Notes: 1. In flyback phase the output voltage can reach 60V.
ESD according toMIL 883C; tested at 2KV;corresponds to maximum energy dissipation 0.2mJ.
-0.3 ... 32
-0.3 ... 45
-0.3 ... 32
-0.3 ... 45
-24 ... 32
-24 ... 45
-0.3 ... 45
1)
-1
internal limited
-0.3 ... 32
-0.3 ... 45
V
V
V
V
V
V
V
A
V
V
THERMAL DATA
SymbolParameterMin.Typ.Max.Unit.
T
JSDon
T
JSDoff
SO 12+4+4
R
th j-pin
R
th j-amb
SO 20
R
th j-amb
2. With 6cm2on board heat sink area.
3. Mounted onSMPCB2 board
Temperature shutdown switch-on-threshold160200°C
Temperature shutdown switch-off-threshold140180°C
Thermal resistance junction to pins15°C/W
Thermal resistance junction to ambient
Thermal resistance junction to ambient
2)
3)
50°C/W
97°C/W
3/9
Page 4
L9339
ELECTRICAL CHARACTERISTCS
The electrical characteristics are valid within the below defined Operating Conditions, unless otherwise specified. The function is guaranteed by design until T
Supply voltage4.5 V to 32 V
V
S
Junction temperature-40 °Cto150°C
T
j
Ambient Temperature-40 °Cto125°C
T
amb
Note: Ambient test temperature = -40 °C to 125 °C
SymbolParameterTest ConditionMin.Typ.Max.Unit
SUPPLY:
switch-on-threshold.
JSDon
I
Quiescent current-0.3V < VEN< 0.5V; VS=14V;
Q
Inputs, IN1 - IN4; Programming, PRG:
V
V
INhigh
INlow
Input voltage LOW-0.32.0V
Input voltage HIGH2.832V
Input currentVIN= 0 ...32V-1525µA
I
IN
Enable EN:
V
ENlow
V
ENhigh
R
I
Input voltage LOW-241V
Input voltage HIGH3.2V
Input impedance-24 V < VIN< 2.5 V10k
EN
Input current2.5 V < VIN< 32V2080µA
EN
Outputs OUT1- OUT4
R
DSon
I
OLeak
Output ON-resistorVS>6V,IO= 0.3A1.73.8
Leakage current
-0.3V < V
< 125 °C
T
a
< 150 °C
T
a
V
> 3.2V; VS< 14V1.52mA
EN
< 0.5V; VS=14V;
EN
<210µA
50µA
S
V
Ω
Ω
=14V;Ta< 125 °C<15µA
V
O=VS
V
OClamp
I
OSC
C
Output voltage during clampingtime < 200µs
Short-circuit current4.5V < VS< 6V0.31A
internal output capacitiesVO> 4.5V100pF
O
Diagnostic Output DIAG
V
Dlow
I
Dmax
Output voltage LOWIDL< 0.6mA1.3V
Max. output currentinternal current limitation
4/9
=VS=14V;Ta< 150 °C25µA
V
O
455260V
10 mA< I
> 6V0.40.71A
V
S
<0.3A
O
1515mA
V
=14V
D
Page 5
L9339
ELECTRICAL CHARACTERISTICS
(Continued)
SymbolParameterTest ConditionMin.Typ.Max.Unit
I
DLeak
TIMING CHARCTERISTICS
t
d,on
t
d,off
t
t
d,DIAG
S
Note :All parameters are measured at T
Leakage currentVD=VS=14V;Ta<125°C<0.11µA
=VS=14V;Ta<150°C5µA
V
D
4)
On delay timeVS=14V,C
10mA < I
Off delay time34.5µs
Enable settling time10µs
set
ext
< 200mA
O
= 0pF
23.5µs
ON or OFF Diagnostic delay time10µs
Output voltage slopes2.5916V/µs
out
= 125°C.
4. See also Fig.3 Timing Characteristics
amb
Figure 1.
V
EN
V
INhig h
V
IN lo w
active
V
PRG
Non-InvertingModeInverting Mode
V
INhig h
V
IN lo w
V
IN
V
INhig h
V
IN lo w
V
OUT
V
S
1/2 V
S
t
set
t
d,off
t
d,on
5. Output voltage slope not controlled for enable low!
t
t
t
5)
t
t
d,off
t
d,on
t
d,off
t
d,on
t
set
5/9
Page 6
L9339
FUNCTIONAL DESCRIPTION
The L9339 isa quad low side driver for lines, lamps or inductiveloads in automotive and industrial applications.
The logic input levels are TTL and CMOS compatible. This allows the device to be driven directly by a micro-
controller. For the noise immunity, all input thresholds has a hysteresis of typ. 100mV. At each input (IN and
PRG) voltages from -0.3V to 32V can be applied, EN can withstand voltages from -25V to 32V. The device is
activated with a’high’ signal on ENable. ENable ’low’ switches the device intothe sleep mode.In this mode the
quiescent current is less than 10µA. A high signal on PRoGramming input changes the signal transfer polarity
from noninverting into the inverting mode. This pin can be connected to V
PRG and EN pin is low, if these pins are not connected. This forced condition leads to a mode change if the
PRG pin was high before the interruption. Independent of the PRoGramming input, the OUTput switches off, if
the signal INput pin is not connected.
Each output driver hasa current limitation of min 0.4A anda independent thermal shut-down. The thermal shutdown deactivates that output, which exceeds temperature switch off level. When the junction temperature decreases 20K below this temperature threshold the output will be activated again (hysteresis of the thermal shutdown function). The slew rate of the output voltage is limited to max. 14V/µs, to reduce the electromagnetic
radiation of theloads and its wiring. For inductive loads aoutput voltage clamp of typicaly 52Vis implemented.
The DIAGnostic is an open drain output with an additional series diode. The logic status depends on the PRoGramming pin. If the PRG pin is ’low’ the DIAG output becomes low, if the device works correctly. At thermal
shut-down of one channel the DIAGnostic output becomes high. If the PRG pin is ’high’ this output is switched
off at normal function and switched on at overtemperature.
Overtemperature
or supply voltageHLXH (off) *H (off)
OvertemperatureHHXH(off) *L(on)
X = not relevant* selective for each channel at overtemperature
6/9
Page 7
Figure 2. Application for Inverting Transfer Polarity
BO AR D VOLT AG E 14 V
VCC = 5V
10µF
L9339
VCC
MICROCONTROLLER
GND
IN T
D0
D1
D2
D3
AdressdecoderA0:8
8
PR G
EN
IN 1
IN 2
IN 3
IN 4
VS
DIAG
U717
L9339
OUT 1
OUT 2
OUT 3
OUT 4
GND
Figure 3.Application for Non Inverting Transfer Polarity
BO ARD VO LTAG E 14 V
VC C = 5 V
2W12mH
50 kHz
M
10µH
250 mA
240Ω
50pF
VC C = 5V
VCC
IN
GND
10µF
VCC
MICROCONTROLLER
GND
IN T
D0
D1
D2
D3
AdressdecoderA0:8
8
PR G
EN
IN 1
IN 2
IN 3
IN 4
VS
DIAG
L9339
U717
OUT 1
OUT 2
OUT 3
OUT 4
GND
2W12mH
50 kHz
Note: We recommend to use the device fordriving inductive loads with flyback energy EFB< 2mJ.
M
10µH
250 mA
240
50pF
VCC = 5V
Ω
VC C
IN
GND
7/9
Page 8
L9339
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A2.352.650.0930.104
A10.10.30.0040.012
B0.330.510.0130.020
C0.230.320.009
D12.6130.4960.512
E7.47.60.2910.299
e1.270.050
H1010.65 0.3940.419
h0.250.750.0100.030
L0.41.270.0160.050
K0°(min.)8°(max.)
mminch
0.013
OUTLINE AND
MECHANICAL DATA
SO20 & SO20(12+4+4)
SO20
B
e
D
1120
110
L
hx45°
A
K
A1C
H
E
SO20MEC
8/9
Page 9
L9339
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes noresponsibility for the consequences
of use of suchinformationnor for anyinfringement of patents orother rights of third partieswhichmay result fromits use.No licenseis granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change withoutnotice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1999 STMicroelectronics - All Rights Reserved
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India -Italy - Japan - Malaysia -Malta - Morocco - Singapore - Spain
STMicroelectronics GROUP OFCOMPANIES
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http://www.st.com
9/9
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