Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HMPSA06
NPN SILICON TRANSISTOR
Description
Amplifier transistor
Spec. No. : HE6302
Issued Date : 1992.09.09
Revised Date : 2002.02.21
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 80 V
VCEO Collector to Emitter Voltage...................................................................................... 80 V
VEBO Emitter to Base Voltage.............................................................................................. 4 V
IC Collector Current........................................................................................................ 500 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 80 - - V IC=100uA, IE=0
BVCEO 80 - - V IC=1mA, IB=0
BVEBO 4 - - V IE=100uA, IC=0
ICBO - - 100 nA VCB=80V, IE=0
ICEO - - 100 nA VCE=60V, IB=0
*VCE(sat) - - 0.25 V IC=100mA, IB=10mA
*VBE(on) - - 1.2 V IC=100mA, VCE=1V
*hFE1 50 - - IC=10mA, VCE=1V
*hFE2 50 - - IC=100mA, VCE=1V
fT 100 - - MHz IC=10mA, VCE=2V, f=100MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMPsA06 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6302
Issued Date : 1992.09.09
Revised Date : 2002.02.21
Page No. : 2/4
1000
125oC
25oC
100
hFE
hFE @ VCE=1V
10
1 10 100 1000
75oC
Collector Current-IC (mA)
ON Voltage & Coll ector Current
1000
25oC
125oC
75oC
Current Gain & Col lector Current
1000
Sat ur ation Voltage & Collector Curr ent
CE(sat)
V
100
125oC
Satur ation Voltag e (mV)
10
1 10 100 1000
1000
100
B
@ IC=10I
75oC
Collec tor Current -IC (mA)
Cutoff Frequency & Ic
VCE=2V
25oC
ON Voltage ( m V)
BE(ON)
V
@ VCE=1V
100
1 10 100 1000
100
10
Capacitance (pF)
1
Capacitance & Reverse- Bia sed Vol ta ge
0.1 1 10 100 1000
Collec tor Current -IC (mA)
Cob
Reverse Biased Vol tage (V)
Cutoff Fr equen cy ( M Hz)...
10
1 10 100 1000
10000
1000
(mA)
C
100
Collector Curre n t-I
10
1
1 10 100 1000
Collector Current (mA)
Safe Operati ng Area
PT=1ms
PT=100ms
PT=1s
Forwar d Voltage- VCE (V)
HMPsA06 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6302
Issued Date : 1992.09.09
Revised Date : 2002.02.21
Page No. : 3/4
700
600
500
400
300
200
Power Dissipation-PD (mW)
100
0
0 50 100 150 200
Ambient Temperat ure- Ta (oC)
PD-Ta
HMPsA06 HSMC Product Specification
Page 4
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6302
Issued Date : 1992.09.09
Revised Date : 2002.02.21
Page No. : 4/4
A
α2
B
31
2
Marking:
HS
PM
0A6
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMPsA06 HSMC Product Specification
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