Datasheet IKW15N120T2FKSA1 Specification

Page 1
1
Rev. 2.2 12.06.2013
Short circuit withstand time – 10s  Designed for :
- Frequency Converters
- Uninterrupted Power Supply
TrenchStop® 2nd generation for 1200 V applications offers :
- very tight parameter distribution
- high ruggedness, temperature stable behavior
Easy paralleling capability due to positive temperature coefficient
in V
CE(sat)
Low EMI  Low Gate Charge  Very soft, fast recovery anti-parallel Emitter Controlled HE Diode  Qualified according to JEDEC1 for target applications  Pb-free lead plating; RoHS compliant
Type
VCE
IC
V
CE(sat),Tj=25°C
T
j,max
Marking Code
Package
IKW15N120T2
1200V
15A
1.75V
175C
K15T1202
PG-TO-247-3
Parameter
Symbol
Value
Unit
Collector-emitter voltage
VCE
1200
V
DC collector current (Tj = 150°C)
TC = 25C TC = 110C
IC
30 15
A
Pulsed collector current, tp limited by T
jmax
I
Cpu ls
60
Turn off safe operating area
V
CE
1200V, Tj 175C
-
60
Diode forward current (Tj = 150°C)
TC = 25C TC = 110C
IF
25 15
Diode pulsed current, tp limited by T
jmax
I
Fpu ls
60
Gate-emitter voltage
VGE
20
V
Short circuit withstand time2)
VGE = 15V, V
CC
600V, T
j, start
175C
tSC
10
s
Power dissipation
TC = 25C
P
tot
235
W Operating junction temperature
Tj
-40...+175
C
Storage temperature
T
stg
-55...+150
Soldering temperature, 1.6mm (0.063 in.) from case for 10s Wavesoldering only, temperature on leads only
-
260
1
2
PG-TO-247-3
G
C
E
IKW15N120T2
TrenchStop
® 2nd
generation Series
Low Loss DuoPack : IGBT in 2
nd
generation TrenchStop® technology
with soft, fast recovery anti-parallel Emitter Controlled Diode
Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/
Maximum Ratings
J-STD-020 and JESD-022
)
Allowed number of short circuits: <1000; time between short circuits: >1s.
Page 2
2
Rev. 2.2 12.06.2013
Parameter
Symbol
Conditions
Max. Value
Unit
IGBT thermal resistance, junction – case
R
thJ C
0.63
K/W
Diode thermal resistance, junction – case
R
thJ CD
1.12
Thermal resistance, junction – ambient
R
thJ A
40
Parameter
Symbol
Conditions
Value
Unit
min.
typ.
max.
Collector-emitter breakdown voltage
V
(BR )C ES
VGE=0V, IC=500µA
1200 - -
V
Collector-emitter saturation voltage
V
CE( sa t)
VGE = 15V, IC=15A Tj=25C Tj=150C Tj=175C
-
-
-
1.7
2.1
2.2
2.2
-
-
Diode forward voltage
VF
VGE=0V, IF=15A Tj=25C Tj=150C Tj=175C
-
-
-
1.75
1.8
1.75
2.2
-
-
Gate-emitter threshold voltage
V
GE( th )
IC=0.6mA,VCE=VGE
5.2
5.8
6.4
Zero gate voltage collector current
I
CES
VCE=1200V, VGE=0V
Tj=25C Tj=150C Tj=175C
-
-
-
-
-
-
0.4
4.0 20
mA
Gate-emitter leakage current
I
GES
VCE=0V,VGE=20V
- - 600
nA
Transconductance
gfs
VCE=20V, IC=15A
- 8 -
S
IKW15N120T2
TrenchStop
® 2nd
generation Series
Thermal Resistance
Characteristic
Electrical Characteristic, at Tj = 25 C, unless otherwise specified
Static Characteristic
Page 3
3
Rev. 2.2 12.06.2013
Input capacitance
C
iss
VCE=25V, VGE=0V, f=1MHz
-
1000
-
pF
Output capacitance
C
oss
-
100
-
Reverse transfer capacitance
C
rss
-
56
-
Gate charge
Q
Gat e
VCC=960V, IC=15A VGE=15V
-
93
-
nC
Internal emitter inductance measured 5mm (0.197 in.) from case
LE
- 13
-
nH
Short circuit collector current1)
I
C(S C)
VGE=15V,tSC10s V
CC
= 600V,
T
j,s ta rt
= 25C
T
j,s ta rt
= 175C
-
82 60
-
A
Parameter
Symbol
Conditions
Value
Unit
min.
typ.
max.
Turn-on delay time
t
d(o n)
Tj=25C, VCC=600V,IC=15A, VGE=0/15V, RG=41.8, L
2)
=126nH,
C
2)
=34pF
Energy losses include
“tail” and diode
reverse recovery.
-
32
-
ns
Rise time
tr
-
25
-
Turn-off delay time
t
d(o ff )
-
362
-
Fall time
tf
-
95
-
Turn-on energy
Eon
-
1.25
-
mJ
Turn-off energy
E
off
-
0.8
-
Total switching energy
Ets
-
2.05
-
Diode reverse recovery time
trr
Tj=25C, VR=600V, IF=15A, diF/dt=450A/s
-
300
-
ns
Diode reverse recovery charge
Qrr
-
1.3
µC
Diode peak reverse recovery current
I
rrm
-
10
A
Diode peak rate of fall of reverse recovery current during tb
dirr/dt
-
215
-
A/s
1
IKW15N120T2
TrenchStop
® 2nd
generation Series
Dynamic Characteristic
Switching Characteristic, Inductive Load, at Tj=25 C
IGBT Characteristic
Anti-Parallel Diode Characteristic
)
Allowed number of short circuits: <1000; time between short circuits: >1s.
2)
Leakage inductance L
and Stray capacity C due to dynamic test circuit in Figure E.
Page 4
4
Rev. 2.2 12.06.2013
Parameter
Symbol
Conditions
Value
Unit
min.
typ.
max.
Turn-on delay time
t
d(o n)
Tj=175C VCC=600V,IC=15A, VGE=0/15V, RG= 41.8 , L
1)
=315nH,
C
1)
=34pF
Energy losses include
“tail” and diode
reverse recovery.
-
31
-
ns
Rise time
tr
-
30
-
Turn-off delay time
t
d(o ff )
-
450
-
Fall time
tf
-
176
-
Turn-on energy
Eon
-
1.5
-
mJ
Turn-off energy
E
off
-
1.3
-
Total switching energy
Ets
-
2.8
-
Diode reverse recovery time
trr
Tj=175C VR=600V, IF=15A, diF/dt=460A/s
-
460
-
ns
Diode reverse recovery charge
Qrr
-
2.65
-
µC
Diode peak reverse recovery current
I
rrm
-
13
-
A
Diode peak rate of fall of reverse recovery current during tb
dirr/dt
-
123
A/s
IKW15N120T2
TrenchStop
® 2nd
generation Series
Switching Characteristic, Inductive Load, at Tj=175 C
IGBT Characteristic
Anti-Parallel Diode Characteristic
1)
Leakage inductance L
and Stray capacity C due to dynamic test circuit in Figure E.
Page 5
5
Rev. 2.2 12.06.2013
I
C
, COLLECTOR CURRENT
10Hz 100Hz 1kHz 10kHz 100kHz
0A
20A
40A
60A
TC=110°C
TC=80°C
I
C
, COLLECTOR CURRENT
1V 10V 100V 1000V
0.1A
1A
10A
DC
10µs
tp=3µs
50µs
500µs
20ms
150µs
f, SWITCHING FREQUENCY
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 1. Collector current as a function of
switching frequency
(Tj 175C, D = 0.5, VCE = 600V, VGE = 0/+15V, RG = 41.8)
Figure 2. Safe operating area
(D = 0, TC = 25C, Tj 175C;VGE=15V)
P
tot
, POWER DISSIPATION
25°C 50°C 75°C 100°C 125°C 150°C
0W
50W
100W
150W
200W
I
C
, COLLECTOR CURRENT
25°C 75°C 125°C
0A
10A
20A
30A
TC, CASE TEMPERATURE
TC, CASE TEMPERATURE
Figure 3. Maximum power dissipation as a
function of case temperature
(Tj 175C)
Figure 4. Maximum DC Collector current as
a function of case temperature
(VGE 15V, Tj 175C)
I
c
I
c
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 6
6
Rev. 2.2 12.06.2013
I
C
, COLLECTOR CURRENT
0V 1V 2V 3V 4V
0A
10A
20A
30A
40A
50A
60A
20V
15V
7V
9V
11V
13V
VGE=17V
I
C
, COLLECTOR CURRENT
0V 1V 2V 3V 4V
0A
10A
20A
30A
40A
50A
60A
20V
15V
7V
9V
11V
13V
VGE=17V
VCE, COLLECTOR-EMITTER VOLTAGE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 5. Typical output characteristic
(Tj = 25°C)
Figure 6. Typical output characteristic
(Tj = 175°C)
I
C
, COLLECTOR CURRENT
0V 2V 4V 6V 8V 10V 12V
0A
10A
20A
30A
40A
50A
60A
25°C
TJ=175°C
V
CE(sat),
COLLECTOR-EMITT SATURATION VOLTAGE
0°C 50°C 100°C 150°C
0.0V
0.5V
1.0V
1.5V
2.0V
2.5V
3.0V
IC=15A
IC=30A
IC=7.5A
IC=2A
V
GE
, GATE-EMITTER VOLTAGE
TJ, JUNCTION TEMPERATURE
Figure 7. Typical transfer characteristic
(VCE=20V)
Figure 8. Typical collector-emitter
saturation voltage as a function of junction temperature
(VGE = 15V)
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 7
7
Rev. 2.2 12.06.2013
t, SWITCHING TIMES
7.5A 15.0A 22.5A
10ns
100ns
t
r
t
d(on)
t
f
t
d(off)
t, SWITCHING TIMES
     
10 ns
100 ns
1000 ns
t
f
t
r
t
d(off)
t
d(on)
IC, COLLECTOR CURRENT
RG, GATE RESISTOR
Figure 9. Typical switching times as a
function of collector current
(inductive load, TJ=175°C, VCE=600V, VGE=0/15V, RG=41.8Ω,
Dynamic test circuit in Figure E)
Figure 10. Typical switching times as a
function of gate resistor
(inductive load, TJ=175°C, VCE=600V, VGE=0/15V, IC=15A,
Dynamic test circuit in Figure E)
t, SWITCHING TIMES
0°C 50°C 100°C 150°C
10ns
100ns
t
r
t
f
t
d(on)
t
d(off)
V
GE(th),
GATE-EMITT TRSHOLD VOLTAGE
0°C 50°C 100°C 150°C
3.5V
4.0V
4.5V
5.0V
5.5V
6.0V
6.5V
min.
typ.
max.
TJ, JUNCTION TEMPERATURE
TJ, JUNCTION TEMPERATURE
Figure 11. Typical switching times as a
function of junction temperature
(inductive load, VCE=600V, VGE=0/15V, IC=15A, RG=41.8Ω, Dynamic test circuit in Figure E)
Figure 12. Gate-emitter threshold voltage as
a function of junction temperature
(IC = 600µA)
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 8
8
Rev. 2.2 12.06.2013
E, SWITCHING ENERGY LOSSES
7.5A 15.0A 22.5A
0.0mJ
2.5mJ
5.0mJ
7.5mJ
Ets*
E
off
*) Eon and Etsinclude losses due to diode recovery
Eon*
E, SWITCHING ENERGY LOSSES
     
0.00 mJ
1.25 mJ
2.50 mJ
3.75 mJ
5.00 mJ
Ets*
Eon*
*) Eon and Ets include losses due to diode recovery
E
off
IC, COLLECTOR CURRENT
RG, GATE RESISTOR
Figure 13. Typical switching energy losses
as a function of collector current
(inductive load, TJ=175°C, VCE=600V, VGE=0/15V, RG=41.8Ω,
Dynamic test circuit in Figure E)
Figure 14. Typical switching energy losses
as a function of gate resistor
(inductive load, TJ=175°C, VCE=600V, VGE=0/15V, IC=15A,
Dynamic test circuit in Figure E)
E, SWITCHING ENERGY LOSSES
0°C 50°C 100°C 150°C
0.0mJ
1.2mJ
2.4mJ
Ets*
Eon*
*) Eon and Ets include losses due to diode recovery
E
off
E, SWITCHING ENERGY LOSSES
400V 500V 600V 700V
0.00mJ
1.25mJ
2.50mJ
3.75mJ
5.00mJ
Ets*
Eon*
*) Eon and Ets include losses due to diode recovery
E
off
TJ, JUNCTION TEMPERATURE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 15. Typical switching energy losses
as a function of junction temperature
(inductive load, VCE=600V, VGE=0/15V, IC=15A, RG=41.8Ω, Dynamic test circuit in Figure E)
Figure 16. Typical switching energy losses
as a function of collector emitter voltage
(inductive load, TJ=175°C, VGE=0/15V, IC=15A, RG=41.8Ω, Dynamic test circuit in Figure E)
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 9
9
Rev. 2.2 12.06.2013
V
GE
, GATE-EMITTER VOLTAGE
0nC 25nC 50nC 75nC
0V
5V
10V
15V
960V
240V
c, CAPACITANCE
0V 10V 20V
10pF
100pF
1nF
C
rss
C
oss
C
iss
QGE, GATE CHARGE
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 17. Typical gate charge
(IC=15 A)
Figure 18. Typical capacitance as a function
of collector-emitter voltage
(VGE=0V, f = 1 MHz)
t
SC
, SHORT CIRCUIT WITHSTAND TIME
12V 14V 16V 18V
0µs
5µs
10µs
15µs
I
C(sc)
, short circuit COLLECTOR CURRENT
12V 14V 16V 18V
0A
25A
50A
75A
100A
VGE, GATE-EMITTETR VOLTAGE
VGE, GATE-EMITTETR VOLTAGE
Figure 19. Short circuit withstand time as a
function of gate-emitter voltage
(VCE=600V, start at TJ175°C)
Figure 20. Typical short circuit collector
current as a function of gate­emitter voltage
(VCE 600V, T
j,start
=175C)
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 10
10
Rev. 2.2 12.06.2013
V
CE
, COLLECTOR-EMITTER VOLTAGE
0V
200V
400V
600V
0A
5A
10A
15A
20A
25A
1.2us0.8us0.4us
0us
I
C
V
CE
I
C
, COLLECTOR CURRENT
0V
200V
400V
600V
0A
5A
10A
15A
1.2us0.8us0.4us
0us
I
C
V
CE
t, TIME
t, TIME
Figure 21. Typical turn on behavior
(VGE=0/15V, RG=41.8Ω, Tj = 175C, Dynamic test circuit in Figure E)
Figure 22. Typical turn off behavior
(VGE=15/0V, RG=41.8Ω, Tj = 175C, Dynamic test circuit in Figure E)
Z
thJC
, TRANSIENT THERMAL RESISTANCE
10µs 100µs 1ms 10ms 100ms
10-2K/W
10-1K/W
100K/W
single pulse
0.01
0.02
0.05
0.1
0.2
D=0.5
Z
thJC
, TRANSIENT THERMAL RESISTANCE
10µs 100µs 1ms 10ms 100ms
10-2K/W
10-1K/W
100K/W
single pulse
0.01
0.02
0.05
0.1
0.2
D=0.5
tP, PULSE WIDTH
tP, PULSE WIDTH
Figure 23. IGBT transient thermal resistance
(D = tp / T)
Figure 24. Diode transient thermal
impedance as a function of pulse width
(D=tP/T)
R,(K/W )
, (s)
0.143
3.06*10-4
0.217
3.47*10
-3
0.258
1.71*10-2
0.017
2.63*10-1
C1=
1/R1
R1R
2
C2=
2/R2
R,(K/W )
, (s)
0.291
2.75*10-4
0.434
2.60*10
-3
0.363
1.48*10-2
0.028
1.78*10-1
C1=
1/R1
R1R
2
C2=
2/R2
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 11
11
Rev. 2.2 12.06.2013
t
rr
, REVERSE RECOVERY TIME
400A/µs 800A/µs 1200A/µs
0ns
100ns
200ns
300ns
400ns
500ns
600ns
TJ=25°C
TJ=175°C
Q
rr
, REVERSE RECOVERY CHARGE
400A/µs 800A/µs 1200A/µs
0µC
1µC
2µC
3µC
TJ=25°C
TJ=175°C
diF/dt, DIODE CURRENT SLOPE
diF/dt, DIODE CURRENT SLOPE
Figure 23. Typical reverse recovery time as
a function of diode current slope
(VR=600V, IF=15A, Dynamic test circuit in Figure E)
Figure 24. Typical reverse recovery charge
as a function of diode current slope
(VR=600V, IF=15A, Dynamic test circuit in Figure E)
I
rr
, REVERSE RECOVERY CURRENT
400A/µs 800A/µs 1200A/µs
0A
5A
10A
15A
20A
TJ=25°C
TJ=175°C
di
rr
/dt, DIODE PEAK RATE OF FALL
OF REVERSE RECOVERY CURRENT
400A/µs 800A/µs 1200A/µs
-0A/µs
-100A/µs
-200A/µs
-300A/µs
-400A/µs
-500A/µs
-600A/µs
TJ=25°C
TJ=175°C
diF/dt, DIODE CURRENT SLOPE
diF/dt, DIODE CURRENT SLOPE
Figure 25. Typical reverse recovery current
as a function of diode current slope
(VR=600V, IF=15A, Dynamic test circuit in Figure E)
Figure 26. Typical diode peak rate of fall of
reverse recovery current as a function of diode current slope
(VR=600V, IF=15A, Dynamic test circuit in Figure E)
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 12
12
Rev. 2.2 12.06.2013
I
F
, FORWARD CURRENT
0V 1V 2V
0A
10A
20A
30A
40A
50A
60A
175°C
TJ=25°C
V
F
, FORWARD VOLTAGE
0°C 50°C 100°C 150°C
0.0V
0.5V
1.0V
1.5V
2.0V 15A
7.5A
IF=30A
2A
VF, FORWARD VOLTAGE
TJ, JUNCTION TEMPERATURE
Figure 27. Typical diode forward current as
a function of forward voltage
Figure 28. Typical diode forward voltage as a
function of junction temperature
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 13
13
Rev. 2.2 12.06.2013
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 14
14
Rev. 2.2 12.06.2013
I
r r m
90% I
r r m
10% I
r r m
di /dt
F
t
r r
I
F
i,v
t
Q
S
Q
F
t
S
t
F
V
R
di /dt
r r
Q =Q Q
r r S F
+
t =t t
r r S F
+
Figure C. Definition of diodes switching characteristics
p(t)
1 2 n
T (t)
j
1
1
2 2
n
n
T
C
r r
r
r
rr
Figure D. Thermal equivalent circuit
Figure E. Dynamic test circuit
Figure A. Definition of switching times
Figure B. Definition of switching losses
IKW15N120T2
TrenchStop
® 2nd
generation Series
Page 15
15
Rev. 2.2 12.06.2013
IKW15N120T2
TrenchStop
® 2nd
generation Series
Published by Infineon Technologies AG 81726 Munich, Germany © 2013 Infineon Technologies AG All Rights Reserved.
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Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).
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Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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