Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HTIP125
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HTIP125 is designed for medium power linear and switching
applications.
Spec. No. : HE6730-B
Issued Date : 1997.08.13
Revised Date : 1999.08.01
Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Tc=25°C) .................................................................................... 65 W
Total Power Dissipation (Ta=25°C)...................................................................................... 2 W
Maximum Voltages and Currents
•
BVCBO Collector to Base Voltage..................................................................................... -60 V
BVCEO Collector to Emitter Voltage.................................................................................. -60 V
BVEBO Emitter to Base Voltage.......................................................................................... -5 V
IC Collector Current............................................................................................................. -5 A
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -60 - - V IC=-1mA, IE=0
*BVCEO -60 - - V IC=-100mA, IB=0
ICEO - - -0.5 mA VCE=-30V, IE=0
ICBO - - -0.2 mA VCE=-60V, IB=0
IEBO - - -2 mA VEB=-5V, IC=0
*VCE(sat1) - - -2 V IC=-3A, IB=-12mA
*VCE(sat)2 - - -4 V IC=-5A, IB=-20mA
*VBE(on) - - -2.5 V IC=-3A, VCE=-3V
*hFE1 1000 - - IC=-0.5A, VCE=-3V
*hFE2 1000 - - IC=-3A, VCE=-3V
Cob - - 300 FP VCB=-10V, f=0.1MHz, IE=0
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6730-B
Issued Date : 1997.08.13
Revised Date : 1999.08.01
Page No. : 2/3
10000
Current Gai n & Collector Current
1000
100
hFE
10
1
1 10 100 1000 10000
10000
Collector Curren t (m A )
On Vol t age & Collector Cur rent
hFE @ VCE=4V
10000
Saturation Volt age & Coll ector Cu rrent
BE(sat)
V
@ IC=100I
1000
CE(sat)
V
@ IC=100I
Saturation Voltage (mV)
100
100 1000 10000
10
Switching Time & Collector Current
VCC=30V, IC=250IB1=-250I
Collector Current (mA)
Tstg
B4
B
B2
1000
On Voltage (mV)
100
1 10 100 1000 10000
BE(on)
V
@ VCE=4V
Collector Curren t (m A )
Capacitance & Reverse-Biased Voltage
1000
100
Capac itanc e (pF)
Cob
1
Tf
Switchin g T imes ( us)
0.1
110
100000
10000
(mA)
C
1000
100
Collector Current-I
10
Ton
Collector Current (A)
Safe Operating Ar ea
PT=1ms
PT=100ms
PT=1s
10
0.1 1 10 100
Reverse-Biased Vol t ag e ( V)
1
1 10 100
Forward-V
CE
(V)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A B
D
H
I
G
Spec. No. : HE6730-B
Issued Date : 1997.08.13
Revised Date : 1999.08.01
Page No. : 3/3
Marking :
E
M
C
K
HSMC Logo
Part Number
Date Code
Style : Pin 1.Base 2.Collector 3.Emitter
Product Series
Rank
3
2
N
4
1
P
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I -
O
DIM
Min. Max. Min. Max.
*
0.1508 B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N -
*
0.1000 E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 -
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*
16.25
*:Typical
*
3.83
*
2.54
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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