Datasheet kmz52 DATASHEETS (Philips)

DISCRETE SEMICONDUCTORS

DATA SH EET

M3D396

KMZ52

Magnetic Field Sensor

Product specification 2000 Jun 09

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

FEATURES

• High sensitivity

• Integrated compensation coil

• Integrated set/reset coil.

APPLICATIONS

• Navigation

• Current and earth magnetic field measurement

• Traffic detection.

DESCRIPTION

The KMZ52 is an extremely sensitive magnetic field
sensor, employing the magnetoresistive effect of thin-film
permalloy. The sensor contains two magnetoresistive
Wheatstone bridges physicallyoffset from one another by
90° and integrated compensation and set/reset coils. The
integrated compensation coils allow magnetic field
measurement with current feedback loops to generate
outputs that are independent of drift in sensitivity. The
orientationofsensitivitymaybesetorchanged(flipped)by
means of the integrated set/reset coils. A short current
pulse should be applied to the compensation coils to
recover(set)thesensorafterexposuretostrongdisturbing
magnetic fields. A negative current pulse will reset the
sensor to reversed sensitivity. By use of periodically
alternated flipping pulses and a lock-in amplifier, the
output is made independent of sensor and amplifier offset.

PINNING

SYMBOL PIN DESCRIPTION

+I
V

flip2

CC2

1 flip coil

2 bridge supply voltage
GND2 3 ground
+I

comp2

4 compensation coil
GND1 5 ground
+I

comp1

−I

comp1

−V

O1

+V

O1

−I

flip1

+I

flip1

V

CC1

−I

comp2

−V

O2

+V

O2

−I

flip2

16

handbook, halfpage

6 compensation coil

7 compensation coil

8 bridge output voltage

9 bridge output voltage

10 flip coil
11 flip coil
12 bridge supply voltage
13 compensation coil
14 bridge output voltage
15 bridge output voltage
16 flip coil

9

2000 Jun 09 2

pin 1 index

1

Fig.1 Simplified outline SOT109-1.

8

MBL201

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

S sensitivity (uncompensated) 12 16 −

V

offset

R

bridge

R

comp

A

comp

R

flip

I

flip

t

flip

Notes

1. The compensation coil generates a field H
become zero if H

2. Average power consumption of the flipping coil, defined by current, pulse duration and pulse repetition rate may not
exceed the specified limit, see Chapter “Limiting values”.

bridge supply voltage − 58V

mV/V

-------------­kA/m

offset voltage per supply voltage −1.5 0 +1.5 mV/V
bridge resistance 123kΩ
compensation coil resistance 100 170 300 Ω
field factor of compensation coil; note 1 19 22 25

A/m

---------­mA

resistance of set/reset coil 1 2 3 Ω
recommended flipping current for stable operation; note 2 ±800 ±1000 ±1200 mA
flip pulse duration; note 2 1 3 100 µs

× I

ext=Hcomp

comp=Acomp

in addition to the external field H

comp

.

. Sensor output will

ext

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 60134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

P

tot

T

stg

T

amb

I

comp

I

flip (max)

P

flip (max)

V

isol

bridge supply voltage − 8V
total power dissipation − 130 mW
storage temperature −65 +150 °C
maximum operating temperature −40 −125 °C
maximum compensation current − 15 mA
maximum flipping current − 1500 mA
maximum flipping power dissipation − 50 mW
voltage between isolated systems:

− 60 V
flip coil and Wheatstone bridge;
compensation coil and Wheatsone bridge;
flip coil and compensation coil

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

terminal resistance from junction to ambient 105 K/W

2000 Jun 09 3

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

CHARACTERISTICS

T

=25°C; V

bridge

CC1=VCC2

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

bridge supply voltage note 1 − 58V

H field strength operating range in sensor

plane

S sensitivity open circuit 12 16 −

TCS temperature coefficient of sensitivity T
k

SX

TCV

R

bridge

TCR

O

bridge

sensitivity synchronism note 2 92 100 108 %
temperature coefficient of output voltage VCC=5V;

bridge resistance note 3 123kΩ
temperature coefficient of bridge

resistance

V

offset

TCV

offset

offset voltage per supply voltage −1.5 0 +1.5 mV/V
temperature coefficient of offset voltage T

FH hysteresis of output voltage −−2 %FS
R

comp

A

comp

R

flip

TCR

flip

resistance of compensation coil note 6 100 170 300 Ω
field factor of compensation coil 19 22 25

resistance of set/reset coil note 7 1 2 3 Ω
temperature coefficient of resistance of

set/reset coil

I

flip

recommended flipping current for stable
operation

t

flip

R

isol

V

isol

R

isol_dice

flip pulse duration 1 3 100 µs
isolating resistance note 8 1 −−MΩ
voltage between isolated systems note 8 −−50 V
isolating resistance between dice die 1 to die 2 1 −−MΩ

f operating frequency 0 − 1 MHz

α angle die-to-die note 9 88 90 92 deg
β angle dice-to-package note 9 −5 0 +5 deg

= 5 V; unless otherwise specified.

= −25 to +125 °C − 0.31 − %/K

s

T

bridge

T

bridge

note 4

bridge

note 5

T

flip

−0.2 − +0.2 kA/m

mV/V

-------------­kA/m

−−0.4 − %/K

= −25 to +125 °C

= −25 to +125 °C;

= −25 to +125 °C;

− 0.3 − %/K

−30 +3

µ V/V

-------------

K

A/m

---------­mA

= −25 to +125 °C − 0.39 − %/K

±800 ±1000 ±1200 mA

Notes

1. Due to the ratiometric output, the same supply voltage (V

2.

k

SX

100

A

-----------------------------­A

×

comp1S1

×

comp2S2

%×=

) must be applied to both dice in one KMZ52 device.

CC

3. Bridge resistance die 1: between pins 5 and 12; bridge resistance die 2: between pins 2 and 3.
R

4. .

TCR

bridge

bridge T2()Rbridge T1()

100=

-------------------------------------------------------------- -

R

bridge T1()T2T1

–

–()

Where T

25°CT2125°C=;–=

1

2000 Jun 09 4

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

V

TCV

5. .

offset

offset T2()Voffset T1()

=

---------------------------------------------------------

–
–()

T

2T1

Where T

25°CT2125°C=;–=

1

6. Resistance of compensation coil die 1: between pins 6 and 7;

resistance of compensation coil die 2: between pins 4 to 13.

7. Resistance of set/reset coil die 1: between pins 10 and 11;

resistance of set/reset coil die 2: between pins 1 to 16.

8. Isolating resistance die 1: pins 7 and 8, 7 and 10 and 8 to 10;

isolating resistance die 2: pins 1 to 2, 1 to 4 and 2 to 4.

9. Angle die-to-die: die 2 is turned by 90 ±2 degrees in anticlockwise direction with respect to die 1;

angle dice-to-package: both dice in their fixed die-to-die position are tilted towards the package edges by
0 ±5 degrees.

2000 Jun 09 5

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

APPLICATION INFORMATION

If the angle α between external
magnetic field H and the long axis of
the package is zero, H is parallel to
the most sensitive direction of die 2
and perpendicular to the sensitive
direction of die 1. A magnetic field
turning clockwise (see Fig.2) thus
yields an output proportional to cos α
(V

) and an output proportional to

out2

sin α (V

out1

).

handbook, halfpage

16

Die 2 Die 1

9

y

x

handbook, full pagewidth

1

y

H

8

MBL202

α

x

Fig.2 Angular relationship of dice.

−I

flip2

Z

+V

16

1

−V

O2

15 14 13 12 11 10 9

bridge

2

O2

−I

comp2VCC1

Z

2

bridge

1

+I

flip1

−I

flip1

Z

4

+V

O1

12345678

+I

flip2

CC2

GND2 −V

+I

comp2

Fig.3 Simplified circuit diagram.

2000 Jun 09 6

Z

3

MBL203

GND1V

+I

comp1−Icomp1

O1

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

Z

16

pin 1 index

1

D

c

y

9

A

2

A

1

8

e

w M

b

p

E

H

E

detail X

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT109-1

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC EIAJ

076E07 MS-012

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

4.0

9.8

3.8

0.39

0.16

0.15

0.050

0.38

REFERENCES

2000 Jun 09 7

eHELLpQZywv θ

1.27

6.2

5.8

0.244

0.228

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.020

EUROPEAN

PROJECTION

0.25 0.1

0.01

0.7

0.3

0.028

0.012

ISSUE DATE

97-05-22
99-12-27

o

8

o

0

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseorat any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury.Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts,conveysnolicenceortitle
under any patent, copyright, or mask work right to these
products,andmakes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Jun 09 8

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

NOTES

2000 Jun 09 9

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

NOTES

2000 Jun 09 10

Philips Semiconductors Product specification

Magnetic Field Sensor KMZ52

NOTES

2000 Jun 09 11

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT PhilipsDevelopment Corporation,Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 613520/01/pp12 Date of release: 2000 Jun 09 Document order number: 9397 750 07049