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5mm Infrared LED
IR323/H0-A
Features
․High reliability
․High radiant intensity
․Peak wavelength λp=940nm
․2.54mm Lead spacing
․Low forward voltage
․Pb Free
․This product itself will remain within RoHS compliant version.
Description
․ EVERLIGHT’s Infrared Emitting Diode (IR323/H0-A) is a
high intensity diode , molded in a blue transparent plastic package.
․ The device is spectrally matched with phototransistor , photodiode
and infrared receiver module.
Applications
․ Infrared applied system
Copyright © 2010, Everlight All Rights Reserved. Release Date : MAY.23.2013 Issue No: DIR-0000935
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Device Selection Guide
Chip
Materials
Lens Color
GaAlAs Blue
Absolute Maximum Ratings (Ta=25℃ )
Parameter Symbol Rating Unit
Continuous Forward Current I
Peak Forward Current(*1) I
Reverse Voltage V
Operating Temperature T
Storage Temperature T
Soldering Temperature(*2) T
F
FP
R
opr
stg
sol
Power Dissipation at (or below)
P
25℃ Free Air Temperature
d
Notes: *1:IFP Conditions--Pulse Width ≦100μs and Duty ≦ 1%.
*2:Soldering time
≦ 5 seconds.
100
1.0
5
-40 ~ +85
-40 ~ +100
260
150
mA
A
V
℃
℃
℃
mW
2
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Electro-Optical Characteristics (Ta=25℃ )
Parameter Symbol Min. Typ. Max. Unit Condition
Radiant Intensity
Peak Wavelength
Spectral Bandwidth
Forward Voltage
Reverse Current
View Angle
Rank
Condition:I
Bin Number
=20mA Unit: mW/sr
F
I
e
2.0 3.5 -----
----- 15 -----
λp
Δλ
----- 940 -----
----- 45 -----
----- 1.2 1.5
VF
----- 1.4 1.8
I
R
2θ1/2
---- ---- 10
---- 60 ----
H J K
mW/sr
nm I
nm I
V
uA V
deg I
I
=20mA
F
=100mA
I
F
=20mA
F
=20mA
F
=20mA
I
F
=100mA
I
F
=5V
R
=20mA
F
Min
Max
2.0 2.8 4.0
3.2 4.5 6.4
3
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Typical Electro-Optical Characteristics Curves
Forward Current vs. Ambient Temperature Spectral Distribution
140
120
1.0
100
80
60
40
0.8
0.6
0.4
20
0.2
Relative Radinat Intensity (%)
0
40
-40 -20
Radiant Intensity vs. Forward Current Relative Radiant Intensity vs. Angular Displacement
100
80
20 0
60 100 80
0.0
700 750 800 850 900 950 1000 1050
Wavelength (nm)
-20
-10
0 20 10
30
60
40
20
Ie-Radiant Intensity(mW/sr)
0
0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10
4
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IF-Forward Current (A)
1.0
0.9
0.8
0.7
0.6
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0.2 0.4 0 0.2 0.4 0.6
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40
50
60
70
80
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Package Dimension
Note: Tolerances unless dimensions ±0.25mm
5
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Label Form Specification
Pb
CPN :
P N : XXXXXXXXXXXXX
XXXXXXXXXXXXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
EVERLIGHT
RoHS
CAT : XXX
HUE : XXX
REF : XXX
CPN: Customer’s Product Number‧
P/N: Product Number‧
QTY: Packing Quantity‧
CAT: Luminous Intensity Rank‧
HUE: Dom. Wavelength Rank‧
REF: Forward Voltage Rank‧
LOT No: Lot Number
‧
‧X: Month
Reference: Identify Label Number
‧
Packing Specification
■ Anti- electrostatic bag ■ Inner Carton ■ Outside Carton
■ Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits
are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a
nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
300
Temp. at tip of iron
Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max
Distance 3mm Min.(From solder
Recommended soldering profile
Fluxing
℃ Max. (30W Max.)
joint to epoxy bulb)
Prehead
Preheat temp.
Distance 3mm Min. (From solder
laminar wave
100
℃ Max. (60 sec Max.)
joint to epoxy bulb)
Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering.
Dip and hand soldering should not be done more than one time
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to
room temperature.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
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DATASHEET
5.0mm Infrared LED
IR323/H0-A
Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest
possible temperature is desirable for the LEDs.
Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder
wave.
4. Cleaning
When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than
one minute. Dry at room temperature before use.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to
ensure this will not cause damage to the LED
5. Heat Management
Heat management of LEDs must be taken into consideration during the design stage of LED application. The current
should be de-rated appropriately by referring to the de-rating curve found in each product specification.
The temperature surrounding the LED in the application should be controlled. Please refer to the data sheet de-rating
curve.
6. ESD (Electrostatic Discharge)
Electrostatic discharge (ESD) or surge current (EOS) can damage LEDs.
An ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling LEDs.
All devices, equipment and machinery must be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic lens as a result of
friction between LEDs during storage and handing.
7. Other
Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above
specification.
When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these
specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does
not comply
with the absolute maximum ratings and the instructions included in these specification sheets.
These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t
reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.
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Copyright © 2010, Everlight All Rights Reserved. Release Date : MAY.23.2013. Issue No: DIR-0000935
LifecyclePhase:
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Expired Period: Forever