
HI-SINCERITY
MICROELECTRONICS CORP.
HTIP32C
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP32C is designed for use in general purpose amplifier and
switching applications.
Spec. No. : HE6724
Issued Date : 1993.01.13
Revised Date : 2002.01.17
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................. -55 ~ +150 °C
Junction Temperature..................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
Total Power Dissipation (Ta=25°C)....................................................................................... 2 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................. -100 V
BVEBO Emitter to Base Voltage........................................................................................... -5 V
IC Collector Current.............................................................................................................. -3 A
TO-220
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -100 - - V IC=-1mA, IE=0
BVCEO -100 - - V IC=-30mA, IB=0
ICES - - -200 uA VCE=-100V
ICEO - - -300 uA VCE=-60V
IEBO - - -1 mA VEB=-5V
*VCE(sat) - - -1.2 V IC=-3A, IB=-375mA
*VBE(on) - - -1.8 V IC=-3A, VCE=-4V
*hFE1 25 45 - IC=-1A, VCE=-4V
*hFE2 10 - 50 IC=-3A, VCE=-4V
fT 3 - - MHz IC=-0.5A, VCE=-10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HTIP32C HSMC Product Specification

HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6724
Issued Date : 1993.01.13
Revised Date : 2002.01.17
Page No. : 2/3
100
75oC125oC
hFE
10
25oC
hFE @ VCE=4V
1 10 100 1000 10000
Collec tor Current IC (mA)
ON Voltage & Collector Current
10000
Current Gain & Collector Current
1000
75oC
125oC
Satur ation Voltag e (mV)
100
1 10 100 1000 10000
25oC
Collec tor Current IC (mA)
CE(sat)
V
@ IC=8I
Switching Time & Collector Current
Sat urat ion Vol tage & Collect or Cu rrent
10.00
VCC=30V, IC=10IB1=-10I
1.00
B2
B
1000
ON Voltage (mV)
100
1 10 100 1000 10000
1000
100
Capacit ance (pF)
25oC
75oC125oC
BE(ON)
V
@ VCE=4V
Collec tor Current IC (mA)
Ca pacitan ce & R everse-Biased V olt age
Cob
Ton
Tstg
0.10
Switching Times (us
0.01
0.1 1.0 10.0
Collector Cu rr ent (A)
Tf
Safe Operating Area
100000
10000
(mA)
C
1000
100
Collector Current-I
PT=1ms
PT=100ms
PT=1s
10
10
0.1 1 10 100
Reverse- Biased Vol t ag e ( V)
1
1 10 100
Forwar d Voltage- V
CE
(V)
HTIP32C HSMC Product Specification

HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A
D
B
Spec. No. : HE6724
Issued Date : 1993.01.13
Revised Date : 2002.01.17
Page No. : 3/3
Marking:
E
C
HP
TI
32C
Date Code
Control Code
H
Style: Pin 1.Base 2.Collector 3.Emitter
G
I
3
M
2
K
N
1
4
OP
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness in cludes lead finish thickness, and minimum lead thickne ss is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP32C HSMC Product Specification