Datasheet ISL9V5036P3, ISL9V5036S3S Datasheet (Fairchild Semiconductor)

ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
EcoSPARKTM 500mJ, 360V, N-Channel Ignition IGBT
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
September 2002
General Description
The ISL9V5036S3S, ISL9V5036P3, and ISL9V5036S3 are the next generation IGBTs that offer outstanding SCIS capability in the D² ­Pak (TO-263) and TO-220 plastic package. These devices are intended for use in automotive ignition circuits, specifically as coil drivers. Internal diodes provide voltage clamping without the need for external components.
EcoSPARK™ devices can be custom made to specific clamp voltages. Contact your nearest Fairchild sales office for more information.
Formerly Developmental Type 49443
Package
JEDEC TO-263AB
D²-Pak
G
E
COLLECTOR
(FLANGE)
Device Maximum Ratings T
JEDEC TO-220AB
JEDEC TO-262AA
E
C
G
COLLECTOR
(FLANGE)
= 25°C unless otherwise noted
A
Applications
• Automotive Ignition Coil Driver Circuits
• Coil- On Plug Applications
Features
• Industry Standard D-Pak package
• SCIS Energy = 500mJ at T
• Logic Level Gate Drive
= 25oC
J
Symbol
E
C
G
GATE
R
1
R
2
COLLECTOR
EMITTER
Symbol Parameter Ratings Units
E
SCIS25
E
SCIS150
I
C25
I
C110
V
GEM
P
T
T
STG
T
T
CER ECS
pkg
Collector to Emitter Breakdown Voltage (IC = 1 mA) 390 V Emitter to Collector Voltage - Reverse Battery Condition (IC = 10 mA) 24 V At Starting TJ = 25°C, I At Starting TJ = 150°C, I
= 38.5A, L = 670 µHy 500 mJ
SCIS
= 30A, L = 670 µHy 300 mJ
SCIS
Collector Current Continuous, At TC = 25°C, See Fig 9 46 A Collector Current Continuous, At TC = 110°C, See Fig 9 31 A Gate to Emitter Voltage Continuous ±10 V Power Dissipation Total TC = 25°C 250 W
D
Power Dissipation Derating T Operating Junction Temperature Range -40 to 175 °C
J
> 25°C 1.67 W/°C
C
Storage Junction Temperature Range -40 to 175 °C Max Lead Temp for Soldering (Leads at 1.6mm from Case for 10s) 300 °C
L
Max Lead Temp for Soldering (Package Body for 10s) 260 °C
ESD Electrostatic Discharge Voltage at 100pF, 1500 4kV
©2002 Fairchild Semiconductor Corporation
ISL9V5036S3S / ISl9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
Package Marking and Ordering Information
Device Marking Device Package Tape Width Quantity
V5036S ISL9V5036S3S TO-263AB 24mm 800 V5036P ISL9V5036P3 TO-220AA - ­V5036S ISL9V5036S3 TO-262AA - -
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
Electrical Characteristics
TA = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off State Characteristics
BV
BV
BV
I
CER
I
ECS
R R
Collector to Emitter Breakdown Voltage IC = 2mA, VGE = 0,
CER
Collector to Emitter Breakdown Voltage IC = 10mA, VGE = 0,
CES
Emitter to Collector Breakdown Voltage IC = -75mA, VGE = 0V,
ECS
Gate to Emitter Breakdown Voltage I
GES
Collector to Emitter Leakage Current V
Emitter to Collector Leakage Current VEC = 24V , See
Series Gate Resistance - 75 -
1
Gate to Emitter Resistance 10K - 30K
2
= 1KΩ, See Fig. 15
R
G
= -40 to 150°C
T
J
R
= 0, See Fig. 15
G
= -40 to 150°C
T
J
= 25°C
T
C
= ± 2mA ±12 ±14 - V
GES
= 250V,
CER
R
= 1KΩ,
G
See Fig. 11
= 25°C- - 25 µA
T
C
= 150°C- - 1 mA
T
C
TC = 25°C- - 1 mA
Fig. 11
T
= 150°C- - 40 mA
C
330 360 390 V
360 390 420 V
30 - - V
On State Characteristics
V
CE(SAT)
V
CE(SAT)
Collector to Emitter Saturation Voltage IC = 10A,
= 4.0V
V
GE
Collector to Emitter Saturation Voltage IC = 15A,
= 4.5V
V
GE
T
= 25°C,
C
- 1.17 1.60 V
See Fig. 4 T
= 150°C - 1.50 1.80 V
C
Dynamic Characteristics
Q
G(ON)
V
GE(TH)
V
GEP
Switching Characteristics
t
d(ON)R
t
t
d(OFF)L
Gate Charge IC = 10A, VCE = 12V,
Gate to Emitter Threshold Voltage IC = 1.0mA,
Gate to Emitter Plateau Voltage IC = 10A,
Current T urn-On Delay Time-Resistive V Current Rise Time-Resistive - 2.1 7 µs
rR
Current T urn-Off Delay Time-Inductive V Current Fall Time-Inductive - 2.8 15 µs
t
fL
SCIS Self Clamped Inductive Switching T
= 5V, See Fig. 14
V
GE
V
= V
CE
GE,
See Fig. 10
= 12V
V
CE
= 14V, RL = 1Ω,
CE
= 5V, RG = 1K
V
GE
T
= 25°C, See Fig. 12
J
= 300V, RL = 46Ω,
CE
= 5V, RG = 1K
V
GE
= 25°C, See Fig. 12
T
J
= 25°C, L = 670 µH,
J
R
= 1KΩ, VGE = 5V, See
G
= 25°C1.3 - 2.2 V
T
C
T
= 150°C0.75 - 1.8 V
C
Fig. 1 & 2
-32-nC
-3.0- V
-0.74µs
- 4.8 15 µs
- - 500 mJ
Thermal Characteristics
R
©2002 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
Thermal Resistance Junction-Case T O-263, TO-220 - - 0.6 °C/W
θJC
Typical Characteristics
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
45
40
35
30
25
20
15
10
, INDUCTIVE SWITCHING CURRENT (A)
5
SCIS
I
0
TJ = 150°C
SCIS Curves valid for V
RG = 1KΩ, VGE = 5V,Vdd = 14V
TJ = 25°C
Voltages of <390V
clamp
t
, TIME IN CLAMP (µS)
CLP
350300025010050 150 200
Figure 1. Self Clamped Inductive Switching
Current vs Time in Clamp
1.10 ICE = 6A
1.05
VGE = 3.7V
1.00
0.95
0.90
, COLLECTOR TO EMITTER VOLTAGE (V)
CE
V
0.85
VGE = 4.5V
VGE = 5.0V
VGE = 8.0V
25-25 17512575-50 0 50 100 150
, JUNCTION TEMPERATURE (°C)
T
J
VGE = 4.0V
Figure 3. Collector to Emitter On-State Voltage vs
Junction Temperature
45
40
35
30
25
20
15
10
, INDUCTIVE SWITCHING CURRENT (A)
5
SCIS
I
0
0102468
TJ = 150°C
SCIS Curves valid for V
RG = 1KΩ, VGE = 5V,Vdd = 14V
Voltages of <390V
clamp
L, INDUCTANCE (mHy)
TJ = 25°C
Figure 2. Self Clamped Inductive Switching
Current vs Inductance
1.25 ICE = 10A
1.20
1.15
1.10
1.05
, COLLECTOR TO EMITTER VOLTAGE (V)
CE
V
1.00
VGE = 4.5V
VGE = 5.0V
T
J
VGE = 3.7V
VGE = 8.0V
25-25 17512575-50 0 50 100 150
, JUNCTION TEMPERATURE (°C)
VGE = 4.0V
Figure 4. Collector to Emitter On-State Voltage
vs Junction Temperature
50
VGE = 8.0V VGE = 5.0V
40
VGE = 4.5V VGE = 4.0V VGE = 3.7V
30
20
10
, COLLECTOR TO EMITTER CURRENT (A)
CE
I
0
02.01.0 3.0 4.0 VCE, COLLECTOR TO EMITTER VOLTAGE (V)
TJ = - 40°C
Figure 5. Collector Current vs Collector Emitter
On-State Voltage
©2002 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
50
VGE = 8.0V VGE = 5.0V
40
VGE = 4.5V VGE = 4.0V VGE = 3.7V
30
20
10
, COLLECTOR TO EMITTER CURRENT (A)
CE
I
0
02.01.0 3.0 4.0 VCE, COLLECTOR TO EMITTER VOLTAGE (V)
TJ = 25°C
Figure 6. Collector Current vs Collector Emitter
On-State Voltage
Typical Characteristics (Continued)
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
50
VGE = 8.0V
VGE = 5.0V VGE = 4.5V
40
VGE = 4.0V VGE = 3.7V
30
20
10
, COLLECTOR TO EMITTER CURRENT (A)
CE
I
0
02.01.0 3.0 4.0 VCE, COLLECTOR TO EMITTER VOLTAGE (V)
TJ = 175°C
Figure 7. Collector to Emitter On-State Voltage vs
Collector Current
50
VGE = 4.0V
40
30
20
, DC COLLECTOR CURRENT (A)
10
CE
I
50
DUTY CYCLE < 0.5%, VCE = 5V
PULSE DURATION = 250µs
40
30
20
10
, COLLECTOR TO EMITTER CURRENT (A)
CE
I
0
TJ = 175°C
TJ = 25°C
2.51.5 3.5 4.5
2.01.0 3.0 4.0
VGE, GATE TO EMITTER VOLTAGE (V)
Figure 8. Transfer Characteristics
2.0
1.8
1.6
1.4
, THRESHOLD VOLTAGE (V)
TH
V
1.2
TJ = -40°C
VCE = VGE ICE = 1mA
0
25 1751257550 100 150
TC, CASE TEMPERATURE (°C)
Figure 9. DC Collector Current vs Case
Temperature
10000
V
= 24V
ECS
1000
100
10
LEAKAGE CURRENT (µA)
1
0.1 25-25 17512575-50 0 50 100 150
TJ, JUNCTION TEMPERATURE (°C)
V
CES
V
= 300V
= 250V
CES
Figure 11. Leakage Current vs Junction
Temperature
©2002 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
1.0
-50 7525-25
TJ JUNCTION TEMPERATURE (°C)
1500 125
Figure 10. Threshold Voltage vs Junction
Temperature
20
ICE = 6.5A, VGE = 5V, RG = 1K
18
16
14
12
10
8
SWITCHING TIME (µS)
6
4
2
25 1751257550 100 150
TJ, JUNCTION TEMPERATURE (°C)
Resistive t
Inductive t
Resistive t
Figure 12. Switching Time vs Junction
Temperature
17550 100
OFF
OFF
ON
Typical Characteristics (Continued)
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
3000
2500
2000
C
1500
1000
C, CAPACITANCE (pF)
500
0
IES
C
RES
0105 152025
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
FREQUENCY = 1 MHz
C
OES
Figure 13. Capacitance vs Collector to Emitter
Voltage
360
I
= 10mA
CER
358 356 354 352 350 348 346
, BREAKDOWN VOLTAGE (V)
CER
344
BV
342 340
10 20001000 3000
100
RG, SERIES GATE RESISTANCE (kΩ)
TJ = 175°C
8
I
= 1mA, RL = 0.6Ω, TJ = 25°C
G(REF)
7
6
5
V
= 12V
CE
4
3
2
, GATE TO EMITTER VOLTAGE (V)
GE
V
1
0
0 10203040
VCE = 6V
Q
, GATE CHARGE (nC)
G
Figure 14. Gate Charge
TJ = 25°C
50
TJ = - 40°C
Figure 15. Breakdown Voltage vs Series Gate Resistance
0
10
0.5
0.2
0.1
-1
10
10
10
, NORMALIZED THERMAL RESPONSE
thJC
Z
10
0.05
0.02
0.01
-2
-3
SINGLE PULSE
-4
-6
10
-5
10
-4
10
T1, RECTANGULAR PULSE DURATION (s)
10
DUTY FACTOR, D = t1 / t PEAK TJ = (PD X Z
-3
t
1
P
D
t
2
2
X R
θ
JC
-2
10
) + T
θ
JC
C
-1
10
Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case
©2002 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
Test Circuits and Waveforms
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
L
C
R
PULSE
GEN
G
DUT
G
E
Figure 17. Inductive Switching Test Circuit
V
CE
L
TO OBTAIN
VARY t
P
REQUIRED PEAK I
V
GS
t
0V
P
AS
R
G
DUT
I
AS
0.01
V
CE
R
or
LOAD
L
C
5V
RG = 1K
G
DUT
+
V
CE
-
E
Figure 18. t
+
V
DD
-
0
ON
and t
I
AS
Switching Test Circuit
OFF
BV
CES
t
P
t
AV
V
CE
V
DD
Figure 19. Energy Test Circuit Figure 20. Energy Waveforms
©2002 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3
SPICE Thermal Model
REV 1 May 2002 ISL9V5036S3S / ISL9V3536P3 / ISL9V5036S3 CTHERM1 th 6 4.0e2
CTHERM2 6 5 3.6e-3 CTHERM3 5 4 4.9e-2 CTHERM4 4 3 3.2e-1 CTHERM5 3 2 3.0e-1 CTHERM6 2 tl 1.6e-2
RTHERM1 th 6 1.0e-2 RTHERM2 6 5 1.4e-1 RTHERM3 5 4 1.0e-1 RTHERM4 4 3 9.0e-2 RTHERM5 3 2 9.4e-2 RTHERM6 2 tl 1.9e-2
SABER Thermal Model
SABER thermal model ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 t h 6 = 4.0e2 ctherm.ctherm2 6 5 = 3.6e-3 ctherm.ctherm3 5 4 = 4.9e-2 ctherm.ctherm4 4 3 = 3.2e-1 ctherm.ctherm5 3 2 = 3.0e-1 ctherm.ctherm6 2 tl = 1.6e-2
rtherm.rtherm1 th 6 = 1.0e-2 rtherm.rtherm2 6 5 = 1.4e-1 rtherm.rtherm3 5 4 = 1.0e-1 rtherm.rtherm4 4 3 = 9.0e-2 rtherm.rtherm5 3 2 = 9.4e-2 rtherm.rtherm6 2 tl = 1.9e-2 }
RTHERM1
RTHERM2
RTHERM3
RTHERM4
RTHERM5
JUNCTION
th
CTHERM1
6
CTHERM2
5
CTHERM3
4
CTHERM4
3
CTHERM5
2
RTHERM6
tl
©2002 Fairchild Semiconductor Corporation ISL9V5036S3S / ISL9V5036P3 / ISL9V5036S3 Rev. C1, September 2002
CTHERM6
CASE
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LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or In Design
First Production
Full Production
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
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Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I1
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