Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6452
Issued Date : 1993.02.10
Revised Date : 2002.04.18
Page No. : 1/3
HTL195
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTL195 is designed for high voltage low power switching
applications especially for use in telephone and telecommunication
circuits.
TO-92
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)....................................................................................... 1 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage...................................................................................... -500 V
VCEO Collector to Emitter Voltage................................................................................... -500 V
IC Collector Current ...................................................................................................... -300 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -500 - - V IC=-100uA, IE=0
BVCEO -500 - - V IC=-1mA, IB=0
ICBO - - -10 uA VCB=-500V, IE=0
ICEO - - -1 uA VCE=-100V, IB=0
IEBO - - -200 nA VEB=-6V, IC=0
*VCE(sat)1 - - -500 mV IC=-20mA, IB=-2mA
*VCE(sat)2 - - -3 V IC=-80mA, IB=-4mA
*VBE(sat) - - -900 mV IC=-20mA, IB=-2mA
*hFE1 50 - - VCE=-10V, IC=-1mA
*hFE2 50 - 300 VCE=-10V, IC=-20mA
*hFE3 40 - - VCE=-10V, IC=-80mA
fT 10 - - MHz VCE=-20V, IE=-10mA, f=1MHz
Cob - - 30 pF VCB=-20V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HTL195 HSMC Product Specification
Page 2
HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6452
Issued Date : 1993.02.10
Revised Date : 2002.04.18
Page No. : 2/3
1000
Current Gain & Collector Current
125oC
100
hFE
10
1 10 100 1000
10000
25oC
hFE @ VCE=10V
Sat urat ion Vol tage & Collect or Cu rrent
CE(sat)
V
@ IC=20I
75oC
Collector Current-IC (mA)
B
1000
Sat urati on Voltage & C ol lector C urrent
75oC
125oC
100
Satur ation Voltag e (mV)
10
0.1 1 10 100 1000
1000
Sat uration Voltage & Collect or Current
Collector Current-IC (mA)
25oC
25oC
CE(sat)
V
@ IC=10I
B
1000
Saturat ion Volta ge ( m V)
125oC
100
0.1 1 10 100 1000
1000
100
Capacitance (Pf)
Capacitan ce & Reverse- Biased Volta ge
10
Collector Current-IC (mA)
75oC
25oC
Cob
75oC
125oC
BE(sat)
V
Saturat ion Volta ge ( m V)
100
0.1 1 10 100 1000
Collec tor Current-IC (mA)
@ IC=10I
Safe Operating Area
10000
1000
100
PT=1ms
Collector Current (mA
10
PT=100ms
PT=1s
B
1
0.1 1 10 100
Reverse Biased Vol t ag e ( V)
1
1 10 100 1000 10000
Forwar d Voltage ( V)
HTL195 HSMC Product Specification
Page 3
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6452
Issued Date : 1993.02.10
Revised Date : 2002.04.18
Page No. : 3/3
A
α2
B
31
2
Marking:
HL
T
915
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Collector 3.Base
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTL195 HSMC Product Specification
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