Page 1
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D239
KTY81-1 series
Silicon temperature sensors
Product specification
Supersedes data of 1998 Mar 26
2000 Aug 25
Page 2
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
DESCRIPTION
The temperature sensors in the KTY81-1 series have a
positive temperature coefficient of resistance and are
suitable foruse in measurement and control systems. The
sensors are encapsulated in the SOD70 leaded plastic
package.
Tolerances of 0.5% or other special selections are
available on request.
MARKING
TYPE NUMBER CODE
KTY81-110 110
KTY81-120 120
KTY81-121 121
KTY81-122 122
KTY81-150 150
KTY81-151 151
KTY81-152 152
QUICK REFERENCE DATA
PINNING
PIN DESCRIPTION
1 electrical contact
2 electrical contact
3 not to be connected to a potential
handbook, halfpage
3
Fig.1 Simplified outline (SOD70).
1
2
MBH739
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
R
25
sensor resistance T
amb
=25°C; I
cont
=1mA
KTY81-110 990 1010 Ω
KTY81-120 980 1020 Ω
KTY81-121 980 1000 Ω
KTY81-122 1000 1020 Ω
KTY81-150 950 1050 Ω
KTY81-151 950 1000 Ω
KTY81-152 1000 1050 Ω
T
amb
ambient operating
−55 +150 °C
temperature
2000 Aug 25 2
Page 3
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
I
cont
T
amb
CHARACTERISTICS
T
=25°C, in liquid, unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
25
TC temperature coefficient − 0.79 − %/K
R
100/R25
R
−55/R25
τ thermal time constant; note 1 in still air − 30 − s
continuous sensor current in free air; T
in free air; T
=25°C − 10 mA
amb
= 150 °C − 2mA
amb
ambient operating temperature −55 +150 °C
sensor resistance I
cont
=1mA
KTY81-110 990 − 1010 Ω
KTY81-120 980 − 1020 Ω
KTY81-121 980 − 1000 Ω
KTY81-122 1000 − 1020 Ω
KTY81-150 950 − 1050 Ω
KTY81-151 950 − 1000 Ω
KTY81-152 1000 − 1050 Ω
resistance ratio T
resistance ratio T
= 100 °C and 25 °C 1.676 1.696 1.716
amb
= −55 °C and 25 °C 0.480 0.490 0.500
amb
in still liquid; note 2 − 5 − s
in flowing liquid; note 2 − 3 − s
rated temperature range −55 − +150 °C
Notes
1. The thermal time constant is the time taken for the sensor to reach 63.2% of the total temperature difference. For
example, if asensor with a temperature of25 °C ismoved to an environment withan ambient temperature of 100 °C,
the time for the sensor to reach a temperature of 47.4 °C is the thermal time constant.
2. Inert liquid, e.g. FC43 manufactured by the 3M company.
2000 Aug 25 3
Page 4
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
Table 1 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-110 and KTY81-120
I
= 1 mA.
cont
AMBIENT
TEMPERATURE
(°C) (°F) (%/K)
−55 −67 0.99 475 490 505 ±3.02 470 490 510 ±4.02
−50 −58 0.98 500 515 530 ±2.92 495 515 535 ±3.94
−40 −40 0.96 552 567 582 ±2.74 547 567 588 ±3.78
−30 −22 0.93 609 624 638 ±2.55 603 624 645 ±3.62
−20 −4 0.91 669 684 698 ±2.35 662 684 705 ±3.45
−10 14 0.88 733 747 761 ±2.14 726 747 769 ±3.27
0 32 0.85 802 815 828 ±1.91 793 815 836 ±3.08
10 50 0.83 874 886 898 ±1.67 865 886 907 ±2.88
20 68 0.80 950 961 972 ±1.41 941 961 982 ±2.66
25 77 0.79 990 1000 1010 ±1.27 980 1000 1020 ±2.54
30 86 0.78 1029 1040 1051 ±1.39 1018 1040 1061 ±2.68
40 104 0.75 1108 1122 1136 ±1.64 1097 1122 1147 ±2.97
50 122 0.73 1192 1209 1225 ±1.91 1180 1209 1237 ±3.28
60 140 0.71 1278 1299 1319 ±2.19 1265 1299 1332 ±3.61
70 158 0.69 1369 1392 1416 ±2.49 1355 1392 1430 ±3.94
80 176 0.67 1462 1490 1518 ±2.8 1447 1490 1532 ±4.3
90 194 0.65 1559 1591 1623 ±3.12 1543 1591 1639 ±4.66
100 212 0.63 1659 1696 1733 ±3.46 1642 1696 1750 ±5.05
110 230 0.61 1762 1805 1847 ±3.83 1744 1805 1865 ±5.48
120 248 0.58 1867 1915 1963 ±4.33 1848 1915 1982 ±6.07
125 257 0.55 1919 1970 2020 ±4.66 1899 1970 2040 ±6.47
130 266 0.52 1970 2023 2077 ±5.07 1950 2023 2097 ±6.98
140 284 0.45 2065 2124 2184 ±6.28 2043 2124 2205 ±8.51
150 302 0.35 2145 2211 2277 ±8.55 2123 2211 2299 ±11.43
TEMP.
COEFF.
KTY81-110 KTY81-120
RESISTANCE
(Ω)
MIN. TYP. MAX. MIN. TYP. MAX.
TEMP.
ERROR
(K)
RESISTANCE
(Ω)
TEMP.
ERROR
(K)
2000 Aug 25 4
Page 5
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
Table 2 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-121 and KTY81-122
I
= 1 mA.
cont
AMBIENT
TEMPERATURE
(°C) (°F) (%/K)
−55 −67 0.99 471 485 500 ±3.02 480 495 510 ±3.02
−50 −58 0.98 495 510 524 ±2.92 505 520 535 ±2.92
−40 −40 0.96 547 562 576 ±2.74 558 573 588 ±2.74
−30 −22 0.93 603 617 632 ±2.55 615 630 645 ±2.55
−20 −4 0.91 662 677 691 ±2.35 676 690 705 ±2.35
−10 14 0.88 726 740 754 ±2.14 741 755 769 ±2.14
0 32 0.85 794 807 820 ±1.91 810 823 836 ±1.91
10 50 0.83 865 877 889 ±1.67 883 895 907 ±1.67
20 68 0.80 941 951 962 ±1.41 960 971 982 ±1.41
25 77 0.79 980 990 1000 ±1.27 1000 1010 1020 ±1.27
30 86 0.78 1018 1029 1041 ±1.39 1039 1050 1062 ±1.39
40 104 0.75 1097 1111 1125 ±1.64 1120 1134 1148 ±1.64
50 122 0.73 1180 1196 1213 ±1.91 1204 1221 1238 ±1.91
60 140 0.71 1266 1286 1305 ±2.19 1291 1312 1332 ±2.19
70 158 0.69 1355 1378 1402 ±2.49 1382 1406 1430 ±2.49
80 176 0.67 1447 1475 1502 ±2.8 1477 1505 1533 ±2.8
90 194 0.65 1543 1575 1607 ±3.12 1574 1607 1639 ±3.12
100 212 0.63 1642 1679 1716 ±3.46 1676 1713 1750 ±3.46
110 230 0.61 1745 1786 1828 ±3.83 1780 1823 1865 ±3.83
120 248 0.58 1849 1896 1943 ±4.33 1886 1934 1982 ±4.33
125 257 0.55 1900 1950 2000 ±4.66 1938 1989 2041 ±4.66
130 266 0.52 1950 2003 2056 ±5.07 1989 2044 2098 ±5.07
140 284 0.45 2044 2103 2162 ±6.28 2085 2146 2206 ±6.28
150 302 0.35 2124 2189 2254 ±8.55 2167 2233 2299 ±8.55
TEMP.
COEFF.
KTY81-121 KTY81-122
RESISTANCE
(Ω)
MIN. TYP. MAX. MIN. TYP. MAX.
TEMP.
ERROR
(K)
RESISTANCE
(Ω)
TEMP.
ERROR
(K)
2000 Aug 25 5
Page 6
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
Table 3 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-150 and KTY81-151
I
= 1 mA.
cont
AMBIENT
TEMPERATURE
(°C) (°F) (%/K)
−55 −67 0.99 456 490 524 ±7.04 456 478 499 ±4.52
−50 −58 0.98 479 515 550 ±6.99 480 502 524 ±4.45
−40 −40 0.96 530 567 605 ±6.91 530 553 576 ±4.3
−30 −22 0.93 584 624 663 ±6.84 584 608 632 ±4.16
−20 −4 0.91 642 684 725 ±6.77 642 667 691 ±4.01
−10 14 0.88 703 747 791 ±6.69 704 729 753 ±3.84
0 32 0.85 769 815 861 ±6.61 770 794 819 ±3.67
10 50 0.83 838 886 934 ±6.51 839 864 889 ±3.48
20 68 0.80 912 961 1010 ±6.41 912 937 962 ±3.28
25 77 0.79 950 1000 1050 ±6.35 950 975 1000 ±3.18
30 86 0.78 987 1040 1093 ±6.55 988 1014 1040 ±3.33
40 104 0.75 1064 1122 1181 ±6.97 1064 1094 1124 ±3.64
50 122 0.73 1143 1209 1274 ±7.4 1144 1178 1212 ±3.97
60 140 0.71 1226 1299 1371 ±7.85 1227 1266 1305 ±4.31
70 158 0.69 1313 1392 1472 ±8.31 1314 1357 1401 ±4.67
80 176 0.67 1402 1490 1577 ±8.79 1404 1453 1501 ±5.05
90 194 0.65 1495 1591 1687 ±9.29 1497 1551 1606 ±5.43
100 212 0.63 1591 1696 1801 ±9.81 1593 1654 1714 ±5.84
110 230 0.61 1690 1805 1919 ±10.4 1692 1759 1827 ±6.3
120 248 0.58 1791 1915 2039 ±11.28 1792 1867 1942 ±6.94
125 257 0.55 1840 1970 2099 ±11.91 1842 1920 1999 ±7.38
130 266 0.52 1889 2023 2158 ±12.72 1891 1973 2055 ±7.94
140 284 0.45 1980 2124 2269 ±15.21 1982 2071 2161 ±9.63
150 302 0.35 2057 2211 2365 ±20.09 2059 2156 2252 ±12.88
TEMP.
COEFF.
KTY81-150 KTY81-151
RESISTANCE
(Ω)
MIN. TYP. MAX. MIN. TYP. MAX.
TEMP.
ERROR
(K)
RESISTANCE
(Ω)
TEMP.
ERROR
(K)
2000 Aug 25 6
Page 7
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
Table 4 Ambient temperature, corresponding resistance, temperature coefficient and maximum expected temperature
error for KTY81-152
I
= 1 mA.
cont
AMBIENT
TEMPERATURE
RESISTANCE
(°C) (°F) (%/K)
MIN. TYP. MAX.
−55 −67 0.99 480 502 525 ±4.52
−50 −58 0.98 505 528 551 ±4.45
−40 −40 0.96 558 582 606 ±4.3
−30 −22 0.93 614 639 664 ±4.16
−20 −4 0.91 675 701 726 ±4.01
−10 14 0.88 740 766 792 ±3.84
0 32 0.85 809 835 861 ±3.67
10 50 0.83 882 908 934 ±3.48
20 68 0.80 959 985 1011 ±3.28
25 77 0.79 1000 1025 1050 ±3.18
30 86 0.78 1038 1066 1093 ±3.33
40 104 0.75 1119 1150 1182 ±3.64
50 122 0.73 1203 1239 1275 ±3.97
60 140 0.71 1290 1331 1372 ±4.31
70 158 0.69 1381 1427 1473 ±4.67
80 176 0.67 1476 1527 1578 ±5.05
90 194 0.65 1573 1631 1688 ±5.43
100 212 0.63 1674 1738 1802 ±5.84
110 230 0.61 1779 1850 1921 ±6.3
120 248 0.58 1884 1963 2041 ±6.94
125 257 0.55 1937 2019 2101 ±7.38
130 266 0.52 1988 2074 2160 ±7.94
140 284 0.45 2084 2178 2271 ±9.63
150 302 0.35 2165 2266 2367 ±12.88
KTY81-152
(Ω)
TEMP.
ERROR
(K)
2000 Aug 25 7
Page 8
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
T
-121
-122
amb
MGG696
(°C)
15
handbook, halfpage
∆T
(K)
10
5
0
−5
−10
−15
KTY81-151
-152
KTY81-120
KTY81-110
−50 150
0 50 100
Fig.2 Maximum expected temperature error (∆T).
T
MSA923
amb
(°C)
2.4
handbook, halfpage
R
(kΩ)
1.6
0.8
0
−100 −50 0
I
= 1 mA.
cont
50 100 150 200
Fig.3 Sensor resistance as a function of ambient
temperature; average values.
handbook, halfpage
3
R
(kΩ)
2
1
0
−1
10
To keep the temperature error low, an operating current of
= 1 mA is recommended for temperatures above 100 °C.
I
cont
150 °C
125 °C
100 °C
75 °C
50 °C
25 °C
0 °C
−25 °C
−50 °C
110
I
cont
MGG699
(mA)
Fig.4 Sensorresistanceasafunctionofoperating
current.
12
handbook, halfpage
I
cont
(mA)
8
4
0
−50 0 50 150
100
T
Fig.5 Maximum operating current for safe
operation.
amb
MGG705
(°C)
2000 Aug 25 8
Page 9
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
(mA)
MGG704
2
20
handbook, halfpage
∆R
(Ω)
10
0
−10
01
T
=25°C.
amb
I
cont
Fig.6 Deviationof sensor resistanceas a function
of operating current in still liquid.
APPLICATION INFORMATION
SYMBOL PARAMETER CONDITIONS TYP. UNIT
∆R
25
drift of sensor resistance at 25 °C 10000 hours continuous operation;
T
= 150 °C
amb
1.6 Ω
2000 Aug 25 9
Page 10
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
PACKAGING
Sensors in SOD70 encapsulation are delivered in bulk packaging and also in reelpackaging for automatic placement on
hybrid circuits and printed-circuit boards (see Figs 7 and 8).
Note: Types in bulk packaging have a lead-to-lead distance of 2.54 millimetres. The lead-to-lead distance of types
packaged on reel is 5.08 millimetres for spread lead types and 2.54 millimetres for straight lead types.
handbook, full pagewidth
H
1
H
0
P
A
1
A
H
2
L
F
12
P
2
F
F
P
0
D
0
(p)
W
2
W
0
W
1
W
MBH795
T
∆h∆h
t
1
t
Fig.7 Configuration of bandolier: spread leads.
2000 Aug 25 10
Page 11
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
handbook, full pagewidth
H
1
H
0
P
A
1
A
H
2
L
F
12
P
2
F
F
P
0
D
0
(p)
W
2
W
0
W
MBL214
1
W
T
∆h ∆h
t
1
t
Fig.8 Configuration of bandolier: straight leads.
2000 Aug 25 11
Page 12
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
Table 5 Tape specification
SYMBOL DIMENSION
REMARKS
MIN. NOM. MAX. TOL. UNIT
SPECIFICATIONS
A
1
body width 4.4 − 4.8 − mm
A body height 5 − 5.2 − mm
T body thickness 3.6 − 4.2 − mm
P pitch of component − 12.7 −±1mm
P
0
feed hole pitch − 12.7 −±0.3 mm
cumulative pitch error −−−±0.1 note 1
P
2
feedhole centre to component
centre
− 6.35 −±0.4 mm to be measured at bottom
of clinch
F lead-to-lead distance
spread leads − 5.08 − +0.6/−0.2 mm
straight leads − 2.54 − +0.6/−0.2 mm
∆h component alignment − 01− mm at top of body
W tape width − 18 −±0.5 mm
W
W
W
H
H
0
1
2
0
1
hold-down tape width − 6 −±0.2 mm
hole position − 9 − +0.7/−0.5 mm
hold-down tape position − 0.5 −±0.2 mm
lead wire clinch height − 16.5 −±0.5 mm
component height −−23.25 − mm
L length of snipped leads −−11 − mm
D
0
t total tape thickness −−1.2 − mm t
F
, F
1
feed hole diameter − 4 −±0.2 mm
lead to snipped lead distance
2
= 0.3 to 0.6
1
spread leads − 2.54 − +0.4/−0.2 mm
straight leads − 1.27 − +0.4/−0.2 mm
H
2
clinch height − 2.5 − +0.5/0 mm
(p) pull-out force 6 −−− N
Note
1. Measured over 20 devices.
2000 Aug 25 12
Page 13
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
PACKAGE OUTLINE
Plastic near cylindrical single-ended package; 2 in-line leads SOD70
c
E
d
A L
1
D
2
b
1
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
mm
OUTLINE
VERSION
SOD70
A
5.2
5.0
b
0.48
0.40
b
c
D
d
1
0.66
0.45
0.40
4.8
4.4
0.56
IEC JEDEC EIAJ
E
1.7
4.2
1.4
3.6
REFERENCES
e
2.54
L
14.5
12.7
(1)
L
1
max.
2.5
L
2
L
1
L
2
0.7
0.5
EUROPEAN
PROJECTION
b
e
ISSUE DATE
98-05-25
2000 Aug 25 13
Page 14
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
DATA SHEET STATUS
DATA SHEET STATUS
Objective specification Development This data sheet contains the design target or goal specifications for
Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be
Product specification Production This data sheet contains final specifications. Philips Semiconductors
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at anyotherconditions above those giveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty that such applicationswillbe
suitable for the specified use without further testing or
modification.
PRODUCT
STATUS
DEFINITIONS
product development. Specification may change in any manner without
notice.
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto result inpersonal injury. Philips
Semiconductorscustomersusing or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseof any of theseproducts,conveysno licence or title
under any patent, copyright, or mask work right to these
products,and makes no representationsor warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
(1)
2000 Aug 25 14
Page 15
Philips Semiconductors Product specification
Silicon temperature sensors KTY81-1 series
NOTES
2000 Aug 25 15
Page 16
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South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
70
Printed in The Netherlands 613520/03/pp16 Date of release: 2000 Aug 25 Document order number: 9397 750 07226
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