Datasheet HMM4148 Datasheet (HSMC)

Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 1/3
HMM4148
Description
The HMM4148 is designed for high-speed switching application in hybrid thick-and thin-film circuits.
Absolute Maximum Ratings
( Operating temperature range applies unless otherwise specified )
Characteristics Symbol Value Unit Reverse Voltage V Peak Reverse Voltage I Rectified Current(A verage) Half Wave Rectification with Resistive Load at Tamb=25°C and f≥50Hz
I
Surge Forward Current at t<1s and Tj=25°C Power Dissipation at Tamb=25°C
FSM
P Junction Temperature T Storage Temperature Range T
RM
I
O
tot
R
j
s
75 V
100 V 150 mA 500 mA
500 mW 200
-65 to +200
C
°
C
°
Characteristics
( Tj=25°C)
Characteristics Symbol Min Typ Max Unit Forward Voltage at IF=10mA V Leakage Current at
VR=20V - - 25 nA VR =75V - - 5 uA
=20V, Tj=150°C
V
R
Reverse Breakdown Voltage tested with 100us Pulses V Capacitance at VF= VR =0 C Voltage Rise when Switching On Tested with 50mA Forward Pulses Tp=0.1us, Rise Time<30ns, fp=5~100kH z Reverse Recovery Time From IF=-IR=10mA to IRR=-1mA, VR=6V, RL=100
Thermal Resistance Function to Ambient Air
Rectification Efficiency at f=100MHz, VRF=2V
I
R
(BR)R
tot
V
t
rr
R
thA
η
F
--1V
- - 50 uA
100 - - V
---4pF
fr
--2.5V
--4ns
- - 0.35 K/mW
0.45 - - -
v
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. :Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 2/3
HSMC Product Specification
Page 3
Dimension
HI-SINCERITY
MICROELECTRONICS CORP.
Cathode Mark
Spec. No. :Preliminary Data Issued Date : 1999.05.01 Revised Date : 1999.09.01 Page No. : 3/3
A
LL-34
B C
D
Mini-Melf
-
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max. A 0.0512 0.0591 1.30 1.50 C 0.0118 0.0197 0.30 0.50 B 0.0118 0.0197 0.30 0.50 D 0.1260 0.1417 3.2 3.6
Notes :
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC assumes no liability for any consequence of customer product design, infringem e nt of patents, or applic ati on assi st ance.
Head Office And Factory :
1.Dimension and tolerance based on our Spec. dated Sep. 30,1999
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
*:Typical
HSMC Product Specification
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