Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6743
Issued Date : 1998.07.01
Revised Date : 2001.08.30
Page No. : 1/3
HTIP105
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTIP105 is designed for monolithic construction with built in baseemitter shunt resistors industrial.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Storage Temperature .......................................................................................................... -55 ~ +150 °C
Junction Temperature .................................................................................................. +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ................................................................................................... 80 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................................... -60 V
BVCEO Collector to Emitter Voltage................................................................................................. -60 V
BVEBO Emitter to Base Voltage......................................................................................................... -5 V
IC Collector Current............................................................................................................................ -8 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -60 - - V IC=-1mA
BVCEO -60 - - V IC=-30mA
BVEBO -5 - - V IE=-0.1mA
ICEO - - -50 uA VCE=-30V
ICBO - - -50 uA VCB=-60V
IEBO - - -8 mA VEB=-5V
*VCE(sat)1 - - -2 V IC=-3A, IB=-6mA
*VCE(sat)2 - - -2.5 V IC=-8A, IB=-80mA
*VBE(on) - - -2.8 V IC=-8A, VCE=-4V
*hFE1 1000 - 20000 IC=-3A, VCE=-4V
*hFE2 200 - - IC=-8A, VCE=-4V
Cob - - 300 pF VCE=-10V, f=100KHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Darlington Schematic
C
B
R2R1
E
HTIP105 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6743
Issued Date : 1998.07.01
Revised Date : 2001.08.30
Page No. : 2/3
10000
Current Gain & Collector Current
1000
100
hFE
10
1
1 10 100 1000 10000
10000
Collector Current (mA)
On Voltage & Collector Current
hFE @ VCE=4V
10000
BE(sat)
V
CE(sat)
V
@ IC=100I
@ IC=100I
1000
Saturation Voltag e ( mV)
100
10 100 1000 10000
Collect or Curren t (mA)
B
B
Switching Ti m e & C ollector Cur rent
10
Saturation Voltage & Collector Current
VCC=30V, IC=250IB1=-250I
B2
1000
On Vol t age (m V)
100
1 10 100 1000 10000
1000
100
Capacitan c e (pF)
Capacit ance & Reverse-B iased Vol tage
Collecto r Cur r e nt ( mA)
BE (on)
V
@ VCE=4V
Cob
Tstg
1
Tf
Switchin g Times (us)
0.1
110
Ton
Collect or Cur rent (mA)
Safe Operat ing Ar ea
100000
10000
(mA)
C
1000
100
Collect or Cur rent-I
10
PT=1ms
PT=100 ms
PT=1 s
10
0.1 1 10 100
Rever se- Biased Voltage (V)
1
1 10 100 1000
Forward Volt age- VCE (V)
HTIP105 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A B
D
Spec. No. : HE6743
Issued Date : 1998.07.01
Revised Date : 2001.08.30
Page No. : 3/3
Marking:
E
C
HTIP
105
Date Code
Control Code
H
Style: Pin 1.Base 2.Collector 3.Emitter
G
I
3
M
2
K
N
1
4
O
DIM
Min. Max. Min. Max.
DIM
P
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H - *0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Fac tory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HTIP105 HSMC Product Specification
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