Page 1
Features
•
Operating voltage 2.7V~5.5V
•
Low power consumption
–
Operation: 25mA max. (VCC=5V)
10mA max. (V
–
Standby: 30µA max. (VCC=5V)
10
•
Access time:150ns max. (VCC=5V)
µA max. (V
250ns max. (V
CC
CC
=3V)
CC
=3V)
=3V)
General Description
The HT23C256 is a read-only memory with
high performance CMOS storage device whose
256K of memory is arrange d into 32768 wo rds
by 8 bits.
For applica tion flexibility, the chip enable and
output enabl e control pins can be selected a s
active high or active low. This flexibility not
only allows easy interface with most microproc-
HT23C256
CMOS 32K×8-Bit Mask ROM
•
32768×8 bits of mask ROM
•
Mask options: chip enable CE/CE/OE1/OE 1 and
output enable OE/
•
TTL compatible inputs and outputs
•
Tristate outputs
•
Fully static operation
•
Package type: 28-pin DIP/SOP
essors, but also eliminates bus contention in
multiple bus mi cropro cessor syste ms. An add itional feature of the HT23C256 is its ability to
enter the standb y mode wh enever the chip enable (CE/
CE) is inactive, thus reducing current
consumption to below 30
these functions makes the chip suitable for high
density low power memory applications.
OE/NC
µA. The combination of
Block Diagram
1 24th Aug ’98
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Pin Assignment
Pin Description
Pin Name I/O Description
A0~A14 I Address inputs
D0~D7 O Data outputs
CE/
CE/OE1/OE1 I Chip enable/Output enable input
OE/
OE/NC I Output enable input
VSS I Negative power supply
VCC I Positive power supply
NC — No connection
HT23C256
Operation Truth Table
Mode CE/CE OE/OE A0~A14 D0~D7
Read H/L H/L Valid Data Out
Deselect H/L L/H X High Z
Standby L/H X X High Z
Note: H=V
, L=VIL, X=VIH or V
IH
IL
2 24th Aug ’98
Page 3
HT23C256
Absolu te Maximum Ra tin g s*
Supply Voltage ................................–0.3V to 6V Storage Temperature ................–50°C to 125°C
Input Voltage .......................–0.3V to V
*Note: These are stress ra tings on ly. Stresses exceeding the range specified under “Abso lute Maxi -
mum Ratings” ma y cause substantial damage to the device. Functional operation of this
device at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme condition s may affect device reliability.
D.C. Characteristics
Supply voltage: 2.7V~3.6V Ta=–40°C to 85°C
+0.3V Operating Temperature ..............–40°C to 85°C
CC
Symbol Pa ra meter
V
CC
I
CC
V
IL
V
IH
V
OL
V
OH
I
LI
I
LO
I
STB1
I
STB2
C
IN
C
OUT
Operating Voltage — — 2.7 — 3.6 V
Operating Current 3V
Input Low Voltage 3V — V
Input High Voltage 3V — 2.0 — V
Output Low Voltage 3V IOL= 2.1mA — — 0 . 4 V
Output High Voltage 3V IOH= –0.4mA 2.4 — V
Input Leakage Current 3V VIN= 0 to V
Output Leakage Current 3V V
Standby Current 3V
Standby Current 3V
Input Capacitance (See note) — f= 1MHz — — 10 pF
Output Capacitance (See note) — f= 1MHz — — 10 pF
Test Conditions
V
CC
Conditions
O/P Unload,
f= 5MHz
= 0 to V
OUT
CE=V
IL
CE=V
IH
≤0.2V
CE
CE≥VCC-0.2V
CC
CC
Note: These parameters are periodically sampled but not 100% tested.
Min. Typ. Max. Unit
——10mA
— 0.4 V
SS
V
CC
V
CC
——10µA
——10µA
——500µA
——10
µA
3 24th Aug ’98
Page 4
HT23C256
Supply voltage: 4.5V~5.5V Ta=–40°C to 85°C
Symbol Pa ra meter
V
CC
I
CC
V
IL
V
IH
V
OL
V
OH
I
LI
I
LO
I
STB1
I
STB2
C
IN
C
OUT
Operating Voltage — — 4.5 — 5.5 V
Operating Current 5V
Input Low Voltage 5V — V
Input High Voltage 5V — 2.2 — V
Output Low Voltage 5V IOL=3.2mA — — 0.4 V
Output High Voltage 5V IOH=–1mA 2.4 — V
Input Leakage Current 5V VIN=0 to V
Output Leakage Current 5V V
Standby Current 5V
Standby Current 5V
Input Capacitance (See note) — f=1MHz — — 10 pF
Output Capacitance (See note) — f=1MHz — — 10 pF
Test Conditions
V
CC
Conditions
O/P Unload,
f=5MHz
=0 to V
OUT
CE=V
IL
CE=V
IH
≤ 0.2V
CE
CE ≥ VCC–0.2V
CC
Min. Typ. Max. Unit
——25mA
— 0.8 V
SS
——10µA
CC
——10µA
— — 1.5 mA
——30
CC
CC
V
V
µA
Note: These parameters are periodically sampled but not 100% tested.
A.C. Characteristics Ta=–40°C to 85°C
=2.7V~3.6V VCC=4.5V~5.5V
V
Symbol Parameter
CC
Min. Max. Min. Max.
t
CYC
t
AA
t
ACE
t
AOE
t
OH
t
OD
t
OE
Cycle Time 250 — 150 — ns
Address Access Time — 250 — 150 ns
Chip Enable Access Time — 250 — 150 ns
Output Enable Access Time — 150 — 80 ns
Output Hold Time — — 10 — ns
Output Disable Time (See Note) — — — 70 ns
Output Enable Time (See Note) — — 10 — ns
Note: These parameters are periodically sampled but not 100% tested.
4 24th Aug ’98
Unit
Page 5
A.C. test conditions
Output load: see figure right
Input rise and fall time: 10ns
Input pulse levels : 0.4V to 2.4V
Input and output timing reference levels:
0.8V and 2.0V (V
=5V), 1.5V (VCC=3V)
CC
Functional Description
The HT23C256 has two modes, namely data
read mode and standby mode, controlled by
CE/
CE/OE1/OE1 and OE/OE/NC inputs.
•
Standby mode
The HT23C256 has lower current consumption,
controlled by the chip enable input (CE/
When a low/high level is applied to the CE /
input regardless of the output enable
(OE/
OE/NC) states the chip will enter the
standby mode.
CE).
CE
HT23C256
Output load circuit
•
Data read mode
When both the chip enable (CE/
and the output enable (OE/
the chip is in data read mode. Otherwise,
active CE/
CE and inactive OE/OE/N C result
in deselect mode. The output will remain i n
Hi-Z state.
CE/OE/OE1)
OE/NC) are active,
Timing Diagrams
•
Propagation delay due to address (CE/CE/OE1/OE1 and OE/OE are active)
•
Propagation delay due to chip enable and output enable (address valid)
5 24th Aug ’98
Page 6
Characteristic Curves
HT23C256
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Page 7
HT23C256
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Page 8
HT23C256 MASK ROM ORDERING SHEET
Custom:
HT23C256
User No. Type/Ref. Name Q’ty Check Sum
Control Pin and Package Form Option:
(a) 28 Pin Type Pin 20:
Pin 22:
(b) Package Form:
Companion User No.
Package Marking :
Delivery Date : Q’ ty:
CUSTOM CONFIRMED BY :
(1) CE (2) CE (3) OE1 (4) OE1
(1) OE (2) OE (3) NC
(1) Chip Form (2) 28 DIP (3) 28 SOP
Memory Address
Start End
(NAME, DATE, POSITION & CO. CHOP)
HOL TEK CONFI RMED BY:
(SALES) (SALES MANAGER)
8 24th Aug ’98
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