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HI-SINCERITY
MICROELECTRONICS CORP.
HTIP31C
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP31C is designed for use in general purpose amplifier and
switching applications.
Spec. No. : HE6721
Issued Date : 1993.09.24
Revised Date : 2002.03.04
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage..................................................................................... 100 V
BVCEO Collector to Emitter Voltage.................................................................................. 100 V
BVEBO Emitter to Base Voltage............................................................................................ 5 V
IC Collector Current............................................................................................................... 3 A
TO-220
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 100 - - V IC=1mA, IE=0
BVCEO 100 - - V IC=30mA, IC=0
ICES - - 200 uA VCE=100V, IB=0
ICEO - - 300 uA VCE=60V, IB=0
IEBO - - 1 mA VEB=5V, IC=0
*VCE(sat) - - 1.2 V IC=3A, IB=375mA
*VBE(on) - - 1.8 V IC=3A, VCE=4V
*hFE1 25 - - IC=1A, VCE=4V
*hFE2 10 - 50 IC=3A, VCE=4V
fT 3 - - MHz IC=0.5A, VCE=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HTIP31C HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6721
Issued Date : 1993.09.24
Revised Date : 2002.03.04
Page No. : 2/3
100
Cur rent Gain & Collector Current
125oC
hFE
10
1 10 100 1000 10000
10000
25oC 75oC
hFE @ VCE=4V
Collector Current- IC (mA)
ON Voltage & Collector Current
BE(ON)
V
@ VCE=4V
1000
100
Satur ation Voltage ( m V)
10
10.0
Sat ura tion Voltage & C ollector C urrent
CE(sat)
V
1 10 100 1000 10000
B
@ IC=8I
75oC
Collector Current- IC (mA)
25oC
125oC
Swi tchi ng Time & Col lector Current
VCC=30V, IC=10IB1=-10I
B2
1000
ON Voltage (mV)
100
1 10 100 1000 10000
100
10
Capacitance (p F)
Capacitance & Reverse-Biased Voltage
25oC
75oC125oC
Collector Current- IC (mA)
Cob
1.0
Switching Times (us)...
0.1
0.1 1.0 10.0
Collector Current (mA)
Tstg
Ton
Tf
Safe Operating Area
100000
10000
(mA)
C
Collector Cirremt-I
PT=1 ms
PT=100 ms
PT=1 s
1000
100
10
1
0.1 1 10 100
Reverse-Biased Vol t a ge ( V)
1
1 10 100
Forwar d Voltage-VCE (V)
HTIP31C HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A
D
B
Spec. No. : HE6721
Issued Date : 1993.09.24
Revised Date : 2002.03.04
Page No. : 3/3
Marking:
E
C
Date Code
H
TIP
3
1C
Rank
Control Code
H
Style: Pin 1.Base 2.Collector 3.Emitter
G
I
3
M
2
K
N
1
4
OP
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP31C HSMC Product Specification
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