Datasheet ISP1123 Datasheet (Philips)

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ISP1123

Universal Serial Bus compound hub

Rev. 01 — 5 October 1999 Preliminary speciﬁcation

1. General description

The ISP1123 is a compound Universal Serial Bus (USB) hub device which complies with

USB Speciﬁcation Rev. 1.1

repeater,hub controller, USB data transceivers and a 3.3 V voltage regulator. It has a conﬁgurable number of downstream ports, ranging from 2 to 5, with one port dedicated to an embedded or non-removable function.

The ISP1123 can be bus-powered, self-powered or hybrid-powered. When it is hybrid-poweredthe hub functions are powered by the upstream power supply (V but the downstream ports are powered by an external 5 Volt supply. The low power consumption in ‘suspend’ mode allows easy design of equipment that is compliant with the ACPI™, OnNow™ and USB power management requirements.

. It integrates a Serial Interface Engine (SIE), hub

BUS

2. Features

The ISP1123 has built-in overcurrent sense inputs, supporting individual and ganged mode overcurrent protection for downstream ports. All ports (including the hub) have GoodLink™ indicator outputs for easy visual monitoring of USB trafﬁc. The ISP1123 has a serial I2C-bus interface forexternal EEPROM access and a reduced frequency (6 MHz) crystal oscillator. These features allow signiﬁcant cost savings in system design and easy implementation of advanced USB functionality into PC peripherals.

■ High performance USB hub device with integrated hub repeater, hub controller,

Serial Interface Engine (SIE), data transceivers and 3.3 V voltage regulator

■ Complies with

USB power management requirements

■ Downstream port 1 dedicated to a non-removable function, correctly reported in

the related descriptors

■ Conﬁgurable from 2 to 5 downstream ports with automatic speed detection

■ Internal power-on reset and low voltage reset circuit

■ Supports bus-powered, hybrid-powered and self-powered application

■ Individual or global power switching for downstream ports

■ Individual or ganged port overcurrent protection with built-in sense circuits

■ 6 MHz crystal oscillator with on-chip PLL for low EMI

■ Visual USB trafﬁc monitoring (GoodLink™) for hub and downstream ports

■ I2C-bus interface to read vendor ID, product ID and conﬁguration bits from

external EEPROM

Universal Serial Bus Speciﬁcation Rev. 1.1

and ACPI, OnNow and

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Philips Semiconductors

ISP1123

USB compound hub

■ Operation over the extended USB bus voltage range (4.0 to 5.5 V)

■ Operating temperature range −40 to +85 °C

■ 8 kV in-circuit ESD protection for lower cost of external components

■ Full-scan design with high test coverage

■ Available in 32-pin SDIP, SO and LQFP packages.

3. Ordering information

Table 1: Ordering information

Type number Package

Name Description Version

ISP1123D SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1 ISP1123NB SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 ISP1123BD

[1]

[1] For the availability of the LQFP32 package please contact your local Philips Semiconductors sales ofﬁce.

LQFP32 plastic low proﬁle quad ﬂat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1

4. Block diagram

ISP1123

ANALOG

Tx/Rx

D+ D− overcurrent

embedded or non-removable

GoodLink/

POWER SWITCH/

OC DETECT

power switch

detection

downstream port 1:

function

ANALOG

LED/

Tx/Rx

D+ D− overcurrent

GoodLink/

POWER SWITCH/

OC DETECT

detection

downstream port 2

(removable)

SUPPLY

REGULATOR

LED/

power switch

reg(3.3)

5 V

3.3 V

HUB

REPEATER

ANALOG

Tx/Rx

D+ D− overcurrent

downstream port 3

upstream

port

D+ D−

ANALOG

Tx/Rx

GoodLink/

POWER SWITCH/

OC DETECT

power switch

detection

(removable)

full speed

LED/

GoodLink

LED

HUB

RECOVERY

ANALOG

Tx/Rx

D+ D− overcurrent

detection

downstream port 4

(removable)

6 MHz

PLL

BIT CLOCK

PHILIPS

SIE

GoodLink/

POWER SWITCH/

OC DETECT

LED/

power switch

PACKET

GENERATOR

HUB

CONTROLLER

ANALOG

Tx/Rx

D+ D− overcurrent

detection

downstream port 5

(removable)

I2C-BUS

INTERFACE

INDV

OPTION

END OF

FRAME

TIMERS

GoodLink/

POWER SWITCH/

OC DETECT

LED/

power switch

SDA SCL

GENERAL

PORT

CONTROLLER

self/bus

powered

MBL083

This is a conceptual block diagram and does not include each individual signal.

Fig 1. Block diagram of the ISP1123.

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Philips Semiconductors

5. Functional diagram

ISP1123

USB compound hub

handbook, halfpage

USB DEVICE

(e.g. keyboard)

compound hub box

(1) Downstream port 1 is non-removable.

Fig 2. A compound hub box using ISP1123.

6. Pinning information

6.1 ISP1123D (SO32) and ISP1123NB (SDIP32)

6.1.1 Pinning

handbook, halfpage

reg(3.3)

PSW2/GL2

GND

DM3

DP3

CC OC1 OC2 OC3 OC4

OC5/GOC

DM4

DP4

SP/BP

HUBGL

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16

ISP1123D

MBL076

PSW1/GL1 DP2

DM2

DP0

DM0

DP1

DM1

DP5

DM5

INDV/SDA

OPTION/SCL

22 21

RESET XTAL2

XTAL1

19 18

PSW5/GL5/GPSW

PSW4/GL4PSW3/GL3

host

(1)

port 1

removable external devices

port 0

ISP1123

ports 2 to 5

handbook, halfpage

reg(3.3)

PSW2/GL2

GND

DM3

DP3

CC OC1 OC2 OC3 OC4

OC5/GOC

DM4

DP4

SP/BP

HUBGL

MBL082

10 11 12 13 14 15 16

1 2 3 4 5 6 7 8

ISP1123NB

MBL077

PSW1/GL1 DP2

DM2

DP0

DM0

DP1

DM1

DP5

DM5

INDV/SDA

OPTION/SCL

22 21

RESET XTAL2

XTAL1

19 18

PSW5/GL5/GPSW

PSW4/GL4PSW3/GL3

Fig 3. Pin conﬁguration SO32. Fig 4. Pin conﬁguration SDIP32.

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6.1.2 Pin description

Table 2: Pin description for SO32 and SDIP32

Symbol

reg(3.3)

PSW2/GL2

GND 3 - ground supply DM3 4 AI/O downstream port 3 D− connection (analog) DP3 5 AI/O downstream port 3 D+ connection (analog) V

OC1 7 AI/I overcurrent sense input for downstream port 1 (analog OC2 8 AI/I overcurrent sense input for downstream port 2 (analog OC3 9 AI/I overcurrent sense input for downstream port 3 (analog OC4 10 AI/I overcurrent sense input for downstream port 4 (analog OC5/GOC

DM4 12 AI/O downstream port 4 D− connection (analog) DP4 13 AI/O downstream port 4 D+ connection (analog) SP/BP 14 I selects power mode:

HUBGL 15 O hub GoodLink LED indicator output (open-drain, 6 mA);

PSW3/GL3

PSW4/GL4

ISP1123

USB compound hub

[1]

[2]

Pin Type Description

1 - regulated supply voltage (3.3 V ± 10%) from internal

regulator; used to connect pull-up resistor on DP0 line

[3]

2Omodes 4 to 6: power switch control output for downstream

port 2 (open-drain, 6 mA) modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 2 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

[4] [4]

6 - supply voltage; connect to USB supply V

hybrid-powered) or to local supply V

[3]

11 AI/I modes 5, 7: overcurrent sense input for downstream port 5

(analog

[5]

)

(bus-poweredor

BUS

(self-powered)

modes 0, 1, 3: global overcurrent sense input (analog

[4] [4]

self-powered: connect to V

(local power supply); also use

this mode for hybrid-powered operation bus-powered:connecttoGND;disabledownstream port 5 to

meet supply current requirements

[4]

to connect an LED use a 330 Ω series resistor; if unused connect to V

[3]

16 O modes 4 to 6: power switch control output for downstream

via a 10 kΩ resistor

port 3 (open-drain, 6 mA) modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 3 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

[3]

17 O modes 4 to 6: power switch control output for downstream

port 4 (open-drain, 6 mA) modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 4 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

[5]

)

[5]

)

[5]

)

[5]

)

[5]

)

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Philips Semiconductors

ISP1123

USB compound hub

Table 2: Pin description for SO32 and SDIP32

Symbol

PSW5/GL5/ GPSW

[1]

Pin Type Description

18 O mode 5: power switch control output for downstream port 5

[3]

(open-drain, 6 mA)

…continued

modes 3, 7: GoodLink LED indicator output for downstream port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

modes 0 to 2: gang mode power switch control output

(open-drain, 6 mA) XTAL1 19 I crystal oscillator input (6 MHz) XTAL2 20 O crystal oscillator output (6 MHz) RESET

[2]

21 I reset input (Schmitt trigger); a LOW level produces an

asynchronous reset; connect to V

for power-on reset

(internal POR circuit)

OPTION/SCL 22 I/O mode selection input; also functions as I

C-bus clock output

(open-drain, 6 mA) INDV/SDA 23 I/O selects individual (HIGH) or global (LOW) power switching

and overcurrent detection; also functions as bidirectional

C-bus data line (open-drain, 6 mA)

I DM5 24 AI/O downstream port 5 D− connection (analog) DP5 25 AI/O downstream port 5 D+ connection (analog) DM1 26 AI/O downstream port 1 D− connection (analog) DP1 27 AI/O downstream port 1 D+ connection (analog)

[4] [4] [6] [6]

DM0 28 AI/O upstream port D− connection (analog) DP0 29 AI/O upstream port D+ connection (analog) DM2 30 AI/O downstream port 2 D− connection (analog) DP2 31 AI/O downstream port 2 D+ connection (analog) PSW1/GL1

[3]

32 O modes 4 to 6: power switch control output for downstream

[6] [6]

port 1 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 1 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals. [2] The voltage at pin V

connecting RESET to V [3] See Table 4 “Mode selection”. [4] To disable a downstream port connect both D+ and D− to VCCvia a 1 MΩ resistor; unused ports must

be disabled in reverse order starting from port 5. [5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,

the pin functions as a logic input (TTL level). [6] Downstream ports 1 and 2 cannot be disabled.

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is gated by the RESET pin. This allows fully self-powered operation by

reg(3.3)

(+5 V USB supply). If V

BUS

is lost upstream port D+ will not be driven.

BUS

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Philips Semiconductors

6.2 ISP1123BD (LQFP32)

6.2.1 Pinning

handbook, full pagewidth

ISP1123

USB compound hub

DP3

OC1 OC2 OC3 OC4

OC5/GOC

DM4

Fig 5. Pin conﬁguration LQFP32.

DM3

GND

1 2 3 4 5 6 7 8

DP4

SP/BP

reg(3.3)

PSW2/GL2

PSW1/GL1

ISP1123BD

HUBGL

PSW3/GL3

PSW4/GL4

DP2

DM2

DP0

MBL078

XTAL1

XTAL2

PSW5/GL5/GPSW

DM0

DP1

DM1

DP5

DM5

INDV/SDA

OPTION/SCL

RESET

6.2.2 Pin description

Table 3: Pin description for LQFP32

reg(3.3)

[1]

[2]

Pin Type Description

29 - regulated supply voltage (3.3 V ± 10%) from internal

regulator; used to connect pull-up resistor on DP0 line

[3]

30 O modes 4 to 6: power switch control output for downstream

port 2 (open-drain, 6 mA) modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 2 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

[4] [4]

2 - supply voltage; connect to USB supply V

hybrid-powered) or to local supply V

(bus-poweredor

BUS

(self-powered)

[5]

)

[5]

)

[5]

)

[5]

)

Symbol

PSW2/GL2

GND 31 - ground supply DM3 32 AI/O downstream port 3 D− connection (analog) DP3 1 AI/O downstream port 3 D+ connection (analog) V

OC1 3 AI/I overcurrent sense input for downstream port 1 (analog OC2 4 AI/I overcurrent sense input for downstream port 2 (analog OC3 5 AI/I overcurrent sense input for downstream port 3 (analog OC4 6 AI/I overcurrent sense input for downstream port 4 (analog

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Philips Semiconductors

ISP1123

USB compound hub

Table 3: Pin description for LQFP32

Symbol

OC5/GOC

[1]

Pin Type Description

[3]

7 AI/I modes 5, 7: overcurrent sense input for downstream port 5

(analog

modes 0, 1, 3: global overcurrent sense input (analog DM4 8 AI/O downstream port 4 D− connection (analog) DP4 9 AI/O downstream port 4 D+ connection (analog)

…continued

[5]

)

[5] [4] [4]

SP/BP 10 I selects power mode:

self-powered: connect to V

(local power supply); also use

this mode for hybrid-powered operation bus-powered:connecttoGND;disabledownstream port 5 to

meet supply current requirements

[4]

HUBGL 11 O hub GoodLink LED indicator output (open-drain, 6 mA);

to connect an LED use a 330 Ω series resistor; if unused

via a 10 kΩ resistor

PSW3/GL3

connect to V

[3]

12 O modes 4 to 6: power switch control output for downstream

port 3 (open-drain, 6 mA) modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 3 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

PSW4/GL4

[3]

13 O modes 4 to 6: power switch control output for downstream

port 4 (open-drain, 6 mA) modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 4 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

PSW5/GL5/

[3]

GPSW

14 O mode 5: power switch control output for downstream port 5

(open-drain, 6 mA) modes 3, 7: GoodLink LED indicator output for downstream

port 5 (open-drain, 6 mA); to connect an LED use a 330 Ω series resistor

modes 0 to 2: gang mode power switch control output

(open-drain, 6 mA) XTAL1 15 I crystal oscillator input (6 MHz) XTAL2 16 O crystal oscillator output (6 MHz) RESET

[2]

17 I reset input (Schmitt trigger); a LOW level produces an

asynchronous reset; connect to V

for power-on reset

(internal POR circuit)

OPTION/SCL 18 I/O mode selection input; also functions as I

C-bus clock output

(open-drain, 6 mA) INDV/SDA 19 I/O selects individual (HIGH) or global (LOW) power switching

and overcurrent detection; also functions as bidirectional

C-bus data line (open-drain, 6 mA)

I DM5 20 AI/O downstream port 5 D− connection (analog) DP5 21 AI/O downstream port 5 D+ connection (analog) DM1 22 AI/O downstream port 1 D− connection (analog) DP1 23 AI/O downstream port 1 D+ connection (analog)

[4] [4] [6] [6]

DM0 24 AI/O upstream port D− connection (analog) DP0 25 AI/O upstream port D+ connection (analog)

)

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Philips Semiconductors

ISP1123

USB compound hub

Table 3: Pin description for LQFP32

Symbol

DM2 26 AI/O downstream port 2 D− connection (analog) DP2 27 AI/O downstream port 2 D+ connection (analog) PSW1/GL1

[1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals. [2] The voltage at pin V

[3] See Table 4 “Mode selection”. [4] To disable a downstream port connect both D+ and D− to VCCvia a 1 MΩ resistor; unused ports must

[5] Analog detection circuit can be switched off using an external EEPROM, see Table 23; in this case,

[6] Downstream ports 1 and 2 cannot be disabled.

[1]

connecting RESET to V

be disabled in reverse order starting from port 5.

the pin functions as a logic input (TTL level).

7. Functional description

The ISP1123 is a compound USB hub with up to 5 downstream ports. The number of ports can be conﬁgured between 2 and 5. The downstream ports can be used to connect low-speed or full-speed USB peripherals. Downstream port 1 is dedicated to an embedded or non-removable function, the other ports are removable.

…continued

Pin Type Description

[6] [6]

[3]

28 O modes 4 to 6: power switch control output for downstream

port 1 (open-drain, 6 mA)

modes 0 to 3, 7: GoodLink LED indicator output for

downstream port 1 (open-drain, 6 mA); to connect an LED

use a 330 Ω series resistor

is gated by the RESET pin. This allows fully self-powered operation by

reg(3.3)

(+5 V USB supply). If V

BUS

is lost upstream port D+ will not be driven.

BUS

All standard USB requests from the host are handled by the hardware without the need forﬁrmware intervention. The block diagram is shown in Figure 1 and the basic architecture of a compound hub in Figure 2.

The ISP1123 requires only a single supply voltage. An internal 3.3 V regulator provides the supply voltage for the analog USB data transceivers.

The ISP1123 supports both bus-powered and self-powered hub operation. When using bus-powered operation a downstream port cannot supply more than 100 mA to a peripheral. In case of self-powered operation an external supply is used to power the downstream ports, allowing a current consumption of max. 500 mA per port.

A basic I2C-bus interface is provided for reading vendor ID, product ID and conﬁguration bits from an external EEPROM upon a reset.

7.1 Analog transceivers

The integrated transceiver interfaces directly to the USB cables through external termination resistors. They are capable of transmitting and receiving serial data at both ‘full-speed’ (12 Mbit/s) and ‘low-speed’ (1.5 Mbit/s) data rates. The slew rates are adjusted according to the speed of the device connected and lie within the range mentioned in the

USB Speciﬁcation Rev. 1.1

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Philips Semiconductors

7.2 Philips Serial Interface Engine (SIE)

The Philips SIE implements the full USB protocol layer. It is completely hardwired for speed and needs no ﬁrmware intervention. The functions of this block include: synchronization pattern recognition, parallel/serial conversion, bit (de-)stufﬁng, CRC checking/generation, Packet IDentiﬁer (PID) veriﬁcation/generation, address recognition, handshake evaluation/generation.

7.3 Hub repeater

The hub repeater is responsible for managing connectivity on a ‘per packet’ basis. It implements ‘packet signalling’ and ‘resume’ connectivity. Low-speed devices can be connected to downstream ports. If a low-speed device is detected the repeater will not propagate upstream packets to the corresponding port, unless theyare preceded by a PREAMBLE PID.

7.4 End-of-frame timers

This block contains the speciﬁed EOF1 and EOF2 timers which are used to detect ‘loss-of-activity’ and ‘babble’ error conditions in the hub repeater. The timers also maintain the low-speed keep-alive strobe which is sent at the beginning of a frame.

ISP1123

USB compound hub

7.5 General and individual port controller

The general and individual port controllers together provide status and control of individual downstream ports. Any port status change will be reported to the host via the hub status change (interrupt) endpoint.

7.6 GoodLink

Indication of a good USB connection is provided through GoodLink technology. An LED can be directly connected via an external 330 Ω resistor.

During enumeration the LED blinks on momentarily. After successful conﬁguration of the ISP1123, the LED is permanently on. The LED blinks off for 100 ms upon each successful packet transfer (with ACK). The hub GoodLink indicator blinks when the hub receives a packet addressed to it. Downstream GoodLink indicators blink upon an acknowledgment from the associated port. In ‘suspend’ mode the LED is off.

This feature provides a user-friendly indication of the status of the hub, the connected downstream devices and the USB trafﬁc.It is a useful diagnostics tool to isolate faulty USB equipment and helps to reduce ﬁeld support and hotline costs.

7.7 Bit clock recovery

The bit clock recovery circuit recovers the clock from the incoming USB data stream using a 4× oversampling principle. It is able to track jitter and frequency drift as speciﬁed by the

USB Speciﬁcation Rev. 1.1

7.8 Voltage regulator

A 5 to 3.3 V DC-DC regulator is integrated on-chip to supply the analog transceiver and internal logic. This can also be used to supply the terminal 1.5 kΩ pull-up resistor on the D+ line of the upstream connection.

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Philips Semiconductors

7.9 PLL clock multiplier

A 6 to 48 MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This allows for the use of low-cost 6 MHz crystals. The low crystal frequency also minimizes Electro-Magnetic Interference (EMI). The PLL requires no external components.

7.10 Overcurrent detection

An overcurrent detection circuit for downstream ports has been integrated on-chip. It is self-reporting, resets automatically, has a low trip time and requires no external components. Both individual and ganged mode overcurrent detection are supported.

7.11 I2C-bus interface

A basic serial I2C-bus interface (single master, 100 kHz) is provided to read VID, PID and conﬁguration bits from an external I2C-bus EEPROM (e.g. Philips PCF8582 or equivalent). At reset the ISP1123 reads 6 bytes of data from the external memory.

The I2C-bus interface timing complies with the standard mode of operation as described in

The I2C-bus and how to use it

ISP1123

USB compound hub

, order number 9398 393 40011.

8. Modes of operation

The ISP1123 has severalmodes of operation,each corresponding with a different pin conﬁguration. Modes are selected by means of pins INDV, OPTION and SP/BP, as shown in Table 4.

Table 4: Mode selection

Mode INDV

0000GoodLink ganged power inactive global overcurrent 1001GoodLink ganged power inactive global overcurrent 2010GoodLink ganged power inactive 3011GoodLink 4100individual power inactive individual

5101individual power individual power individual

6110individual power inactive inactive 7111GoodLink

[1] Port power switching: logic 0 = ganged, logic 1 = individual. [2] Power mode: logic0=bus-powered, logic 1 = self-powered (or hybrid-powered). [3] No overcurrent detection. [4] No power switching.

[1]

OPTION SP/BP

[2]

PSWn/GLn (n = 1 to 4)

PSW5/GL5/GPSW OCn

[4]

GoodLink

[4]

(n = 1 to 4)

[3]

inactive global overcurrent

overcurrent

[3]

individual overcurrent

OC5/GOC

inactive

individual overcurrent

inactive individual

overcurrent

[3]

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9. Endpoint descriptions

Each USB device is logically composed of several independent endpoints. An endpoint acts as a terminus of a communication ﬂow between the host and the device. At design time each endpoint is assigned a unique number (endpoint identiﬁer, see Table 5). The combination of the device address (given by the host during enumeration), the endpoint number and the transfer direction allows each endpoint to be uniquely referenced.

The ISP1123 has two endpoints, endpoint 0 (control) and endpoint 1 (interrupt).

Table 5: Hub endpoints

Function Ports Endpoint

Hub

[1] IN: input for the USB host; OUT: output from the USB host.

0: upstream 1 to 5: downstream

ISP1123

USB compound hub

identiﬁer

0 control

1 interrupt IN 1

Transfer type

Direction

OUT 64 IN 64

[1]

Max. packet size (bytes)

9.1 Hub endpoint 0 (control)

All USB devices and functions must implement a default control endpoint (ID = 0). This endpoint is used by the host to conﬁgure the device and to perform generic USB status and control access.

The ISP1123 hub supports the following USB descriptor information through its control endpoint 0, which can handle transfers of 64 bytes maximum:

Device descriptor

•

Conﬁguration descriptor

•

Interface descriptor

•

Endpoint descriptor

•

Hub descriptor

•

String descriptor.

•

9.2 Hub endpoint 1 (interrupt)

Endpoint 1 is used by the ISP1123 hub to provide status change information to the host. This endpoint can be accessed only after the hub has been conﬁgured by the host (by sending the Set Conﬁguration command).

Endpoint 1 is an interrupt endpoint: the host polls it once every 255 ms by sending an IN token. If the hub has detected no change in the port status it returns a NAK (Not AcKnowledge) response to this request, otherwise it sends the Status Change byte (see Table 6).

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Table 6: Status Change byte: bit allocation

Bit Symbol Description

0 Hub SC a logic 1 indicates a status change on the hub’s upstream port 1 Port 1 SC a logic 1 indicates a status change on downstream port 1 2 Port 2 SC a logic 1 indicates a status change on downstream port 2 3 Port 3 SC a logic 1 indicates a status change on downstream port 3 4 Port 4 SC a logic 1 indicates a status change on downstream port 4 5 Port 5 SC a logic 1 indicates a status change on downstream port 5 6 reserved not used 7 reserved not used

10. Host requests

The ISP1123 handles all standard USB requests from the host via control endpoint 0. The control endpoint can handle a maximum of 64 bytes per transfer.

Remark: Please note that the USB data transmission order is Least Signiﬁcant Bit (LSB) ﬁrst. In the following tables multi-byte variables are displayed least signiﬁcant byte ﬁrst.

ISP1123

USB compound hub

10.1 Standard requests

Table 7 shows the supported standard USB requests. Some requests are explicitly

unsupported. All other requests will be responded with a STALL packet.

Table 7: Standard USB requests

Request name bmRequestType

Address

Set Address X000 0000 05 address

Conﬁguration

Get Conﬁguration 1000 0000 08 00, 00 00, 00 01, 00 conﬁguration

Set Conﬁguration (0) X000 0000 09 00, 00 00, 00 00, 00 none Set Conﬁguration (1) X000 0000 09 01, 00 00, 00 00, 00 none

Descriptor

Get Conﬁguration Descriptor

Get Device Descriptor 1000 0000 06 00, 01 00, 00 length

Get String Descriptor (0) 1000 0000 06 03, 00 00, 00 length

Get String Descriptor (1) 1000 0000 06 03, 01 00, 00 length

Get String Descriptor (2) 1000 0000 06 03, 02 00, 00 length

byte 0 [7:0] (Bin)

1000 0000 06 00, 02 00, 00 length

bRequest byte 1 (Hex)

wValue byte 2, 3 (Hex)

wIndex byte 4, 5 (Hex)

[1]

00, 00 00, 00 none

wLength byte 6, 7 (Hex)

Data

value = 01H

[2]

conﬁguration, interface and endpoint descriptors

device descriptor

language ID string

manufacturer string

product string

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Philips Semiconductors

ISP1123

USB compound hub

Table 7: Standard USB requests

Request name bmRequestType

byte 0 [7:0] (Bin)

…continued

bRequest byte 1 (Hex)

wValue byte 2, 3 (Hex)

wIndex byte 4, 5 (Hex)

wLength byte 6, 7 (Hex)

Data

Feature

Clear Device Feature

X000 0000 01 01, 00 00, 00 00, 00 none

(REMOTE_WAKEUP) Clear Endpoint (1)

X000 0010 01 00, 00 81, 00 00, 00 none

Feature (HALT/STALL) Set Device Feature

X000 0000 03 01, 00 00, 00 00, 00 none

(REMOTE_WAKEUP) Set Endpoint (1)

X000 0010 03 00, 00 81, 00 00, 00 none

Feature (HALT/STALL)

Status

Get Device Status 1000 0000 00 00, 00 00, 00 02, 00 device status Get Interface Status 1000 0001 00 00, 00 00, 00 02, 00 zero Get Endpoint (0) Status 1000 0010 00 00, 00 00/80

[3]

, 00 02, 00 endpoint 0

status

Get Endpoint (1) Status 1000 0010 00 00, 00 81, 00 02, 00 endpoint 1

status

Unsupported

Set Descriptor 0000 0000 07 XX, XX XX, XX XX, XX descriptor;

STALL Get Interface 1000 0001 0A 00, 00 XX, XX 01, 00 STALL Set Interface X000 0001 0B XX, XX XX, XX 00, 00 STALL Synch Frame 1000 0010 0C 00, 00 XX, XX 02, 00 STALL

[1] Device address: 0 to 127. [2] Returned value in bytes. [3] MSB speciﬁes endpoint direction: 0 = OUT, 1= IN. The ISP1123 accepts either value.

10.2 Hub speciﬁc requests

In Table 8 the supported hub speciﬁc requests are listed, as well as some unsupported requests. Table 9 provides the feature selectors for setting or clearing port features.

Table 8: Hub speciﬁc requests

Request name bmRequestType

byte 0 [7:0] (Bin)

Descriptor

Get Hub Descriptor 1010 0000 06 00, 00/29

Feature

Clear Hub Feature

X010 0000 01 00, 00 00, 00 00, 00 none

(C_LOCAL_POWER) Clear Port Feature

X010 0011 01 feature

(feature selectors) Set Port Feature

X010 0011 03 feature

(feature selectors)

bRequest byte 1 (Hex)

wValue byte 2, 3 (Hex)

[1]

[3]

, 00 port

[3]

, 00 port

wIndex byte 4, 5 (Hex)

wLength byte 6, 7 (Hex)

00, 00 length

[4]

, 00 00, 00 none

[4]

, 00 00, 00 none

Data

[2]

, 00 hub descriptor

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Philips Semiconductors

ISP1123

USB compound hub

Table 8: Hub speciﬁc requests

Request name bmRequestType

…continued

byte 0 [7:0] (Bin)

bRequest byte 1 (Hex)

wValue byte 2, 3 (Hex)

wIndex byte 4, 5 (Hex)

wLength byte 6, 7 (Hex)

Data

Status

Get Hub Status 1010 0000 00 00, 00 00, 00 04, 00 hub status and

status change

ﬁeld

[4]

Get Port Status 1010 0011 00 00, 00 port

, 00 04, 00 port status

Unsupported

[4]

Get Bus Status 1010 0011 02 00, 00 port Clear Hub Feature

X010 0000 01 01, 00 00, 00 00, 00 STALL

, 00 01, 00 STALL

(C_OVER_CURRENT) Set Hub Descriptor 0010 0000 07 XX, XX 00, 00 3E, 00 STALL Set Hub Feature

X010 0000 03 00, 00 00, 00 00, 00 STALL

(C_LOCAL_POWER) Set Hub Feature

X010 0000 03 01, 00 00, 00 00, 00 STALL

(C_OVER_CURRENT)

[1]

USB Speciﬁcation Rev. 1.0

[2] Returned value in bytes. [3] Feature selector value, seeTable 9. [4] Downstream port identiﬁer: 1 to N with N = number of enabled ports (2 to 5).

uses 00H,

USB Speciﬁcation Rev. 1.1

speciﬁes 29H.

Table 9: Port feature selectors

Feature selector name Value (Hex) Set feature Clear feature

PORT_CONNECTION 00 not used not used PORT_ENABLE 01 not used disables a port PORT_SUSPEND 02 suspends a port resumes a port PORT_OVERCURRENT 03 not used not used PORT_RESET 04 resets and enables a

not used

port PORT_POWER 08 powers on a port powers off a port PORT_LOW_SPEED 09 not used not used C_PORT_CONNECTION 10 not used clears port connection

change bit

C_PORT_ENABLE 11 not used clears port enable

change bit

C_PORT_SUSPEND 12 not used clears port suspend

change bit

C_PORT_OVERCURRENT 13 not used clears port overcurrent

change bit

C_PORT_RESET 14 not used clears port reset

change bit

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Philips Semiconductors

10.3 Descriptors

The ISP1123 hub controller supports the following standard USB descriptors:

•

Table 10: Device descriptor

Values in square brackets are optional.

Offset (bytes)

0 bLength 1 12 descriptor length = 18 bytes 1 bDescriptorType 1 01 type = DEVICE 2 bcdUSB 2 10, 01 4 bDeviceClass 1 09 HUB_CLASSCODE 5 bDeviceSubClass 1 00 6 bDeviceProtocol 1 00 7 bMaxPacketSize0 1 40 packet size = 64 bytes 8 idVendor 2 CC, 04 Philips Semiconductors vendor ID

10 idProduct 2 23, 11 ISP1123 product ID; can be

12 bcdDevice 2 00, 01 device release 1.0; silicon revision

14 iManufacturer 1 00 no manufacturer string (default)

15 iProduct 1 00 no product string (default)

16 iSerialNumber 1 00 no serial number string 17 bNumConﬁgurations 1 01 one conﬁguration

Device Conﬁguration Interface Endpoint Hub String.

Field name Size

(bytes)

ISP1123

USB compound hub

Value (Hex)

[01] manufacturer string enabled

[02] product string enabled

Comments

USB Speciﬁcation Rev. 1.1

(04CC); can be customized using an external EEPROM (see Table 23)

customized using an external EEPROM (see Table 23)

increments this value

(using an external EEPROM)

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Philips Semiconductors

Table 11: Conﬁguration descriptor

Values in square brackets are optional.

Offset (bytes)

0 bLength 1 09 descriptor length=9bytes 1 bDescriptorType 1 02 type = CONFIGURATION 2 wTotalLength 2 19, 00 total length of conﬁguration, interface

4 bNumInterfaces 1 01 one interface 5 bConﬁgurationValue 1 01 conﬁguration value = 1 6 iConﬁguration 1 00 no conﬁguration string 7 bmAttributes 1 E0 self-powered with remote wake-up

8 MaxPower

[1] Selected by input SP/BP. [2] Value in units of 2mA.

Field name Size

(bytes)

[2]

1 32 100 mA (default)

ISP1123

USB compound hub

Value (Hex)

A0 bus-powered with remote wake-up

[00] 0 mA (using an external EEPROM) [FA] 500 mA (using an external EEPROM)

Comments

and endpoint descriptors (25 bytes)

[1] [1]

Table 12: Interface descriptor

Offset (bytes)

Field name Size

(bytes)

Value (Hex)

Comments

0 bLength 1 09 descriptor length=9bytes 1 bDescriptorType 1 04 type = INTERFACE 2 bInterfaceNumber 1 00 3 bAlternateSetting 1 01 no alternate setting 4 bNumEndpoints 1 01 status change (interrupt) endpoint 5 bInterfaceClass 1 09 HUB_CLASSCODE 6 bInterfaceSubClass 1 00 7 bInterfaceProtocol 1 00 no class-speciﬁc protocol 8 bInterface 1 00 no interface string

Table 13: Endpoint descriptor

Offset (bytes)

Field name Size

(bytes)

Value (Hex)

Comments

0 bLength 1 07 descriptor length=7bytes 1 bDescriptorType 1 05 type = ENDPOINT 2 bEndpointAddress 1 81 endpoint 1, direction: IN 3 bmAttributes 1 03 interrupt endpoint 4 wMaxPacketSize 2 01, 00 packet size = 1 byte 6 bInterval 1 FF polling interval (255 ms)

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Table 14: Hub descriptor

Values in square brackets are optional.

Offset (bytes)

0 bDescLength 1 09 descriptor length=9bytes 1 bDescriptorType 1 29 type = HUB 2 bNbrPorts 1 05 to 02 number of enabled downstream ports;

3 wHubCharacteristics 2 0D, 00 individual power switching

5 bPwrOn2PwrGood

6 bHubContrCurrent 1 64 maximum hub controller current

7 DeviceRemovable 1 02 port 1 is non-removable 8 PortPwrCtrlMask 1 FF must be all ones for compatibility with

Field name Size

(bytes)

[3]

1 32 100 ms (default; modes 0, 1, 2, 4, 5, 6)

ISP1123

USB compound hub

Value (Hex)

15, 00 individual power switching

00 0 ms (default; modes 3, 7) [FA] 500 ms (using an external EEPROM;

Comments

selectable by DP/DM strapping

[1]

, overcurrent protection active (modes 0, 1, 3,4, 5, 7), hub is part of a compound device

[1]

, no overcurrent protection (modes 2, 6) hub is part of a compound device

modes 0, 1, 2, 4, 5, 6); see Table 23

(100 mA)

USB Speciﬁcation Rev. 1.0

[2]

[1] ISP1123 always reports power management status on an individual basis, even for ganged/global

modes. This is compliant with [2] Condition with no overcurrent detection is reported to the host. [3] Value in units of 2ms.

USB Speciﬁcation Rev. 1.1

Table 15: String descriptors

String descriptors are optional and therefore disabled by default; they can be enabled through an external EEPROM.

Offset (bytes)

Field name Size

(bytes)

Value (Hex)

Comments

String descriptor (0): language ID string

0 bLength 1 04 descriptor length=4bytes 1 bDescriptorType 1 03 type = STRING 2 bString 2 09, 04 LANGID code zero

String descriptor (1): manufacturer string

0 bLength 1 2E descriptor length = 46 bytes 1 bDescriptorType 1 03 type = STRING

[1]

2 bString 44 UC

“Philips Semiconductors”

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Philips Semiconductors

ISP1123

USB compound hub

Table 15: String descriptors

String descriptors are optional and therefore disabled by default; they can be enabled through an external EEPROM.

Offset (bytes)

String descriptor (2): product string

0 bLength 1 10 descriptor length = 16 bytes 1 bDescriptorType 1 03 type = STRING 2 bString 14 UC

[1] Unicode encoded string.

Field name Size

10.4 Hub responses

This section describes the hub responses to requests from the USB host.

10.4.1 Get device status

The hub returns 2 bytes, see Table 16.

Table 16: Get device status response

Bit # Function Value Description

0 self-powered 0 bus-powered

1 remote wake-up 0 no remote wake-up

2 to 15 reserved 0 -

…continued

(bytes)

Value (Hex)

1 self-powered

1 remote wake-up enabled

[1]

Comments

“ISP1122”

10.4.2 Get conﬁguration

The hub returns 1 byte, see Table 17.

Table 17: Get conﬁguration response

Bit # Function Value Description

0 conﬁguration value 0 device not conﬁgured

1 to 7 reserved 0 -

10.4.3 Get interface status

The hub returns 2 bytes, see Table 18.

Table 18: Get interface status response

Bit # Function Value Description

0 to 15 reserved 0 -

1 device conﬁgured

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Philips Semiconductors

10.4.4 Get hub status

The hub returns 4 bytes, see Table 19.

Table 19: Get hub status response

Bit # Function Value Description

0 local power source 0 local power supply good

1 overcurrent indicator 0 no overcurrent condition

2 to 15 reserved 0 16 local power status change 0 no change in local power status

17 overcurrent indicator change 0 no change in overcurrent condition

18 to 31 reserved 0 -

10.4.5 Get port status

The hub returns 4 bytes. The ﬁrst 2 bytes contain the port status bits (wPortStatus, see Table 20). The last 2 bytes hold the port status change bits (wPortChange, see

Table 21).

ISP1123

USB compound hub

1 local power supply lost

1 hub overcurrent condition detected

1 local power status changed

1 overcurrent condition changed

Table 20: Get port status response (wPortStatus)

Bit # Function Value Description

0 current connect status 0 no device present

1 device present on this port

1 port enabled/disabled 0 port disabled

1 port enabled

2 suspend 0 port not suspended

1 port suspended

3 overcurrent indicator 0 no overcurrent condition

1 overcurrent condition detected

4 reset 0 reset not asserted

1 reset asserted 5 to 7 reserved 0 8 port power 0 port powered off

1 port power on 9 low-speed device attached 0 full-speed device attached

1 low-speed device attached 10 to 15 reserved 0 -

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Philips Semiconductors

Table 21: Get port status response (wPortChange)

Bit # Function Value Description

0 connect status change 0 no change in current connect status

1 port enabled/disabled

2 suspend change 0 no change in suspend status

3 overcurrent indicator change 0 no change in overcurrent status

4 reset change 0 no change in reset status

5 to 15 reserved 0 -

10.4.6 Get conﬁguration descriptor

The hub returns 25 bytes containing the conﬁguration descriptor (9 bytes, see

Table 11), the interface descriptor (9 bytes,see Table 12) and the endpoint descriptor

(7 bytes, see Table 13).

change

ISP1123

USB compound hub

1 current connect status changed

0 no port error

1 port disabled by a port error

1 resume complete

1 overcurrent indicator changed

1 reset complete

10.4.7 Get device descriptor

The hub returns 18 bytes containing the device descriptor, see Table 10.

10.4.8 Get hub descriptor

The hub returns 9 bytes containing the hub descriptor, see Table 14.

10.4.9 Get string descriptor (0)

The hub returns 4 bytes containing the language ID, see Table 15.

10.4.10 Get string descriptor (1)

The hub returns 46 bytes containing the manufacturer name, see Table 15.

10.4.11 Get string descriptor (2)

The hub returns 16 bytes containing the product name, see Table 15.

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Philips Semiconductors

11. I2C-bus interface

A simple I2C-bus interface is provided in the ISP1123 to read customized vendor ID, product ID and some other conﬁguration bits from an external EEPROM. The interface supports single master operation at a nominal bus speed of 93.75 kHz.

The I2C-bus interface is intended forbidirectionalcommunication between ICs viatwo serial bus wires, SDA (data) and SCL (clock). Both lines are driven by open-drain circuits and must be connected to the positive supply voltage via pull-up resistors.

11.1 Protocol

The I2C-bus protocol deﬁnes the following conditions:

•

ISP1123

USB compound hub

Bus free: both SDA and SCL are HIGH START: a HIGH-to-LOW transition on SDA, while SCL is HIGH STOP: a LOW-to-HIGH transition on SDA, while SCL is HIGH Data valid: after a START condition, data on SDA are stable during the HIGH

period of SCL; data on SDA may only change while SCL is LOW.

Each device on the I2C-bus has a unique slave address, which the master uses to select a device for access.

The master starts a data transfer using a START condition and ends it by generating a STOP condition. Transfers can only be initiated when the bus is free. The receiver must acknowledge each byte by means of a LOW level on SDA during the ninth clock pulse on SCL.

For detailed information please consult 9398 393 40011.

11.2 Hardware connections

Via the I2C-bus interface the ISP1123 can be connected to an external EEPROM (PCF8582 or equivalent). The hardware connections are shown in Figure 6.

The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively.

dth

OPTION/SCL

INDV/SDA

ISP1123

USB HUB

The I2C-bus and how to use it

C-bus

SCL SDA

PCF8582

EEPROM

equivalent

., order number

A0 A1 A2

MBL081

Fig 6. EEPROM connection diagram.

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Philips Semiconductors

The slave address which ISP1123 uses to access the EEPROM is 1010000B. Page mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be connected to GND (logic 0).

11.3 Data transfer

When the ISP1123 is reset, the I2C-bus interface tries to read 6 bytes of conﬁguration data from an external EEPROM. If no response is detected, the levels on inputs SDA and SCL are interpreted as INDV and OPTION to select the operating mode (see

Table 4).

The data in the EEPROM memory are organized as shown in Table 22.

Table 22: EEPROM organization

Address (Hex)

00 CC idVendor 01 04 idVendor 02 23 idProduct 03 11 idProduct 04 - conﬁguration bits C7 to C0; see Table 23 05 AA signature

Default value (Hex)

Contents

[1]

(lower byte)

[1]

(upper byte)

[2]

(lower byte)

[2]

(upper byte)

ISP1123

USB compound hub

[1] Vendor ID code in the Device descriptor, see Table 10. [2] Product ID code in the Device descriptor, see Table 10.

Table 23: Conﬁguration bits

Bit Function Value

Description

(Bin)

C0 OPTION see Table 4 “Mode selection” C1 INDV see Table 4 “Mode selection” C2 reserved 0 C3 PwrOn2PwrGood

[2]

[1] [1]

must always be programmed to logic 0 100 ms (bPwrOn2PwrGood = 32H)

1 500 ms (bPwrOn2PwrGood = FAH) C4 string descriptor enable 0

[1]

string descriptors disabled

1 string descriptors enabled (strings:

“Philips Semiconductors”, “ISP1122”)

C5 internal analog overcurrent

detection enable

0 internal analog overcurrent detection

circuit disabled; overcurrent pins function as digital inputs (TTL level)

[1]

internal analog overcurrent detection circuit enabled

C7, C6 MaxPower

[3]

[1]

100 mA (MaxPower = 32H) 01 500 mA (MaxPower = FAH) 1X 0 mA (MaxPower = 00H)

OCn

[1] Default value at reset if no external EEPROM is present. [2] Modiﬁes the Hub Descriptor ﬁeld ‘bPwrOn2PwrGood’, see Table 14. [3] Modiﬁes the Hub Descriptor ﬁeld ‘MaxPower’, see Table 14.

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Philips Semiconductors

12. Hub power modes

USB hubs can either be self-powered or bus-powered. Self-powered — Self-powered hubs have a 5 V local power supply on board which

provide power to the hub and the downstream ports. The requires that these hubs limit the current to 500 mA per downstream port and report overcurrent conditions to the host. The hub may optionally draw 100 mA from the USB supply (V

Bus-powered — Bus-powered hubs obtain all power from the host or an upstream self-powered hub. The maximum current is 100 mA per downstream port. Current limiting and reporting of overcurrent conditions are both optional.

Power switchingof downstream ports can be done individually or ganged, where all ports areswitchedsimultaneously with one powerswitch.The ISP1123 supportsboth modes, which can be selected using input INDV (see Table 4).

12.1 Voltage drop requirements

USB Speciﬁcation Rev. 1.1

) to power the interface functions (hybrid-powered).

BUS

ISP1123

USB compound hub

handbook, full pagewidth

POWER SUPPLY

± 3% regulated

12.1.1 Self-powered hubs

Self-powered hubs are required to provide a minimum of 4.75 V to its output port connectors at all legal load conditions. To comply with Underwriters Laboratory Inc. (UL) safety requirements, the power from any port must be limited to 25 W (5 A at 5 V). Overcurrent protection may be implemented on a global or individual basis.

Assuming a 5 V ± 3% power supply the worstcase supply voltage is 4.85 V. This only allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each downstream connector. This includes a voltage drop across:

Power supply connector

•

Hub PCB (power and ground traces, ferrite beads)

•

Power switch (FET on-resistance)

•

Overcurrent sense device.

•

PCB resistance and power supply connector resistance may cause a drop of 25 mV, leaving only 75 mV as the voltage drop allowed across the power switch and overcurrent sense device. The individual voltage drop components are shown in

Figure 7.

5 V

4.85 V(min)

−

ISP1123

power switch

voltage drop

75 mV

low-ohmic

PMOS switch

voltage drop

25 mV

hub board

resistance

4.75 V(min)

(1)

BUS

D+ D− GND SHIELD

MBL088

downstream

port

connector

(1) Includes PCB traces, ferrite beads, etc.

Fig 7. Typical voltage drop components in self-powered mode using individual overcurrent detection.

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Philips Semiconductors

In case of global overcurrent detection an increased voltage drop is needed for the overcurrent sense device (in this case a low-ohmic resistor). This can be realized by using a special power supply of 5.1 V ± 3%, as shown in Figure 8.

ISP1123

USB compound hub

handbook, full pagewidth

5.1 V KICK-UP

POWER SUPPLY

± 3% regulated

4.95 V(min)

−

voltage drop

100 mV

low-ohmic

sense resistor

for overcurrent

detection

voltage drop

ISP1123

power switch

75 mV

PMOS switch

low-ohmic

voltage drop

25 mV

hub board resistance

4.75 V(min)

(1)

BUS

D+ D− GND SHIELD

MBL089

(1) Includes PCB traces, ferrite beads, etc.

Fig 8. Typical voltage drop components in self-powered mode using global overcurrent detection.

12.1.2 Bus-powered hubs

Bus-powered hubs are guaranteed to receive a supply voltage of 4.5 V at the upstream port connector and must provide a minimum of 4.4 V to the downstream port connectors. The voltage drop of 100 mV across bus-powered hubs includes:

Hub PCB (power and ground traces, ferrite beads)

•

Power switch (FET on-resistance)

•

Overcurrent sense device.

•

The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power switch and overcurrent sense device. The voltage drop components are shown in

Figure 9.

downstream

port

connector

For bus-powered hubs overcurrent protection is optional. It may be implemented for all downstream ports on a global or individual basis.

handbook, full pagewidth

upstream

port

connector

BUS

D+ D−

GND

SHIELD

voltage drop

ISP1123

power switch

75 mV

low-ohmic

PMOS switch

(1) Includes PCB traces, ferrite beads, etc.

Fig 9. Typical voltage drop components in bus-powered mode (no overcurrent detection).

voltage drop

25 mV

hub board

resistance

4.40 V(min)4.50 V(min)

(1)

V D+ D− GND SHIELD

BUS

MBL090

downstream

port

connector

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Philips Semiconductors

13. Overcurrent detection

The ISP1123 has an analog overcurrent detection circuit for monitoring downstream port lines. This circuit automatically reports an overcurrent condition to the host and turns off the power to the faulty port. The host must reset the condition ﬂag.

Pins OC1 to OC5/GOC are used for individual port overcurrent detection. Pin OC5/GOC can also be used for global overcurrent detection. This is controlled by input INDV (see Table 4).

The overcurrent detection circuit can be switchedoff using an external EEPROM (see

Table 23). In this case, the overcurrent pins OCn function as logic inputs (TTL level).

13.1 Overcurrent circuit description

The integrated overcurrent detection circuit of ISP1123 senses the voltage drop across the power switch or an extra low-ohmic sense resistor. When the port draws too much current, the voltage drop across the power switch exceeds the trip voltage threshold (∆V switch control signal after a delay of 15 ms (t period to minimizefalsetripping, especially during the inrushcurrent produced by‘hot plugging’ of a USB device.

ISP1123

USB compound hub

). The overcurrent circuit detects this and switches off the power

trip

). This delay acts as a ‘debounce’

trip

13.2 Power switch selection

From the voltage drop analysis given in Figure 7, Figure 8 and Figure 9, the power switch has a voltage drop budget of 75 mV. For individual self-powered mode, the current drawn per port can be up to 500 mA. Thus the power switch should have maximum on-resistance of 150 mΩ.

If the voltage drop due to the hub board resistance can be minimized, the power switch can have more voltage drop budget and therefore a higher on-resistance. Power switcheswith a typical on-resistance of around 100 mΩ ﬁt into this application.

The ISP1123 overcurrent detection circuit has been designed with a nominal trip voltage (∆V

) of 85 mV. This gives a typical trip current of approximately 850 mA for

trip

a power switch with an on-resistance of 100 mΩ1.

13.3 Tuning the overcurrent trip voltage

The ISP1123 trip voltage can optionally be adjusted through external components to set the desired trip current. This is done by inserting tuning resistors at pins SP/BP or OCn (see Figure 10). Rtu tunes up the trip voltage ∆V according to Equation 1.

∆V

with I

trip

ref(nom)

∆V

trip intrinsic()

=5µA and I

⋅ IOCRtd⋅–+=

refRtu

OC(nom)

= 0.5 µA.

and Rtd tunes it down

trip

(1)

1. The following PMOS power switches have been tested to work well with the ISP1123: Philips PHP109, Vishay Siliconix Si2301DS, Fairchild FDN338P.

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Philips Semiconductors

ISP1123

USB compound hub

handbook, halfpage

VCCSP/BP

low-ohmic PMOS switch

ref

OCn

handbook, halfpage

BUS

VCCSP/BP

ISP1123

MBL079

ref(nom)

OC(nom)

=5µA

= 0.5 µA

OC(nom)

= 0.5 µA

a. Self-powered mode. b. Bus-powered mode.

Fig 10. Tuning the overcurrent trip voltage.

13.4 Reference circuits

Some typical examples of port power switching and overcurrent detection modes are given in Figure 11 to Figure 14.

The RC circuit (10 kΩ and 0.1 µF) around the PMOS switch provides for soft turn-on. The series resistor connecting the SP/BP pin to VCC tunes up the overcurrent trip voltage slightly (see Figure 10). In the schematic diagram the resistor separates the net names for pins VCC and SP/BP. This allows an automatic router to use a wide trace for VCC and a narrow trace to connect pin SP/BP.

ISP1123

low-ohmic PMOS switch

OCn

MBL080

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Philips Semiconductors

ISP1123

USB compound hub

handbook, full pagewidth

+4.85 V(min)

100 Ω

1 kΩ

5 V

POWER SUPPLY

± 3%

GND

INDV SP/BP OPTION

PSW1/GL1

PSW2/GL2 PSW3/GL3

PSW4/GL4

PSW5/GL5/GPSW

ISP1123

OC5/GOC

+4.85 V(min)

−

330 kΩ

(5×)

OC1 OC2 OC3 OC4

0.1 µF

10 kΩ

0.1 µF

10 kΩ

0.1 µF

10 kΩ

0.1 µF

10 kΩ

0.1 µF

10 kΩ

low-ohmic

PMOS switch

low-ohmic

PMOS switch

low-ohmic

PMOS switch

low-ohmic

PMOS switch

low-ohmic

PMOS switch

downstream

(min)

ports

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

MBL084

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

Power switches 1 to 5 are low-ohmic PMOS devices as speciﬁed in Section 13.2.

Fig 11. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection.

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Preliminary speciﬁcation Rev. 01 — 5 October 1999 27 of 49

Page 28

Philips Semiconductors

ISP1123

USB compound hub

handbook, full pagewidth

+4.95 V(min)

100 Ω

1 kΩ

5.1 V KICK-UP

POWER SUPPLY

± 3%

GND

INDV SP/BP

OPTION

PSW1/GL1 PSW2/GL2 PSW3/GL3

PSW4/GL4

PSW5/GL5/GPSW

ISP1123

OC5/GOC

+4.95 V(min)

−

OC1 OC2 OC3 OC4

330

downstream

(min)

ports

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

MBL085

ferrite bead

+4.75 V

120

low-ohmic sense resistor for overcurrent detection

kΩ

low-ohmic

PMOS switch

0.1 µF

10 kΩ

µF

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

ferrite bead

+4.75 V

120 µF

Power switch is low-ohmic PMOS device as speciﬁed in Section 13.2.

Fig 12. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 28 of 49

Page 29

Philips Semiconductors

ISP1123

USB compound hub

handbook, full pagewidth

upstream

port

BUS

D+ D−

GND

SHIELD

GND

PSW5/GL5/GPSW

INDV SP/BP OPTION

ISP1123

+4.50 V(min)

330 kΩ

PSW1/GL1

PSW2/GL2

PSW3/GL3

PSW4/GL4

OC1 OC2 OC3 OC4

OC5/GOC

(4×)

0.1 µF

10 kΩ

0.1 µF

10 kΩ

0.1 µF

10 kΩ

0.1 µF

10 kΩ

low-ohmic

PMOS switch

low-ohmic

PMOS switch

low-ohmic

PMOS switch

low-ohmic

PMOS switch

downstream

(min)

ports

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

MBL086

ferrite bead

+4.40 V

120 µF

ferrite bead

+4.40 V

120 µF

ferrite bead

+4.40 V

120 µF

ferrite bead

+4.40 V

120 µF

Power switches 1 to 4 are low-ohmic PMOS devices as speciﬁed in Section 13.2.

Fig 13. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 29 of 49

Page 30

Philips Semiconductors

ISP1123

USB compound hub

handbook, full pagewidth

upstream

port

BUS

D+ D−

GND

SHIELD

GND

PSW5/GL5/GPSW

INDV SP/BP OPTION

ISP1123

+4.50 V(min)

PSW1/GL1 PSW2/GL2 PSW3/GL3

PSW4/GL4

OC1 OC2 OC3 OC4

OC5/GOC

330

downstream

(min)

ports

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

BUS

D+ D− GND SHIELD

MBL087

ferrite bead

+4.40 V

120 µF

kΩ

low-ohmic

PMOS switch

0.1 µF

10 kΩ

ferrite bead

+4.40 V

120 µF

ferrite bead

+4.40 V

120 µF

ferrite bead

+4.40 V

120 µF

Power switch is low-ohmic PMOS device as speciﬁed in Section 13.2.

Fig 14. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 30 of 49

Page 31

Philips Semiconductors

ISP1123

USB compound hub

14. Limiting values

Table 24: Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

latchup

esd

stg

tot

[1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). [2] Values are given for device only; in-circuit V [3] For open-drain pins V

Table 25: Recommended operating conditions

Symbol Parameter Conditions Min Max Unit

I(AI/O)

O(od)

amb

supply voltage −0.5 +6.0 V input voltage −0.5 VCC+ 0.5 V latchup current VI< 0 or VI>V electrostatic discharge voltage ILI<15µA

- 200 mA

[1] [2]

- ±4000

[3]

V storage temperature −60 +150 °C total power dissipation - 95 mW

= ±8000 V.

esd(max)

= ±2000 V.

esd(max)

supply voltage 4.0 5.5 V input voltage 0 5.5 V input voltage on analog I/O pins

0 3.6 V

(D+/D−) open-drain output pull-up voltage 0 5.5 V operating ambient temperature −40 +85 °C

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Preliminary speciﬁcation Rev. 01 — 5 October 1999 31 of 49

Page 32

Philips Semiconductors

ISP1123

USB compound hub

15. Static characteristics

Table 26: Static characteristics; supply pins

VCC= 4.0 to 5.5 V; V

Symbol Parameter Conditions Min Typ Max Unit

reg(3.3)

) suspend supply current 1.5 kΩ pull-up on upstream

CC(susp

[1] In ‘suspend’ mode the minimum voltage is 2.7 V.

regulated supply voltage 3.0 operating supply current - 18 - mA

Table 27: Static characteristics: digital pins

VCC= 4.0 to 5.5 V; V

Symbol Parameter Conditions Min Typ Max Unit

Input levels

LOW-level input voltage - - 0.8 V

HIGH-level input voltage 2.0 - - V

Schmitt trigger inputs

th(LH)

positive-going threshold

voltage V

th(HL)

negative-going threshold

voltage V

hys

hysteresis voltage 0.4 - 0.7 V

Output levels

LOW-level output voltage

(open drain outputs)

Leakage current

input leakage current - - ±1 µA

Open-drain outputs

OFF-state output current - - ±1 µA

GND

=0V; T

=−40 to+85°C; unless otherwise speciﬁed.

amb

port D+ (pin DP0) no pull-up on upstream port

D+ (pin DP0)

=−40 to+85°C; unless otherwise speciﬁed.

amb

IOL= 6 mA - - 0.4 V

=20µA - - 0.1 V

[1]

3.3 3.6 V

- - 270 µA

--80µA

1.4 - 1.9 V

0.9 - 1.5 V

Table 28: Static characteristics: overcurrent sense pins

VCC= 4.0 to 5.5 V; V

GND

=0V; T

=−40 to+85°C; unless otherwise speciﬁed.

amb

Symbol Parameter Conditions Min Typ Max Unit

∆V

trip

[1] Bus-powered mode. [2] Self-powered or hybrid-powered mode.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 32 of 49

overcurrent detection

trip voltage on

OCn pins

∆V=V ∆V=V

CC SP/BP

− V

OCn

− V

OCn

[1]

65 85 105 mV

[2]

Page 33

Philips Semiconductors

ISP1123

USB compound hub

Table 29: Static characteristics: analog I/O pins (D+, D−)

VCC= 4.0 to 5.5 V; V

GND

=0V; T

=−40 to+85°C; unless otherwise speciﬁed.

amb

[1]

Symbol Parameter Conditions Min Typ Max Unit

Input levels

differential input sensitivity |V

differential common mode

− V

I(D+)

| 0.2 - - V

I(D−)

includes VDI range 0.8 - 2.5 V

voltage V

LOW-level input voltage - - 0.8 V

HIGH-level input voltage 2.0 - - V

Output levels

LOW-level output voltage RL= 1.5 kΩ to +3.6V - - 0.3 V

HIGH-level output voltage RL=15kΩ to GND 2.8 - 3.6 V

Leakage current

OFF-state leakage current - - ±10 µA

Capacitance

transceiver capacitance pin to GND - - 20 pF

Resistance

[2]

DRV

INP

driver output impedance steady-state drive 28 - 44 Ω

input impedance 10 - - MΩ

Termination

TERM

[3]

termination voltage for

upstream port pull-up (R

)

3.0

[4]

- 3.6 V

[1] D+ is the USB positive data pin (DPn); D− is the USB negative data pin (DMn). [2] Includes external resistors of 20 Ω±1% on both D+ and D−. [3] This voltage is available at pin V [4] In ‘suspend’ mode the minimum voltage is 2.7 V.

reg(3.3)

16. Dynamic characteristics

Table 30: Dynamic characteristics

VCC= 4.0 to 5.5 V; V

Symbol Parameter Conditions Min Typ Max Unit

Reset

W(RESET)

pulse width on input RESET crystal oscillator running 10 - - µs

Crystal oscillator

XTAL

[1] Dependent on the crystal oscillator start-up time.

crystal frequency - 6 - MHz

GND

=0V; T

=−40 to+85°C; unless otherwise speciﬁed.

amb

crystal oscillator stopped - 2

[1]

-ms

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 33 of 49

Page 34

Philips Semiconductors

ISP1123

USB compound hub

Table 31: Dynamic characteristics: overcurrent sense pins

VCC= 4.0 to 5.5 V; V

Symbol Parameter Conditions Min Typ Max Unit

trip

overcurrent trip response time

from

[1] Operating modes 0, 1, 4 and 5; see Table 4.

GND

=0V; T

=−40 to+85°C; unless otherwise speciﬁed.

amb

OCn LOW to PSWn HIGH

see Figure 15

[1]

--15ms

Table 32: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode

VCC= 4.0 to 5.5 V; V

GND

=0V;T

=−40 to+85°C; CL= 50 pF; RPU= 1.5 kΩon D+to V

amb

[1]

.; unless otherwise speciﬁed.

TERM

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

rise time CL=50pF;

fall time CL=50pF;

FRFM differential rise/fall time

CRS

matching (t

output signal crossover voltage

FR/tFF

)

10 to 90% of |V

− VOL|

4 - 20 ns

[2]

90 - 111.11 %

[2] [3]

1.3 - 2.0 V

Data source timing

DJ1

source differential jitter for

see Figure 16

[2] [3]

−3.5 - +3.5 ns

consecutive transitions t

DJ2

source differential jitter for

see Figure 16

[2] [3]

−4- +4ns

paired transitions t

FEOPT

FDEOP

source EOP width see Figure 17

sourcedifferentialdata-to-EOP

see Figure 17

[3]

160 - 175 ns

[3]

−2- +5ns

transition skew

Receiver timing

JR1

receiverdata jitter tolerance for

see Figure 18

[3]

−18.5 - +18.5 ns

consecutive transitions t

JR2

receiverdata jitter tolerance for

see Figure 18

[3]

−9- +9ns

paired transitions t

FEOPR

receiver SE0 width accepted as EOP;

[3]

82--ns

see Figure 17

FST

width of SE0 during differential

transition

rejected as EOP; see Figure 19

[3]

--14ns

Hub timing (downstream ports conﬁgured as full-speed)

FHDD

FSOP

hub differential data delay

(without cable)

data bit width distortion after

see Figure 20;

=0pF

see Figure 20

[3]

--44ns

[3]

−5- +5ns

SOP t

FEOPD

FHESK

hub EOP delay relative to t

HDD

see Figure 21

hub EOP output width skew see Figure 21

[3]

0 - 15 ns

[3]

−15 - +15 ns

[1] Test circuit; see Figure 23. [2] Excluding the ﬁrst transition from Idle state. [3] Characterized only, not tested. Limits guaranteed by design.

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Preliminary speciﬁcation Rev. 01 — 5 October 1999 34 of 49

Page 35

Philips Semiconductors

ISP1123

USB compound hub

Table 33: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode

VCC= 4.0 to 5.5 V; V

GND

=0V;T

=−40 to+85°C; CL= 50 pF; RPU= 1.5 kΩon D−to V

amb

[1]

; unless otherwise speciﬁed.

TERM

Symbol Parameter Conditions Min Typ Max Unit

Driver characteristics

rise time CL= 200 to 600 pF;

fall time CL= 200 to 600 pF;

LRFM differential rise/fall time

CRS

matching (t

output signal crossover voltage

LR/tLF

)

10 to 90% of |V

− VOL|

75 - 300 ns

[2]

80 - 125 %

[2] [3]

1.3 - 2.0 V

Hub timing (downstream ports conﬁgured as low-speed)

LHDD

LSOP

hub differential data delay see Figure 20 - - 300 ns

data bit width distortion after

see Figure 20

[3]

−60 - +60 ns

SOP t

LEOPD

LHESK

[1] Test circuit: see Figure 23. [2] Excluding the ﬁrst transition from Idle state. [3] Characterized only, not tested. Limits guaranteed by design.

hub EOP delay relative to t

HDD

see Figure 21

hub EOP output width skew see Figure 21

[3]

0 - 200 ns

[3]

−300 - +300 ns

handbook, halfpage

Overcurrent input: OCn; power switch output: PSWn. Reference voltage for overcurrent sensing: VCC (bus-powered mode) or V

overcurrent

input

0 V

power switch

output

0 V

∆V

trip

Fig 15. Overcurrent trip response timing.

trip

MBL032

(self-powered mode).

SP/BP

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 35 of 49

Page 36

Philips Semiconductors

ISP1123

USB compound hub

handbook, full pagewidth

+3.3 V

differential data lines

PERIOD

crossover point

0 V

N × T

is the bit duration corresponding with the USB data rate.

Fig 16. Source differential data jitter.

andbook, full pagewidth

+3.3 V

differential data lines

0 V

PERIOD

crossover point

differential data to

SE0/EOP skew

N × T

PERIOD

consecutive

transitions PERIOD

+ t

DEOP

+ t

DJ1

N × T

paired

transitions PERIOD

crossover point crossover point

+ t

DJ2

crossover point

extended

source EOP width: t receiver EOP width: t

MGR870

EOPT

EOPR

MGR776

is the bit duration corresponding with the USB data rate.

PERIOD

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timings a preﬁx ‘L’.

Fig 17. Source differential data-to-EOP transition skew and EOP width.

handbook, full pagewidth

+3.3 V

differential data lines

PERIOD

0 V

N × T

consecutive

transitions PERIOD

+ t

JR1

N × T

paired

transitions PERIOD

is the bit duration corresponding with the USB data rate.

+ t

JR2

JR1

Fig 18. Receiver differential data jitter.

JR2

MGR871

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Preliminary speciﬁcation Rev. 01 — 5 October 1999 36 of 49

Page 37

Philips Semiconductors

ISP1123

USB compound hub

handbook, halfpage

differential data lines

Fig 19. Receiver SE0 width tolerance.

andbook, full pagewidth

+3.3 V

upstream

differential

data lines

0 V

+3.3 V

downstream

differential

data lines

0 V

crossover

point

hub delay

downstream

HDD

(A) downstream hub delay (B) upstream hub delay

+3.3 V

0 V

crossover

point

FST

downstream

differential

data

upstream

differential

data

IH(min)

MGR872

crossover

point

hub delay

upstream

HDD

crossover

point

MGR777

SOP distortion: t

SOP

= t

HDD (next J)

− t

HDD(SOP)

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timings a preﬁx ‘L’.

Fig 20. Hub differential data delay and SOP distortion.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 37 of 49

Page 38

Philips Semiconductors

+3.3 V

andbook, full pagewidth

upstream

differential

data lines

0 V

EOP−

+3.3 V

downstream

differential

data lines

EOP+

crossover

point

extended

crossover

point

extended

downstream

port

upstream

end of cable

EOP−

ISP1123

USB compound hub

crossover

point

extended

EOP+

crossover

point

extended

0 V

(A) downstream EOP delay (B) upstream EOP delay

EOP delay:

= max (t

EOP

EOP delay relative to t

EOPD

EOP skew:

HESK

= t

EOP

EOP+

EOP−

− t

, t

HDD

EOP−

EOP+

)

MGR778

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timings a preﬁx ‘L’.

Fig 21. Hub EOP delay and EOP skew.

Table 34: Dynamic characteristics: I2C-bus pins (SDA, SCL)

VCC and T

within recommended operating range; V

amb

+5 V; VSS=V

; VIL and VIH between VSS and VDD.

GND

Symbol Parameter Conditions Min Typ Max Unit

SCL

BUF

SU;STA

HD;STA

LOW

HIGH

SU;DAT

HD;DAT

VD;DAT

SCL clock frequency f

= 6 MHz 0 93.75

XTAL

bus free time 4.7 - - µs

START condition set-up time 250 - - ns

hold time START condition 4.0 - - µs

SCL LOW time 4.7 - - µs

SCL HIGH time 4.0 - - µs

SCL and SDA rise time

[2]

- - 1000 ns SCL and SDA fall time - - 300 ns data set-up time 250 - - ns data hold time 0 - - µs SCL LOW to data out valid

- - 0.4 µs

[1]

100 kHz

time

SU;STO

STOP condition set-up time 4.0 - - µs capacitive load for each bus

- - 400 pF line

[1] f

SCL

=1⁄64f

XTAL

[2] Rise time is determined by Cb and pull-up resistor value Rp (typ. 4.7 kΩ).

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 38 of 49

Page 39

Philips Semiconductors

andbook, full pagewidth

SDA

ISP1123

USB compound hub

BUF

SCL

S S

HD;STA

Fig 22. I2C-bus timing.

17. Test information

The dynamic characteristics of the analog I/O ports (D+ and D−) as listed in Table 32 and Table 33, were determined using the circuit shown in Figure 23.

LOW

HD;STA

handbook, halfpage

HIGH

D.U.T.

20 Ω

SU;DAT

test point

15 kΩ

SU;STA

HD;STA

SU;STO

MGR779

reg(3.3)

1.5 kΩ

test

D−/LS D+/LS D−/FS D+/FS

closed

open open

closed

MGR775

Load capacitance:

CL= 50 pF (full-speed mode) CL= 200 pF or 600 pF (low-speed mode, minimum or maximum timing).

Speed selection:

full-speed mode (FS): 1.5 kΩ pull-up resistor on D+ low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.

Fig 23. Load impedance for D+ and D- pins.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 39 of 49

Page 40

Philips Semiconductors

18. Package outline

ISP1123

USB compound hub

SO32: plastic small outline package; 32 leads; body width 7.5 mm

pin 1 index

w M

SOT287-1

detail X

v M

(A )

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT287-1

A1A2A3b

max.

0.3

2.65

0.1

0.012

0.10

0.004

2.45

2.25

0.096

0.086

IEC JEDEC EIAJ

0.25

0.01

0.49

0.36

0.02

0.01

0.27

0.18

0.011

0.007

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1)

20.7

20.3

0.81

0.80

REFERENCES

eHELLpQZywv θ

7.6

7.4

0.30

0.29

1.27

0.050

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.2

1.0

0.047

0.039

0.25 0.1

0.25

0.010.01

EUROPEAN

PROJECTION

0.004

(1)

0.95

0.55

0.037

0.022

ISSUE DATE

95-01-25 97-05-22

Fig 24. SO32 package outline.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 40 of 49

Page 41

Philips Semiconductors

ISP1123

USB compound hub

SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)

seating plane

pin 1 index

SOT232-1

w M

(e )

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT232-1

max.

4.7 0.51 3.8

min.

max.

IEC JEDEC EIAJ

1.3

0.8

0.53

0.40

REFERENCES

cEe M

0.32

0.23

(1) (1)

29.4

28.5

9.1

8.7

(1)

3.2

10.7

2.8

10.2

EUROPEAN

PROJECTION

12.2

10.5

0.181.778 10.16

ISSUE DATE

92-11-17 95-02-04

max.

1.6

Fig 25. SDIP32 package outline.

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 41 of 49

Page 42

Philips Semiconductors

ISP1123

USB compound hub

LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm

24 17

pin 1 index

w M

SOT358-1

(A )

detail X

DIMENSIONS (mm are the original dimensions)

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT358 -1

A1A2A3bpcE

max.

0.20

1.45

1.60

0.05

0.25

1.35

IEC JEDEC EIAJ

w M

0.4

0.3

0 2.5 5 mm

(1)

(1) (1)(1)

0.18

0.12

7.1

6.9

REFERENCES

Fig 26. LQFP32 package outline.

v M

scale

9.15

0.8

8.85

9.15

8.85

0.75

0.45

0.25 0.11.0 0.2

EUROPEAN

PROJECTION

0.9

0.5

Zywv θ

0.9

0.5

ISSUE DATE

95-12-19 97-08-04

9397 750 06325

Preliminary speciﬁcation Rev. 01 — 5 October 1999 42 of 49

Page 43

Philips Semiconductors

19. Soldering

19.1 Introduction

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

Packages

There is no soldering method that is ideal for all IC packages. Wavesoldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reﬂow soldering is often used.

19.2 Surface mount packages

19.2.1 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

ISP1123

USB compound hub

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

Several methods exist for reﬂowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C.

19.2.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high

•

upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e):

•

– larger than or equal to 1.27 mm, the footprintlongitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45° angle

•

to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

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Philips Semiconductors

During placement and before soldering, the package must be ﬁxed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most applications.

19.2.3 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

19.3 Through-hole mount packages

19.3.1 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

ISP1123

USB compound hub

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speciﬁed maximum storage temperature (T If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

19.3.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

stg(max)

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19.4 Package related soldering information

Table 35: Suitability of IC packages for wave, reﬂow and dipping soldering methods

Mounting Package Soldering method

Through-hole mount

Surface mount BGA, LFBGA, SQFP,

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

[2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

[3] These packages are notsuitable for wavesoldering asa solder joint between the printed-circuit board

[4] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

[5] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

[6] Wave soldering is only suitable forSSOP and TSSOP packages with apitch (e) equal to or larger than

ISP1123

USB compound hub

Wave Reﬂow

DBS, DIP, HDIP, SDIP, SIL suitable

[2]

not suitable suitable −

TFBGA HLQFP, HSQFP, HSOP,

not suitable

[3]

HTQFP, HTSSOP, SMS

[4]

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended

maximum temperature (with respect to time) and body sizeofthe package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

Circuit Packages; Section: Packing Methods

printed-circuit board.

and heatsink (at bottom version) can not be achieved, and as solder may stickto the heatsink (on top version).

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

than 0.8 mm; it is deﬁnitely not suitable for packageswith a pitch (e) equal to or smaller than 0.65 mm.

0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

, SO, SOJ suitable suitable −

[4] [5] [6]

Data Handbook IC26; Integrated

[1]

Dipping

− suitable

suitable −

suitable − suitable −

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20. Revision history

Table 36: Revision history

Rev Date CPCN Description

01 19991005 Preliminary speciﬁcation; initial version.

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USB compound hub

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21. Data sheet status

ISP1123

USB compound hub

Datasheet status Product status Deﬁnition

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for product development. Speciﬁcation may

change in any manner without notice.

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

22. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

23. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors

[1]

customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speciﬁed.

24. Licenses

Purchase of Philips I2C components

Purchase of Philips I under the Philips’ I

C system provided the system conforms to the I2C

I speciﬁcation deﬁned by Philips. This speciﬁcation can be ordered using the code 9398 393 40011.

C components conveys a license

C patent to use the components in the

25. Trademarks

ACPI — is an open industry speciﬁcation for PC power management,

co-developed by Intel Corp., Microsoft. and Toshiba

GoodLink — is a trademark of Philips Electronics LazyClock — is a trademark of Philips Electronics

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OnNow — is a trademark of Microsoft SMBus — is a bus speciﬁcation for PC power management, developed by

Intel Corp. based on the I2C-bus from Philips Electronics SoftConnect — is a trademark of Philips Electronics

Page 48

Philips Semiconductors

USB compound hub

Philips Semiconductors - a worldwide company

ISP1123

Argentina: see South America Australia: Tel. +61 29 805 4455, Fax. +61 29 805 4466 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 14 099 6161, Fax. +33 14 099 6427 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: see Austria India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 02 67 52 2531, Fax.+39 02 67 52 2557 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy

Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax.+41 14 81 7730 Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874 Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 62 5344, Fax.+381 11 63 5777

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825

Internet: http://www.semiconductors.philips.com

(SCA65)

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Contents

ISP1123

USB compound hub

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 ISP1123D (SO32) and ISP1123NB (SDIP32) . 3

6.1.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 ISP1123BD (LQFP32) . . . . . . . . . . . . . . . . . . . 6

6.2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6

7 Functional description . . . . . . . . . . . . . . . . . . . 8

7.1 Analog transceivers . . . . . . . . . . . . . . . . . . . . . 8

7.2 Philips Serial Interface Engine (SIE). . . . . . . . . 9

7.3 Hub repeater. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

7.4 End-of-frame timers . . . . . . . . . . . . . . . . . . . . . 9

7.5 General and individual port controller. . . . . . . . 9

7.6 GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

7.7 Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . . 9

7.8 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . 9

7.9 PLL clock multiplier. . . . . . . . . . . . . . . . . . . . . 10

7.10 Overcurrent detection . . . . . . . . . . . . . . . . . . . 10

7.11 I

C-bus interface. . . . . . . . . . . . . . . . . . . . . . . 10

8 Modes of operation . . . . . . . . . . . . . . . . . . . . . 10

9 Endpoint descriptions. . . . . . . . . . . . . . . . . . . 11

9.1 Hub endpoint 0 (control). . . . . . . . . . . . . . . . . 11

9.2 Hub endpoint 1 (interrupt). . . . . . . . . . . . . . . . 11

10 Host requests. . . . . . . . . . . . . . . . . . . . . . . . . . 12

10.1 Standard requests . . . . . . . . . . . . . . . . . . . . . 12

10.2 Hub specific requests . . . . . . . . . . . . . . . . . . . 13

10.3 Descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

10.4 Hub responses . . . . . . . . . . . . . . . . . . . . . . . . 18

10.4.1 Get device status . . . . . . . . . . . . . . . . . . . . . . 18

10.4.2 Get configuration . . . . . . . . . . . . . . . . . . . . . . 18

10.4.3 Get interface status. . . . . . . . . . . . . . . . . . . . . 18

10.4.4 Get hub status . . . . . . . . . . . . . . . . . . . . . . . . 19

10.4.5 Get port status . . . . . . . . . . . . . . . . . . . . . . . . 19

10.4.6 Get configuration descriptor . . . . . . . . . . . . . . 20

10.4.7 Get device descriptor . . . . . . . . . . . . . . . . . . . 20

10.4.8 Get hub descriptor . . . . . . . . . . . . . . . . . . . . . 20

10.4.9 Get string descriptor (0) . . . . . . . . . . . . . . . . . 20

10.4.10 Get string descriptor (1) . . . . . . . . . . . . . . . . . 20

10.4.11 Get string descriptor (2) . . . . . . . . . . . . . . . . . 20

11 I

C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 21

11.1 Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

11.2 Hardware connections . . . . . . . . . . . . . . . . . . 21

11.3 Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . 22

12 Hub power modes . . . . . . . . . . . . . . . . . . . . . . 23

12.1 Voltage drop requirements . . . . . . . . . . . . . . . 23

12.1.1 Self-powered hubs . . . . . . . . . . . . . . . . . . . . . 23

12.1.2 Bus-powered hubs . . . . . . . . . . . . . . . . . . . . . 24

13 Overcurrent detection . . . . . . . . . . . . . . . . . . . 25

13.1 Overcurrent circuit description . . . . . . . . . . . . 25

13.2 Power switch selection . . . . . . . . . . . . . . . . . . 25

13.3 Tuning the overcurrent trip voltage . . . . . . . . . 25

13.4 Reference circuits . . . . . . . . . . . . . . . . . . . . . . 26

14 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 31

15 Static characteristics. . . . . . . . . . . . . . . . . . . . 32

16 Dynamic characteristics . . . . . . . . . . . . . . . . . 33

17 Test information. . . . . . . . . . . . . . . . . . . . . . . . 39

18 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 40

19 Soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

19.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 43

19.2 Surface mount packages . . . . . . . . . . . . . . . . 43

19.2.1 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 43

19.2.2 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 43

19.2.3 Manual soldering. . . . . . . . . . . . . . . . . . . . . . . 44

19.3 Through-hole mount packages . . . . . . . . . . . . 44

19.3.1 Soldering by dipping or by solder wave . . . . . 44

19.3.2 Manual soldering. . . . . . . . . . . . . . . . . . . . . . . 44

19.4 Package related soldering information . . . . . . 45

20 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 46

21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 47

22 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

23 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

24 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

25 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Date of release: 5 October 1999 Document order number: 9397 750 06325