The LM2724A is a dual N-channel MOSFET driver which
can drive both the top and bottom MOSFETs in a push-pull
structure simultaneously. The LM2724A takes a logic input
and splits it into two complimentary signals with a typical
20ns dead time in between. The built-in cross-conduction
protection circuitry prevents the top and bottom MOSFETs
from turning on simultaneously. With a bias voltage of 5V, the
peak sourcing and sinking current for each driver of the
LM2724A is about 3A. Input UVLO (Under-Voltage-LockOut) ensures that all the driver outputs stay low until the
supply rail exceeds the power-on threshold during system
power on, or after the supply rail drops below power-on
threshold by a specified hysteresis during system power
down. The cross-conduction protection circuitry detects both
driver outputs and will not turn on a driver until the other
driver output is low. The top gate voltage needed by the top
MOSFET is obtained through an external boot-strap structure. When not switching, the LM2724A only draws up to
195µA from the 5V rail. The synchronization operation of the
bottom MOSFET can be disabled by pulling the SYNC pin to
ground.
Features
n Shoot-through protection
n Input Under-Voltage-Lock-Out
n 3A peak driving current
n 195µA quiescent current
n 28V input voltage in buck configuration
n SO-8 and LLP packages
Applications
n High Current DC/DC Power Supplies
n High Input Voltage Switching Regulators
n Fast Transient Microprocessors
n Notebook Computers
2HGTop gate drive output. Should be connected to the top FET gate.
3BOOT
4INAccepts a logic control signal
5SYNCBottom gate enable
6V
CC
7LG
8GNDGround
Top driver return. Should be connected to the common node of top
and bottom FETs
Bootstrap. Accepts a bootstrap voltage for powering the high-side
driver
Connect to +5V supply
Bottom gate drive output. Should be connected to the bottom FET
gate.
= 39˚C/W
θ
JA
Supplied As
20073506
www.national.com2
Block Diagram
LM2724A
20073503
www.national.com3
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
LM2724A
Distributors for availability and specifications.
V
CC
BOOT to SW7V
7V
Storage Temperature−65˚C to 150˚C
ESD Susceptibility
Human Body Model (Note 4)2.0 kV
Soldering Time, Temperature10sec., 300˚C
Operating Ratings (Note 1)
BOOT to GND (Note 2)35V
V
SW to GND30V
Junction Temperature+150˚C
Power Dissipation
(Note 3)
720mW (SO-8)
3.2W (LLP-8)
CC
Junction Temperature Range-40˚C to 125˚C
Electrical Characteristics
LM2724A
VCC= BOOT = SYNC = 5V, SW = GND = 0V, unless otherwise specified. Typicals and limits appearing in plain type apply for
T
POWER SUPPLY
I
q_op
TOP DRIVER
t
4
t
6
t
3
t
5
BOTTOM DRIVER
t
8
t
2
t
7
t
1
LOGIC
V
uvlo_up
V
uvlo_dn
V
uvlo_hys
V
IH_SYNC
V
IL_SYNC
I
leak_SYNC
= +25˚C. Limits appearing in boldface type apply over the entire operating temperature range.
A=TJ
SymbolParameterConditionMinTypMaxUnits
Operating Quiescent
IN = 0V145195µA
Current
Peak Pull-Up Current3.0A
Pull-Up Rds_onI
BOOT=IHG
= 0.3A1.2Ω
Peak Pull-down Current−3.2A
Pull-down Rds_onI
SW=IHG
Rise TimeTiming Diagram, C
Fall Time12ns
3.3nF
= 0.3A0.5Ω
LOAD
=
17ns
Pull-Up Dead TimeTiming Diagram19ns
Pull-Down DelayTiming Diagram, from IN
Falling Edge
27ns
Peak Pull-Up Current3.2A
Pull-up Rds_onI
VCC=ILG
= 0.3A1.1Ω
Peak Pull-down Current3.2A
Pull-down Rds_onI
GND=ILG
Rise TimeTiming Diagram, C
Fall Time14ns
3.3nF
= 0.3A0.6Ω
LOAD
=
17ns
Pull-up Dead TimeTiming Diagram22ns
Pull-down DelayTiming Diagram13ns
V
CC
Under-Voltage-Lock-Out
rises from 0V toward
V
CC
5V4V
Upper Threshold
V
CC
Under-Voltage-Lock-Out
VCC falls from 5V toward
0V2.5V
Lower Threshold
V
CC
Under-Voltage-Lock-Out
falls from 5V toward 0V
V
CC
0.8V
Hysteresis
SYNC Pin High Input55%
SYNC Pin Low Input25%
SYNC Pin Leakage
Current
SYNC = 5V, Sink Current2
SYNC = 0V, Source Current10
4.3V to 6.8V
V
CC
µA
www.national.com4
Electrical Characteristics
LM2724A
VCC= BOOT = SYNC = 5V, SW = GND = 0V, unless otherwise specified. Typicals and limits appearing in plain type apply for
T
I
leak_IN
t
on_min1
t
on_min2
t
on_min3
t
off_min1
t
off_min2
V
IH_IN
V
IL_IN
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating ratings are conditions under which the device operates
correctly. The gaurnteed specifications apply only for the listed test conditions. Some performance characteristics may degrade when the part is not operated under
listed conditions.
Note 2: If BOOT voltage exceeds this value, the ESD structure will degrade.
Note 3: Maximum allowable power dissipation is a function of the maximum junction temperature, T
ambient temperature, T
ambient thermal resistance, θ
LM2724A LLP package is 39˚C/W. For a T
Note 4: ESD machine model susceptibility is 200V.
Note 5: If the positive pulse width at IN pin is below this value but above t
value.
Note 6: If the positive pulse width at IN pin is below this value but above t
Note 7: If the positive pulse width at IN pin is below this value, the pulse will be completely ignored. Neither HG or LG will respond to it.
Note 8: If the negative pulse width at IN pin is below this value but above t
Note 9: If the negative pulse width at IN pin is below this value, the pulse will be completely ignored. Neither HG or LG will respond to it.
= +25˚C. Limits appearing in boldface type apply over the entire operating temperature range.
A=TJ
SymbolParameterConditionMinTypMaxUnits
(Continued)
IN Pin Leakage CurrentIN = 0V, Source Current2µA
IN = 5V, Sink Current10
Minimum Positive Pulse
Width at IN Pin
160
(Note 5)
Minimum Positive Pulse
Width at IN Pin for HG to
Respond
45
(Note 6)
Minimum Positive Pulse
Width at IN Pin for LG to
Respond
10
ns
(Note 7)
Minimum Negative Pulse
Width at IN Pin for LG to
Respond
40
(Note 8)
Minimum Negative Pulse
Width at IN Pin for HG to
Respond
5
(Note 9)
IN High Level Input
Voltage
IN Low Level Input
Voltage
. The maximum allowable power dissipation at any ambient temperature is calculated using: P
A
, for LM2724A is 172˚C/W. For a T
JA
of 150˚C and TAof 25˚C, the maximum allowable power dissipation is 3.2W.
JMAX
When IN pin goes high from
0V
When IN pin goes low from
5V
of 150˚C and TAof 25˚C, the maximum allowable power dissipation is 0.7W. The θJA, for
JMAX
, the pulse is internally stretched to t
on_min2
, then HG stops responding while LG still responds to the pulse.
on_min3
, then LG stops responding while HG still responds.
off_min2
55%
25%
, the junction-to-ambient thermal resistance, θJA, and the
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
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Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
www.national.com
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Europe Customer Support Center
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
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Support Center
Email: ap.support@nsc.com
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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