The L6375D is a monolithic intelligent power
switch in BCDmultipower technology, for driving
inductive or resistive loads with controlled output
voltage slew rate and short-circuit protection.
An internal clamping diode enables the fast
demagnetization of inductive loads. Diagnostics
for CPU feedback and extensive use of electrical
protection make this device extremely rugged and
specially suitable for industrial automation
applications.
4OUTHigh side output with built-in current limitation
6V
S
10Output status
15DIAG1
14DIAG2
17IN+Comparator inverting input
19ON-DELAYProgrammable ON time interval duration during short-circuit operation
1, 3, 5, 7, 8,
9, 11, 12, 13,
N.C.Not connected
16, 18, 20
Supply voltage input; the value of the supply voltage is monitored to
detect undervoltage condition
This current source output is capable of driving an LED to signal the
status of the output pin. The pin is active (source current) when the
output pin is considered high (see Figure 4)
DIAGNOSTIC 1 output. This open drain reports the IC working
conditions (see Table 6: Diagnostic truth table)
DIAGNOSTIC 2 output. This open drain reports the IC working
conditions (see Table 6: Diagnostic truth table)
4/16 Doc ID 13678 Rev 3
Page 5
L6375DElectrical specifications
2 Electrical specifications
2.1 Absolute maximum ratings
Table 3.Absolute maximum ratings
SymbolParameterValueUnit
V
Supply voltage (tw < 10 ms) 50 V
S
V
Supply voltage (DC) 40 V
S
V
-V
Supply to output differential voltage Internally limited V
S
out
od Externally forced voltage -0.3 to 7 V
V
od Externally forced current ±1 mA
I
I
out Output current (see also I
V
P
TOT
V
diag
I
diag
I
Output voltage Internally limited V
out
Power dissipation Internally limited W
External voltage -0.3 to 40 V
Externally forced current -10 to 10 mA
i Input current 20 mA
Vi Input voltage -10 to V
Top Ambient temperature, operating range -25 to 85 °C
) Internally limited A
sc
+0.3 V
S
T
J
STG Storage temperature -55 to 150 °C
T
E
I
2.2 Thermal data
Table 4.Thermal data
SymbolParameterValueUnit
R
thJA
R
thJP
1. When mounted on an FR4 printed circuit board with 0.5 cm2 of Cu (at least 35 mm thick).
Junction temperature, operating range
(seeSection 2.6)
-25 to 125 °C
Energy inductive load TJ = 85 °C 200mJ
Thermal resistance junction-ambient max.
(1)
65°C/W
Thermal resistance junction-pins max.15°C/W
Doc ID 13678 Rev 35/16
Page 6
Electrical specificationsL6375D
2.3 Electrical characteristics
VS = 24 V; TJ = –25 to +125 °C, unless otherwise specified.
Table 5.Electrical characteristics
SymbolParameter Test condition Min.Typ.Max.Unit
V
V
V
V
V
I
V
V
V
V
V
I
dch
V
I
V
V
I
I
V
V
Supply voltage for valid
smin
diagnostic
Operative supply voltage 8 24 35 V
S
Undervoltage threshold 1 7 7.5 8 V
sth1
Undervoltage threshold 2 6.5 7 7.5 V
sth2
Undervoltage hysteresis 300 500 700 mV
shys
Quiescent current Output open 800 μA
I
q
Quiescent current Output ON 1.6 mA
qo
Input threshold voltage 0.8 1.3 2 V
ith
Input threshold hysteresis 50 400 mV
iths
Input low level voltage -7 0.8 V
il
Input high level voltage VS < 18 V 2 VS - 3 V
ih
Input high level voltage V
ih
Input bias current Vi = -7 to 15 V -250 250 μA
I
ib
Delay capacitor charging
current
Output voltage drop
don
Output leakage current Vi = LOW; V
olk
Output low state voltage Vi = HIGH; pin floating 0.8 1.5 V
ol
Internal voltage clamp
cl
(Vs-V
Short-circuit output current VS = 8 to 35 V; Rl = 2 Ω; 0.75 1.1 1.5 A
sc
Open load detection current Vi = Vih; TA= 0 to +85 °C 1 3 6 mA
old
Output status threshold 1
oth1
voltage
Output status threshold 2
oth2
voltage
out
)
I
= > 0.5 mA;
diag
= 1.5 V;
V
diag
> 18 V 2 15 V
S
ON DELAY pin shorted to
ground
Iout = 500 mA T
= 25 °C
J
TJ = 125 °C
Iout =625 mA T
= 25 °C
J
TJ= 125 °C
=0 100 μA
out
I
= 200 mA
o
single pulsed = 300 ms
4 35 V
2.5 μA
200
320
250
400
280
440
350
550
48 53 58 V
4.5 5 5.5 V
4 4.5 5 V
mV
mV
mV
mV
ohys
I
osd
hysteresis
Output status source current
Output status threshold
V
6/16 Doc ID 13678 Rev 3
300 500 700 mV
> Voth1; Vos =
V
out
2.5 V
2 4 mA
Page 7
L6375DElectrical specifications
Table 5.Electrical characteristics (continued)
SymbolParameter Test condition Min. Typ. Max.Unit
Active output status driver drop
V
osd
voltage
I
V
I
T
T
Output status driver leakage
oslk
current
Diagnostic drop voltage
dgl
dglk Diagnostic leakage current
Overtemperature upper
max
threshold
Overtemperature hysteresis 20 °C
hys
– VOS; IOS = 2 mA
V
S
TA = 0 to +85 °C
V
< V
out
; Vos = 0 V
oth2
VS = 18 to 35 V
D1 / D2 = L; I
D1 / D2 = L; I
diag
diag
D1 / D2 = H; 0 < V
= 15.6 to 35 V
V
S
= 0.5 mA
= 3 mA
< VS
dg
1.5 3 V
25 mA
40
250
5 μA
150 °C
AC operation (pin numbering referred to Minidip package)
= 24 V; Rl =70 Ω Rl to
V
t
-tr Rise or fall time
r
Delay time
t
d
S
ground
= 24 V; Rl =70 Ω Rl to
V
S
ground
20 μs
5 μs
dV/dt Slew-rate (rise and fall edge) 0.7 1 1.5 V/μs
ON time during short-circuit
t
ON
t
OFF
f
max
condition
OFF time during short-circuit
condition
Maximum operating frequency 25 KHz
50 pF < C
< 2 nF1.28 μs/pF
DON
64 t
Source drain NDMOS diode
mV
mV
ON
V
Forward ON voltage @ Ifsd = 625 mA 1 1.5 V
f
Forward peak voltage t = 10 ms; d = 20% 2 A
I
fD
Reverse recovery time If= 625 mA di/dt = 25 A/ms 200 ns
t
rr
t
Forward recovery time 50 ns
fr
Doc ID 13678 Rev 37/16
Page 8
Electrical specificationsL6375D
2.4 Switching waveform
Figure 3.Switching waveform
2.5 Input section
A single ended input TTL/CMOS compatible with a wide voltage range and high noise
immunity (thanks to a built-in hysteresis) is available.
2.6 Overtemperature protection (OVT)
An on-chip overtemperature protection provides excellent protection of the device in
extreme conditions. Whenever the temperature, measured on a central portion of the chip,
exceeds T
= 150 °C (typical value), the device is shut off, and the DIAG2 output goes
max
LOW. Normal operation is resumed as the chip temperature (normally after a few seconds)
falls below T
max
- T
= 130 °C (typical value). The hysteresis avoids that an intermittent
hys
behavior takes place.
2.7 Undervoltage protection (UV)
The supply voltage is expected to range from 8 to 35 V. In this range the device operates
correctly. To avoid any malfunctioning the supply voltage is continuously monitored to
provide an undervoltage protection. As V
Figure 1) the output Power MOSFET is switched off and DIAG1 and DIAG2 (see
Section 2.11). Normal operation is resumed as soon as V
behavior prevents intermittent operation at low supply voltage.
falls below V
S
sth-Vshys
exceeds V
S
(typically 7.5 V, see
. The hysteretic
sth
8/16 Doc ID 13678 Rev 3
Page 9
L6375DElectrical specifications
2.8 Overcurrent operation
In order to implement a short-circuit protection the output Power MOSFET is driven in linear
mode to limit the output current to the I
to the I
value) lasts for a Ton time interval, that can be set by means of a capacitor (C
sc
connected to the ON DELAY pin according to the following formula:
T
= 1.28 μsec/ pF
on
for
(1.1 A typical value). This condition (current limited
sc
don
)
50 pF< C
After the T
< 2 nF
don
interval has expired the output Power MOSFET is switched off for the T
on
off
time
interval with:
T
= 64 ·Ton.
off
When also the T
interval has expired, the output Power MOSFET is switched ON. At this
off
point in time two conditions may occur
a) The overload is still present, and then the output Power MOSFET is again driven
in linear mode (limiting the output current to I
) for another Ton, starting a new
sc
cycle, or
b) the overload condition is removed, and the output Power MOSFET is no longer
driven in linear mode. All these occurrences are presented on the DIAG2 pin
(see Figure 2).
This unique feature is called non-dissipative short-circuit protection and it ensures a very
safe operation even in permanent overload conditions. Note that choosing the most
appropriate value for the T
interval (i.e. the value of the C
on
capacitor) a delay (the Ton
don
itself) prevents that misleading short-circuit information is presented on the DIAG2 output,
when driving capacitive loads (that acts as a short-circuit in the very beginning) or
incandescent lamp (a cold filament has a very low resistive value). The non-dissipative
short-circuit protection can be disabled (keeping T
limited to I
, and diagnostic disabled) simply shorting to ground the ON DELAY pin.
sc
= 0 but with the output current still
on
Doc ID 13678 Rev 39/16
Page 10
Electrical specificationsL6375D
2.9 Diagnostic logic
The operating conditions of the device are permanently monitored and the following
occurrences are signalled via the DIAG1/DIAG2 open drain output pins, see Tab l e 6 :
Diagnostic truth table.
●Short-circuit vs. ground
●Short-circuit vs. VS
●Undervoltage (UV)
●Overtemperature (OVT)
●Open load, if the output current is less than 3 mA (typical value).
2.10 Demagnetization of inductive loads
An internal Zener diode, limiting the voltage across the Power MOSFET to between 50 and
60 V (V
), provides safe and fast demagnetization of inductive loads without external
cl
clamping devices. The maximum energy that can be absorbed from an inductive load is
specified as 200 mJ (at T
= 85 °C).
J
2.11 Diagnostic truth table
Table 6.Diagnostic truth table
Diagnostic conditions Input Output Diag1 Diag2
Normal operation
Open load condition (I
Short to V
S
Short-circuit to ground (I
o
< I
O
)
old
= Isc)
(1)
(pin ON-DELAY grounded)
Output DMOS open
Overtemperature
Supply undervoltage (V
1. A cold lamp filament, or a capacitive load may activate the current limiting circuit of the IPS, when the IPS
is initially turned on.
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Doc ID 13678 Rev 313/16
Page 14
Package mechanical dataL6375D
Table 7.SO20 mechanical data
mminch
Dim.
Min.Typ.Max.Min.Typ.Max.
A 2.35 2.65 0.093 0.104
A1 0.1 0.3 0.004 0.012
B 0.33 0.51 0.013 0.020
C 0.23 0.32 0.009 0.013
D 12.6 13 0.496 0.512
E 7.4 7.6 0.291 0.299
e 1.27 0.050
H 10 10.65 0.394 0.419
h 0.25 0.75 0.010 0.030
L 0.4 1.27 0.016 0.050
K 0° (min.)8° (max.)
Figure 9.Package dimensions
14/16 Doc ID 13678 Rev 3
Page 15
L6375DRevision history
5 Revision history
Table 8.Document revision history
DateRevisionChanges
24-Jul-20071Initial release
29-Jun-20092Updated Table 5 on page 7
21-Dec-20113Updated Table 5 on page 7
Doc ID 13678 Rev 315/16
Page 16
L6375D
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