Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HTIP107
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP107 is designed for use in general purpose amplifier and lowspeed switching applications.
Spec. No. : HE6735
Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 1/4
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stora ge Temperature........................................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................................ +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)................................................................................................. 80 W
Total Power Dissipation (Ta=25°C)................................................................................................... 2 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage............................................................................................... -100 V
BVCEO Collector to Emitter Voltage............................................................................................ -100 V
BVEBO Emitter to Base Voltage...................................................................................................... -5 V
IC Collector Current......................................................................................................................... -8 A
TO-220
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -100 - - V IC=-1mA, IE=0
BVCEO -100 - - V IC=-30mA, IB=0
ICBO - - -50 uA VCB=-100V, IE=0
ICEO - - -50 uA VCE=-50V, IB=0
IEBO - - -8 mA VEB=-5V, IC=0
*VCE(sat)1 - - -2 V IC=-3A, IB=-6mA
*VCE(sat)2 - - -2.5 V IC=-8A, IB=-80mA
*VBE(on) - - -2.8 V IC=-8A, VCE=-4V
*hFE1 1 - 20 K IC=-3A, VCE=-4V
*hFE2 200 - - IC=-8A, VCE=-4V
Cob - - 300 pF VCB=-10V, f=0.1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Darlington Schematic
C
B
R2R1
E
HTIP107 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6735
Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 2/4
100000
Current Gain & Collector Current
10000
1000
hFE
10000
125oC 75oC
100
25oC
10
hFE @ VCE=4V
1
1 10 100 1000 10000
Collec tor Current IC (mA)
Sat urat ion Vol tage & Collect or Cu rrent
10000
1000
Satur ation Voltag e (mV)
100
75oC
125oC
CE(sat)
V
100 1000 10000
Collector Current IC (mA)
25oC
@ IC=500I
Sat urat ion Vol tage & Collect or Cu rrent
10000
Sat urat ion Vol tage & Collect or Cu rrent
B
1000
Saturat ion Volta ge ( m V)
100
75oC
125oC
CE(sat)
V
100 1000 10000
Collec tor Current IC (mA)
25oC
@ IC=625I
ON Voltage & Collcetor Current
10000
25oC
1000
125oC
ON Voltage ( m V)
75oC
BE(ON)
V
@ VCE=4V
1000
Saturat ion Voltag e ( m V)
B
100
10
1
Switching Times (us)..
75oC
125oC
V
100 1000 10000
Collector Current IC (mA)
CE(sat)
25oC
@ IC=100I
B
Switching Time & Collector Current
VCC=30V, IC=250IB1=-250I
B2
Tstg
Tf
Ton
100
10 100 1000 10000
Collec tor Current IC (mA)
0.1
110
Collector Current (A)
HTIP107 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6735
Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 3/4
1000
100
Capacitance (p F)
10
Capacitan ce & Reverse-Biased Volta ge
Cob
0.1 1 10 100
Rev e r se- Biased Voltage ( V)
100000
10000
(mA)
C
1000
100
Collect or Curre nt- I
10
1
1 10 100 1000
Safe Oper ating Area
Forwar d Vol t a ge- VCE (V)
PT=1ms
PT=100ms
PT=1s
HTIP107 HSMC Product Specification
Page 4
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A
D
B
Spec. No. : HE6735
Issued Date : 1994.08.10
Revised Date : 2002.01.18
Page No. : 4/4
Marking:
E
C
HTIP
107
Date Code
Control Code
H
Style: Pin 1.Base 2.Collector 3.Emitter
G
I
3
M
2
K
N
1
4
OP
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H - *0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
•
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP107 HSMC Product Specification
Loading...