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HI-SINCERITY
MICROELECTRONICS CORP.
HTIP50
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP50 is designed for line operated audio output amplifier
switch-mode power supply drivers and other switching applications.
Spec. No. : HE6761
Issued Date : 1994.10.06
Revised Date : 2002.02.26
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -50 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
Total Power Dissipation (Ta=25°C)....................................................................................... 2 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 500 V
BVCEO Collector to Emitter Voltage.................................................................................. 400 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current............................................................................................................... 1 A
TO-220
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 500 - - V IC=1mA, IE=0
BVCEO 400 - - V IC=30mA, IB=0
BVEBO 5 - - V IE=0.1mA, IC=0
IEBO - - 1 mA VEB=5V, IC=0
ICEO - - 1 mA VCE=300V, IB=0
ICES - - 1 mA VCE=500V, VEB=0
*VCE(sat) - - 1 V IC=1A, IB=0.2A
VBE(on) - - 1.5 V IC=1A, VCE=10V
*hFE1 30 - 150 IC=0.3A, VCE=10V
*hFE2 10 - - IC=1A, VCE=10V
fT 10 - - MHz IC=0.2A, VCB=10V, f=2MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HTIP50 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6761
Issued Date : 1994.10.06
Revised Date : 2002.02.26
Page No. : 2/3
1000
hFE @ VCE=10V
100
hFE
10
1 10 100 1000
125oC
25oC
75oC
Collector Current- IC (mA)
ON Voltage & C ollector Current
1000
25oC
75oC
Current Gai n & Collector Current
1000
Sat uration Voltage & Collect or Cur rent
CE(sat)
V
100
125oC
Satur ation Voltage ( m V)
10
1 10 100 1000
100
Cutoff Frequency & Collector Current
B
@ IC=5I
75oC
Collector Current- IC (mA)
VCE=10V
25oC
125oC
ON Voltage ( m V)
100
1 10 100 1000
100
10
Capacitance (pF)
Ca pacitance & Reverse-Biased Voltage
Collector Current- IC (mA)
BE(ON)
V
@ VCE=10V
Cob
Cutoff Frequency (MHz)...
10
1 10 100 1000
Collector Current (mA)
Safe Operating Area
10
PT=1ms
PT=100ms
PT=1s
(mA)
C
Collector Current-I
1
0.1
0.01
1
1 10 100
Reverse Biased Volt age ( V)
0.001
1 10 100 1000
Forwar d Voltage-VCE (V)
HTIP50 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A
D
B
Spec. No. : HE6761
Issued Date : 1994.10.06
Revised Date : 2002.02.26
Page No. : 3/3
Marking:
E
C
H
TIP
5
0
Date Code
Control Code
H
Style: Pin 1.Base 2.Collector 3.Emitter
G
I
3
M
2
K
N
1
4
OP
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP50 HSMC Product Specification
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