Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HTIF127
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HTIF127 is designed for use in general purpose amplifier and
low-speed switching applications.
Spec. No. : HE9216-A
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Tc=25°C) .................................................................................... 45 W
Maximum Voltages and Currents
•
BVCBO Collector to Base Voltage................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................ -100 V
BVEBO Emitter to Base Voltage.......................................................................................... -5 V
IC Collector Current (Pulse)................................................................................................. -8 A
IC Collector Current (Continuous)........................................................................................ -5 A
IB Base Current............................................................................................................ -120 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO -100 - - V IC=-1mA
*BVCEO -100 - - V IC=-100mA
ICBO - - -200 uA VCB=-100V
ICEO - - -500 uA VCE=-50V
IEBO - - -2 mA VEB=-5V
*VCE(sat)1 - - -2 V IC=-3A, IB=-12mA
*VCE(sat)2 - - -4 V IC=-5A, IB=-20mA
*VBE(on) - - -2.5 V IC=-3A, VCE=-3V
*hFE1 1 - - K IC=-0.5A, VCE=-3V
*hFE2 1 - - K IC=-3A, VCE=-3V
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9216-A
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 2/3
10000
1000
100
hFE
10000
10
1
Current Gai n & Collector Current
hFE @ VCE=4V
1 10 100 1000 10000
Collector Curren t (m A )
On Vol t age & Collector Cur rent
10000
Saturation Volt age & Coll ector Current
BE(sat)
V
CE(sat)
V
@ IC=100I
@ IC=100I
B2
1000
Saturation Voltage (mV)
100
10 100 1000 10000
10
Switching Time & Collector Current
VCC=30V, IC=250IB1=-250I
Collector Current (mA)
B
B
1000
On Voltage (mV)
100
1 10 100 1000 10000
1000
100
Capac itanc e (pF)
Capacitance & Reverse-Biased Volt age
Collector Curren t (m A )
BE(on)
V
@ VCE=4V
Cob
Tstg
1
Tf
Switchin g T imes ( us)
0.1
110
Ton
Collector Current (A)
Safe Operating Area
100000
10000
(mA)
C
Collector Current-I
1000
PT=1ms
PT=100ms
PT=1s
100
10
10
0.1 1 10 100
Reverse-Biased Vol t a ge (V)
1
1 10 100
Forwar d Voltage-VCE (V)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220FP Dimension
Spec. No. : HE9216-A
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 3/3
A
α
1
α
D
2
α
3
G
B
α
4
E
O
C
α
5
H
I
J
Marking :
HSMC Logo
Part Number
Date Code
Style : Pin 1.Base 2.Collector 3.Emitter
Product Series
Rank
3
N
F
2
K
1
LM
3-Lead TO-220FP Plastic Pack age
HSMC Package Code : F
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.2480 0.2520 6.30 6.40 K - *0.1004 - *2.55
B 0.3386 0.3425 8.60 8.70 L 0.5118 0.5906 13.00 15.00
C 0.1673 0.1870 4.25 4.75 M 0.5886 0.5925 14.95 15.05
D 0.1043 0.1083 2.65 2.75 N - *0.0669 - *1.70
E 0.0230 0.0242 0.58 0.61 O 0.1098 0.1114 2.79 2.83
F 0.3980 0.4039 10.11 10.26
G 0.1083 0.1122 2.75 2.85
H 0.3386 0.3425 8.60 8.70
I - *0.1496 - *3.80
J - *0.0236 - *0.60
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sales office.
1
2
3
4
5
-
-
-
-
-
-2
*5
*15
*5
*5
°
°
°
°
°
-
-
-
-
-
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
*:Typical
°
*2
°
*5
°
*15
°
*5
°
*5
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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