Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HT200210
Issued Date : 2001.01.01
Revised Date : 2002.05.08
Page No. : 1/3
HMJE13003
NPN EPITAXIAL PLANAR TRANSISTOR
Description
• High Voltage, High Sp eed Power Switch
• Switch Regulators
• PWM Inverters and Motor Controls
• Solenoid and Relay Drivers
• Deflection Circuits
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -50 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
TO-126
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
• Maximum Voltages and Currents (Ta=25°C)
VCEX Collector to Emitter Voltage .................................................................................... 700 V
VCEO Collector to Emitter Voltage.................................................................................... 400 V
VEBO Emitter to Base Voltage.............................................................................................. 9 V
IC Collector Current ........................................................................................ Continuous 1.5 A
IB Base Current............................................................................................. Continuous 0.75 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCEX 700 - - V IC=1mA, VBE(off)= 1. 5V
BVCEO 400 - - V IC=10mA
IEBO - - 1 mA VEB=9V
ICEX - - 1 mA VCE=700V, VBE(off)=1.5V
*VCE(sat)1 - - 500 mV IC=0.5A, IB=0.1A
*VCE(sat)2 - - 1 V IC=1A, IB=0.25A
*VCE(sat)3 - - 3 V IC=1.5A, IB=0.5A
*VBE(sat) - - 1 V IC=0.5A, IB=0.1A
*VBE(sat) - - 1.2 V IC=1A, IB=0.25A
*hFE1 8 - 40 IC=0.5A, VCE=2V
*hFE2 5 - 25 IC=1A, VCE=2V
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMJE13003 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HT200210
Issued Date : 2001.01.01
Revised Date : 2002.05.08
Page No. : 2/3
100
Cur rent G ain & C o llector Current
75oC125oC
25oC
10
hFE
hFE @ VCE=2V
1
0.1 1 10 100 1000 10000
10000
1000
Collector Current-IC (mA)
Sat urati on Voltage & Collector Curren t
CE(sat)
V
@ IC=4I
B
1000
CE(sat)
V
100
Saturation Voltage (mV)
10
1 10 100 1000 10000
B
@ IC=3I
125oC
25oC
Collector Current- IC (mA)
Sat uration Voltage & Collect or Cur rent
10000
Sat urati on Voltage & Collector Cu rrent
1000
CE(sat)
V
@ IC=5I
B
75oC
75oC
100
125oC
Saturat ion Volta ge ( m V)
10
1 10 100 1000 10000
Collector Current- IC (mA)
25oC
Sat ura tion Voltage & C ollector C urrent
10000
Saturation Voltage (mV)
1000
BE(sat)
V
@ IC=4I
25oC
125oC
B
75oC
75oC
125oC
100
Saturation Vpltage (mV)
10
1 10 100 1000 10000
Collector Current-IC (mA)
25oC
Sat uration Voltage & Collector Current
10000
Satur ation Voltage ( m V)
1000
BE(sat)
V
@ IC=5I
25oC
125oC
B
75oC
100
1 10 100 1000 10000
Collector Current-IC (mA)
100
1 10 100 1000 10000
Collector Current- IC (mA)
HMJE13003 HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126 Dimension
Spec. No. : HT200210
Issued Date : 2001.01.01
Revised Date : 2002.05.08
Page No. : 3/3
D
E
A
B
2
1
3
I
KJ
M
α3
Marking:
Date Code
HE
130MJ03
Control Code
α4
G
C
F
H
L
Style: Pin 1.Base 2.Collector 3.Emitter
α1
3-Lead TO-126 Plastic Package
e Code: T
*3°
*3°
*3°
*3°
*3°
*3°
*3°
*3°
HSMC Packa
-
-
-
-
*: Typical
DIM
Min. Max. Min. Max.
F 0.0280 0.0319 0.71 0.81
G 0.0480 0.0520 1.22 1.32
H 0.1709 0.1890 4.34 4.80
I 0.0950 0.1050 2.41 2.66
DIM
α1
α2
α3
α4
α2
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
-
-
-
A 0.1500 0.1539 3.81 3.91 J 0.0450 0.0550 1.14 1.39
B 0.2752 0.2791 6.99 7.09 K 0.0450 0.0550 1.14 1.39
C 0.5315 0.6102 13.50 15.50 L - *0.0217 - *0.55
D 0.2854 0.3039 7.52 7.72 M 0.1378 0.1520 3.50 3.86
E 0.0374 0.0413 0.95 1.05
Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13003 HSMC Product Specification
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