Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 1999.05.01
Revised Date : 1999.09.01
Page No. : 1/3
HMM4148
SURFACE MOUNT SWITCHING DIODES
Description
The HMM4148 is designed for high-speed switching application in hybrid thick-and thin-film
circuits.
Absolute Maximum Ratings
( Operating temperature range applies unless otherwise specified )
Characteristics Symbol Value Unit
Reverse Voltage V
Peak Reverse Voltage I
Rectified Current(A verage)
Half Wave Rectification with Resistive Load at
Tamb=25°C and f≥50Hz
I
Surge Forward Current at t<1s and Tj=25°C
Power Dissipation at Tamb=25°C
FSM
P
Junction Temperature T
Storage Temperature Range T
RM
I
O
tot
R
j
s
75 V
100 V
150 mA
500 mA
500 mW
200
-65 to +200
C
°
C
°
Characteristics
( Tj=25°C)
Characteristics Symbol Min Typ Max Unit
Forward Voltage at IF=10mA V
Leakage Current at
VR=20V - - 25 nA
VR =75V - - 5 uA
=20V, Tj=150°C
V
R
Reverse Breakdown Voltage tested with 100us Pulses V
Capacitance at VF= VR =0 C
Voltage Rise when Switching On Tested with 50mA
Forward Pulses Tp=0.1us, Rise Time<30ns, fp=5~100kH z
Reverse Recovery Time From
IF=-IR=10mA to IRR=-1mA, VR=6V, RL=100
Ω
Thermal Resistance
Function to Ambient Air
Rectification Efficiency at f=100MHz, VRF=2V
I
R
(BR)R
tot
V
t
rr
R
thA
η
F
--1V
- - 50 uA
100 - - V
---4pF
fr
--2.5V
--4ns
- - 0.35 K/mW
0.45 - - -
v
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. :Preliminary Data
Issued Date : 1999.05.01
Revised Date : 1999.09.01
Page No. : 2/3
HSMC Product Specification
Page 3
Dimension
HI-SINCERITY
MICROELECTRONICS CORP.
Cathode Mark
Spec. No. :Preliminary Data
Issued Date : 1999.05.01
Revised Date : 1999.09.01
Page No. : 3/3
A
LL-34
B C
D
Mini-Melf
-
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.0512 0.0591 1.30 1.50 C 0.0118 0.0197 0.30 0.50
B 0.0118 0.0197 0.30 0.50 D 0.1260 0.1417 3.2 3.6
Notes :
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
• HSMC assumes no liability for any consequence of customer product design, infringem e nt of patents, or applic ati on assi st ance.
Head Office And Factory :
•
•
•
1.Dimension and tolerance based on our Spec. dated Sep. 30,1999
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
*:Typical
HSMC Product Specification
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