Datasheet HTRC12002B Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

HTRC12002B

HITAG co-processor

Product specification
Supersedes data of 2000 Sep 01
File under Integrated Circuits, IC11

2001 Nov 15

Philips Semiconductors Product specification

HITAG co-processor HTRC12002B

FEATURES
General security concept

• Data encryption

• Encryption mutual authentication

• Password verification.

Additional features

• On-chip EEPROM to store secret data

• Uncomplicated host interface

• Sleep mode for reduced current consumption.

All secret keys are stored within the HTRC12002B.

GENERAL DESCRIPTION

The HITAG

(1)

co-processor is designed to perform all
computations of the read/write device in a system where
HITAG1 and HITAG2 transponders are used.

Access to related extended data sheet

This short data sheet will inform about the basic features
of the product and about the mechanical dimensions only.
Due to our marketing strategy to supply reader
manufacturerswithan IC based toolset for HITAG readers
the HITAG12002B is available without any license fees.
However, because of the security aspect of this product
Philips tracks the delivery of the extended data sheet
HTRC12002B, which includes all additional necessary
information to run the HTRC12002B.

In order to gain access to the extended data sheet, please
contact your local sales office in order to sign a
non-disclosure agreement.

The device performs all encryption computations needed
to access transponders and cards based on the HITAG1
respectively HITAG2 ICs in secure mode. Usually the
HTRC12002B is used in combination with the
HTRC11001T, which comprisesthe complete analog part
of a read/write device.

(1) HITAG - is a trademark of Philips Semiconductors

Gratkorn GmbH.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

HTRC12002B LQFP32 plastic low profile quad flat package; 32 leads; body7x7x1.4mm SOT358-1

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134)

SYMBOL PARAMETER MIN. MAX. UNIT

T

stg

T

j

V

DD

V

I

storage temperature −65 +150 °C
junction temperature − 90 °C
supply voltage −0.5 +7.0 V
input voltage at any pin with respect to ground (VSS) −0.5 VDD+ 0.5 V

2001 Nov 15 2

Philips Semiconductors Product specification

HITAG co-processor HTRC12002B

DC CHARACTERISTICS

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

V
I

V
V
I
I
I

DD

DD

IL

IH
IL
OL
OH

supply voltage 2.5 − 6.0 V
supply current operating mode; VDD=5V;

f

= 16.0 MHz

clk

LOW-level input voltage VDD=5V; f

= 16.0 MHz 0 − 0.3VDDV

clk

HIGH-level input voltage 0.7VDD− V
input leakage current VSS≤ VI≤ V

DD

− 2.4 − mA

DD

V

−1.0 − +1.0 µA
LOW-level port sink current VDD=3V; VO= 0.4 V 0.7 3.5 − mA
HIGH-level port pull-up source and

push-pull current

pull-up

= 3 V; VO= 2.7 V −10 −30 −µA

V

DD

V

= 3 V; VO= 0.0 V −−140 −300 µA

DD

push-pull

V

= 3 V; VO= 2.6 V −0.7 −−3.5 mA

DD

2001 Nov 15 3

Philips Semiconductors Product specification

HITAG co-processor HTRC12002B

PACKAGE OUTLINE

LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm

c

y

X

SOT358-1

24 17

25

pin 1 index

32

1

e

w M

b

p

D

H

D

A

16

Z

E

e

E

w M

b

p

9

8

Z

D

v M

A

B

v M

B

0 2.5 5 mm

scale

H

E

A

2

A

A

1

(A )

3

θ

L

p

L

detail X

DIMENSIONS (mm are the original dimensions)

UNIT

mm

A

A1A2A3b

max.

0.20

1.60

0.05

1.45

1.35

0.25

cE

p

0.4

0.18

0.3

0.12

(1)

(1) (1)(1)

D

7.1

6.9

eH

7.1

0.8

6.9

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT358 -1 136E03 MS-026

2001 Nov 15 4

H

9.15

8.85

D

E

9.15

8.85

LL

p

0.75

0.45

0.25 0.11.0 0.2

EUROPEAN

PROJECTION

Z

D

0.9

0.5

Zywv θ

E

o

0.9

7

o

0.5

0

ISSUE DATE

99-12-27
00-01-19

Philips Semiconductors Product specification

HITAG co-processor HTRC12002B

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurface mount ICs, but itisnot suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on foursides,the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2001 Nov 15 5

Philips Semiconductors Product specification

HITAG co-processor HTRC12002B

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 Nov 15 6

Philips Semiconductors Product specification

HITAG co-processor HTRC12002B

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

(1)

STATUS

(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or at any other conditions above those giveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warranty thatsuch applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers using or sellingthese products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of any of theseproducts,conveys no licence or title
under any patent, copyright, or mask work right to these
products,and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2001 Nov 15 7

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
For sales offices addresses send e-mail to: [e-mail].

© Koninklijke Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 613502/02/pp8 Date of release: 2001 Nov 15 Document order number: 9397750 08388

SCA73