Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 1/3
HTL295D
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HTL295D is designed for high voltage low power switching
applications especially for use in telephone and telecommunication
circuits.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature..................................................................................... 150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)................................................................................... 1.5 W
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltag e..................................................................................... -500 V
VCEO Collector to Emitter Voltage .................................................................................. -500 V
VEBO Emitter to Base Voltage ............................................................................................ -6 V
IC Collector Current ..................................................................................................... -250 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -500 - - V IC=-100uA, IE=0
BVCEO -500 - - V IC=-1mA, IB=0
BVEBO -6 - - V IE=-10uA
ICBO - - -1 uA VCB=-500V, IE=0
ICES - - -10 uA VCE=-500V, IB=0
IEBO - - -0.2 uA VEB=-6V, IC=0
*VCE(sat)1 - - -500 mV IC=-10mA, IB=-1mA
*VCE(sat)2 - - -2 V IC=-50mA, IB=-5mA
*VCE(sat)3 -3 V IC=-80mA, IB=-4mA
*VBE(sat) - - -750 mV IC=-10mA, IB=-1m A
*hFE1 50 - - VCE=-10V, IC=-1mA
*hFE2 60 - 250 VCE=-10V, IC=-20mA
*hFE3 50 - - VCE=-10V, IC=-80mA
fT 10 - - MHz VCE=-20V, IE=-10mA, f=1MHz
Cob - - 30 pF VCB=-20V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HTL295D HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
hFE @ VCE=10V
Collector Current-IC (mA)
Saturation Volt age & Coll ector Current
1000
Current Gain & Collector Current
BE(sat)
V
@ IC=10I
B
100000
10000
1000
CE(sat)
V
Saturation Voltage (mV)
100
10
1 10 100 1000
B
@ IC=20I
CE(sat)
V
Collector Current-IC (mA)
@ IC=10I
Capacitance & Reverse-Biased Volt age
100
Cob
Sasturation Voltage & Collector Current
B
SATU RATION VOLTAGE-(mV)
100
1 10 100 1000
Collector Current-IC (mA)
Safe Operating Area
10
PT=1mS
(A)
1
C
PT=100mS
PT=1S
0.1
Collector Current-I
10
Capac itanc e (pF)
1
0.1 1 10 100
1.6
1.4
1.2
1
0.8
0.6
0.4
PD(W) , Power Dissipation
0.2
Reverse Biased Volt a ge ( V)
Power Derating
0.01
1 10 100 1000
Forwar d Biased Vol tage-VCE (V)
0
0 50 100 150 200
Ta(oC) , Ambient T em peratu r e
HTL295D HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126ML Dimension
Spec. No. : Preliminary Data
Issued Date : 2001.03.01
Revised Date : 2001.03.29
Page No. : 3/3
Marking :
A
D
C
N
M L K
E
F
3
2
1
O
H
G
J
B
I
HSMC Logo
Part Number
Date Code
Ink Marking
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
3-Lead TO-126ML Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : D
DIM
Min. Max. Min. Max.
A 0.1356 0.1457 3.44 3.70 I - *0.1795 - *4.56
B 0.0170 0.0272 0.43 0.69 J 0.0268 0.0331 0.68 0.84
C 0.0344 0.0444 0.87 1.12 K 0.5512 0.5906 14.00 15.00
D 0.0501 0.0601 1.27 1.52 L 0.2903 0.3003 7.37 7.62
E 0.1131 0.1231 2.87 3.12 M 0.1378 0.1478 3.50 3.75
F 0.0737 0.0837 1.87 2.12 N 0.1525 0.1625 3.87 4.12
G 0.0294 0.0494 0.74 1.25 O 0.0740 0.0842 1.88 2.14
H 0.0462 0.0562 1.17 1.42
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HTL295D HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Tai pei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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