Datasheet HTL194 Datasheet (HSMC)

Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6549-B Issued Date : 1993.04.12 Revised Date : 2000.10.01 Page No. : 1/3
HTL194
Description
The HTL194 is designed for high voltage low power switching applications especially for use in telephone and telecommunication circuits.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature..................................................................................... 150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)...................................................................................... 1 W
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltag e..................................................................................... -400 V
VCEO Collector to Emitter Voltage .................................................................................. -400 V
IC Collector Current...................................................................................................... -300 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -400 - - V IC=-100uA, IE=0 BVCEO -400 - - V IC=-1mA, IB=0
ICBO - - -10 uA VCB=-400V, IE=0 ICEO - - -1 uA VCE=-200V, IE=0
IEBO - - -0.2 uA VEB=-6V, IC=0 *VCE(sat)1 - - -200 mV IC=-20mA, IB=-2mA *VCE(sat)2 - - -1.2 V IC=-80mA, IB=-4mA
*VBE(sat) - - -900 mV IC=-20mA, IB=-2mA
*hFE1 50 - - VCE=-10V, IC=-1mA *hFE2 50 - 300 VCE=-10V, IC=-20mA *hFE3 40 - - VCE=-10V, IC=-80mA
fT 10 - - MHz VCE=-20V, IE=-10mA, f=1MHz
Cob - - 30 pF VCB=-20V, f=1MHz , IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6549-B Issued Date : 1993.04.12 Revised Date : 2000.10.01 Page No. : 2/3
1000
100
Current Gain-h FE
10
0.1 1 10 100 1000
10000
Current Gain & Collector Current
hFE @ VCE=10V
Collector Curren t-IC (mA)
On Voltage & Collector Current
10000
1000
100
Satu r ation Voltage (mV)
10
100
Saturation Volt age & Collector Current
BE(sat)
V
CE(sat)
V
CE(sat)
V
0.1 1 10 100 1000
Collector Curren t-IC (mA)
@ IC=10I
@ IC=20I
@ IC=10I
B
B
B
Capa cita n ce & Reverse-Bi ased Volta ge
Cob
1000
BE(on)
V
On Voltage (m V)
100
0.1 1 10 100 1000
Collector Curren t-IC (mA)
@ VCE=10V
Safe Operating Area
1000
PT=1ms PT=100ms
(mA)
100
C
10
Collector Curren t-I
PT=1s
10
Capac itanc e (pF)
1
0.1 1 10 100
Reverse-Biased Vol t ag e ( V)
1
1 10 100 1000
Forwar d Vol tage-VCE (V)
HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6549-B Issued Date : 1993.04.12 Revised Date : 2000.10.01 Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches M illimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max. A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56 B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54 C 0.5000 - 12.70 - I - *0.0500 - *1.27 D 0.0142 0.0220 0.36 0.56 E - *0.0500 - *1.27 F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
1
α
2
α
3
α
-
-
-
*5 *2 *2
° ° °
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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