The L6932 Ultra Low Drop Output linear regulator
operates from 2V to 14V and is able to support 2A.
Designed with an internal 50mΩ N-channel
TYPICAL OPERATING CIRCUIT
V
IN
2V to 14V
IN
2
C1
L6932D
5,6,7,8
GND
Mosfet, can be usefull for the DC-DC conversion
between 2.5V and 1.5V at 2A in portable applications reducing the power dissipation.
L6932 is available in 1.5V, 1.8V, 2.5V and adj version from 1.2V and ensure a voltage regulation accuracy of 1%.
The current limit is fixed at 2.5A to control the current in short circuit condition within ±8%. The current is sensed in the power mos in order to limit the
power dissipation.
The device is also provided of a thermal shut down
that limits the internal temperature at 150°C with
an histeresys of 20°C. L6932 provides the Enable
and the Power good functions.
1.5V-1.8V-2.5V
C2
V
OUT
OUT
3
PGOOD
4
1
EN
December 2005
V
IN
2V to 14V
C2
V
OUT
1.2V to 5V
IN
2
C1
L6932D
5,6,7,8
GND
OUT
4
R1
ADJ
3
1
EN
R2
Rev. 9
1/11
Page 2
L6932
PIN CONNECTIONS
EN
ADJ
OUT
1
IN
2
3
4
L6932D1.2
8
7
6
5
GND
GND
GND
GND
EN
IN
OUT
PGOOD
1
2
3
4
L6932D1.5
L6932D1.8
L6932D2.5
8
7
6
5
GND
GND
GND
GND
PIN FUNCTION
N°
L6232D
1.2
1ENEnables the device if connected to Vin and disables the device if forced to gnd.
2INSupply voltage. This pin is connected to the drain of the internal N-mos. Connect this
ADJ–Connecting this pin to a voltage divider it is possible to programme the output voltage
3
L6232D
1.5/1.8/
Description
2.5
pin to a capacitor larger than 10
µF.
between 1.2V and 5V.
–OUTRegulated output voltage. This pin is connected to the source of the internal N-mos.
Connect this pin to a capacitor of 10
µF.
OUT–Regulated output voltage. This pin is connected to the source of the internal N-mos.
Connect this pin to a capacitor of 10
µF.
4
–PGOOD Power good output. The pin is open drain and detects the output voltage. It is forced
low if the output voltage is lower than 90% of the programmed voltage.
5, 6, 7, 8GNDGround pin.
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
in
VIN and Pgood14.5V
EN, OUT and ADJ-0.3 to (V
+0.3)V
in
THERMAL DATA
SymbolParameterValueUnit
R
th J-amb
T
max
T
stg
(*) Measured on Demoboard with about 4 cm2 of dissipating area 2 Oz.
Thermal Resistance Junction to Ambient62 (*)°C/W
Maximum Junction Temperature 150°C
Storage Temperature Range-65 to 150°C
2/11
Page 3
L6932
BLOCK DIAGRAM
GND
ELECTRICAL CHARACTERISTCS
(*) Specification referred to T
(Referred to the Fixed Voltage version)
IN
REFERENCE
VREF=1.25V
ENABLEEN
THERMAL
SENSOR
(Tj = 25°C, VIN = 5V unless otherwise specified)
from -25°C to 125°C.
j
VREF
0.9 VREF
+
ERROR
AMPL.
CHARGE
PUMP
-
+
CURRENT
LIMIT
DRIVER
OUT
PG
D99IN1100
SymbolParameterTest ConditionMin. Typ.Max.Unit
V
R
Operating Supply Voltage 214V
in
V
Output voltage L6932D1.2Io = 0.1A; Vin = 3.3V1.1881.21.212V
o
Output voltage L6932D1.5I
Output voltage L6932D1.8I
Output voltage L6932D2.5I
L6932D1.2
Line Regulation
L6932D1.5
Line Regulation
L6932D1.8
Line Regulation
L6932D2.5
Line Regulation
L6932D1.2 Load RegulationV
L6932D1.5 Load RegulationV
L6932D1.8 Load RegulationV
L6932D2.5 Load RegulationV
Drain Source ON resistance200mΩ
dson
= 0.1A; Vin = 3.3V1.4851.51.515V
o
= 0.1A; Vin = 3.3V1.7821.81.818V
o
= 0.1A; Vin = 3.3V2.4752.52.525V
o
V
= 2.5V ±10%; Io = 10mA5mV
in
V
= 3.3V ±10%; Io = 10mA5mV
in
V
= 5V ±10%; Io = 10mA5mV
in
V
= 2.5V ±10%; Io = 10mA5mV
in
V
= 3.3V ±10%; Io = 10mA5mV
in
V
= 5V ±10%; Io = 10mA5mV
in
V
= 2.5V ±10%; Io = 10mA5mV
in
V
= 3.3V ±10%; Io = 10mA5mV
in
= 5V ±10%; Io = 10mA5mV
V
in
V
= 3.3V ±10%; Io = 10mA5mV
in
V
= 5V ±10%; Io = 10mA5mV
in
= 3.3V; 0.1A < Io < 2A15mV
in
= 3.3V; 0.1A < Io < 2A15mV
in
= 3.3V; 0.1A < Io < 2A15mV
in
= 3.3V; 0.1A < Io < 2A15mV
in
3/11
Page 4
L6932
ELECTRICAL CHARACTERISTCS
(continued)
SymbolParameterTest ConditionMin. Typ.Max.Unit
I
I
V
Current limiting2.32.52.7A
occ
I
Quiescent current0.20.4mA
q
Shutdown current2V < Vin < 14V
sh
Ripple Rejectionf = 120Hz, I
= 5V, ∆Vin = 2Vpp
V
in
EN Input Threshold0.50.650.8V
en
Pgood thresholdV
rise90%Vo
o
= 1A
o
*
6075dB
25µA
Pgood Hysteresis10%Vo
Pgood saturationI
Figure 1. Output Voltage vs. Junction
Temperature (L6932D1.2)
1.213
1.212
1.212
1.211
V
1.211
1.210
1.210
1.209
-60 -40 -20 0 20 40 60 80 100 120 140 160
Temp [°C]
=1mA0.20.4V
pgood
Figure 3. Output Voltage vs. Junction
Temperature (L6932D2.5)
2.520
2.515
2.510
V
2.505
2.500
2.495
-60 -40 -20 0 2 0 40 60 80 100 1 20 140 1 60
Temp [°C]
Figure 2. Output Voltage vs. Junction
Temperature (L6932D1.8)
1.808
1.804
1.800
V
1.796
1.792
1.788
-60 - 40 -20 0 20 40 60 80 100 120 140 160
4/11
Temp [°C]
Figure 4. Quiescent Current vs. Junction
Temperature
310
300
Vin=5V
290
Iq
280
(uA)
270
260
250
-40-20020406080100 120 140
Temp [°C ]
Page 5
Figure 5. Shutdown Current vs. Junction TemperatureAPPLICATION INFORMATIONS
7.5
7
6.5
Ishdn
(uA)
Vin=5V
6
5.5
5
4.5
4
-40-20020406080100120140
Temp [°C ]
APPLICATION CIRCUIT
In figure 6 the schematic circuit of the demoboards are shown.
Figure 6. Demoboards Schematic Circuit
L6932
C2
V
OUT
VOUT+×=
1.2
R2
R1
R2
3
4
OUT
PGOOD
1.2V to 5V
C2
V
OUT
V
IN
V
IN
IN
EN
C1
2
1
IN
EN
C1
L6932D1.2
5
GND
2
L6932D1.5
L6932D1.8
1
L6932D2.5
678
5
GND
4
678
3
OUT
ADJ
COMPONENT LIST
Fixed version
ReferencePart NumberDescriptionManufacturer
R2)(R1
C1C34Y5U1E106Z10uF, 25VTOKIN
C2C34Y5U1E106Z10uF, 25VTOKIN
5/11
Page 6
L6932
Figure 7. Demoboard Layout (Fixed Version)
Adjustable version
ReferencePart NumberDescriptionManufacturer
C1C34Y5U1E106Z10uF, 25VTOKIN
C2C34Y5U1E106Z10uF, 25VTOKIN
R15.6K, 1%, 0.25WNeohm
R23.3K, 1%, 0.25WNeohm
Figure 8. Demoboard Layout (Adjustable Version)
COMPONENTS SELECTION
Input Capacitor
The input capacitor value depends on a lot of factors such as load transient requirements, input source (battery
or DC/DC converter) and its distance from the input cap. Usually a 47
µ
F is enough for any application but a
much lower value can be sufficient in many cases.
Output Capacitor
The output capacitor choice depends basically on the load transient requirements.
Tantalum, Speciality Polimer, POSCAP and aluminum capacitors are good and offer very low ESR values.
6/11
Page 7
L6932
Multilayer ceramic caps have the lowest ESR and can be required for particular applications. Nevertheless in
several applications they are ok, the loop stability issue has to be considered (see loop stability section).
Below a list of some suggested capacitor manufacturers.
ManufacturerTypeCap Value (µF)Rated Voltage (V)
PANASONICCERAMIC1 to 474 to 16
TAYO YUDENCERAMIC1 to 474 to 16
TDKCERAMIC1 to 474 to 16
TOKINCERAMIC1 to 474 to 16
SANYOPOSCAP1 to 474 to 16
PANASONICSP1 to 474 to 16
KEMETTANTALUM1 to 474 to 16
Loop Stability
The stability of the loop is affected by the zero introduced by the output capacitor.
The time constant of the zero is given by:
TESRC
⋅=F
OUT
ZERO
---------------- --------------- -------------=
2π ESR C
1
⋅⋅
OUT
This zero helps to increase the phase margin of the loop until the time constant is higher than some hundreds
of nsec, depending also on the output voltage and current.
So, using very low ESR ceramic capacitors could produce oscillations at the output, in particular when regulating
high output voltages (adjustable version).
To solve this issue is sufficient to add a small capacitor (e.g. 1nF to 10nF) in parallel to the high side resistor of
the external divider, as shown in figure 9.
Figure 9. Compensation Network
VIN=2V TO 14V
C1
IN
EN
2
1
5
L6932D1.2
6
GND
OUT
4
R1
ADJ
3
8
7
R2
VOUT=1.2V TO 5V UP to 2A
C3
C2
Thermal Considerations
Since the device is housed in a small SO(4+2+2) package the thermal issue can be the bottleneck of many applications. The power dissipated by the device is given by:
P
DISS
= (VIN - V
OUT
) · I
OUT
7/11
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L6932
The thermal resistance junction to ambient of the demoboard is approximately 62°C/W. This mean that, considering an ambient temperature of 60°C and a maximum junction temperature of 150°C, the maximum power that
the device can handle is 1.5W.
This means that the device is able to deliver a DC output current of 2A only with a very low dropout.
In many applications, high output current pulses are required. If their duration is shorter than the thermal con-
stant time of the board, the thermal impedance (not the thermal resistance) has to be considered.
In figure 10 the thermal impedance versus the duration of the current pulse for the SO(4+2+2) mounted on board
is shown.
Figure 10. Thermal Impedance
Considering a pulse duration of 1sec, the thermal impedance is close to 20°C/W, allowing much bigger power
dissipated.
Considering a thermal impedance of 20°C/W, the maximum junction temperature will be:
= TA + Z
T
J
THJA
· P
= 60 + 60 = 120°C
DISS
Obviously, with pulse durations longer than approximately 10sec the thermal impedance is very close to the
thermal resistance (60°C/W to 70°C/W).
8/11
Page 9
Figure 11. SO-8 Mechanical Data & Package Dimensions
L6932
DIM.
A1.351.75 0.0530.069
A10.100.250.0040.010
A21.101.650.0430.065
B0.330.51 0.0130.020
C0.190.25 0.0070.010
(1)
D
E3.804.000.150.157
e1.270.050
H5.806.20 0.2280.244
h0.250.500.0100.020
L0.401.270.0160.050
k0˚ (min.), 8˚ (max.)
ddd0.100.004
Note: (1) Dimensions D does no t include mold flash, protru-
mminch
MIN.TYP. MAX. MIN.TYP. MAX.
4.805.000.1890.197
sions or gate burrs.
Mold flash, potrusions or gate burrs shall not exceed
0.15mm (.006inch) in total (both side).
OUTLINE AND
MECHANICAL DATA
SO-8
0016023 C
9/11
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L6932
Table 1. Revision History
DateRevisionDescription of Changes
February 20038First Issue
December 20059Added new Ordering Numbers: L6932D1.5 & L6932D1.5TR.
10/11
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L6932
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