Datasheet KMI15-1 Datasheet (Philips)

DISCRETE SEMICONDUCTORS

DATA SH EET

KMI15/1

Integrated rotational speed sensor

Preliminary specification
File under Discrete Semiconductors, SC17

1996 Dec 05

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

FEATURES

• Digital current output signal

• Zero speed capability

• Wide air gap

• Wide temperature range

• Insensitive to vibration

• EMC resistant.

DESCRIPTION

The KMI15/1 sensor detects rotational speed of ferrous
gear wheels and reference marks

(1)

.
The sensor consists of a magnetoresistive sensor
element, a signal conditioning integrated circuit in bipolar
technology and a magnetized ferrite magnet.
The frequency of the digital current output signal is
proportional to the rotational speed of a gear wheel.

CAUTION

Do not press two or more products together against their
magnetic forces.

PINNING

PIN DESCRIPTION

1V

CC

2V−

handbook, halfpage

12

MBH781

(1) The sensor contains a customized integrated circuit. Usage in

hydraulic brake systems and in systems with active brake
control is forbidden.

Fig.1 Simplified outline; (SOT453B).

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

I

CC (low)

I

CC (high)

DC supply voltage − 12 − V
current output signal low − 7 − mA

current output signal high − 14 − mA
d sensing distance 0 to 2.5 0 to 2.9 − mm
f

t

T

amb

operating tooth frequency 0 − 25000 Hz

ambient operating temperature −40 − +85 °C

1996 Dec 05 2

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

T

stg

T

amb

T

sld

Note

1. With R
(see Fig.7).

CHARACTERISTICS

=25°C; VCC= 12 V; d = 2.1 mm; ft= 2 kHz; test circuit: see Fig.7; RL=115Ω; sensor positioning: see Fig.15;

T

amb

gear wheel: module 2 mm; material 1.0715; unless otherwise specified.

DC supply voltage T

= −40 to +85 °C; RL=115Ω− 16 V

amb

storage temperature −40 +150 °C
ambient operating temperature −40 +85 °C
soldering temperature t ≤ 10 s − 260 °C
output short-circuit duration to GND continuous; note 1

= 115 Ω the device is continuously protected against wrong polarity of DC supply voltage (VCC) to GND

L

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

CC (low)

I

CC (high)

t

r

t

f

t

d

current output signal low see Figs 6 and 8 5.6 7.0 8.4 mA
current output signal high see Figs 6 and 8 11.2 14.0 16.8 mA
output signal rise time CL= 100 pF; see Fig.9; 10 to 90% value − 0.5 −µs
output signal fall time CL= 100 pF; see Fig.9; 10 to 90% value − 0.7 −µs
switching delay time between stimulation pulse (generated

− 1 −µs

by a coil) and output signal

f

t

operating tooth frequency for both rotation directions 0 − 25000 Hz
d sensing distance see Fig.15 and note 1 0 to 2.5 0 to 2.9 − mm
δ duty cycle see Fig.6 30 50 70 %

Note

1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17).

1996 Dec 05 3

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

FUNCTIONAL DESCRIPTION

The KMI15/1 sensor is sensitive to the motion of ferrous
gear wheels or reference marks. The functional principle is
shown in Fig.3. Due to the effect of flux bending, the
different directions of magnetic field lines in the
magnetoresistive sensor element will cause an electrical
signal. Because of the chosen sensor orientation and the
direction of ferrite magnetization, the KMI15/1 is sensitive
to movement in the ‘y’ direction in front of the sensor only
(see Fig.2).

The magnetoresistive sensor element signal is amplified,
temperature compensated and passed to a Schmitt trigger
in the conditioning integrated circuit (Figs 4 and 5).
The digital output signal level (see Fig.6) is independent of
the sensing distance within the measuring range (Fig.14).
A (2-wire) output current enables safe transfer of the
sensor signal to the detecting circuit (see Fig.7).
The integrated circuit housing is separated from the
sensor element housing to optimize the sensor behaviour
at high temperatures.

handbook, halfpage

y

xx

magnet with
direction of
magnetization

sensor

IC

z

handbook, full pagewidth

gear wheel

z

sensor

Fig.2 Component detail of the KMI15/1.

magnetic

magnet

y

(a) (b) (c)

field lines

Fig.3 Functional principle.

direction

of

motion

MBH778

MRA957

(d)

1996 Dec 05 4

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

handbook, full pagewidth

VOLTAGE CONTROL

AMPLIFIERSENSOR

Fig.4 Block diagram.

SCHMITT
TRIGGER

CONSTANT

CURRENT

SOURCE

SWITCHABLE

CURRENT

SOURCE

V

MRA958

CC

V

handbook, full pagewidth

sensor

EMC

FILTER

pre-
amplifier

switchable

current source

Schmitt-
trigger

Fig.5 Simplified circuit diagram.

1996 Dec 05 5

power supply

constant
current source

V

ref

GAP

MRA959

V

CC

V

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

handbook, halfpage

I

δ

CC

14 mA

7 mA

t

p

--- ­T

100%×=

T

t

p

Fig.6 Output signal as a function of time.

APPLICATION INFORMATION

16

handbook, halfpage

I

CC

(mA)

14

12

10

8

6

4

50 0 50 100 150 200

I

CC(high)

I

CC(low)

VCC = 20 V

VCC = 20 V

MRA967

VCC = 12 V

VCC = 8 V

VCC = 12 V

VCC = 8 V

T

amb

MRA960

(oC)

V

C

GND

CC

V

L

SENSOR

I

CC

R

L

MRA961

t

Fig.7 Test and application circuit.

T

amb

MRA968

t

f

o

( C)

t

1

handbook, halfpage

t

µ

(s)

0.8

0.6

0.4

0.2

0

50

t

f

t

r

I

CC

t

r

0 50 100 150 200

Fig.8 Output current levels as functions of

ambient temperature.

1996 Dec 05 6

VCC= 12V; CL= 100pF; RL= 115Ω.

Fig.9 Output current switching times as functions

of ambient temperature.

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

Mounting conditions

The recommended sensor position in front of a gear wheel
is shown in Fig.15. The distance ‘d’ is measured between
the sensor front and the tip of a gear wheel tooth.
The KMI15/1 senses ferrous indicators like gear wheels in
the ± y direction only (no rotational symmetry of the
sensor); see Fig.2. The effect of incorrect mounting
positions on sensing distance is shown in Figs 11, 12 and

13. The symmetrical reference axis of the sensor
corresponds to the axis of the ferrite magnet.

Environmental conditions

Due to eddy current effects the sensing distance depends
on the tooth frequency (Fig.17). The influence of gear
wheel module on the sensing distance is shown in Fig.16.

pitch

handbook, halfpage

Gear Wheel Dimensions

SYMBOL DESCRIPTION UNIT

German DIN

z number of teeth
d diameter mm
m module m = d/z mm
p pitch p = π×mmm

ASA; note1
PD pitch diameter (d in inch) inch

DP diametric pitch DP = z/PD inch

−1

CP circular pitch CP = π/DP inch

Note

1. For conversion from ASA to DIN: m = 25.4 mm/DP;
p = 25.4 mm × CP.

handbook, halfpage

4

d

(mm)

3

MRA998

pitch

diameter

module

pitch =module ×π

pitch diameter

=

-----------------------------------------­number ofteeth

MRA964

Fig.10 Gear wheel dimensions.

1996 Dec 05 7

2

d

1

0

01234

VCC= 12V; ft= 2kHz; module = 2 mm; pitch diameter = 100 mm.

y

y (mm)

Fig.11 Sensing distance as a function of positional

tolerance in the y-axis.

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

handbook, halfpage

4

d

(mm)

3

2

d

1

0

01

VCC= 12 V; ft= 2 kHz; module = 2 mm.

Θ

234

MRA999

Θ (deg)

Fig.12 Sensing distance as a function of positional

tolerance.

handbook, halfpage

4

d

(mm)

3

2

d

1

0

VCC= 12 V; ft= 2 kHz; module = 2 mm.

x

10 mm

0246−2−4−6

MRA982

x (mm)

Fig.13 Sensing distance as a function of positional

tolerance in the x-axis.

T

amb

MRA962

(

handbook, halfpage

4

d

(mm)

3

2

d

1

0

−50 0 50 100 150 200

VCC= 12 V; ft= 2 kHz; module = 2 mm.

Fig.14 Sensing distance as a function of ambient

temperature.

handbook, halfpage

d

o

C)

sensor

d

gear wheel

MRA963

Fig.15 Sensor positioning.

1996 Dec 05 8

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

1.5

handbook, halfpage

d
d

0

1

0.5

0

0

do= measuring distance for a gear wheel with module m = 2 mm.

12 34 5

module m (mm)

MRA966

Fig.16 Normalized maximum sensing distance as

a function of gear wheel module.

handbook, halfpage

4

d

(mm)

3

2

d

1

0

01234

VCC= 12 V; module = 2 mm.

tooth

frequency

f

t

f (kHz)

Fig.17 Sensing distance as a function of tooth

frequency.

MRA965

1996 Dec 05 9

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

EMC

Figure 18 shows a recommended application circuit for
automotive applications (wheel sensing ft< 5 kHz).
It provides a protection interface to meet Electromagnetic
Compatibility (EMC) standards and safeguard against
voltage spikes. Table 1 lists the tests which are applicable
to this circuit and the achieved class of functional status.
Protection against ‘load dump’ (test pulse 5 according to

“DIN 40839”

) means a very high demand on the protection
circuit and requires a suitable suppressor diode with
sufficient energy absorption capability.

The board net often contains a central load dump
protection that makes such a device in the protection
circuit of the sensor module unnecessary.

Tests for electrostatic discharge (ESD) were conducted in
line with

“IEC 801-2”

handling capabilities. The

to demonstrate the KMI15/1’s

“IEC 801-2”

test conditions

were: C = 150 pF, R = 150 Ω, V = 2 kV.
Electromagnetic disturbances with fields up to 150 V/m

and f = 1 GHz (ref.

“DIN 40839”

) have no influence on

performance.

Table 1 EMC test results

EMC REF. DIN 40839 SYMBOL MIN. (V) MAX. (V) REMARKS CLASS

Test pulse 1 V
Test pulse 2 V
Test pulse 3a V
Test pulse 3b V
Test pulse 4 V
Test pulse 5 V

LD
LD
LD
LD
LD
LD

−100 − td=2ms C

− 100 td= 0.2 ms A

−150 − td= 0.1 µsA

− 100 td= 0.1 µsA

−7 − td= 130 ms B

− 120 td= 400 ms B

+V

1N4001/3

BZTO3G36

D1

D2

C1

100

nF

R

115

C

L

100

nF

Ω

handbook, halfpage

GND

Fig.18 Test/application circuit for the KMI15/1.

V

CC

SENSOR

−V

L

MGD805

1996 Dec 05 10

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

PACKAGE OUTLINE

Package description SOT453B

M

1

H

E1

E

L

1

b

p1

E

1

vM

AB

B

A

D

L

vM

D

1

AB

M

2

M

3

K

A

Q

H

E

L

2

(+)(−)

b

p

e

DIMENSIONS (mm are the original dimensions)

(1)

(1)

(1)

b

mm

OUTLINE
VERSION

SOT453B

A

1.7

1.4

UNIT

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.8

0.7

b

p

c QL

p1

1.5

0.3

1.4

0.24

IEC JEDEC EIAJ

D

4.1

3.9

D

1

5.7

5.5

(1)

E

E

1

4.5

5.7

4.3

5.5

REFERENCES

4.6

4.4

e

18.2

17.8

1996 Dec 05 11

0 2.5 5 mm

scale

H

5.6

5.5

E1

K

max.

5.37

L

7.55

7.25

H

E

L

1.2

0.9

1

c

M

2

1

8.15

3.9

7.85

3.5

EUROPEAN

PROJECTION

M

8.15

7.85

2

M

3

4.7

0.75

4.3

0.65

ISSUE DATE

96-11-12

v

0.25

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Dec 05 12

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

NOTES

1996 Dec 05 13

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

NOTES

1996 Dec 05 14

Philips Semiconductors Preliminary specification

Integrated rotational speed sensor KMI15/1

NOTES

1996 Dec 05 15

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© Philips Electronics N.V. 1996 SCA52
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Printed in The Netherlands 147021/1200/01/pp16 Date of release: 1996 Dec 05 Document order number: 9397 750 01315