
HSU83
Silicon Epitaxial Planar Diode for High Voltage Switching
ADE-208-307A(Z)
Rev 1
Jun. 1996
Features
• High reverse voltage. (VR = 250V)
• Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.
Ordering Information
Type No. Laser Mark Package Code
HSU83 T URP
Outline
Cathode mark
Mark
12
T
1. Cathode
2. Anode
 

HSU83
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Value Unit
Peak reverse voltage V 
Reverse voltage V 
Peak forward current I 
Non-Repetitive peak
RM
R
FM
*1
I
FSM
forward surge current 
Average rectified current I
O
Junction temperature Tj 125 °C 
Storage temperature Tstg –55 to +125 °C
Note: 1. Value at duration of 10msec.
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Condition
Forward voltage V 
Reverse current I
F
R1
I
R2
Capacitance C — — 3.0 pF VR = 0V, f = 1 MHz 
Reverse recovery
t
rr
time
— — 1.2 V IF = 100 mA 
— — 0.2 µAVR = 250V 
— — 100 VR = 300V
— — 100 ns IF = IR =30 mA, Irr = 3mA
300 V 
250 V 
300 mA 
2A
100 mA
2
 

Main Characteristic
HSU83
-2
10
-3
10
-4
10
  (A)
F
-5
10
-6
10
-7
Forward current I
10
-8
10
-9
10
0 0.2 0.4
Forward voltage V 
0.6 0.8
F
Fig.1  Forward current Vs. Forward voltage
 (V)
f=1MHz
1.0
-5
10
-6
10
  (A)
R
-7
10
Reverse current I 
-8
10
-9
10
0 50 200
100
150
Reverse voltage V R (V)
Fig.2  Reverse current Vs. Reverse voltage
250
10
1.0
Capacitance C  (pF)
-1
10
10
-1
1.0
Reverse voltage V R (V)
Fig.3  Capacitance Vs. Reverse voltage
10
3
 

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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high 
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk 
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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly 
for maximum rating, operating supply voltage range, heat radiation characteristics, installation 
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used 
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failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other 
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