Datasheet HMC132C8 Datasheet (Hittite)

'99

new!

MICROWAVE CORPORATION

GaAS MMIC SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

FEBRUARY 2001

HMC132C8

7

Features

BANDWIDTH: DC-8 GHz

HIGH ISOLATION : > 50 dB

NON-REFLECTIVE DESIGN

General Description

The HMC132C8 is a surface mount, low
cost, non-hermetic packaged version of the
HMC132G7 MMIC SPDT switch. The device
is a fast, broadband SPDT switch featuring
high (> 42 dB) isolation over the entire band.
The switch is non-reflective at both RF1 and
RF2 ports. Applications for this device
include T/R switching for 5.2 GHz UNII, 5.8
GHz ISM circuits, WLAN, and S,C and X­Band Telecom radios.

Guaranteed Performance, With 0/-5V control, 50 Ohm System, -55 to +85 deg C

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SWITCHES

SPDT

SMT

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

7 - 6

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MICROWAVE CORPORATION

HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

new!

HMC132C8

FEBRUARY 2001

'99

Insertion Loss

0

-1

-2

-3

-4

INSERTION LOSS (dB)

-5
0246810

FREQUENCY (GHz)

Return Loss

0

Output

-10

"On"

Isolation

0

-10

-20

-30

-40

-50

ISOLATION (dB)

-60

-70
0246810

FREQUENCY (GHz)

Input

7

SWITCHES

-20

-30

RETURN LOSS (dB)

-40
024 6810

FREQUENCY (GHz)

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

Output

"Off"

7 - 7

SPDT

SMT

'99

new!

MICROWAVE CORPORATION

HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

FEBRUARY 2001

Schematic

RF COM

(PIN 7)

RF1

IN 1)

A

(PIN 5)B(PIN 6)

Absolute Maximum Ratings

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RF2

(PIN 4)

(PINS 2,3,8 and
BACKSIDE are GND)

HMC132C8

T ruth Table

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Do not "HOT" switch power levels > +15 dBm ( V

Control V oltages

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= 0/-5Vdc)

ctl

7

Outline

SWITCHES

SPDT

SMT

PIN 8

CHAMFERED

0.282/0.298
(7.16/7.57)

PIN 1

0.050 TYP
(1.27)

0.197/0.203
(5.00/5.16)

RF

COM

GND

HMC
132C8

GND GND RF2

RF1

BA

0.004 (0.10)

COPLANARITY

MAX.

0.095

(2.41)

MAX.

0.157/0.163
(3.99/4.14)

0.007/0.009 TYP
(0.18/0.23)

0.177/0.183
(0.18/0.23)

0.137/0.143
(3.48/3.63)

RF GND PLANE

COPLANAR WITH LEADS

0.020 +/- 0.003 TYP
(0.51 +/- 0.08)

0 DEG.

TO 7 DEG.

0.020/0.040
(0.51/1.02)

1. MATERIAL:
A) PACKAGE BODY & COVER : WHITE ALUMINA (92%)
B) LEADS & PACKAGE BOTTOM: COPPER

2 . PLATING : ELECTROLYTIC GOLD 100 - 200 MICROINCHES

OVER ELECTROLYTIC NICKEL 100 TO 200 MICROINCHES.

3. DIMENSIONS ARE IN INCHES (MILLIMETERS).
UNLESS OTHERWISE SPECIFIED TOL. ARE ±0.005(±0.13).

4. ALL UNLABELED LEADS ARE GROUND. THESE LEADS ARE
CONNECTED INTERNALLY TO THE PACKAGED BOTTOM GROUND.
THE PACKAGE BOTTOM RF GROUND MUST BE SOLDERED TO
THE PCB RF GROUND.

5. PACKAGE LENGTH AND WIDTH DIMENSIONS SHOWN DO NOT INCLUDE
LID SEAL PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.005
(0.127MM) PER SIDE.

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

7 - 8

MICROWAVE CORPORATION

HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

Suggested Driver Circuit for HMC132C8

Vz=5.1V

Izt=50uA
COMPENSATED
DEVICES
CD4689

TTL
OR
CMOS

VCC
GND GND

10K

VCC

74HCT04 (TTL)
74HC04

(CMOS)

HMC132C8

A

GaAs SWITCH

CONTROL

B

FEBRUARY 2001

'99

new!

-5 VDC

Simple driver using inexpensive standard logic ICs provides fast switching using minimum DC current.

7

SWITCHES

SPDT

SMT

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

7 - 9

'99

new!

MICROWAVE CORPORATION

HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

FEBRUARY 2001

Evaluation Circuit Board

HMC132C8

7

The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to
that shown above. A sufficient number of VIA holes should be used to connect the top and bottom ground planes.
The evaluation circuit board as shown is available from Hittite upon request.

SWITCHES

Evaluation Circuit Board Layout Design Details

SPDT

SMT

Layout Technique Grounded Co-Planar Waveguide (GCPW)
Material Rogers 4350
Dielectric Thickness 0.020" (0.51 mm)
50 Ohm Line Width 0.034" (0.86 mm)
Gap to Ground Edge 0.010" (0.25 mm)
Ground VIA Hole Diameter 0.014" (0.36 mm)

Connectors SMA-F ( EF - Johnson P/N 142-0701-806)

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

7 - 10

MICROWAVE CORPORATION

HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ

NOTES:

new!

HMC132C8

FEBRUARY 2001

'99

7

SWITCHES

SPDT

SMT

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: [phone] Fax: [phone] Web Site: www.hittite.com

7 - 11