(NOTE: For new designs, we recommend IR’s new products
SELF-OSCILLATING HALF-BRIDGE DRIVER
Features
Floating channel designed for bootstrap operation
•
Fully operational to +600V
Tolerant to negative transient voltage
dV/dt immune
Undervoltage lockout
•
Programmable oscillator frequency
•
f =
1.4 (R150 ) C
Matched propagation delay for both channels
•
Micropower supply startup current of 125 µA typ.
•
Low side output in phase with R
•
• Available in Lead-Free
Description
The IR2155 is a high voltage, high speed, selfoscillating power MOSFET and IGBT driver with both
high and low side referenced output channels. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction.
The front end features a programmable oscillator
which is similar to the 555 timer. The output drivers
feature a high pulse current buffer stage and an internal deadtime designed for minimum driver crossconduction. Propagation delays for the two
channels are matched to simplify use in 50% duty
cycle applications. The floating channel can be
used to drive an N-channel power
Typical Connection
1
×+×
Ω
TT
T
Data Sheet No. PD60029 revJ
IR2155&(PbF)
IR2153 and IR21531)
Product Summary
V
OFFSET
Duty Cycle50%
IO+/ -210 mA / 420 mA
V
OUT
Deadtime (typ.)1.2 µs
Package
8 Lead PDIP
MOSFET or IGBT in the high side configuration that
operates off a high voltage rail up to 600 volts.
up to 600V
600V max.
10 - 20V
V
CC
R
T
C
T
(Refer to Lead Assignment diagram for correct pin configuration)
V
HO
V
LOCOM
B
S
TO
LOAD
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Page 2
IR2155&(PbF)
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured
under board mounted and still air conditions.
ParameterValue
SymbolDefinitionMin.Max.Units
V
B
V
S
V
HO
V
LO
V
RT
V
CT
I
CC
I
RT
dVs/dtAllowable Offset Supply Voltage T ransient—50V/ns
P
D
R
θJA
T
J
T
S
T
L
High Side Floating Supply Voltage-0.3625
High Side Floating Supply Offset VoltageVB - 25VB + 0.3
High Side Floating Output VoltageVS - 0.3V
Low Side Output Voltage-0.3VCC + 0.3
RT V oltage-0.3VCC + 0.3
CT Voltage-0.3V
Supply Current (Note 1)—25
RT Output Current-55
Package Power Dissipation @ TA ≤ +25°C(8 Lead DIP)—1.0
(8 Lead SOIC)—0.625
Thermal Resistance, Junction to Ambient(8 Lead DIP)—125
(8 Lead SOIC)—200
Junction T emperature—150
Storage T emperature-55150°C
Lead Temperature (Soldering, 10 seconds)—300
CC
B
+ 0.3
+ 0.3
mA
°C/W
V
W
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.
ParameterValue
SymbolDefinitionMin.Max.Units
V
B
V
S
V
HO
V
LO
I
CC
T
A
Note 1:Because of the IR2155’s application specificity toward off-line supply systems, this IC contains a zener clamp
2www.irf.com
High Side Floating Supply Absolute VoltageVS + 10VS + 20
High Side Floating Supply Offset Voltage—600
High Side Floating Output VoltageV
Low Side Output Voltage0V
Supply Current (Note 1)—5mA
Ambient T emperature-40125°C
structure between the chip VCC and COM which has a nominal breakdown voltage of 15.6V. Therefore, the IC
supply voltage is normally derived by forcing current into the supply lead (typically by means of a high value
resistor connected between the chip VCC and the rectified line voltage and a local decoupling capacitor from
VCC to COM) and allowing the internal zener clamp circuit to determine the nominal supply voltage. Therefore, this circuit should not be driven by a DC, low impedance power source of greater than V
S
V
B
CC
CLAMP
V
.
Page 3
IR2155&(PbF)
Dynamic Electrical Characteristics
V
(VCC, VBS) = 12V, CL = 1000 pF and TA = 25°C unless otherwise specified.
BIAS
ParameterValue
SymbolDefinitionMin.Typ. Max. Units T est Conditions
t
t
DTDeadtime0.501.202.25µs
DR
Static Electrical Characteristics
V
(VCC, VBS) = 12V, CL = 1000 pF, CT = 1 nF and TA = 25°C unless otherwise specified. The VIN, VTH and I
BIAS
parameters are referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the
respective output leads: HO or LO.
SymbolDefinitionMin.Typ. Max. Units T est Conditions
f
OSC
V
CLAMP
V
CT+
V
CT-
V
CTUV
V
RT+
V
RT-
V
RTUV
V
OH
V
OL
I
LK
I
QBS
I
QBSUV
I
QCC
I
QCCUV
I
CT
V
BSUV+
V
BSUV-
V
BSUVH
V
CCUV+
V
CCUV-
V
CCUVH
I
O+
I
O-
Turn-On Rise Time—80120
r
Turn-Off Fall Time—4070
r
Duty Cycle485052%
T
ns
ParameterValue
Oscillator Frequency19.420.020.6RT = 35.7 kΩ
94100106RT = 7.04 kΩ
VCC Zener Shunt Clamp Voltage14.415.616.8ICC = 5 mA
2/3 VCC Threshold7.88.08.2V
1/3 VCC Threshold3.84.04.2
CT Undervoltage Lockout—20502.5V < V
RT High Level Output Voltage, VCC - R
T
—0100IRT = -100 µA
—200300IRT = -1 mA
RT Low Level Output Voltage—2050IRT = 100 µA
—200300IRT = 1 mA
RT Undervoltage Lockout, VCC - R
High Level Output Voltage, V
Low Level Output Voltage, V
Oscillator timing resistor input,in phase with LO for normal IC operation
Oscillator timing capacitor input, the oscillator frequency according to the following equation:
where 150Ω is the effective impedance of the RT output stage
High side floating supply
High side floating supply return
Low side and logic fixed supply
-
+
UV
DETECT
R
f =
×+×
1.4 (R150 ) C
DETECT
HV
LEVEL
PULSE
SHIFT
FILTER
PULSE
DEAD
TIME
GEN
DEAD
TIME
1
Ω
TT
UV
DELAY
R
R
S
15.6V
V
B
Q
HO
V
S
V
CC
LO
COM
Lead Assignments
8 Lead DIP
4www.irf.com
IR2155
Page 5
IR2155&(PbF)
8 Lead PDIP
01-3003 01
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Page 6
IR2155&(PbF)
V
V
+
CCUV
V
CC
R
T
C
T
HO
LO
Figure 1. Input/Output Timing DiagramFigure 2. Switching Time Waveform Definitions