Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2002.08.14
Page No. : 1/4
HMJE13007
NPN EPITAXIAL PLANAR TRANSISTOR
Description
• High Voltage, High Sp eed Power Switch
• Switch Regulators
• PWM Inverters and Motor Controls
• Solenoid and Relay Drivers
• Deflection Circuits
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -50 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
TO-220
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 80 W
• Maximum Voltages and Currents (Ta=25°C)
VCEX Collector to Emitter Voltage .................................................................................... 700 V
VCEO Collector to Emitter Voltage.................................................................................... 400 V
VEBO Emitter to Base Voltage.............................................................................................. 9 V
IC Collector Current ........................................................................................... Continuous 8 A
IB Base Current.................................................................................................. Continuous 4 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCEX 700 - - V IC=1mA, VBE(off)= 1. 5V
BVCEO 400 - - V IC=10mA
IEBO - - 100 uA VEB=9V
ICEX - - 100 uA VCE=700V, VBE(off)=1.5V
*VCE(sat)1 - - 1 V IC=2A, IB=0.4A
*VCE(sat)2 - - 2 V IC=5A, IB=1A
*VCE(sat)3 - - 3 V IC=8A, IB=2A
*VBE(sat) - - 1.2 V IC=2A, IB=0.4A
*VBE(sat) - - 1.6 V IC=5A, IB=1A
*hFE1 10 - - IC=2A, VCE=5V
*hFE2 6 - - IC=5A, VCE=5V
*hFE3 10 - 30 IC=0.5A, VCE=5V
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMJE13007 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2002.08.14
Page No. : 2/4
100
Current Gain & Collector Current
125oC
10
hFE
1
1 10 100 1000 10000
10000
1000
100
Saturat ion Voltag e ( m V)
25oC
Collector Current-IC (mA)
Sat uration Voltage & Collector Current
CE(sat)
V
@ IC=4I
B
75oC
hFE @ VCE=5V
125oC
75oC
25oC
10000
CE(sat)
V
1000
100
Saturation Voltage (mV)
10
1 10 100 1000 10000
B
@ IB=5I
Collector Current- IC (mA)
75oC
125oC
Sat urati on Voltage & Col lector Current
10000
Sat urati on Voltage & Collector Curren t
Saturation Voltage (mV)
1000
BE(sat)
V
@ IC=5I
25oC
125oC
B
75oC
25oC
10
1 10 100 1000 10000
Collector Current- IC (mA)
Switchange Tim e & C ollector C urrent
10
VCC=125V, IC=5IB1, IC=2I
1
Switching Time (uS)...
0.1
0.1 1 10
B2
Tstg
Ton
Tf
Collector Current-IC (A)
100
1 10 100 1000 10000
Collector Current- IC (mA)
Collector Output Capacitance
1000
100
Cob
10
Capacitance (pF)
1
0.1 1 10 100
Collector Base Voltage (V)
HMJE13007 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2002.08.14
Page No. : 3/4
10000
Safe Oper ating Area
1000
(mA)
C
100
Collector Current-I
10
1
1 10 100 1000
Forwar d Vol t a ge- VCE (V)
1mS
100mS
1S
HMJE13007 HSMC Product Specification
Page 4
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A
D
B
Spec. No. : HE200207
Issued Date : 1993.04.12
Revised Date : 2002.08.14
Page No. : 4/4
Marking:
E
C
H
1
3007
MJ E
Date Code
Control Code
H
Style: Pin 1.Base 2.Collector 3.Emitter
G
I
3
M
2
K
N
1
4
OP
3-Lead TO-220AB Plastic Package
HSMC Package Code: E
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H - *0.6398 - *16.25
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infri ngement of patents, or appl ication assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13007 HSMC Product Specification
Loading...