)
, can now be found:
θ
(J−A)
=
T
R
(max)/P
D
IMPORTANT: If the maximum allowable value for θ
(J−A)
is found to be 60˚C/W for the TO-220 package, 80˚C/W for the TO-263 package, or 174˚C/W for the SOT-223 pack­age, no heatsink is needed since the package alone will dis­sipate enough heat to satisfy these requirements.
If the calculated value for θ
(J−A)
falls below these limits, a
heatsink is required.
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or se­cured to a copper plane on a PC board. If a copper plane is to be used, the values of θ
(J−A)
will be the same as shown in
the next section for the TO-263.
DS012080-5
FIGURE 1. ESR Limits
DS012080-6
I
IN
=
I
L+IG
P
D
=
(V
IN−VOUT)IL
+(VIN)I
G
FIGURE 2. Power Dissipation Diagram
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Application Hints (Continued)
If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, θ
(H−A)
, must first be
calculated:
θ
(H−A)
=
θ
(J−A)
θ
(C−H)
θ
(J−C)
Where: θ
(J−C)
is defined as the thermal resistance from the junction to the surface of the case. A value of 4˚C/W can be assumed for θ
(J−C)
for this calculation.
θ
(C−H)
is defined as the thermal resistance be­tween the case and the surface of the heat­sink. The value of θ
(C−H)
will vary from about 1.5˚C/W to about 2.5˚C/W (depend­ing on method of attachment, insulator, etc.). If the exact value is unknown, 2˚C/W should be assumed for θ
(C−H)
.
When a value for θ
(H−A)
is found using the equation shown,
a heatsink must be selected that has a value that is less than or equal to this number.
θ
(H−A)
is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots temperature rise vs power dissipation for the heatsink.
HEATSINKING TO-263 AND SOT-223 PACKAGE PARTS
Both the TO-263 (“S”) and SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.
Figure 3
shows for the TO-263 the measured values of θ
(J−A)
for different copper area sizes using a typical PCB with 1 ounce copper
and no solder mask over the copper area used
for heatsinking.
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ
(J−A)
for the TO-263
package mounted to a PCB is 32˚C/W.
As a design aid,
Figure 4
shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device (assuming θ
(J−A)
is 35˚C/W and the maxi-
mum junction temperature is 125˚C).
Figure 5
and
Figure 6
show the information for the SOT-223
package.
Figure 6
assumes a θ
(J−A)
of 74˚C/W for 1 ounce copper and 51˚C/W for 2 ounce copper and a maximum junction temperature of 125˚C.
Please see AN1028 for power enhancement techniques to be used with the SOT-223 package.
DS012080-7
FIGURE 3. θ
(J−A)
vs Copper (1 ounce) Area for the
TO-263 Package
DS012080-8
FIGURE 4. Maximum Power Dissipation vs T
AMB
for
the TO-263 Package
DS012080-11
FIGURE 5. θ
(J−A)
vs Copper (2 ounce) Area for the
SOT-223 Package
DS012080-12
FIGURE 6. Maximum Power Dissipation vs T
AMB
for
the SOT-223 Package
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Page 7
Physical Dimensions inches (millimeters) unless otherwise noted
3-Lead SOT-223 Package
Order Part Number LM3940IMP-3.3
NSC Package Number MA04A
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Page 8
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
3-Lead TO-220 Package
Order Part Number LM3940IT-3.3
NSC Package Number TO3B
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Page 9
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
3-Lead TO-263 Package
Order Part Number LM3940IS-3.3
NSC Package Number TS3B
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Page 10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Ceramic Dual-in-Line Package
Order Part Number LM3940J-3.3-QML
5962-9688401QEA
NSC Drawing Number J16A
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Page 11
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
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2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
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www.national.com
16-Lead Ceramic Surface-Mount Package
Order Part Number LM3940WG-3.3-QML
5962-9688401QXA
NSC Package Number WG16A
LM3940 1A Low Dropout Regulator for 5V to 3.3V Conversion
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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