Datasheet HS-565ARH-T Datasheet (Intersil Corporation)

Page 1
HS-565ARH-T
Data Sheet July 1999 File Number
Radiation Hardened High Speed, Monolithic Digital-to-Analog Converter
Intersil’sSatellite Applications FlowTM(SAF) devices are fully tested and guaranteed to 100kRAD total dose. This QML Class T device is processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability.
The HS-565ARH-T is a fast, radiation hardened 12-bit current output, digital-to-analog converter. The monolithic chip includes a precision voltage reference, thin-film R-2R ladder, reference control amplifier and twelve high-speed bipolar current switches.
The Intersil Semiconductor Dielectric Isolation process provides latch-up free operation while minimizing stray capacitance and leakage currents, to produce an excellent combination of speed and accuracy. Also, ground currents are minimized to produce a low and constant current through the ground terminal, which reduces error due to code­dependent ground currents.
4607.1
Features
• qml Class T, Per MIL-PRF-38535
• Radiation Performance
- Gamma Dose (γ) 1 x 10
5
RAD(Si)
- No Latch-Up, Dielectrically Isolated Device Islands
• DAC and Reference on a Single Chip
• Pin Compatible with AD-565A and HI-565A
• Very High Speed: Settles to 0.50 LSB in 500ns Max
• Monotonicity Guaranteed Over Temperature
• 0.50 LSB Max Nonlinearity Guaranteed Over Temperature
o
• Low Gain Drift (Max., DAC Plus Reference) 50ppm/
±0.75 LSB Accuracy Guaranteed Over Temperature (±0.125 LSB Typical at 25
o
C)
C
Pinouts
HS1-565ARH-T (SBDIP), CDIP2-T24
TOP VIEW
HS-565ARH-T die are laser trimmed for a maximum integral nonlinearity error of ±0.25 LSB at 25
o
C. In addition, the low noise buried zener reference is trimmed both for absolute value and minimum temperature coefficient.
Specifications
Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the HS-565ARH-T are contained in SMD 5962-96755. A “hot-link” is provided from our website for downloading. www.intersil.com/spacedefense/ne wsafc lasst.asp
Intersil‘s Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website.
www.intersil.com/quality/manuals.asp
Ordering Information
TEMP.
ORDERING
NUMBER
5962R9675501TJC HS1-565ARH-T -55 to 125 5962R9675501TXC HS9-565ARH-T -55 to 125
NOTE:
Minimumorderquantity for -T is 150 units through
distribution, or 450 units direct.
PART
NUMBER
RANGE
(oC)
BIPOLAR RIN
NC NC
V
CC
REF OUT REF GND
REF IN
-V
BIPOLAR RIN
EE
IDAC OUT 10V SPAN 20V SPAN
PWR GND
NC NC
V
CC
REF OUT
REF GND
REF IN
-V
EE
IDAC OUT 10V SPAN 20V SPAN PWR GND
1 2 3 4 5 6 7 8
9 10 11 12
BIT 1 IN (MSB)
24
BIT 2 IN
23 22
BIT 3 IN BIT 4 IN
21
BIT 5 IN
20
BIT 6 IN
19
BIT 7 IN
18
BIT 8 IN
17
BIT 9 IN
16 15
BIT 10 IN BIT 11 IN
14 13
BIT 12 IN (LSB)
HS9-565ARH-T (FLATPACK), CDFP4-F24
TOP VIEW
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
BIT 1 IN (MSB)
BIT 2 IN BIT 3 IN BIT 4 IN BIT 5 IN BIT 6 IN BIT 7 IN BIT 8 IN BIT 9 IN BIT 10 IN BIT 11 IN BIT 12 IN
(LSB)
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
www.intersil.com or 407-727-9207
Satellite Applications Flow™ (SAF) is a trademark of Intersil Corporation.
| Copyright © Intersil Corporation 1999
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Functional Diagram
HS-565ARH-T
REF
REF
GND
IN
REF OUT V
6
5
43
+
-
19.95K
CC
10V
3.5K
3K
I
REF
0.5mA
-V
Definitions of Specifications
Digital Inputs
The HS-565ARH-T accepts digital input codes in binary format and may be user connected for any one of three binary codes. Straight binary, Two’s Complement (see note below), or Offset Binary, (see Operating Instructions).
DIGITAL
INPUT
STRAIGHT
BINARY
000 . . . 000 Zero - fS (Full Scale) Zero 100 . . . 000 0.50 f 111 . . . 111 + fS - 1 LSB + fS - 1 LSB Zero - 1 LSB 011 . . . 111 0.50 fS- 1 LSB Zero - 1 LSB + fS - 1 LSB
NOTE: Invert MSB with external inverter to obtain Two’s
Complement Coding.
Accuracy
Nonlinearity - Nonlinearity of a D/A converter is an
important measure of its accuracy. It describes the deviation from an ideal straight line transfer curve drawn between zero (all bits OFF) and full scale (all bits ON).
Differential Nonlinearity - For a D/A converter, it is the differencebetween the actual output voltagechange and the ideal (1 LSB) voltage change for a one bit change in code. A Differential Nonlinearity of ±1 LSB or less guarantees monotonicity; i.e., the output always increases and never decreases for an increasing input.
Settling Time
Settling time is the time required for the output to settle to within the specified error band for any input code transition. It is usually specified for a full scale or major carry transition, settling to within 0.50 LSB of final value.
Drift
Gain Drift - The change in full scale analog output over the
specified temperature range expressed in parts per million of
ANALOG OUTPUT
OFFSET BINARY
S
(NOTE)
TWO’S
COMPLEMENTMSB . LSB
Zero - f
S
+
-
712
PWR
EE
GND
BIP.
9.95K
DAC
(4X IREF
X CODE)
24. . . 13
MSB LSB
OFF.
8
IO
5K
5K
2.5K
11
10
9
20V SPAN
10V SPAN
OUT
full scale range peroC (ppm of FSR/oC). Gain error is measured with respect to 25 temperatures. Gain drift is calculated for both high (t
o
25
C) and low ranges (25oC - tL) by dividing the gain error
o
C at high (tH) and low (tL)
-
L
bythe respectivechange in temperature. The specification is the larger of the two representing worst case drift.
Offset Drift - The change in analog output with all bits OFF over the specified temperature range expressed in parts per million of full scale range per error is measured with respect to 25 (t
) temperatures.Offset drift is calculated for both high (tD-
L
o
25
C) and low (25oC-tL) ranges by dividing the offset error
o
C (ppm of FSR/oC). Offset
o
C at high (tH) and low
by the respective change in temperature. The specification given is the larger of the two, representing worst case drift.
Power Supply Sensitivity
Power Supply Sensitivity is a measure of the change in gain and offset of the D/A converter resulting from a change in -15V or +15V supplies. It is specified under DC conditions and expressed as parts per million of full scale range per percent of change in power supply (ppm of FSR/%).
Compliance
Compliance Voltage is the maximum output voltage range that can be tolerated and still maintain its specified accuracy. Compliance Limit implies functional operation only and makes no claims to accuracy.
Glitch
A glitch on the output of a D/A converter is a transient spike resulting from unequal internal ON-OFF switching times. Worst case glitches usually occur at half scale or the major carry code transition from 011 . . . 1 to 100 . . . 0 or vice versa. For example, if turn ON is greater than turn OFF for 011 . . . 1 to 100 . . . 0, an intermediate state of 000 . . . 0 exists, such that, the output momentarily glitches toward zero output. Matched switching times and fast switching will reduce glitches considerably.
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HS-565ARH-T
Applying the HS-565ARH-T
OP AMP Selection
The HS-565ARH-T’s current output may be converted to voltage using the standard connections shown in Figures 1 and 2. The choice of operational amplifier should be reviewed for each application, since a significant trade-off may be made between speed and accuracy. Remember settling time for the DAC-amplifier combination is:
tD()2tA()
where t
2
+
, tA are settling times for the DAC and amplifier.
D
R2
100
REF
IN
REF
GND
REF OUT
6
5
+
-
19.95 K
V
CC
34
10V
0.5mA
3.5K
3K
I
REF
+
-
HS-565ARH-T
No Trim Operation
The HS-565ARH-T will perform as specified without calibration adjustments. To operate without calibration, substitute 50 resistors for the 100 trimming potentiometers: In Figure 1 replace R2 with 50; also remove the network on pin 8 and connect 50 to ground. For bipolar operation in Figure 2, replace R3 and R4 with 50 resistors.
With these changes, performance is guaranteed as shown under Specifications, “External Adjustments”. Typical unipolar zero will be ±0.50 LSB plus the op amp offset.
The feedback capacitor C must be selected to minimize settling time.
+15V
R1 50k
-15V
C
-
+ R (SEE
TABLE 7)
V
O
9.95K
DAC
(4 x I x CODE)
CODE INPUT
BIP.
OFF.
IO
REF
5K
5K
2.5K
100k
100
8
11
20V SPAN
10
10V SPAN
DAC OUT
9
R4
100
REF
REF
GND
REF OUT
6
IN
5
+
-
19.95K
7
-V
EE
PWR GND
. . . . .
24 13
MSB LSB
FIGURE 1. UNIPOLAR VOLTAGE OUTPUT
7
-V
I
0.5mA
+
-
EE
R3
100
HS-565ARH-T
REF
MSB LSB
PWR
GND
BIP.
OFF.
9.95K
DAC
(4 x I x CODE)
CODE
INPUT
. . . . .
24 13
IO
REF
8
5K
5K
2.5K
V
CC
34
10V
3.5K
3K
FIGURE 2. BIPOLAR VOLTAGE OUTPUT
11
10
10V SPAN
DAC OUT
9
20V SPAN
-
+ R (SEE
TABLE 7)
V
O
C
3
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HS-565ARH-T
Calibration
Calibration provides the maximum accuracy from a converter by adjusting its gain and offset errors to zero, For the HS-565ARH-T, these adjustments are similar whether the current output is used, or whether an external op amp is added to convert this current to a voltage. Refer to Table 7 for the voltage output case, along with Figure 1 or 2.
Calibration is a two step process for each of the five output ranges shown in Table 1. First adjust the negative full scale (zero for unipolar ranges). This is an offset adjust which translates the output characteristic, i.e., affectseach code by the same amount.
Nextadjust positivef rotates the output characteristic about the negative f
For the bipolar ranges, this approach leaves an error at the zero code, whose maximum values is the same as for integral nonlinearity error. In general, only two values of output may be calibrated exactly; all others must tolerate some error. Choosing the extreme end points (plus and minus full scale) minimizes this distributed error for all other codes.
. This is a gain error adjustment, which
S
value.
S
shown this to be a reliable and repeatable way to measure settling time.
The usual specification is based on a 10V step, produced by simultaneously switching all bits from off-to-on (t to-off (t
). The slower of the two cases is specified, as
OFF
measured from 50% of the digital input transition to the final entry within a window of ±0.50 LSB about the settled value. Four measurements characterize a given type of DAC:
(a) t (b) t (c) t
, to final value +0.50 LSB
ON
, to final value -0.50 LSB
ON
, to final value +0.50 LSB
OFF
(d) OFF, to final value -0.50 LSB
(Cases (b) and (c) may be eliminated unless the overshoot exceeds 0.50 LSB). For example, refer to Figures 3A and 3B for the measurement of case (d).
Procedure
As shown in Figure 3B, settling time equals tX plus the comparator delay (t
• Adjust the delay on generator number 2 for a tXof several
D
microseconds. This assures that the DAC output has
Settling Time
This is a challenging measurement, in which the result
settled to its final wave
• Switch on the LSB (+5V)
depends on the method chosen, the precision and quality of test equipment and the operating configuration of the DAC (test conditions). As a result, the different techniques in use by converter manufacturers can lead to consistently different results. An engineer should understand the advantage and limitations of a given test method before using the specified settling time as a basis for design.
The approach used for several years at Intersil calls for a strobed comparator to sense final perturbations of the DAC output waveform. This gives the LSB a reasonable magnitude (814mV for the HS-565ARH-T, which provides the comparator with enough overdrive to establish an accurate ±0.50 LSB window about the final settled value. Also, the required test conditions simulate the DACs environment for a common application - use in a successive approximation A/D converter. Considerable experience has
TABLE 1. OPERATING MODES AND CALIBRATION
CIRCUIT CONNECTIONS CALIBRATION
OUTPUT
MODE
Unipolar (See Figure 1) 0 to +10V VO Pin 10 1.43K All 0’s
RANGE
0 to +5V VO Pin 9 1.1K All 0’s
PIN 10
TO
PIN 11
TO
• Adjust the VLSB supply for 50% triggering at COMPARATOR OUT. This is indicated by traces of equal brightness on the oscilloscope display as shown in Figure 3B. Note DVM reading
• Switch to LSB to Pulse (P)
• Readjust the VLSB supply for 50% triggering as before, and note DVM reading. One LSB equals one tenth the difference in the DVM readings noted above
• Adjust the VLSB supply to reduce the DVM reading by 5 LSBs (DVM reads 10X, so this sets the comparator to sense the final settled value minus 0.50 LSB). Comparator output disappears
• Reduce generator number 2 delayuntil comparator output reappears, and adjust for “equal brightness”
• Measure t time equals t
RESISTOR
(R)
from scope as shown in Figure 3B. Settling
X
+ tD, i.e., tX + 15ns
X
APPLY
INPUT CODE ADJUST TO SET VO
All 1’s
All 1’s
= 15ns). To measure tX:
R1 R2
R1 R2
) or on-
ON
0V
+9.99756V
0V
+4.99878V
4
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HS-565ARH-T
TABLE 1. OPERATING MODES AND CALIBRATION (Continued)
CIRCUIT CONNECTIONS CALIBRATION
OUTPUT
MODE
RANGE
Bipolar (See Figure 2) ±10V NC VO 1.69K All 0’s
±5V VO Pin 10 1.43K All 0’s
±2.5V VO Pin 9 1.1K All 0’s
PIN 10
TO
PIN 11
TO
RESISTOR
(R)
APPLY
INPUT CODE ADJUST TO SET VO
All 1’s
All 1’s
All 1’s
R3 R4
R3 R4
R3 R4
-10V
+9.99512V
-5V
+4.99756V
-2.5V
+2.49878V
12
SYNC
TRIG OUT
5K
5K
2.5K
IN
GENERATOR
20V ± 20%
BIAS 8 11
10
NC
9
5
DVM
PULSE
NO. 2
TURN ON TURN OFF
B
OUT
C
STROBE IN
+
-
90 200K
10
D
COMPARATOR OUT
0.1µF
VLSB
SUPPLY
OUT
A
~100
kHz
5V
PULSE
GENERATOR
NO. 2
HS-565ARH-T
24 23
. . . .
9.95K . . . . . . . . .
14
P
13
2mA
LSB
FIGURE 3A. FIGURE 3B.
Other Considerations
Grounds
The HS-565ARH-T has two ground terminals, pin 5 (REF GND) and pin 12 (PWR GND). These should not be tied together near the package unless that point is also the system signal ground to which all returns are connected. (If such a point exists, then separate paths are required to pins 5 and 12).
The current through pin 5 is near zero DC (Note); but pin 12 carries up to 1.75mA of code - dependent current from bits 1, 2, and 3. The general rule is to connect pin 5 directly to the system “quiet” point, usually called signal or analog ground. Connect pin 12 to the local digital or power ground. Then, of course, a single path must connect the analog/signal and digital/power grounds.
NOTE: Current cancellation is a two step process within the HS­565ARH-Tin which code dependent variations are eliminated, there­sulting DC current is supplied internally. First an auxiliary 9-bit R-2R ladderisdrivenbythecomplementofthe DACsinput code. Together,
+3V
A
0V
0V
B
-400mV
(TURN OFF)
2V
C
0.8V
4V
D
0V
50%
50%
t
X
-0.50LSB
SETTLING TIME tD = COMPARATOR DELAY
“EQUAL BRIGHTNESS”
DIGITAL INPUT
DAC OUTPUT
COMP. STROBE
COMP. OUT
the main and auxiliary ladders draw a continuous 2.25mA from the internal ground node,regardlessofinputcode.PartoftheDCcurrent is supplied by the zener voltage reference, and the remainder is sourced from the positive supply via a current mirror which is laser trimmed for zero current through the external terminal (pin 5).
Layout
Connections to pin 9 (I critical for high speed performance. Output capacitance of the DAC is only 20pF, so a small change of additional capacitance may alter the op amp’s stability and affect settling time. Connections to pin 9 should be short and few. Component leads should be short on the side connecting to pin 9 (as for feedback capacitor C). See the Settling Time Section.
) on the HS-565ARH-T are most
OUT
Bypass Capacitors
Power supply bypass capacitors on the op amp will serve the HS-565ARH-T also.If no op amp is used, a 0.01mF ceramic capacitor from each supply terminal to pin 12 is sufficient, since supply current variations are small.
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Page 6
Die Characteristics
HS-565ARH-T
DIE DIMENSIONS:
(2718µm x 4547µm x 483µm ±25.4µm) 107 x 179 x 19mils ±1mil
METALLIZATION:
Type: Al Si Cu Thickness: 16.0k
Å ±2kÅ
SUBSTRATE POTENTIAL:
Tie substrate to reference ground
BACKSIDE FINISH:
Silicon
Metallization Mask Layout
V
REF
OUT
V
REF
GND
PASSIVATION:
Type: Silox (S Thickness: 8k
)
iO2
Å ±1kÅ
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm
2
TRANSISTOR COUNT:
200
PROCESS:
Bipolar, Dielectric Isolation
HS-565ARH-T
V
CC
3
(MSB)
BIT 1 BIT 2
BIT 3
BIT 4
BIT 5
V
IN
REF
-V
EE
BIPOLAR
R
IDAC
OUT
10V
SPAN
IN
20V
SPAN
POWER
GND
(LSB)
BIT 11BIT 12
BIT 6
BIT 7
BIT 8
BIT 9
BIT 10
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with­out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However ,no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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