Page 1
three-axis digital output gyroscope for gaming and OIS
LGA-16
(4x4x1 mm)
Features
■ Three selectable full-scales (250/500/2000
dps) for gaming applications
■ ± 65 dps full-scale for OIS applications
■ Independent I
■ Embedded temperature sensor
■ Integrated low- and high-pass filters with user-
selectable bandwidth
■ Wide supply voltage range: 2.4 V to 3.6 V
■ Low voltage-compatible IOs (1.8 V)
■ Power-down and sleep mode for smart power
saving
■ Embedded FIFO (first-in first-out buffer)
■ ECOPACK
Applications
2
C and SPI digital interfaces
®
RoHS and “Green” compliant
L3G4IS
MEMS motion sensor:
Preliminary data
scale can be activated by powering two separate
pins, the internal ASIC blocks automatically detect
and enable the selected device configuration.
The unique sensing element is manufactured
using a dedicated micro-machining process
developed by STMicroelectronics to produce
inertial sensors and actuators on silicon wafers.
The L3G4IS is available in a plastic land grid array
(LGA) package and can operate within a
temperature range of -30 °C to +85 °C.
■ Gaming and virtual reality input devices
■ Optical image stabilization
■ Motion control and gesture recognition
■ GPS navigation systems
Description
The L3G4IS is the first three-axis MEMS
gyroscope that enables both user interface and
image stabilization applications at the same time.
Thanks to two different independent reading
chains and digital interfaces, the L3G4IS delivers
previously unseen levels of flexibility to the end
user.
Each reading chain and the corresponding full-
Table 1. Device summary
Order code Temperature range (°C) Package Packing
L3G4IS -30 to +85 LGA-16 (4x4x1) Tray
L3G4ISTR -30 to +85 LGA-16 (4x4x1) Tape and reel
December 2011 Doc ID 022612 Rev 1 1/24
This is preliminar y information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
www.st.com
24
Page 2
Contents L3G4IS
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Working mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 User interface mode specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 Image stabilization (OIS mode) specifications . . . . . . . . . . . . . . . . . . . 13
5.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.1 Power supply configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1.1 Configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1.2 Configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.1.3 Configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.1.4 Configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24 Doc ID 022612 Rev 1
Page 3
L3G4IS List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 5. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 6. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 7. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 8. Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 9. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 10. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 11. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 12. External components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 13. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Doc ID 022612 Rev 1 3/24
Page 4
List of figures L3G4IS
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. L3G4IS electrical connections and external component values . . . . . . . . . . . . . . . . . . . . . 16
Figure 4. L3G4IS power supply configuration 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5. L3G4IS power supply configuration 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 6. L3G4IS power supply configuration 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 7. L3G4IS power supply configuration 4 (case use) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 8. LGA-16: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4/24 Doc ID 022612 Rev 1
Page 5
L3G4IS Block diagram and pin description
AM10234V1
MEMS SENSOR
MUX
MUX
C -
converter
V
SC filter
ADC
Digital
filters
SPI
BW Selection
Actuation Interface
C -
converter
V
SC filter
ADC
Digital
filters
I2C
BW Selection
Actuation Interface
Full scale
Selection
FIFO
OIS Reading Chain
UI Reading Chain
AM10235v1
(TOP VIEW)
DIRECTIONS OF THE
DETECTABLE
ANGULAR RATES
X
Vdd_IO_SPI
SCL
SDA
GND
CS_OIS
SCL_OIS
SDI/SDO_OIS
Res
INT
DRDY
Res
Res
Cap
HAVdd
AVdd
Reg
1
8
12
5
49
13 16
+ Ω
Z
+Ω
X
BOTTOM
VIEW
+Ω
Y
1 Block diagram and pin description
Figure 1. Block diagram
1.1 Pin description
Figure 2. Pin connection
Doc ID 022612 Rev 1 5/24
Page 6
Block diagram and pin description L3G4IS
Table 2. Pin description
Pin# Name Function
1 Vdd_IO_SPI Power supply for I/O pins of the PSPI interface
2SCLI
3SDAI
4 GND 0 V power supply
5 Reserved Leave unconnected
6 DRDY Data ready signal (open drain pad)
7 INT Programmable interrupt (open drain pad)
8 Reserved Leave unconnected
9 Reserved Leave unconnected
10 SDI/SDO_OIS Data-in, data-out line for SPI interface
11 SCL_OIS Clock line for SPI interface
12 CS_OIS SPI chip select line
13 Reg Capacitance connection pin for internal regulator
2
C serial clock (SCL)
2
C serial data (SDA)
14 Cap Capacitance connection pin for internal charge pump
15 HAVdd Power supply for OIS mode
16 AVdd Power supply for user interface mode
6/24 Doc ID 022612 Rev 1
Page 7
L3G4IS Terminology
2 Terminology
2.1 Sensitivity
An angular rate gyroscope is a device that produces a positive-going digital output for
counter-clockwise rotation around the sensitive axis considered. Sensitivity describes the
gain of the sensor and can be determined by applying a defined angular velocity to it. This
value changes very little over temperature and time.
2.2 Zero-rate level
Zero-rate level describes the actual output signal if there is no angular rate present. The
zero-rate level of precise MEMS sensors is, to some extent, a result of stress to the sensor
and therefore the zero-rate level can slightly change after mounting the sensor onto a
printed circuit board or after exposing it to extensive mechanical stress. This value changes
very little over temperature and time.
Doc ID 022612 Rev 1 7/24
Page 8
Working mode selection L3G4IS
3 Working mode selection
The L3G4IS can be used for user interface and image stabilization applications. Depending
on the power supply provided and dedicated internal bits configuration, the L3G4IS is able
to keep both reading chains active allowing the user to exploit the advantages of high
resolution on low full-scale and low current consumption on high full-scale at the same time
through SPI and I
Table 3. Operating mode
AVdd AVdd_OIS Operating mode I2C interface SPI interface
OFF OFF Gyro off Not available Not available
ON OFF UI
2
C digital interfaces.
Read/Write UI
registers
Not available
OFF ON OIS Not available
ON ON OIS/UI
Read/Write UI
registers
Read/Write OIS
registers
Read/Write OIS
registers
When either AVdd or HAVdd are removed they must be connected to GND for proper
working of the device.
8/24 Doc ID 022612 Rev 1
Page 9
L3G4IS User interface mode specifications
4 User interface mode specifications
4.1 Mechanical characteristics
@ AVdd = 2.8 V, T = 25 °C unless otherwise noted
Table 4. Mechanical characteristics
Symbol Parameter Test condition Min. Typ.
FS Measurement range User selectable
So Sensitivity
SoDr
DVoff Digital zero-rate level
OffDr
NL Non linearity
Rn Rate noise density 0.015
Sensitivity change vs.
temperature
Zero-rate level change
vs. temperature
(2)
FS = 250 dps 8.75
FS = 2000 dps 70
From -30 °C to +85 °C
Delta from T = 25 °C
FS = 250 dps ±25
FS = 2000 dps ±25
FS = 250 dps ±0.03 dps/°C
FS = 2000 dps ±0.04 dps/°C
Best fit straight line 0.2 % FS
(a)
.
(1)
±250
±2000
±2 %
Max. Unit
dps±500
mdps/digitFS = 500 dps 17.50
dpsFS = 500 dps ±25
BW System bandwidth 140 Hz
Ton Turn-on time
ODR Digital output data rate
Top
1. Typical specifications are not guaranteed.
2. Guaranteed by design.
Operating temperature
range
a. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 5.
From power-down to
normal mode
60 ms
95/190/
380/760
-30 +85 °C
Hz
Doc ID 022612 Rev 1 9/24
Page 10
User interface mode specifications L3G4IS
4.2 Electrical characteristics
@ AVdd = 2.8 V, T = 25 °C unless otherwise noted
Table 5. Electrical characteristics
Symbol Parameter Test condition Min. Typ.
AVdd Supply voltage 2.42 2.8 3.6 V
Vdd_IO_UI
VddI2Cbus
Supply voltage for UI
digital pins
Supply voltage I
bus
Idd Supply current 6 mA
IddSL
Supply current in
sleep mode
(2)
Internal voltage
reference
Allowed supply
2
C
voltage for UI I
bus
Selectable by digital
interface
2
C
(b)
.
(1)
Max. Unit
1.62 1.8 1.98 V
1.62 1.8 1.98 V
3.2 mA
IddPdn
VIH
VIL
VOH
VOL
Top
1. Typical specifications are not guaranteed.
2. Sleep mode introduces a faster turn-on time related to power-down mode.
Supply current in
power-down mode
Digital high level
input voltage
Digital low level
input voltage
Digital high level
output voltage
Digital low level
output voltage
Operating
temperature range
Selectable by digital
interface
0.7*Vdd_IO_UI Vdd_IO_UI Vdd_IO_UI + 0.3 V
-0.3 0 0.3*Vdd_IO_UI V
INT/DRDY signals 0.65*Vdd_IO_UI Vdd_IO_UI Vdd_IO_UI + 0.3 V
INT/DRDY signals -0.3 0 0.35*Vdd_IO_UI V
-30 +85 °C
20 µA
b. The product is factory calibrated at 3.3 V.
10/24 Doc ID 022612 Rev 1
Page 11
L3G4IS User interface mode specifications
4.3 Temperature sensor characteristics
@ AVdd = 2.8 V, T = 25 °C unless otherwise noted
Table 6. Electrical characteristics
Symbol Parameter Test condition Min. Typ.
Temperature sensor
TSDr
TODR Temperature refresh rate 1 Hz
To p
1. Typical specifications are not guaranteed.
output change vs.
temperature
-
Operating temperature
range
(c)
.
(1)
-1 °C/digit
-30 +85 °C
Max. Unit
4.4 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7. Absolute maximum ratings
Symbol Ratings Maximum value Unit
AVdd Supply voltage -0.3 to 4.8 V
HAVdd Supply voltage -0.3 to 4.8 V
Vdd_IO_SPI Vdd IO SPI interface -0.3 to HAVdd +0.1 V
Vin(UI)
Vin(OIS)
T
STG
Sg Acceleration g for 0.1 ms 10,000 g
ESD Electrostatic discharge protection
1. Supply voltage on any pin should never exceed 4.8 V.
Input voltage on:
(SCL, SDA, INT, DRDY)
Input voltage on:
(CS_OIS, SDI/SDO_OIS, SCL_OIS)
Storage temperature range -40 to +125 °C
(1)
-0.3 to AVdd +0.1 V
-0.3 to Vdd_IO_SPI
+0.1
2 (HBM) kV
1.5 (CDM) kV
200 (MM) V
V
c. The product is factory calibrated at 3.3 V.
Doc ID 022612 Rev 1 11/24
Page 12
User interface mode specifications L3G4IS
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
12/24 Doc ID 022612 Rev 1
Page 13
L3G4IS Image stabilization (OIS mode) specifications
5 Image stabilization (OIS mode) specifications
5.1 Mechanical characteristics
@ HAVdd = 3.3 V, T = 25 °C unless otherwise noted
Table 8. Mechanical characteristics
Symbol Parameter Test condition Min. Typ.
FS Measurement range ±65 dps
So Sensitivity ±225 LSb/dps
SoDr
DVoff Digital zero-rate level
OffDr
Sensitivity change vs.
temperature
Zero-rate level change
vs. temperature
NL Non linearity
(2)
Rn Rate noise density
From -30 °C to +85 °C ±5 %
High pass filter disabled ±75
High pass filter enabled ±20
High pass filter disabled ±25
High pass filter enabled ±10
Best fit straight line ±1 % FS
(2)
(d)
.
(1)
0.008
Max. Unit
dps
dps
BW Internal bandwidth LPF0 set to ‘1’ 370 Hz
PhDl Phase delay
At 20 Hz (370 Hz BW
selected)
4.5 deg
ODR Digital output data rate 9.5 kHz
Top
1. Typical specifications are not guaranteed.
2. Guaranteed by design.
Operating temperature
range
-30 +85 °C
d. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 5.
Doc ID 022612 Rev 1 13/24
Page 14
Image stabilization (OIS mode) specifications L3G4IS
5.2 Electrical characteristics
@ HAVdd = 3.3 V, T = 25 °C unless otherwise noted
Table 9. Electrical characteristics
Symbol Parameter Test condition Min. Typ.
HAVdd Supply voltage 3.0 3.3 3.6 V
Vdd_IO_SPI I/O pins supply voltage
Idd Supply current OIS and UI modes active 10 mA
IddSL
Supply current in sleep
(3)
mode
(2)
Selectable by digital
interface
(e)
1.71
.
(1)
3.2 mA
Max. Unit
HAVdd+0
.1
V
IddPdn
VIH
VIL
To p
1. Typical specifications are not guaranteed.
2. It is possible to remove HAVdd maintaining Vdd_IO_SPI without blocking the communication busses, in this condition the
measurement chain is powered off.
3. Sleep mode introduces a faster turn-on time related to power-down mode.
Supply current in powerdown mode
Digital high level input
voltage
Digital low level input
voltage
Operating temperature
range
Selectable by digital
interface
20 μA
0.8*Vdd_I
O_SPI
0.2*Vdd_I
O_SPI
-30 +85 °C
5.3 Temperature sensor characteristics
@ HAVdd = 3.3 V, T = 25 °C unless otherwise noted
Table 10. Electrical characteristics
Symbol Parameter Test condition Min. Typ.
Temperature sensor
TSDr
TODR Temperature refresh rate 1 Hz
To p
output change vs.
temperature
-
Operating temperature
range
(f)
.
(1)
Max. Unit
-1 °C/digit
-30 +85 °C
V
V
1. Typical specifications are not guaranteed.
e. The product is factory calibrated at 3.3 V.
f. The product is factory calibrated at 3.3 V.
14/24 Doc ID 022612 Rev 1
Page 15
L3G4IS Image stabilization (OIS mode) specifications
This is a mechanical shock sensitive device, improper handling can cause permanent
damage to the part.
This is an ESD sensitive device, improper handling can cause permanent damage to
the part.
5.4 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 11. Absolute maximum ratings
Symbol Ratings Maximum value Unit
AVdd Supply voltage -0.3 to 4.8 V
HAVdd Supply voltage -0.3 to 4.8 V
(1)
Vdd_IO_
SPI
Vin(UI)
Vin(OIS)
T
Vdd IO SPI interface -0.3 to HAVdd +0.1 V
Input voltage on:
(SCL, SDA, INT, DRDY)
Input voltage on:
(CS_OIS, SDI/SDO_OIS, SCL_OIS)
Storage temperature range -40 to +125 °C
STG
-0.3 to AVdd +0.1 V
-0.3 to Vdd_IO_SPI
+0.1
Sg Acceleration g for 0.1 ms 10,000 g
2 (HBM) kV
ESD Electrostatic discharge protection
1.5 (CDM) kV
200 (MM) V
1. Supply voltage on any pin should never exceed 4.8 V.
V
Doc ID 022612 Rev 1 15/24
Page 16
Application hints L3G4IS
AVd d
GND
C6
GND
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
INT
(TOP VIEW)
DIRECTIONS OF THE
DETECTABLE
ANGULAR RATES
X
+Ω
Z
+Ω
X
+Ω
Y
Rpu = 10kOhm
Rpu
SCL
SDA
Pull-up to be added on I2C lines
14
GND
SCL_OIS
CS_OIS
SDI/SDO_OIS
Res Res
Res
RegC5Cap
C1C2
C4
C3
HAVdd
HAVdd
VddI2Cbus
Rpu = 10kOhm
Rpu
INT
DRDY
Pull-up to be added on INT and DRDY signals
VddI2Cbus
AM10236V1
6 Application hints
Figure 3. L3G4IS electrical connections and external component values
Table 12. External components
16/24 Doc ID 022612 Rev 1
1. This value must guarantee a minimum of 1 nF value under 11 V bias condition.
Type description Value Purpose
C1 = C3 1 µF Decoupling
C2 = C4 100 pF Decoupling
(1)
C5
C6 220 nF (5 V class) Internal regulator
Rpu 10 kΩ
10 nF (25 V class) Charge pump
Page 17
L3G4IS Application hints
Power supply decoupling capacitors (100 pF + 1 µF) should be placed as near as possible
to the device (common design practice). Pull-up resistors must be added to I
2
C SDA and
SCL lines and to INT and DRDY lines.
Doc ID 022612 Rev 1 17/24
Page 18
Application hints L3G4IS
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
INT
Rpu = 10kOhm
Rpu
SCL
SDA
Pull-up to be added on I2C lines
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
Res Res
Res
Reg
Cap
HAVdd
AVdd HAVdd
Rpu = 10kOhm
Rpu
INT
DRDY
VddI2Cbus
VddI2Cbus
AM10237v1
6.1 Power supply configurations
The L3G4IS can be powered according to several different configurations, as reported in
Section 3. Depending on the particular power supply provided, either the user interface or
image stabilization modes are activated. The presence of a certain power supply
determines also which digital interface is available. In Figure 4 three possible power supply
configurations are reported to further explain the high level of flexibility allowed by the
component. It should be noted that when AVdd and HAVdd are removed they must be
connected to GND for proper working of the device.
6.1.1 Configuration 1
Figure 4. L3G4IS power supply configuration 1
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
18/24 Doc ID 022612 Rev 1
where:
● AVdd is ON
● HAVdd is ON
● UI and OIS modes enabled
2
● I
C (SCL/SDA) is supplied by AVdd)
● DRDY/INT are supplied by AVdd
● Vdd_IO_SPI can be connected to any voltage in the range of 1.71 V to HAVdd.
connections and external component values.
Page 19
L3G4IS Application hints
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
Res Res
Res
Reg
Cap
HAVdd
HAVddGND
INT
AM10238v1
SCL
DRDY
GND
SDA
Vdd_IO_SPI
AVdd
1
8
12
5
49
1316
TOP
VIEW
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
Res Res
Res
Reg
Cap
HAVdd
HAVdd
AVdd
INT
Rpu = 10kOhm
Rpu
SCL
SDA
Pull-up to be added on I2C lines
VddI2Cbus
Rpu = 10kOhm
Rpu
INT
DRDY
Pull-up to be added on INT and DRDY signals
VddI2Cbus
AM10239v1
6.1.2 Configuration 2
Figure 5. L3G4IS power supply configuration 2
where:
● AVdd is OFF
● HAVdd is ON
● OIS mode enabled
2
● I
C (SCL/SDA) is not available
● Vdd_IO_SPI has been shorted to HAVdd: SPI is now powered by HAVdd.
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
6.1.3 Configuration 3
Figure 6. L3G4IS power supply configuration 3
Doc ID 022612 Rev 1 19/24
Page 20
Application hints L3G4IS
SCL
DRDY
GND
SDA
AVdd
1
8
12
5
49
1316
TOP
VIEW
14
SCL_OIS
CS_OIS
SDI/SDO_OIS
Res Res
Res
Reg
Cap
HAVdd
HAVdd
AVdd
INT
GYRO
OIS
CONTROLLER
Rpu = 10kOhm
Rpu
HOST
UI
Rpu = 10kOhm
Rpu
VddI2Cbus
VddI2Cbus
AM10240v1
where:
● AVdd is ON
● HAVdd is ON
● OIS mode enabled
● UI mode enabled
2
● I
C (SCL/SDA) is available (internally powered at 1.8 ± 10%
● DRDY/INT are available
● Vdd_IO_SPI has been shorted to HAVdd: SPI is now powered by HAVdd.
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
6.1.4 Configuration 4 (case use)
Figure 7. L3G4IS power supply configuration 4 (case use)
Note: For complete external component placement please refer to Figure 3: L3G4IS electrical
connections and external component values.
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Page 21
L3G4IS Soldering information
7 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems
.
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Page 22
Package information L3G4IS
Dimensions
Ref.
mm inch
Min. Typ. Max. Min. Typ. Max.
A1 1.000 0.0394
A2 0.7850.0309
A3 0.200 0.0079
d0.300 0.0118
D1 3.850 4.000 4.150 0.1516 0.1575 0.1634
E1 3 .8 50 4.000 4.150 0.1516 0.1575 0.1634
L2 1.950 0.0768
M 0.100 0.0039
N1 0.650 0.0256
N2 0.975 0.0384
P1 1.750 0.0689
P2 1.525 0.0600
T1 0.400 0.0157
T2 0.300 0.0118
k 0.050 0.0020
LGA-16 (4x4x1mm)
Land Grid Array Package
Outline and
8125097_A
mechanical data
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 8. LGA-16: mechanical data and package dimensions
packages, depending on their level of environmental compliance. ECOPACK
22/24 Doc ID 022612 Rev 1
Page 23
L3G4IS Revision history
9 Revision history
Table 13. Document revision history
Date Revision Changes
22-Dec-2011 1 Initial release.
Doc ID 022612 Rev 1 23/24
Page 24
L3G4IS
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