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查询IRF054供应商
PD - 90640
REPETITIVE A V ALANCHE AND dv/dt RA TED IRF054
HEXFETTRANSISTORS
60V, N-CHANNEL
THRU-HOLE (TO-204AA/AE)
Product Summary
Part Number BVDSS RDS(on) ID
IRF054 60V 0.022Ω 45A*
The HEXFETtechnology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resistance combined with high transconductance; superior reverse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well established advantages of MOSFETs such as voltage control,
very fast switching, ease of paralleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
Features:
n Repetitive Avalanche Ratings
n Dynamic dv/dt Rating
n Hermetically Sealed
n Simple Drive Requirements
n Ease of Paralleling
TO-3
Absolute Maximum Ratings
Parameter Units
ID @ VGS = 0V, TC = 25°C Continuous Drain Current 45 *
ID @ VGS =0V, TC = 100°C Continuous Drain Current 3 1
I
DM
PD @ TC = 25°C Max. Power Dissipation 15 0 W
V
GS
E
AS
I
AR
E
AR
dv/dt Peak Diode Recovery dv/dt ➂ 4.5
T
J
T
STG
* Current limited by pin diameter.
For footnotes refer to the last page
Pulsed Drain Current ➀ 220
Linear Derating Factor 1. 2 W/°C
Gate-to-Source Voltage ±20 V
Single Pulse Avalanche Energy ➁ 480 mJ
Avalanche Current ➀ -A
Repetitive Avalanche Energy ➀ -m J
Operating Junction -55 to 150
Storage Temperature Range
Lead Temperature 300 (0.063 in. (1.6mm) from case for 10s)
Weight 11.5(typical) g
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A
V/ns
o
C
01/24/01
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IRF054
Electrical Characteristics @ Tj = 25°C (Unless Otherwise Specified)
Parameter Min Typ Max Units Test Conditions
BV
∆ BV
R
V
g
I
I
I
Q
Q
Q
t
t
t
t
L
C
C
C
DSS
GSS
GSS
d(on)
d(off)
DSS
DSS
DS(on)
GS(th)
fs
g
gs
gd
r
f
S + LD
iss
oss
rss
Drain-to-Source Breakdown Voltage 6 0 — — V VGS = 0V, ID = 1.0mA
/∆ TJTemperature Coefficient of Breakdown — 0.68 — V/°C Reference to 25°C, ID = 1.0mA
Voltage
Static Drain-to-Source On-State — — 0.02 2 VGS = 10V, ID = 31A ➃
Resistance — — 0.025 V GS = 10V, ID =45A ➃
Gate Threshold Voltage 2. 0 — 4.0 V VDS = VGS, ID =250µA
Forward Transconductance 2 0 — — S ( )V DS > 15V, IDS = 31A ➃
Zero Gate Voltage Drain Current — — 2 5 VDS= 48V ,VGS=0V
— — 250 VDS = 48V
Gate-to-Source Leakage Forward — — 1 00 VGS = 20V
Gate-to-Source Leakage Reverse — — -100 VGS = -20V
Total Gate Charge 8 0 — 18 0 VGS =10V, ID =45A
Gate-to-Source Charge 2 0 — 4 5 nC VDS = 30V
Gate-to-Drain (‘Miller’) Charge 3 4 — 1 05
Turn-On Delay Time — — 3 3 VDD =30V, ID =45A,
Rise Time — — 1 80 RG =2.35Ω
Turn-Off Delay Time — — 10 0
Fall Time — — 1 00
Total Inductance — 6 .1 —
Input Capacitance — 4600 VGS = 0V, VDS = 25V
Output Capacitance — 2000 — pF f = 1.0MHz
Reverse Transfer Capacitance — 3 40 —
Ω
Ω
µA
nA
ns
nH
VGS = 0V, TJ = 125°C
Measured from drain lead (6mm/0.25in. from
package) to source lead (6mm/0.25in. from
package)
Source-Drain Diode Ratings and Characteristics
Parameter Min Typ Max Units Test Conditions
I
Continuous Source Current (Body Diode) — — 45 *
S
I
Pulse Source Current (Body Diode) ➀ — — 220
SM
V
Diode Forward Voltage — — 2.5 V Tj = 25°C, IS = 45A, VGS = 0V ➃
SD
t
Reverse Recovery Time — — 28 0 nS Tj = 25°C, IF = 45A, di/dt ≤ 100A/µs
rr
Q
Reverse Recovery Charge — — 2 .2 µC VDD ≤ 50V ➃
RR
t
Forward Turn-On Time Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L
on
*Current limited by pin diameter.
A
S
Thermal Resistance
Parameter Min Typ Max Units Test Conditions
R
thJC
R
thJA
For footnotes refer to the last page
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Junction to Case — — 0.83
Junction to Ambient — — 30 Typical socket mount
°C/W
+ LD.
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IRF054
Fig 2. Typical Output Characteristics Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
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IRF054
13 a& b
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode
Forward Voltage
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 8. Maximum Safe Operating Area
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Fig 9. Maximum Drain Current Vs.
Case Temperature
R
V
DS
V
GS
R
G
D
D.U.T.
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Fig 10a. Switching Time Test Circuit
V
DS
90%
10%
V
GS
t
d(on)tr
t
d(off)tf
Fig 10b. Switching Time Waveforms
IRF054
+
V
DD
-
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRF054
15V
DRIVER
R
G
10V
20 V
V
DS
t
L
D.U.T
I
AS
0.01
p
Ω
Fig 12a. Unclamped Inductive Test Circuit
V
(BR)DSS
t
p
I
AS
Fig 12b. Unclamped Inductive Waveforms
Q
G
10 V
Q
GS
Q
GD
+
V
DD
-
A
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
Current Regulator
Same Type as D.U.T.
50KΩ
12V
.2µF
.3µF
D.U.T.
+
V
DS
-
V
V
G
Charge
Fig 13a. Basic Gate Charge Waveform
GS
3mA
I
G
Current Sampling Resistors
I
D
Fig 13b. Gate Charge Test Circuit
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Foot Notes:
➂ I
➀ Repetitive Rating; Pulse width limited by
maximum junction temperature.
➁ V
= 25V, starting TJ = 25°C,
DD
Peak IL = 45A,
≤ 45A, di/dt ≤ 200A/µ s,
SD
VDD≤ 60V, TJ ≤ 150°C
Suggested RG =2.35 Ω
➃ Pulse width ≤ 300 µ s; Duty Cycle ≤ 2%
Case Outline and Dimensions —TO-204AE (Modified TO-3)
IRF054
IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200
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IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936
Data and specifications subject to change without notice. 1/01
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